CN222530377U - Semiconductor cleaning equipment - Google Patents

Abstract

The utility model provides semiconductor cleaning equipment which comprises a process tank, a drying tank, a first supporting structure, a second supporting structure and a second supporting structure, wherein the drying tank is buckled on the process tank, the first supporting structure is movably arranged in the process tank, the second supporting structure is arranged in the drying tank and comprises at least one pair of oppositely arranged supporting components, the second supporting structure is in a supporting state and an avoiding state, and in the supporting state of the second supporting structure, the two oppositely arranged supporting components are supported on a part of a wafer separated from a liquid interface so as to separate the wafer positioned at the position separated from the liquid interface from the first supporting structure and the liquid interface. The semiconductor cleaning device is supported on the part of the wafer, which is separated from the liquid interface, through the support component of the second support structure, so that the wafer is fixed, the first support structure can be separated from the part of the wafer, which is positioned below the liquid interface, and the rest part of the wafer does not have a contact point with the first support structure in the process of separating from the liquid interface later.

Description

Semiconductor cleaning equipment

Technical Field

The utility model relates to the field of semiconductor manufacturing, in particular to semiconductor cleaning equipment.

Background

Wet cleaning is an important process in semiconductor manufacturing. Among these, the drying of the wafer is the last step of wet cleaning, which has a decisive influence on the effect of wet cleaning. In the prior art, a main flow drying mode of a semiconductor cleaning device for drying a wafer is a marangoni drying mode, and the principle is that a cleaning solution on the surface of the wafer is separated from the wafer by a tension gradient between two liquid interfaces with different surface tension (i.e. marangoni effect).

In the drying process, the wafer moves relatively to the liquid interface through the bracket, and when the contact point of the wafer and the bracket moves to the liquid interface, the position of the contact point forms a bulge, so that the stability of the liquid interface can be damaged, the drying effect at the contact point is affected, and the contact area of the wafer and the bracket is easy to form liquid residues, so that defects are generated. Moreover, if the cleanliness of the contact point between the carrier and the wafer is poor during long-term use, particles may be accumulated in the pattern on the wafer surface at the contact point, which reduces the product yield and even leads to the risk of product rejection.

In the prior art, in order to avoid the influence of the contact point position of the bracket and the wafer on the drying effect, a mode of adding a water absorbing material at the contact point is adopted, or the number of the contact points is reduced, but the negative influence of the contact point on the drying effect cannot be thoroughly solved because the bracket is still in contact with the wafer.

Disclosure of utility model

The utility model aims to at least solve the problem that in the prior art, in the process of separating a wafer from a liquid interface, liquid residues are easy to form at the contact position of a bracket and the wafer, so that the wafer is defective, and provides semiconductor cleaning equipment.

The utility model provides a semiconductor cleaning device which comprises a process tank, a drying tank, a first supporting structure, a second supporting structure and a second supporting structure, wherein the process tank is used for containing liquid, the drying tank is buckled on the process tank, the first supporting structure is movably arranged in the process tank and used for supporting a wafer and moving the wafer to a position which is partially separated from a liquid interface, the second supporting structure is arranged in the drying tank and comprises at least one pair of oppositely arranged supporting components, the second supporting structure is provided with a supporting state and an avoiding state, in the avoiding state of the second supporting structure, the two oppositely arranged supporting components avoid the wafer so that the wafer can move to a position which is partially separated from the liquid interface, and in the supporting state of the second supporting structure, the two oppositely arranged supporting components are supported on the part of the wafer which is separated from the liquid interface so that the wafer which is positioned at the position which is partially separated from the liquid interface is separated from the first supporting structure and the liquid interface.

Optionally, the support assembly comprises a mounting seat and a support plate, wherein the mounting seat is arranged above the process groove, the support plate is movably connected to the mounting seat, and in the two support assemblies which are oppositely arranged, the two support plates are oppositely arranged, and the distance between the oppositely arranged support plates is variable.

Optionally, the supporting plates are rotatably arranged on the mounting seat, the rotation axes of the supporting plates are arranged along the horizontal direction, the rotation axes of the two oppositely arranged supporting plates are parallel to each other, and the oppositely arranged supporting plates are far away from or close to each other by rotating around the respective rotation axes so as to enlarge or reduce the distance between the oppositely arranged supporting plates.

Optionally, the support plates are telescopically arranged on the mounting base in a horizontal direction, and two support plates arranged oppositely are mutually close to or far away from each other through telescopic movement so as to reduce or enlarge the distance between the support plates arranged oppositely.

Optionally, the edge of the supporting plate is provided with a clamping groove matched with the wafer, the clamping grooves of the supporting plate which are oppositely arranged are arranged in a one-to-one correspondence manner, and an area for fixing the wafer is formed between the two corresponding clamping grooves in the unfolded state of the second supporting structure.

Optionally, the clamping grooves are multiple, and the clamping grooves are arranged on the supporting plate along the length direction of the supporting plate and form a zigzag structure.

Optionally, in the supporting state of the second supporting structure, the distance between the two oppositely arranged supporting components is smaller than the diameter of the wafer, and in the avoiding state of the second supporting structure, the distance between the two oppositely arranged supporting components is larger than the diameter of the wafer.

Optionally, the second supporting structure further comprises a guiding part, the guiding part is arranged in the drying groove, the guiding part and the supporting component are arranged in a one-to-one correspondence, the supporting component is arranged on the corresponding guiding part in a lifting manner, and the supporting component is used for enabling the wafer to be separated from the first supporting structure and the liquid interface through lifting.

Optionally, the cleaning device further comprises a cleaning component which is arranged above the supporting component and used for cleaning the supporting component.

The guide part comprises two guide rails which are oppositely arranged, the supporting component is respectively and slidably connected to the two guide rails, the cleaning component comprises a guide pipe and a spray head, the guide pipe is connected between the two guide rails, the spray head is arranged on the guide pipe, and the spray head is used for spraying cleaning liquid to the supporting component.

According to the semiconductor cleaning equipment, the second supporting structure is arranged in the drying groove and is matched with the lifting of the first supporting structure, after the wafer is partially separated from the liquid interface, the wafer is fixed at the part of the wafer separated from the liquid interface through the supporting component of the second supporting structure, so that the first supporting structure is separated from the part of the wafer positioned below the liquid interface, the rest part of the wafer does not have a contact point with the first supporting structure in the process of separating from the liquid interface later, the damage of the contact point to the integrity of the liquid interface is completely eliminated, and a good drying effect can be obtained at all positions on the wafer. The cleanliness of the surface of the wafer and the product yield are improved. Meanwhile, the influence of the newly added device on the cleanliness of the wafer is avoided, and the maintenance cost of the process tank is reduced.

Drawings

Fig. 1 is a schematic view of a structure of a prior art semiconductor cleaning apparatus;

FIG. 2 is a schematic diagram of a wafer placement step during a drying process of a prior art semiconductor cleaning apparatus;

FIG. 3 is a schematic diagram of a pre-cleaning step in a drying process of a prior art semiconductor cleaning apparatus;

FIG. 4 is a schematic diagram of a cleaning step in a drying process of a prior art semiconductor cleaning apparatus;

FIG. 5 is a schematic diagram of a draining step during drying of a prior art semiconductor cleaning apparatus;

FIG. 6 is a schematic diagram of a drying step in a drying process of a prior art semiconductor cleaning apparatus;

Fig. 7 is a schematic structural view of a semiconductor cleaning apparatus according to a first embodiment of the present utility model;

Fig. 8 is a schematic view of a second support structure of a semiconductor cleaning apparatus according to a first embodiment of the present utility model in a support state;

Fig. 9 is a schematic view of a second support structure of a semiconductor cleaning apparatus according to a first embodiment of the present utility model in an avoidance state;

Fig. 10 is a schematic view of a second support structure of a semiconductor cleaning apparatus according to a second embodiment of the present utility model in a support state;

FIG. 11 is a schematic view of a second support structure of a semiconductor cleaning apparatus according to a second embodiment of the present utility model in a dodged state;

fig. 12 is a schematic view showing the structure of a support plate of the semiconductor cleaning apparatus according to the first embodiment of the present utility model;

FIG. 13 is an enlarged view of a portion A of FIG. 12;

Fig. 14 is a schematic view showing a structure of a cleaning assembly of a semiconductor cleaning apparatus according to the first embodiment of the present utility model;

Fig. 15 is a schematic view of a wafer placement step of the semiconductor cleaning apparatus according to the first embodiment of the present utility model in a process flow;

FIG. 16 is a schematic view of a pre-cleaning step of a semiconductor cleaning apparatus according to a first embodiment of the present utility model in a process flow;

FIG. 17 is a schematic view of a cleaning step of a semiconductor cleaning apparatus according to a first embodiment of the present utility model in a process flow;

FIG. 18 is a schematic diagram of a wafer transferring step in a process flow of a semiconductor cleaning apparatus according to a first embodiment of the present utility model;

FIG. 19 is a schematic view of a semiconductor cleaning apparatus according to a first embodiment of the present utility model in a liquid draining step in a process flow;

List of reference numerals:

10. the device comprises a process tank, 20 parts of a first supporting structure, 30 parts of a second supporting structure, 31 parts of a supporting assembly, 311 parts of a mounting seat, 312 parts of a supporting plate, 313 parts of a clamping groove, 32 parts of a guiding part, 40 parts of a drying groove, 41 parts of a drying cavity, 50 parts of a cleaning assembly, 51 parts of a guide pipe, 52 parts of a spray head, 60 parts of a spraying device, 70 parts of a liquid inlet, 80 parts of a liquid outlet and 100 parts of a liquid interface.

Detailed Description

In order to enable those skilled in the art to better understand the technical scheme of the present utility model, the following describes the semiconductor cleaning apparatus provided by the present utility model in detail with reference to the accompanying drawings.

Wet cleaning is an important process in semiconductor manufacturing. Among these, the drying of the wafer is the last step of wet cleaning, which has a decisive influence on the effect of wet cleaning. In the prior art, a main flow drying mode of a semiconductor cleaning device for drying a wafer is a marangoni drying mode, and the principle is that a cleaning solution on the surface of the wafer is separated from the wafer by a tension gradient between two liquid interfaces with different surface tension (i.e. marangoni effect).

Specifically, as shown in FIG. 1, the conventional semiconductor cleaning apparatus includes a process tank 1, a drying tank 7 provided above the process tank 1, a liquid inlet 2 provided at the bottom of the process tank 1, a liquid outlet 3 provided at the bottom of the process tank 1, a tray 4 provided in the process tank 1 to be liftable, a lower shower port 5 provided at the bottom of the drying tank 7, and an upper shower port 6 provided at the top of the drying tank 7.

As shown in fig. 2 to 6, the conventional semiconductor cleaning apparatus has the following processes:

a. Wafer load as shown in fig. 2, the drying tub 7 is opened, the wafer is placed on the carrier 4, and the wafer is placed in the process tub 1 through the carrier 4 by closing the drying tub 7;

b. Pre-cleaning (pre-Clean) as shown in fig. 3, injecting high flow (HighFlow) ultrapure water from the liquid inlet 2 to overflow (overflow), and spraying isopropyl alcohol (IPA) downwards through the upper spraying opening 6, wherein the isopropyl alcohol reaches the water surface to form a film, so that two liquid interfaces 100 with different surface tension are formed with water;

c. Cleaning (Clean) as shown in fig. 4, the wafer is slowly pulled by the bracket 4, and moves relatively to the liquid interface 100, the surface dirt of the wafer is removed by using the surface tension, and the water on the surface of the wafer is removed by using the marangoni effect until the wafer is completely separated from the water surface;

d. Drain (Drain) As shown in FIG. 5, drain water below the wafer to prevent the excessive concentration of water vapor in the system from affecting the wafer drying effect;

e. Drying (Dry) As shown in FIG. 6, the wafer surface is dried using Hot nitrogen (Hot N ₂) and excess isopropyl alcohol is removed, wherein the upper shower port 6 is used to Dry the wafer and the lower shower port 5 is used to Dry the contact point.

During the cleaning process, the wafer and the liquid interface 100 move relatively, and the integrity of the liquid interface 100 is affected by the contact point between the carrier 4 and the wafer, resulting in poor water removal effect near the contact point. This is because the contact point between the carrier 4 and the wafer is raised to deteriorate the stability of the liquid interface 100, affect the drying effect of the contact point region, and cause defects in the contact point region due to the liquid residue. Moreover, if the cleanliness of the contact point between the carrier and the wafer is poor during long-term use, the patterns on the wafer surface at the contact point may have particles aggregated, which reduces the yield of products and even leads to the risk of scrapping the products.

It is easily conceivable to those skilled in the art that in order to avoid the influence of the contact position of the carrier with the wafer on the drying effect, a manner of adding a water absorbing material at the contact point is adopted, but the negative influence of the contact point on the drying effect cannot be thoroughly solved because the carrier is still in contact with the wafer.

In order to solve the above-mentioned problems, as shown in fig. 7, a semiconductor cleaning apparatus for wafer cleaning is disclosed. The semiconductor cleaning apparatus includes a process tank 10, a first support structure 20, a second support structure 30, and a drying tank 40. As shown in fig. 7, the process tank 10 is used for containing liquid, the drying tank 40 is fastened on the process tank 10, the first support structure 20 is movably arranged in the process tank 10, the first support structure 20 is used for placing a wafer, and the first support structure 20 is moved to enable the wafer to descend into the process tank 10 or to be lifted to a position partially separated from the liquid interface 100. The second support structure 30 is disposed in the drying tub 40 above the process tub 10, wherein the second support structure 30 includes at least one pair of oppositely disposed support assemblies 31, and the second support structure 30 has a support state and a avoidance state. In the avoidance state of the second support structure 30, the two oppositely disposed support members avoid the wafer so that the wafer can move to a position partially separated from the liquid interface 100, and in the support state of the second support structure 30, the two oppositely disposed support members are supported on the portion of the wafer separated from the liquid interface 100 so that the wafer positioned at the position partially separated from the liquid interface 100 is separated from the first support structure 20 and the liquid interface 100.

Specifically, as shown in fig. 15, in use, the first support structure 20 is first positioned at the notch of the process tank 10, and at this time, the second support structure 30 (see fig. 9) is in a retracted state, so that the wafer passes through and is supported on the first support structure 20. After the wafer is supported on the first support structure 20, the first support structure 20 is lowered to immerse the wafer in the liquid in the process tank 10 for pre-cleaning and cleaning, as shown in fig. 16. As shown in fig. 17, during the cleaning process, the first support structure 20 drives the wafer to rise, so that the wafer moves to a position partially separated from the liquid interface 100, and at this time, the second support structure 30 is kept in the avoidance state for facilitating the passage of the wafer. As shown in fig. 18, when the wafer is mostly separated from the liquid interface 100, the second support structure 30 is switched to a support state, and at this time, two opposite support assemblies 31 are supported on the portion of the wafer separated from the liquid interface 100, so that the wafer is fixed between the two support assemblies 31, after the first support structure 20 descends, the portion of the wafer located under the liquid interface 100 is separated from the first support structure 20 due to the fixation of the support assemblies 31, and since the bottom of the wafer is separated from the first support structure 20, there is no contact point between the wafer and the first support structure 20 in the subsequent separation process of the wafer and the liquid interface 100, and damage of the contact point to the integrity of the liquid interface 100 is completely eliminated, so that a better drying effect can be obtained at all positions on the wafer.

According to the semiconductor cleaning device, the second supporting structure 30 is arranged in the drying groove 40, and is matched with the lifting of the first supporting structure 20, so that after a part of a wafer is separated from the liquid interface 100, the wafer is fixed on the part of the wafer separated from the liquid interface 100 through the supporting component 31 of the second supporting structure 30, the first supporting structure 20 is separated from the part of the wafer positioned below the liquid interface 100, the rest part of the wafer does not have a contact point with the first supporting structure 20 in the process of separating from the liquid interface 100 later, the damage of the contact point to the integrity of the liquid interface 100 is completely eliminated, and a good drying effect can be obtained at all positions on the wafer. The cleanliness of the surface of the wafer and the product yield are improved. Meanwhile, the influence of the added device on the cleanliness of the wafer is avoided, and the maintenance cost of the process tank 10 is reduced.

It should be noted that, in the specific implementation, the support assemblies 31 may be a pair, but this is not limitative, and in some other embodiments not shown in the drawings, the support assemblies 31 may be a plurality of pairs, and the support assemblies 31 are disposed in pairs and the support assemblies 31 in the same pair are opposite to each other, that is, as long as the support assemblies 31 are at least one pair disposed opposite to each other, in the avoidance state of the second support structure 30, the support assemblies 31 in the same pair avoid the wafer so that the wafer moves to a position partially separated from the liquid interface 100, and in the support state of the second support structure 30, the support assemblies 31 in the same pair abut against the portion separated from the liquid interface 100, so that the structure separated from the first support structure 20 and the liquid interface 100 in the position partially separated from the liquid interface 100 is within the protection scope of the present utility model.

The support assembly 31 includes a mounting seat 311 and a support plate 312. The mounting seat 311 is arranged above the process tank 10, the supporting plate 312 is movably connected to the mounting seat 311, and in the two oppositely arranged supporting components 31, the two supporting plates 312 are oppositely arranged, and the distance between the oppositely arranged supporting plates 312 is variable. Through the movable connection of the supporting plates 312 on the mounting seat 311, the distance between the two supporting plates 312 can be changed through the relative movement between the two supporting plates 312 which are oppositely arranged, so that the switching of the second supporting structure 30 between the supporting state and the avoiding state is realized.

Specifically, as shown in fig. 8 and 9, in the first embodiment of the present utility model, the support plate 312 is rotatably disposed on the mount 311, and the rotation axis of the support plate 312 is disposed in the horizontal direction, that is, when the support plate 312 supports the wafer, the rotation axis of the support plate 312 is oriented vertically to the wafer, and the rotation axes of the two support plates 312 disposed opposite to each other are parallel to each other, and the support plate 312 is disposed to extend in the direction of the rotation axis, that is, the length direction of the support plate 312 is identical to the direction of the rotation axis. The oppositely disposed support plates 312 are moved away from or toward each other by rotating about their respective axes of rotation to expand or contract the distance between the oppositely disposed support plates 312.

As shown in fig. 8, in the supported state of the second support structure 30, the two support plates 312 are moved closer to each other by rotating the support plates 312 about their respective rotation axes, and the distance between the two support plates 312 is reduced, so that the support plates 312 are supported on the portions of the wafer separated from the liquid interface 100, thereby fixing the wafer between the two support plates 312.

In the retracted state of the second support structure 30, as shown in fig. 9, the two support plates 312 are moved away from each other by rotating the support plates 312 about their respective axes of rotation, and the distance between the support plates 312 is increased to a distance greater than the diameter of the wafer so that the wafer passes through and moves to a position partially out of the liquid interface 100.

It will be appreciated that in this embodiment, the second support structure 30 further includes a first motor disposed on the mounting base 311, and the first motor is drivingly connected to the support plate 312 to drive the support plate 312 to rotate about its own axis of rotation. For example, the supporting plate 312 is connected to the mounting seat 311 through a rotating shaft, and an output shaft of the first motor is in driving connection with the rotating shaft of the supporting plate 312, so as to realize rotation of the supporting plate 312.

It should be noted that, in the first embodiment, the support plate 312 is rotatably provided on the mounting seat 311, but this is not limitative. In some other embodiments, the support plate 312 may also be coupled to the mount 311 in other ways.

Specifically, in the second embodiment of the present utility model shown in fig. 10 and 11, a semiconductor cleaning apparatus is also disclosed, the structure of which is substantially the same as that of the first embodiment, except that in the present embodiment, the support plates 312 are retractably provided on the mounting base 311 in the horizontal direction, and the two support plates 312 disposed opposite to each other are moved closer to or farther from each other by retraction to reduce or enlarge the distance between the support plates 312 disposed opposite to each other.

As shown in fig. 10, in the support state of the second support structure 30, the two support plates 312 are moved closer to each other to reduce the distance therebetween, so that the two support plates 312 are supported on the portion of the wafer separated from the liquid interface 100, thereby fixing the wafer between the two support plates 312.

In the retracted state of the second support structure 30, as shown in fig. 11, the two support plates 312 are moved away from each other to expand the gap to a larger diameter than the wafer, allowing the wafer to pass and move to a position partially out of the liquid interface 100.

It will be appreciated that in this embodiment, the first motor is used to drive the support plate 312 to horizontally extend and retract, for example, a rack may be provided on the support plate 312, a gear engaged with the rack is provided on an output shaft of the first motor, and the first motor is rotated to drive the support plate 312 to horizontally translate, thereby realizing extension and retraction.

It can be seen that the above structures belong to the support plates 312 movably connected to the mounting seat 311, and the two support plates 312 of the same pair of support assemblies 31 on the second support structure 30 are oppositely arranged, in the avoidance state of the second support structure 30, the distance between the oppositely arranged support plates 312 is enlarged to allow the wafer to pass through and move to a position partially separated from the liquid interface 100, and in the support state of the second support structure 30, the distance between the oppositely arranged support plates 312 is reduced to allow the support plates 312 to be supported on the portion separated from the liquid interface 100. Therefore, the structure of the above-mentioned case is included in the protection scope of the present utility model.

As shown in fig. 12, in the first embodiment, the edge position of the supporting plate 312 is provided with the clamping grooves 313 matched with the wafer, the clamping grooves 313 of the oppositely arranged supporting plate 312 are arranged in a one-to-one correspondence, and in the supporting state of the second supporting structure 30, the area for fixing the wafer is formed between the two corresponding clamping grooves 313. Further, in the present embodiment, the plurality of the clamping grooves 313 are formed and zigzag-shaped on the supporting plate 312 along the length direction (i.e. the direction perpendicular to the wafer) of the supporting plate 312. As shown in fig. 13, the clamping grooves 313 are in V-shaped structures, the distance between the bottom sharp corners of two adjacent clamping grooves 313 is d, the value range of d is 4mm-6mm (including the end point value), and preferably, d is 5mm.

It should be noted that, in the above embodiment, in the supporting state of the second supporting structure 30, the distance between the two oppositely disposed supporting members 31 is smaller than the diameter of the wafer so that the two oppositely disposed supporting plates 312 abut against and support the wafer, and in the avoiding state of the second supporting structure 30, the distance between the two oppositely disposed supporting members 31 is larger than the diameter of the wafer so that the two oppositely disposed supporting plates 312 avoid the wafer. The distance between the two support assemblies 31 refers to the minimum distance between two positions for supporting the wafer on the two support plates 312 disposed opposite to each other among the two support assemblies 31.

As shown in fig. 8, in the present embodiment, in the supported state of the second support structure 30, the support plate 312 is supported at an edge position near the bottom in the wafer vertical direction, preferably at a top-to-bottom 2/3 position. The position can more firmly support the wafer and prevent instability caused by overhigh center of the wafer.

It should be noted that, in the present embodiment, the second support structure 30 further includes a guiding portion 32, the guiding portion 32 is disposed in the drying tank 40, the guiding portion 32 is disposed in one-to-one correspondence with the supporting component 31, the supporting component 31 is disposed on the corresponding guiding portion 32 in a liftable manner, and the supporting component 31 is used for separating the wafer from the first support structure 20 and the liquid interface 100 by lifting.

Specifically, in the first embodiment shown in fig. 8, two guide portions 32 are provided on the left and right sides in fig. 8, respectively. The two support members 31 are slidably coupled to the respective guide portions 32. Each guide portion 32 includes two oppositely disposed guide rails spaced apart along the length of the support plate 312, and each guide rail is disposed along a vertical direction. The two mounting seats 311 are arranged, each mounting seat 311 is movably arranged on one guide rail, two ends of the length direction of the supporting plate 312 are respectively connected with one mounting seat 311 and are slidably connected on the guide rail through the mounting seats 311, and the mounting seats 311 realize lifting of the supporting plate 312 by moving along the guide rail.

It will be appreciated that a driving device may be further disposed on the guiding portion 32, where the driving device is in driving connection with the mounting seat 311, so as to drive the mounting seat 311 to move along the guide rail by using the driving device, thereby lifting the supporting plate 312.

When in use, when the wafer is supported by the second support structure 30, the supporting plate 312 supports the wafer to separate the bottom of the wafer from the first support structure 20, and then the supporting components 31 supported on both sides of the wafer synchronously drive the wafer to lift up to completely separate the bottom of the wafer from the liquid interface 100, because the bottom of the wafer is already separated from the first support structure 20 at this time, there is no contact point, and damage of the contact point to the integrity of the liquid interface 100 is completely eliminated, so that better drying effect can be obtained at all positions on the wafer.

It will be appreciated that there are various ways in which the driving device cooperates with the mounting seat 311 to move along the guide rail, for example, in this embodiment, the driving device includes a second motor and a screw, a driving shaft of the second motor is connected with the screw to drive the screw to rotate, the screw is threaded on the mounting seat 311 and cooperates with the mounting seat 311, and the second motor drives the mounting seat 311 to move along the guide rail by rotating the screw, so as to realize lifting of the supporting component 31. However, this is not limitative, and in some other embodiments not shown in the drawings, the driving device may be other driving mechanisms, as long as the driving mechanism can realize the sliding movement of the driving seat 311, which is within the scope of the present utility model.

It should be noted that, in the present embodiment, the wafer is separated from the liquid interface 100 by lifting the support assembly 31 to separate the wafer from the liquid interface 100, but this is not limitative, and in some other embodiments not shown in the drawings, the guide portion 32 may be replaced by a fixing bracket, and the support assembly 31 may be disposed on the fixing bracket, that is, the support assembly may not be lifted. After the first support structure 20 moves the wafer to a position where the wafer is partially separated from the liquid interface 100, the second support structure 30 is switched to a support state, and the support assembly 31 is abutted against the portion where the wafer is separated from the liquid interface 100 to fix the wafer, and after the first support structure 20 descends, the position of the liquid surface can be lowered, so that the position of the liquid interface 100 is gradually lowered, and the rest portion of the wafer is separated. Therefore, the above structure is also within the scope of the present utility model.

As in the first embodiment shown in fig. 8 and 9, the semiconductor cleaning apparatus further includes a cleaning member 50 above the supporting member 31 for cleaning the supporting member 31.

Specifically, as shown in FIG. 14, the cleaning assembly 50 includes a duct 51 and a spray head 52, the duct 51 being connected to the top of the two rails so that the duct 51 is supported by the two rails, the spray head 52 being provided on the duct 51, the spray head 52 being for spraying the cleaning liquid to the support assembly 31. The number of the spray heads 52 is plural, the spray heads 52 are arranged at intervals along the extending direction of the guide pipe 51, and the positions of the spray heads 52 are arranged in one-to-one correspondence with the positions of the clamping grooves 313. Each spray head 52 can spray mist-like deionized water, and the spray angle covers the contact part of the upper support plate 312 and the wafer, in this way, the support plate 312 can be cleaned by the spray heads 52, so that the potential pollution risk to the wafer caused by the position of the support plate 312, which is in contact with the wafer, after long-term use is avoided, the service life of the process tank 10 is prolonged, and the maintenance cost is reduced. Preferably, a single conduit 51 contains between 10 and 50 sprayers 52.

As shown in fig. 15 to 19, the semiconductor cleaning apparatus of the first embodiment further includes a shower device 60, a liquid inlet 70, and a liquid outlet 80. As shown in fig. 15, a drying chamber 41 is formed between the drying tank 40 and the process tank 10, the second support structure 30 is positioned in the drying chamber 41, the spraying device 60 is arranged at the top of the drying chamber 41 and above the second support structure 30 so as to spray isopropyl alcohol or blow hot nitrogen gas to the wafer below, and the liquid inlet 70 and the gas outlet are arranged at the bottom of the process tank 10 for liquid inlet and discharge.

The following describes the specific process flow of the semiconductor cleaning apparatus according to the first embodiment of the present utility model in detail with reference to fig. 15 to 19:

1. Wafer placement as shown in fig. 15, a wafer is placed on the first support structure 20 and placed into the process tank 10 through the first support structure 20. In order to facilitate the placement of the wafer into the process tank 10, the second support structure 30 is in an avoidance state;

2. Pre-cleaning, as shown in fig. 16, injecting high-flow ultrapure water through the liquid inlet 70 for overflow, and simultaneously continuously spraying isopropanol downwards by the spraying device 60, wherein the isopropanol reaches the water surface to form a film, so that two liquid interfaces 100 with different surface tension are formed with the water, and the second supporting structure 30 is still in an avoidance state;

3. In the process of spraying isopropyl alcohol downwards by the spraying device 60, as shown in fig. 17, the wafer is slowly lifted by the first supporting structure 20, the wafer and the liquid interface 100 move relatively, the surface dirt of the wafer is removed by using the surface tension, the water on the surface of the wafer is removed by using the marangoni effect, meanwhile, a small part of the wafer is separated from the liquid interface 100 and is positioned above the liquid interface 100, and a large part of the wafer is still positioned below the liquid interface 100 and continuously rises under the drive of the first supporting structure 20. Because the contact point between the first support structure and the wafer is still at the liquid interface 100 at this time, the liquid interface 100 is not damaged, and a good drying effect can be maintained;

4. as shown in fig. 18, when the wafer is mostly separated from the liquid interface 100 by the driving of the first support structure 20, the second support structure 30 is switched to a supporting state, and at this time, two opposite support assemblies 31 are propped against the portion of the wafer separated from the liquid interface 100, so as to fix the wafer between the two support assemblies 31, so that the first support structure 20 is separated from the wafer by descending, and the support assemblies 31 are lifted along the guiding portion 32, so that the bottom of the wafer is separated from the liquid interface 100. Because the supporting position of the supporting component 31 is above the liquid interface 100, the liquid interface 100 is not damaged due to water outlet at the contact point, and a good drying effect can be maintained;

5. Liquid draining, as shown in FIG. 19, the liquid below the wafer is drained through the liquid draining port 80, so that the influence of the too high concentration of water vapor in the system on the drying effect of the wafer is prevented;

6. and drying, namely blowing hot nitrogen into the drying cavity 41 through the spraying device 60 after the liquid discharge is finished, so that the surface of the wafer is dried, and the superfluous isopropanol is removed.

It can be seen that the damage to the integrity of the liquid interface 100 caused by the contact point between the first support structure 20 and the wafer is completely eliminated during the whole drying process, so that a good drying effect can be obtained at all positions on the wafer. The utility model avoids the damage of mechanical contact points to the marangoni drying liquid interface 100 in the wafer drying process by improving the wafer transmission mode and the drying process of the process tank 10, effectively improves the wafer drying effect, and improves the surface cleanliness of the wafer and the product yield. Meanwhile, the influence of the added devices on the cleanliness of the wafer is avoided, and the maintenance cost of the process tank 10 is reduced.

In addition, the present utility model can clean the support plate 312 in order to prevent the contamination of the support plate 312 during long-term use from causing particle problems on the wafer surface. The specific process is as follows,

1. The water draining process is to drain deionized water in the process tank 10 to prevent sprayed water from splashing back to the upper part of the process tank 10 after contacting the water surface in the cleaning process of the supporting plate 312;

2. The cleaning process comprises the steps that a supporting plate 312 stretches out, a spray head 52 above the supporting plate 312 sprays deionized water to the surface of the supporting plate 312 for cleaning, and the waste water is discharged through a drainage pipeline at the bottom of a process tank 10;

3. A drying process, in which the supporting plate 312 still keeps an extended state, hot nitrogen is injected into the groove to dry the supporting plate 312, and then the supporting plate 312 is restored to a retracted state;

4. and (3) water injection, namely injecting water into the process tank 10 until the tank body is full.

5. The water draining process, namely draining the water in the process tank 10, wherein the steps 4 and 5 are used for cleaning the tank body for preventing the dirt on the supporting plate 312 from being washed into the process tank 10 to pollute the tank body;

6. And (3) water filling, namely filling the process tank 10 until the tank body is full, cleaning the supporting plate 312, and recovering the process tank 10 to a state allowing the drying process to be carried out.

By arranging the cleaning component 50, the semiconductor cleaning equipment avoids the potential pollution risk to the wafer after the supporting component 31 is used for a long time, prolongs the service life of the drying tank and reduces the maintenance cost.

It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present utility model, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the utility model, and are also considered to be within the scope of the utility model.

Claims (10)

1. A semiconductor cleaning apparatus, comprising:

A process tank (10) for containing a liquid;

a drying groove (40) which is buckled on the process groove (10);

a first support structure (20) movably disposed within the process tank (10) for supporting a wafer and moving the wafer to a position partially out of the liquid interface (100);

A second support structure (30) disposed within the drying trough (40), the second support structure (30) comprising at least one pair of oppositely disposed support assemblies (31), the second support structure (30) having a support state and a stowed state;

In the avoidance state of the second support structure (30), the two oppositely arranged support assemblies (31) avoid the wafer so that the wafer moves to a position partially separated from the liquid interface (100);

In the supporting state of the second supporting structure (30), two supporting components (31) which are oppositely arranged are supported on the part of the wafer separated from the liquid interface (100) so as to separate the wafer positioned at the position of being partially separated from the liquid interface (100) from the first supporting structure (20) and the liquid interface (100).

2. The semiconductor cleaning apparatus according to claim 1, wherein the support assembly (31) comprises:

The mounting seat (311) is arranged above the process groove (10);

The support plates (312) are movably connected to the mounting seats (311), and in the two support assemblies (31) which are oppositely arranged, the two support plates (312) are oppositely arranged, and the distance between the oppositely arranged support plates (312) is variable.

3. The semiconductor cleaning apparatus of claim 2, wherein,

The supporting plates (312) are rotatably arranged on the mounting seat (311), the rotation axes of the supporting plates (312) are arranged along the horizontal direction, and the rotation axes of the two oppositely arranged supporting plates (312) are parallel to each other;

The oppositely disposed support plates (312) are moved away from or toward each other by being rotated about respective axes of rotation to expand or contract the distance between the oppositely disposed support plates (312).

4. The semiconductor cleaning apparatus of claim 2, wherein,

The supporting plates (312) are arranged on the mounting seat (311) in a telescopic manner in the horizontal direction, and the two oppositely arranged supporting plates (312) are mutually close to or far away from each other through telescopic manner so as to reduce or enlarge the distance between the oppositely arranged supporting plates (312).

5. A semiconductor cleaning apparatus according to any one of claims 2 to 4,

The edge position of the supporting plate (312) is provided with clamping grooves (313) matched with the wafer, the clamping grooves (313) of the supporting plate (312) which are oppositely arranged are arranged in a one-to-one correspondence mode, and an area for fixing the wafer is formed between the two corresponding clamping grooves (313) in the unfolded state of the second supporting structure (30).

6. The semiconductor cleaning apparatus of claim 5, wherein,

The plurality of clamping grooves (313) are formed, and the plurality of clamping grooves (313) are arranged on the supporting plate (312) along the length direction of the supporting plate (312) and form a zigzag structure.

7. The semiconductor cleaning apparatus of claim 1, wherein,

In the supporting state of the second supporting structure (30), the distance between the two opposite supporting components (31) is smaller than the diameter of the wafer;

in the avoidance state of the second support structure (30), the distance between the two opposite support assemblies (31) is larger than the diameter of the wafer.

8. The semiconductor cleaning apparatus of claim 1, wherein the second support structure (30) further comprises:

The guide parts (32) are arranged in the drying grooves (40), the guide parts (32) are arranged in one-to-one correspondence with the supporting components (31), the supporting components (31) are arranged on the corresponding guide parts (32) in a lifting mode, and the supporting components (31) are used for enabling the wafer to be separated from the first supporting structure (20) and the liquid interface (100) through lifting.

9. The semiconductor cleaning apparatus of claim 8, wherein the cleaning apparatus further comprises:

And the cleaning assembly (50) is arranged above the supporting assembly (31) and is used for cleaning the supporting assembly (31).

10. The semiconductor cleaning apparatus of claim 9, wherein,

The guide part (32) comprises two guide rails which are oppositely arranged, and the support component (31) is respectively and slidably connected to the two guide rails;

The cleaning assembly (50) comprises a guide pipe (51) and a spray head (52), wherein the guide pipe (51) is connected between the two guide rails, the spray head (52) is arranged on the guide pipe (51), and the spray head (52) is used for spraying cleaning liquid to the supporting assembly (31).