CN211376654U - Silicon wafer cleaning equipment - Google Patents

Abstract

The utility model provides a silicon wafer cleaning device, which comprises a walking arm and a cleaning device installed on the side of the walking arm. The cleaning device includes a fixing device, an air knife device installed on the fixing device, and a silicon wafer support A device, an induction device installed on the silicon wafer support device, and a control device connected with the induction device by telecommunication or signal, the control device controls the opening and closing of the air knife device. Compared with the prior art, in the present invention, an induction device for sensing silicon wafers is arranged on the cleaning device, so that the cleaning device automatically cleans the silicon wafers through the induction of the induction device, thereby avoiding the waste of compressed air and reducing the generation of compressed air. noise and effectively remove the dirt on the surface of the silicon wafer.

Description

Wafer Cleaning Equipment

technical field

The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer cleaning device.

Background technique

With the vigorous development of new energy sources, solar energy has received more and more attention due to its reliability, safety, environmental protection, resource adequacy and other characteristics. In the context of vigorously promoting and using solar green energy, the demand for solar cells is also increasing rapidly.

In the production process of solar cells, silicon wafer screen printing, as the most important, critical and most delicate part of the whole process, has very high requirements on the cleanliness of the surface of silicon wafers. Screen printing includes several processes of printing-drying-printing-drying-printing-sintering. When the silicon wafer is dried in a drying oven, the surface of the silicon wafer will inevitably stick to residual organic dust and other contamination.

At the same time, after the silicon wafer is moved by the walking arm, its contact with the walking arm will cause contamination on the surface of the silicon wafer. If the surface of the silicon wafer is dirty, when the silicon wafer is moved under the printing screen for printing, the grid will be broken in light, and the mesh will be broken in heavy.

In view of this, it is indeed necessary to provide a silicon wafer cleaning device to solve the above problems.

Utility model content

The purpose of the utility model is to provide a silicon wafer cleaning device which can effectively clean the dirt on the surface of the silicon wafer.

To achieve the above object, the utility model adopts the following technical solutions:

A silicon wafer cleaning device includes a walking arm and a cleaning device installed on the side of the walking arm, the cleaning device includes a fixing device, an air knife device installed on the fixing device, a silicon wafer supporting device, and a cleaning device installed on the fixing device. An induction device on the silicon wafer supporting device and a control device connected with the induction device by telecommunication or signal, the control device controls the opening and closing of the air knife device.

As a further improved technical solution of the present invention, the air knife device is in gas communication with the high-pressure gas supply device, and the high-pressure gas provided by the high-pressure gas supply device is blown toward the silicon wafer through the air knife device.

As a further improved technical solution of the present invention, the air knife device includes an air knife main body and a plurality of air knife nozzles installed on the air knife main body, and the air knife main body is in air communication with the air knife nozzles.

As a further improved technical solution of the present invention, the length of the air knife body is substantially the same as the length of the silicon wafer.

As a further improved technical solution of the present invention, the fixing device includes a cover plate located on the side of the walking arm, two bases installed on the cover plate, and a connecting rod installed on the two bases.

As a further improved technical solution of the present invention, the upper end of the cover plate is inclined toward the direction of the traveling arm, and the base and the connecting rod are installed on the upper end of the cover plate.

As a further improved technical solution of the present invention, one end of the connecting rod is rotatably connected with the base, and the other end is rotatably connected with the air knife device.

As a further improved technical solution of the present invention, the cover plate is provided with a slide rail extending along the length of the cover plate, and the base and the silicon wafer support device can slide along the slide rail.

As a further improved technical solution of the present invention, the control device includes a signal amplifier and a solenoid valve installed on the high-pressure gas supply equipment, and the induction device, the signal amplifier and the solenoid valve are sequentially connected by telecommunication or signal; the induction device is Infrared sensor device.

As a further improved technical solution of the present invention, there are two cleaning devices, and the two cleaning devices are respectively arranged on both sides of the walking arm.

The beneficial effect of the utility model is that: by arranging an induction device for sensing silicon wafers on the cleaning device, the cleaning device can automatically clean the silicon wafers through the induction of the induction device, thereby avoiding the waste of compressed air and reducing the noise generated by the compressed air. And effectively remove the dirt on the surface of the silicon wafer.

Description of drawings

FIG. 1 is a schematic diagram of the silicon wafer cleaning equipment of the present invention.

FIG. 2 is a schematic diagram of the cleaning device of the present invention.

FIG. 3 is an enlarged view of part A in FIG. 2 .

Detailed ways

In order to make the objectives, technical solutions and advantages of the present utility model more clear, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

Referring to FIG. 1 , the silicon wafer cleaning device of the present invention includes a walking arm 1 and a cleaning device 2 installed on the side of the walking arm 1 . The silicon wafer 3 is placed on the walking arm 1, and the walking arm 1 can drive the silicon wafer 3 to move, and can move the silicon wafer 3 to the cleaning device 2 for cleaning.

Referring to FIG. 2 , the cleaning device 2 includes a fixing device 21 , an air knife device 22 , a silicon wafer supporting device 23 , a sensing device 24 and a control device 25 . The cleaning device 2 is mainly used to clean the dirt on the surface of the silicon wafer 3, and has high cleaning efficiency and cleanliness, simple structure and convenient operation.

2 and 3 , the fixing device 21 is mainly used to fix the air knife device 22 on the side of the walking arm 1 , and includes a cover plate 211 , two bases 212 and connecting rods installed on the two bases 212 213. The cover plate 211 is located on the side of the walking arm 1, and its upper end is inclined toward the direction of the walking arm 1, so that the silicon wafer 3 placed on the silicon wafer support device 23 is staggered from the air knife device 22, so as to prevent the silicon wafer 3 from being lifted upwards. When moving, it collided with the air knife device 22. In addition, the upper end of the cover plate 211 is provided with a sliding rail 210 extending along the length of the cover plate 211 .

The two bases 212 are mounted on the upper end of the cover plate 211 and can slide along the slide rail 210 , thereby driving the air knife device 22 to move along the slide rail 210 . One end of the connecting rod 213 is rotatably connected with the base 212 through the bolt 214, and the other end is also rotatably connected with the air knife device 22 through the bolt 214, so that the air knife device 22 can be rotated 360 degrees, and the cleaning operation in any direction can be carried out, thereby satisfying multiple needs. Cleaning of dimensional, multi-angle wafers 3.

The air knife device 22 is installed on the fixing device 21 , which is in gas communication with the high-pressure gas supply device 4 , and the high-pressure gas provided by the high-pressure gas supply device 4 can be blown toward the silicon wafer 3 through the air knife device 22 . The air knife device 22 includes an air knife main body 221 and a plurality of air knife nozzles 222 mounted on the air knife main body 221 , and the air knife main body 221 is in air communication with the air knife nozzles 222 . The length of the air knife main body 221 is substantially the same as the length of the silicon wafer 3 , so that each area on the silicon wafer 3 can be cleaned at one time, and the cleaning efficiency is high. Compared with the general air-knife blowing holes, the air-knife nozzle 222 can effectively increase the blowing speed of the compressed air, so that some relatively firm dirt on the surface of the silicon wafer 3 can also be removed, with high cleanliness.

Referring to FIG. 2 , the silicon wafer supporting device 23 is installed on the upper end of the cover plate 211 , and is mainly used for carrying and supporting the silicon wafer 3 . The sensing device 24 is installed on the silicon wafer supporting device 23 , and is mainly used for sensing whether the silicon wafer 3 is carried on the silicon wafer supporting device 23 . In addition, the sensing device 24 is an infrared sensing device, and the sensing is relatively sensitive.

The control device 25 is mainly used to control the opening and closing of the air knife device 22, and it includes a signal amplifier 251 and a solenoid valve 252 installed on the high-pressure gas supply equipment 4. The induction device 24, the signal amplifier 251 and the solenoid valve 252 are connected in turn by telecommunication or signal . The induction device 24 transmits the induction signal to the signal amplifier 251, and the signal amplifier 251 amplifies the signal and transmits it to the solenoid valve 252. The solenoid valve 252 controls the opening and closing of the high-pressure gas supply device 4 through different induction signals, thereby controlling the operation of the air knife device 22. Opening and closing.

When the silicon wafer 3 is not moved to the wafer support device 23, the solenoid valve 252 is closed, and the air knife device 22 stops purging; when the wafer 3 is moved to the wafer support device 23, the solenoid valve 252 is opened, and the air knife device 22 Start purging, thus avoiding the waste of compressed air and reducing the noise produced by compressed air.

In the present invention, there are two cleaning devices 2 , and the two cleaning devices 2 are respectively arranged on both sides of the walking arm 1 . When the walking arm 1 drives the silicon wafer 3 to move onto the cleaning device 2 , the cleaning device 2 cleans the silicon wafer 3 from both ends to the middle. Using this cleaning method, on the one hand, the cleaning device 2 can clean the entire surface of the silicon wafer 3; on the other hand, the two ends of the silicon wafer 3 are the supporting positions of the silicon wafer supporting device 23, which can effectively prevent the silicon wafer from being damaged during high-pressure gas cleaning. slice 3.

To sum up, the present invention provides a silicon wafer cleaning device, which includes a walking arm 1 and a cleaning device 2 installed on the side of the walking arm 1 . The silicon wafer cleaning equipment sets the sensing device 224 for sensing the silicon wafer 3 on the cleaning device 2, so that the cleaning device 2 automatically cleans the silicon wafer 3 through the induction of the sensing device 24, thereby avoiding the waste of compressed air and reducing the generation of compressed air. noise and effectively remove the dirt on the surface of the silicon wafer 3.

Terms such as "upper," "lower," "left," "right," "front," "rear," etc. used herein to indicate spatially relative positions are for ease of illustration to describe the figures as shown in the accompanying drawings. The relationship of one feature with respect to another feature. It can be understood that, according to different placement positions of products, the terms of relative positions in space may be intended to include different orientations other than those shown in the figures, and should not be construed as limitations on the claims.

In addition, the above embodiments are only used to illustrate the present utility model rather than limit the technical solutions described in the present utility model. The understanding of this specification should be based on those skilled in the art, although this specification refers to the above-mentioned embodiments to the present utility model. It has been described in detail, however, those skilled in the art should understand that those skilled in the art can still modify or equivalently replace the present invention, and all technical solutions that do not depart from the spirit and scope of the present invention and The improvements thereof should be covered within the scope of the claims of the present invention.

Claims (10)

1. A silicon wafer cleaning device, comprising a walking arm and a cleaning device installed on the side of the walking arm, is characterized in that: the cleaning device comprises a fixing device, an air knife device installed on the fixing device, a silicon A wafer support device, an induction device installed on the silicon wafer support device, and a control device connected with the induction device by telecommunication or signal, the control device controls the opening and closing of the air knife device. 2 . The silicon wafer cleaning device according to claim 1 , wherein the air knife device is in gas communication with a high-pressure gas supply device, and the high-pressure gas provided by the high-pressure gas supply device is blown toward the silicon wafer through the air knife device. 3 . 3. The silicon wafer cleaning device according to claim 1, wherein the air knife device comprises an air knife main body and a plurality of air knife nozzles installed on the air knife main body, the air knife main body and the air knife are shown The nozzle is in gas communication. 4 . The silicon wafer cleaning apparatus according to claim 3 , wherein the length of the air knife body is substantially the same as the length of the silicon wafer. 5 . 5 . The silicon wafer cleaning device according to claim 1 , wherein the fixing device comprises a cover plate located on the side of the walking arm, two bases installed on the cover plate, and two bases installed on the two bases. 6 . the connecting rod. 6 . The silicon wafer cleaning device according to claim 5 , wherein the upper end of the cover plate is inclined toward the direction of the traveling arm, and the base and the connecting rod are installed on the upper end of the cover plate. 7 . 7 . The silicon wafer cleaning device according to claim 5 , wherein one end of the connecting rod is rotatably connected with the base, and the other end is rotatably connected with the air knife device. 8 . 8 . The silicon wafer cleaning apparatus according to claim 5 , wherein the cover plate is provided with a slide rail extending along the length of the cover plate, and the base and the silicon wafer support device can slide along the slide rail. 9 . 9 . The silicon wafer cleaning device according to claim 2 , wherein the control device comprises a signal amplifier and a solenoid valve installed on the high-pressure gas supplying device, and the induction device, the signal amplifier and the solenoid valve are telecommunication or electromagnetic valves in sequence. 10 . Signal connection; the sensing device is an infrared sensing device. 10 . The silicon wafer cleaning device according to claim 1 , wherein the number of the cleaning devices is two, and the two cleaning devices are respectively arranged on both sides of the walking arm. 11 .

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