CN222528811U - Pressure sensor - Google Patents
Pressure sensor Download PDFInfo
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- CN222528811U CN222528811U CN202421199605.3U CN202421199605U CN222528811U CN 222528811 U CN222528811 U CN 222528811U CN 202421199605 U CN202421199605 U CN 202421199605U CN 222528811 U CN222528811 U CN 222528811U
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- Prior art keywords
- pressure sensor
- circuit board
- core wire
- pressure
- installation space
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- 239000003566 sealing material Substances 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 claims description 43
- 239000011248 coating agent Substances 0.000 claims description 30
- 238000000576 coating method Methods 0.000 claims description 30
- 238000005259 measurement Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 21
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 8
- 125000006850 spacer group Chemical group 0.000 description 31
- 239000000853 adhesive Substances 0.000 description 19
- 230000001070 adhesive effect Effects 0.000 description 19
- 230000002093 peripheral effect Effects 0.000 description 12
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 238000003466 welding Methods 0.000 description 11
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- 230000035882 stress Effects 0.000 description 6
- 239000005394 sealing glass Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000005057 refrigeration Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000010485 coping Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
本实用新型提供一种压力传感器，其能够减轻施加于内置的电路基板的应力，并且实现高精度地确保液密性的构造，并可靠性高地使用。一种压力传感器，是检测测定对象的压力的传感器芯片(11)与内置于壳体(20)内的电路基板(50)连接的压力传感器(100)，其特征在于，传感器芯片以承受测定对象的压力的方式设置于液封室(LR)，电路基板以介于传感器芯片与外部设备(A)之间的方式设置于在壳体内填充密封材料(26)而液密地形成的设置空间(SR)，电路基板与向外部引出而与外部设备连接的引线(38)的芯线(C)导通连接，该芯线由包覆部(38c)包覆至设置空间的近前。
The utility model provides a pressure sensor, which can reduce the stress applied to the built-in circuit substrate, realize a structure that ensures liquid tightness with high precision, and can be used with high reliability. A pressure sensor is a pressure sensor (100) in which a sensor chip (11) for detecting the pressure of a measured object is connected to a circuit substrate (50) built in a housing (20), characterized in that the sensor chip is arranged in a liquid seal chamber (LR) in a manner to withstand the pressure of the measured object, the circuit substrate is arranged in a setting space (SR) formed by filling a sealing material (26) in the housing in a manner between the sensor chip and an external device (A), and the circuit substrate is conductively connected to a core wire (C) of a lead wire (38) led out to the outside and connected to the external device, and the core wire is covered by a covering portion (38c) to the front of the setting space.
Description
Technical Field
The present utility model relates to a pressure sensor liquid-tightly molded from resin.
Background
Various sensors for detecting pressure, temperature, and the like are fixed in the vicinity of a measurement object, are used to send detection signals to measurement equipment, and are widely used to be built in or built out of the measurement equipment.
Such various sensors can be incorporated into a sensor unit so as to be disposed in a location exposed to the same environment as the object to be measured, and may be used, for example, when it is necessary to change the electrical characteristics of the sensor chip input and output, or the like, a circuit board may be incorporated therein (see patent document 1).
Prior art literature
Patent literature
Patent document 1 Japanese patent No. 6633597
Disclosure of utility model
Problems to be solved by the utility model
However, in the pressure sensor described in patent document 1, as shown in fig. 8, a circuit board 1431 connected to a sensor chip 1121 in a case 1124 is housed in a case 1135, and the case 1135 is filled with a sealing material 1136 such as a resin material, thereby sealing the case in a liquid-tight manner.
In such a configuration, since the linear expansion coefficients of constituent materials such as the circuit board 1431, the case 1135, and the sealing material 1136 are different, when a temperature difference occurs between the inside and outside of the object to be measured, a stress corresponding to the temperature difference may occur. The stress may be a load on the circuit board 1431 itself or a component mounted on the circuit board 1431.
In the pressure sensor shown in fig. 8, for example, a lead 1433 for connecting the core wire C to the circuit board 1431 is often used to connect a lead that can be electrically connected to an external device to the circuit board.
In such a structure, the sealing material 1136 is filled to seal the case 1135 in a liquid-tight manner, but when the sealing material 1136 is filled in a state where the coating portion 1433C of the lead 1433 is in close contact with one surface side of the circuit substrate 1431, it is difficult to embed the boundary end portion of the core wire C exposed from the lead 1433, that is, the coating end portion, in the sealing material 1136 to seal in a liquid-tight manner. Further, since the lead wire has a structure in which wires having a small diameter are twisted, a minute space exists inside the core wire, and the outside air on the external device side is communicated with the circuit board portion of the pressure sensor through the minute space. For example, in a pressure sensor mounted in a refrigerant pipe in a refrigeration cycle, a temperature change of the refrigerant in the pipe accompanying the start-stop of a unit repeatedly acts. In such a case, there is a possibility that a so-called respiration occurs in which moisture in the air is immersed in the pressure sensor through the core wire due to a temperature difference between the pressure sensor main body and the external device side, a pressure difference, temperature expansion and contraction, or the like. In such a case, moisture in the atmosphere may enter the other end face side of the circuit board 1431, and short-circuiting, migration, and the like of the circuit board due to dew condensation may occur.
Accordingly, an object of the present utility model is to provide a pressure sensor that can reduce stress applied to a built-in circuit board, and that can be used with high reliability while realizing a structure that ensures liquid tightness with high accuracy.
Means for solving the problems
In order to solve the above-described problems, according to an aspect 1 of the present utility model, there is provided a pressure sensor in which a sensor for detecting a pressure of a measurement object is connected to a circuit board incorporated in a housing, wherein the sensor is disposed in a pressure chamber so as to receive the pressure of the measurement object, the circuit board is disposed in a space between the sensor and an external device, the space being filled with a sealing material and being formed in a liquid-tight manner in the housing, and the circuit board is connected to a core wire of a coating connection member led to the outside and connected to the external device, the core wire of the coating connection member being coated by a coating portion to a position immediately before the space.
In the utility model according to claim 2, the conductive core wire of the coating connection member penetrates the space formation member forming the installation space and is connected to the circuit board in a conductive manner.
In the utility model according to claim 3, the conductive core wire of the coating connection member is connected to the circuit board in a conductive manner via an external connection member penetrating a space formation member forming the installation space.
The utility model according to claim 4 is characterized in that the covered connection member is constituted by an electric wire covered with a core wire constituted by a twisted wire.
In the utility model according to claim 5, the external connection member is a component of a connector that penetrates through a space formation member that forms the installation space and is connectable to the coating connection member.
Effects of the utility model
In this way, according to one aspect of the present utility model, the mounting member of the circuit board is positioned in the installation space, contact of the sealing material can be avoided, and stress load applied to the mounting member of the circuit board can be prevented in advance. Further, since the core wire is led from the inside of the sealing material into the installation space before the connected coating connection member is coated by the coating portion to the installation space where the circuit board is installed, that is, the coating end portion of the lead wire is present in the sealing material, it is possible to prevent moisture from entering the installation space from between the coating portion and the core wire or the like, and to ensure the liquid tightness with high accuracy. Therefore, a pressure sensor that can be used with high reliability can be provided.
Drawings
Fig. 1 is a view showing a pressure sensor according to a first embodiment of the present utility model, and is a vertical cross-sectional view showing a schematic overall structure thereof.
Fig. 2 is a diagram showing a pressure sensor according to a second embodiment of the present utility model, and is a vertical cross-sectional view showing a schematic overall structure thereof.
Fig. 3 is a view showing a first other embodiment of the present embodiment, and is a vertical cross-sectional view showing a schematic overall structure thereof.
Fig. 4 is a view showing a second other embodiment of the present embodiment, and is a vertical cross-sectional view showing a schematic overall structure thereof.
Fig. 5 is a view showing a third other embodiment of the present embodiment, and is a vertical cross-sectional view showing a schematic overall structure thereof.
Fig. 6 is a view showing a fourth other embodiment of the present embodiment, and is a vertical cross-sectional view showing a schematic overall structure thereof.
Fig. 7 is a view showing a fifth other embodiment of the present embodiment, and is a vertical cross-sectional view showing a schematic overall structure thereof.
Fig. 8 is a diagram showing the prior art of the present embodiment, and is a vertical cross-sectional view showing the general overall structure thereof.
In the figure:
10-pressure sensor unit, 11-pressure sensor chip, 20, 220, 320, 420A, 420B, 520-waterproof case, 24, 124, 324, 624-spacer, 25, 325-cover member, 26, 226, 626-sealing material, 30-joint member, 38-lead wire, 38C-coating portion, 40-pin, 44-oil filling tube, 50-circuit board, 100-pressure sensor, 126-contact pin, 524-spacer, 530-connector, 531-contact member, 625-space cover, 636-double contact member, 637-single contact member, a-external device, C-core wire, SR-set space.
Detailed Description
Hereinafter, embodiments of the present utility model will be described in detail with reference to the accompanying drawings. Fig. 1 is a diagram illustrating a pressure sensor according to a first embodiment of the present utility model.
< First embodiment >
In fig. 1, a pressure sensor 100 is manufactured by attaching a pressure sensor unit 10 provided with a pressure sensor chip (sensor) 11 to a refrigerant pipe in the unit to measure the pressure of refrigerant in, for example, a refrigeration cycle, and outputting pressure information detected by the pressure sensor chip 11 to an external device a as a control device for controlling the refrigeration cycle. The pressure sensor 100 of the present embodiment is configured such that the pressure sensor unit 10 including the waterproof metal case 20 formed in a cylindrical shape can be connected to a pipe for guiding a fluid such as a gas or a liquid at a detection pressure by using, for example, the metal joint member 30.
The waterproof case 20 is fixed by welding or the like to one end surface side of a cylindrical metal case 12 having a wall thickness for housing the pressure sensor chip 11 of the pressure sensor unit 10, and a disk-shaped metal cover 28 having a joint member 30 fixed thereto is connected by welding or the like to the other end surface side of the case 12. The joint member 30 is formed with a female screw 30s so as to be screwed to a pipe or the like to be measured for pressure, and a fluid supplied from the pipe in the direction of arrow P is introduced into a pressure chamber PR, which is a space surrounded by the cover 28, the housing 12, and a diaphragm 32 described later, through a port 30a communicating with the female screw 30 s. The outer peripheral edge portions of the waterproof case 20, the housing 12, and the cover 28 are integrated with a desired bonding strength by welding from the outside by TIG welding, plasma welding, laser welding, or the like.
The housing 12 is disposed such that the column 13 having the pressure sensor chip 11 provided at one end thereof is positioned at the inner center of the inner tube, and a sealing glass 14 is formed so as to be filled between the inner surface of the housing 12 and the outer surface of the column 13, thereby securing a closed state and fixing the member penetrating the inside in a fluid-tight manner.
In the pressure sensor unit 10, a metal diaphragm 32 is bonded and fixed to a lower end surface of the housing 12. The diaphragm 32 forms an airtight pressure chamber PR on the cover 28 side, and isolates the installation space of the pressure sensor chip 11 on the pillar 13 side in the case 12 from the pressure chamber PR.
In the pressure sensor unit 10, a space for installing the pressure sensor chip 11 formed by the seal glass 14 and the diaphragm 32 in the inner tube of the housing 12 is filled with a predetermined amount of silicone oil (may be a fluorine-based inert liquid or the like) as a pressure transmission medium, and functions as the liquid seal chamber LR.
As a result, the pressure sensor chip 11 functions as a pressure sensor that detects pressure of the fluid to be detected introduced into the pressure chamber PR from the pipe to which the joint member 30 is connected, as pressure fluctuation of the pressure transmission medium in the liquid seal chamber LR, via the diaphragm 32. That is, the pressure chamber PR of the present embodiment has a structure including the liquid seal chamber LR and is configured to be able to detect the fluid pressure of the measurement target introduced from the joint member 30 by the pressure sensor chip 11. The pressure chamber may be a pressure chamber in which the fluid pressure to be measured is directly applied to the sensor chip without a liquid seal chamber, and the measurement target is not limited to a liquid, and may be a gas such as various gases or a mist gas containing minute fluid particles.
The pressure sensor chip 11 is provided with a plurality of leads (cover connection members) 38 from the external device a via bonding wires 11w, and is electrically connected to leads (lead members) 40 connected via a circuit board 50 described later, to be supplied with power, and outputs a detection signal as pressure information. The pressure transmission medium is filled in the liquid seal chamber LR between the seal glass 14 and the diaphragm 32 in the inner tube of the housing 12 via the oil filling tube 44. These leads 40 and the oil filling pipe 44 are arranged in the same circular shape at equal intervals around the support posts 13, and are supported so as to be insulated from the housing 12 via an insulator such as the sealing glass 14. The oil filling pipe 44 is closed at one end after being filled with the pressure transmission medium.
In this case, diaphragm 32 is bonded and fixed to diaphragm cover 34 having a plurality of communication holes 34a on the lower end surface of case 12, thereby preventing damage due to an external force or abrupt pressure into pressure chamber PR. A concave frame 16 is fixed to one end side of the sealing glass 14, and a cover-shaped shield plate 17 is attached thereto, and the frame 16 accommodates a pressure transmission medium so as to freely flow between the pressure sensor chip 11 side and the diaphragm 32 side via a communication hole 17a formed in the shield plate 17 to suppress rapid pressure fluctuation.
The leads 40 are arranged with two power supply terminals, one output signal terminal, and five adjustment terminals used in assembly, and are electrically connected to the pressure sensor chip 11 via bonding wires 11w, and these leads 40 are fixedly supported by the sealing glass 14 so as to protrude from one end surface side of the case 12.
One end of a resin spacer 24 formed in a short-sized substantially cylindrical shape is fitted into one end surface side of the casing 12 from one end side opening side of the waterproof casing 20, one end of the spacer 24 is abutted against one end surface of the casing 12, and a cover member (space forming member) 25 is fixed so as to close the other end side opening side of the spacer 24. With this structure, the pressure sensor unit 10 having the installation space SR of the circuit board 50 connecting the leads 40 and the leads 38 is constructed. In addition, in the waterproof case 20 of the pressure sensor unit 10, the installation space SR of the circuit board 50 is waterproof-treated and fixed by filling the sealing material 26 such as urethane resin, and the circuit board 50 is soldered to the lead wire C of the lead wire 38 and is positioned and supported. A part of the outer peripheral end portion of the circuit board 50 and the like may be fixed to the inner surface of the spacer 24 by an adhesive or the like in an auxiliary manner.
By disposing the circuit board 50 in the installation space SR formed by the case 12, the spacer 24, and the cover member 25 in the waterproof case 20, an air layer having low thermal conductivity can be formed around the circuit board 50, and rapid transmission of temperature changes from around the pressure sensor and the piping to the circuit board 50 can be prevented. In addition, the circuit board 50 itself and the mounting member mounted on the circuit board 50 are not in contact with the sealing material 26, and thus mechanical stress caused by contraction and expansion of the sealing material 26 due to a change in ambient temperature can be prevented from acting on the connection member, the mounting member, and particularly the soldered portion thereof.
The two ends of the lead 40 pass through both sides of the sealing glass 14 in the inner tube of the case 12, the pressure sensor chip 11 is connected to one end side of the liquid seal chamber LR side via the bonding wire 11w, and the other end side of the lead 40 corresponding to the power supply terminal and the output signal terminal passes through a plurality of through holes (not shown) in the circuit board 50 in the direction toward the cover member 25, and is connected to the other end side by soldering or the like.
The lead 38, which is led out so as to be connectable to the external device a, passes through the through hole 25h penetrating the cover member 25, passes through a through hole (not shown) penetrating one portion of the circuit board 50 in the direction toward the case 12, and is connected in a conductive manner by soldering or the like. The lead 38 connected to the circuit board 50 is embedded (molded) in the sealing material 26 in a state of being peeled off from the coating portion 38C around the core wire C to the position just before the cover member 25 forming the installation space SR, and the sealing material 26 is sealed reliably in a liquid-tight manner until the space between the core wire C and the coating portion 38C, i.e., the coating end portion as the boundary region. Here, through holes and the like are appropriately opened in the circuit board 50 so as to enable assembly work, and for example, insertion holes (not shown) of the oil filling pipe 44 are also opened. The connection between the lead 40 and the lead 38 may be performed by applying not only a molten metal such as solder but also an adhesive containing a conductive material, for example. As described above, the conductive connection may be performed by welding (e.g., spot welding by laser or the like) or the like in addition to the conductive connection by welding or conductive adhesive, and the means of welding is not particularly limited.
The circuit board 50 is interposed between the pressure sensor chip 11 and the external device a in series and functions as a part of a circuit configuration, and in this embodiment, a conversion adjustment circuit for adjusting input/output voltages such as different input/output voltages of the pressure sensor chip 11 and the external device a, for example, an input/output voltage such as an input voltage DC12V or a DC3.3V of the external device a becomes an operation voltage DC5V of the pressure sensor chip 11 is mounted. Such a conversion adjustment circuit is not limited to the present embodiment, and is an arbitrary conversion adjustment circuit for coping with various drive voltage and pressure detection signal modes such as a voltage output mode of a drive/output voltage different from the present embodiment, a current output mode such as a 2-wire/3-wire mode, or a digital output mode. These conversion adjustment circuits are configured by mounting a plurality of electronic components, not shown.
As described above, in the pressure sensor 100 of the present embodiment, the circuit board 50 connected in series and interposed between the pressure sensor chip 11 and the external device a is housed in the installation space SR in the waterproof case 20 that is sealed in a fluid-tight manner by filling the sealing material 26. Therefore, in the pressure sensor 100, the circuit board 50 located in the installation space SR where the spacer 24 and the cover member 25 are formed on the one end surface side of the case 12 can prevent in advance the mechanical load of direct contact of the sealing material 26 of the high-temperature resin melted at the time of production and the thermal stress due to the difference in expansion and contraction degree caused by the difference in linear expansion coefficient of the constituent materials according to the temperature change at the time of use or the like from being applied as a stress load to the board itself and the mounting member.
Further, in the pressure sensor 100, the coating portion 38C of the lead 38 connected to the circuit board 50 is peeled off before the cover member 25 forming the installation space SR, and the core wire C of the lead 38 penetrates the cover member 25 to be connected in conduction. Therefore, even if the core wire C of the lead wire 38 is twisted, the end portion of the coating portion 38C can be buried in the sealing material 26 outside the installation space SR, and even if moisture transmitted to the periphery of the core wire C is present, the situation of being immersed in the circuit board 50 side can be prevented. In the present embodiment, the core wire C is inserted into the through hole 25h of the cover member 25, but an adhesive may be further applied between the core wire C and the through hole 25h of the cover member 25. The core wire C is a stranded wire, and therefore a minute gap may be generated inside. Therefore, the adhesive is applied to the through-hole 25h to seal and fix the minute gap, whereby a double seal structure can be formed by the sealing material 26 and the adhesive. This can further prevent moisture in the atmosphere from being transferred to the minute space inside the core wire C of the lead 38 and from being immersed in the installation space SR.
As a result, the pressure sensor 100 can ensure the liquid tightness of the installation space SR in which the circuit board 50, the pins 40, and the like exist with high accuracy, and can be used with high reliability while suppressing occurrence of short circuits, migration, and the like due to dew condensation.
< Second embodiment >
Next, fig. 2 is a diagram illustrating a pressure sensor according to a second embodiment of the present utility model. Since this embodiment is substantially the same as the above-described embodiment, the same reference numerals are given to the same components, and detailed description thereof is omitted, so that the characteristic portions will be described (the same applies to other embodiments described below).
In fig. 2, in the pressure sensor 100, instead of the spacer 24 of the above embodiment, a resin spacer 124 formed in a bottomed cylindrical shape is fitted from one end side opening side of the waterproof case 20, the bottom 124b is fixed in contact with one end surface side of the housing 12, and the cover member 25 is fixed to the other end side opening side of the spacer 124, thereby constructing the pressure sensor unit 10 having the installation space SR of the circuit board 50 connecting the leads 40 and the leads 38.
In the pressure sensor 100, a step 124a is formed on the inner surface of the cylindrical inner middle section of the spacer 124, and after the assembly is performed in a state in which the peripheral edge end portion of the circuit board 50 is placed on the step 124a of the spacer 124, the opposite side opening of the case 12 is covered with the cover member 25 and the sealing material 26 is filled, whereby the installation space SR of the circuit board 50 is made into a liquid-tight structure.
In the pressure sensor 100, instead of the core wire C of the lead 38 according to the above embodiment, one end portion of the contact pin (external connection member) 126 penetrating through the through hole 25h of the cover member 25 penetrates through the through hole of the circuit board 50 in the direction toward the housing 12 and is connected in conduction by soldering or the like, and the core wire C protruding from the covered end portion of the lead 38 is connected in conduction to the other end portion of the contact pin 126 by soldering or the like.
Therefore, the lead 38, which is led out so as to be connectable to the external device a, is connected to the contact pin 126 and embedded in the sealing material 26 in a state where the coating portion 38C around the core wire C is peeled off to the front of the cover member 25 forming the installation space SR. The core wire C and the end of the coating portion 38C are sealed in a fluid-tight manner by the sealing material 26.
As described above, in the pressure sensor 100 of the present embodiment, the lead 38 is connected to the circuit board 50 via the contact pin 126 penetrating the cover member 25, and the core wire C from which the coating portion 38C of the lead 38 is peeled is conductively connected to the contact pin 126 immediately before the cover member 25 forming the installation space SR. Therefore, the pressure sensor 100 can also obtain the same operational effects as those of the above-described embodiment, and can be used with high reliability while ensuring the liquid tightness of the installation space SR with high accuracy. In the present embodiment, an adhesive may be applied to the insertion portion of the through hole 25h of the cover member 25 of the contact pin 126, as in the first embodiment. A minute gap for inserting the contact pin 126 may be generated in the through hole 25 h. Therefore, the adhesive can be applied to the through-hole 25h to seal and fix the minute gap, and thus a double seal structure can be formed by the sealing material 26 and the adhesive. This can further prevent moisture in the atmosphere from being transferred to the minute space between the contact pin 126 and the through hole 25h and from being immersed in the installation space SR.
< First other modes >
As the pressure sensor 100 according to the first other aspect of the above-described embodiment, as shown in fig. 3, instead of the metal waterproof case 20 according to the above-described embodiment, a resin waterproof case 220 is provided, which is formed in a substantially cylindrical shape extending from the entire outer peripheral surface of the housing 12 toward the joint member 30 side beyond the position of the cover 28, not only outside the installation space SR.
In this pressure sensor 100, instead of welding the waterproof case 20 and the cover 28 to the case 12 to ensure the liquid tightness, the entire waterproof case 220 made of resin is covered to ensure the liquid tightness of the pressure sensor unit 10, and the sealing material 26 is filled outside the cover member 25 on one end side of the waterproof case 220, and the sealing material 226 is filled outside the cover 28 on the other end side of the waterproof case 220 to make the space between the waterproof case and the case 12 liquid-tight.
< Second other mode >
As the pressure sensor 100 according to the second aspect of the embodiment, as shown in fig. 4, instead of the waterproof case 220 according to the other aspect, a waterproof case 320 made of a resin having a substantially cylindrical shape is attached, and the sealing materials 26 and 226 are filled in the cover member 25 on one end side and the other end side of the waterproof case 320 and the outside of the cover 28 to ensure the liquid tightness, as in the first aspect.
In this pressure sensor 100, instead of the spacer 124 described above, a bottomed cylindrical spacer 324 formed in a shape of a cylinder with one end side opening side omitted at the position (height) of the step 124a is fixed by abutting the bottom 324b against one end surface side of the case 12, and the circuit board 50 of the connection pin 40 and the lead 38 is fixed to the one end side opening side of the spacer 324.
The waterproof case 320 is formed so that a cover member 325 having substantially the same outer shape as the housing 12 can be attached, and a small diameter region 320r having a reduced diameter is formed between a portion covering the entire outer peripheral surface of the housing 12 and a portion covering the outer peripheral end portion of the cover member 325. According to this structure, the waterproof case 320 restricts the proximity of the case 12 and the cover member 325 at both end sides of the small diameter region 320r, thereby ensuring a separation distance from each other and ensuring a space SR for installing the circuit board 50. The contact pins 126 similarly pass through the through holes 325h of the cover member 325, and are connected to the circuit board 50 in a conductive manner.
In short, the waterproof case 320 is assembled without using the spacers 24, 124, 224, with the outer peripheral end of the case 12 abutting against the step 320a on one end side of the small diameter region 320r, and with the outer peripheral end of the cover member 325 abutting against the step 320b on the other end side, to form the installation space SR in which the circuit board 50 can be installed.
< Third other modes >
As shown in fig. 5, as the pressure sensor 100 according to the third embodiment of the present invention, resin waterproof cases 420A and 420B made of two components are attached instead of the waterproof case 320 according to the other embodiment.
The waterproof case 420A is formed in a lid shape in which a lid member 325 is integrally formed at a position of the step 320A in the small diameter region 320r of the waterproof case 320, and includes a step 420A, a small diameter region 420r, and a lid shape portion 420c, which correspond to each other. The waterproof case 420B has an inner diameter of a small diameter region 420r that accommodates the waterproof case 420A, and extends to the lead 38 side to secure a space for filling the sealing material 26.
In short, the waterproof cases 420A and 420B are formed in such a manner that the outer peripheral end of the case 12 is brought into contact with only the step 420A on one end side of the small diameter region 420r without using the spacers 24, 124, 224 and the cover member 25, thereby forming the installation space SR in which the circuit board 50 can be installed, and the waterproof case 420B is attached to the small diameter region 420r of the waterproof case 420A. The waterproof cases 420A and 420B are provided such that the sealing material 226 is filled in the opening side of the waterproof case 420A to seal the space between the case 12 and the cover 28 in a liquid-tight manner, and the sealing material 26 is filled in the opening side of the waterproof case 420B to embed the covered end portions of the leads 38 in the sealing material 26, whereby the liquid-tightness can be ensured.
In the pressure sensor 100, similar to the cover member 25 described above, a through hole 420h is formed in the cover-shaped portion 420C of the waterproof case 420A, through which the contact pin 126 connected to the circuit board 50 and connected to the core wire C of the lead 38 is passed, and the circuit board 50 is positioned and supported so as to be suspended by being soldered to and connected to both the lead 40 and the contact pin 126 in the installation space SR formed in the waterproof case 420A.
< Fourth other mode >
As the pressure sensor 100 according to the fourth embodiment, as shown in fig. 6, in place of the cover member 25 and the like in the embodiment, a resin spacer 524 having a cylindrical shape with a bottom is fitted into the waterproof case 20 in a cover shape by being turned upside down in addition to the spacer 324 having a cylindrical shape, and a space SR for disposing the circuit board 50 is formed between the waterproof case and one end surface side of the case 12. That is, the spacer 524 is formed such that the outer peripheral wall portion 524s functions as the spacer 24 for preventing the invasion of the sealing material 26, and the bottom portion 524b functions as the cover shape portion of the cover member 25, thereby forming and securing the installation space SR in which the circuit board 50 and the like can be installed.
Further, the contact member 531 and the connector housing 533 constitute the male connector 530 by integrally forming the connector housing 533, which is positioned inside the contact member 531 electrically connected to the circuit board 50, on the bottom portion 524b of the spacer 524. The contact member 531 penetrates through a through hole 524h of a bottom portion 524b of a spacer 524 integrated with the connector housing 533 and is connected to the circuit board 50 in a conductive manner, and the sealing material 26 is filled in the one end opening side of the waterproof case 20 outside the spacer 524 in the same manner as in the above embodiment, thereby securing the liquid tightness.
According to this structure, the pressure sensor unit 10 includes the male connector 530, and the external device a can be connected to the circuit board 50 via the contact member 531 and the lead 38 by inserting a female connector, not shown, connected to one end of the lead 38 into the connector housing 533.
That is, the pressure sensor unit 10 can be configured such that the core wire C of the lead 38 is not positioned in the installation space SR of the circuit board 50 or the like, but the coating portion 38C of the lead 38 is peeled off outside the installation space SR and connected to the female connector side connected to the male connector 530. Moisture does not infiltrate from the lead 38 into the installation space SR. In this embodiment, an adhesive may be applied to the insertion portion between the contact member 531 and the through hole 524 h. A minute gap for inserting the contact member 531 may be left in the through hole 524 h. Therefore, the adhesive is applied to the through-hole 524h to seal and fix the minute gap, whereby a double seal structure can be formed by the sealing material 26 and the adhesive. This can further prevent moisture in the atmosphere transmitted along the core wire C of the lead 38 from entering the inside of the installation space SR.
< Fifth other aspect >
As the pressure sensor 100 according to the fifth other aspect of the above embodiment, as shown in fig. 7, a pressure sensor unit 10 including a resin spacer 624 having a smaller diameter than the bottomed cylindrical spacer 124 of the above embodiment and fixed to one end surface side of the housing 12 is constructed, and a space cover 625 is covered and closed on the opening side of the spacer 624 to provide a space SR for the circuit board 50. The pressure sensor unit 10 is formed to have a diameter larger than that of the outer peripheral surface of the housing 12, and is configured to fill a sealing material 626 from the outer peripheral side of the housing 12 to the space cover 625 in a substantially cylindrical waterproof case 520 fitted into the cover 28 on the other end surface side and extended to the vicinity of the closed end of the space cover 625 on the opposite side, thereby securing the liquid tightness around the installation space SR.
The spacer 624 is inserted between the lead 40 penetrating the bottom portion 624b and the circuit board 50 in the installation space SR from the outer side surface of the side wall portion 624s through the terminal pieces 636a, 636b of the double contact member 636, and the insertion portion is fixed by the terminal fixing adhesive. After that, the pressure sensor chip 11 can be connected to the circuit board 50 by connecting the leads 40 to the terminal pieces 636a and the circuit board 50 to the terminal pieces 636b in a conductive manner. Similarly, the spacer 624 is inserted into the terminal piece 637a of the single contact member 637 from the outer side surface of the side wall portion 624s on the opposite side of the double contact member 636, and the inserted portion is fixed with the terminal fixing adhesive. Then, the circuit board 50 is connected to the terminal piece 637a in a conductive manner, and the core wire C of the peeled-off covering portion 38C is soldered to the flat surface portion 637f located on the outer surface of the side wall portion 624s of the single contact member 637 so as to protrude from the covered end portion of the lead wire 38. By fixing the double-contact member 636 and the single-contact member 637 to the spacer 624 with the adhesive in this manner, the terminal pieces are prevented from coming off the spacer, and the insertion position is prevented from being shifted. After the conductive connection, the waterproof case 20 is filled with a sealing material 626 to seal the connection portion and the covered end portion of the lead 38. With this configuration, in this other embodiment, the lead 40 of the pressure sensor chip 11 and the circuit board 50 are also connected in series and electrically connected to the lead 38 via the double contact member 636 and the single contact member 637.
That is, in this other embodiment, the lead 38 that can be led out to be connected to the external device a is connected to the single contact member 637 outside the installation space SR, and the core wire C whose coating portion 38C is peeled off and the coated end portion of the lead 38 are buried in the sealing material 626 in a liquid-tight manner. Further, the lead 40 is conductively connected to the installation space SR via the double contact member 636 which is temporarily wound around the sealing material 626 from the spacer 624. As a result, the pressure sensor 100 can ensure the liquid tightness of the installation space SR in which the circuit board 50, the leads 40, and the like exist with high accuracy, and can be used with high reliability while suppressing occurrence of short circuits, migration, and the like due to dew condensation. Further, small gaps may be formed in the insertion portions of the terminal pieces 636a, 636b, 637a of the side wall portions 624s to such an extent that the terminal pieces can be inserted. The amount of the adhesive used for fixing the double-contact member 636 and the single-contact member 637 in the present embodiment may be an amount of the adhesive applied to completely close the gap of the insertion portion. Accordingly, the minute gap can be sealed and fixed to the double-contact member 636 and the single-contact member 637 by applying the adhesive, and thus a double sealing structure can be formed by the sealing material 626 and the adhesive. This can further prevent moisture in the atmosphere from entering the installation space SR.
The scope of the present utility model is not limited to the illustrative embodiments described in the drawings, but includes all embodiments that bring about the effects equivalent to the objects of the present utility model. The scope of the present utility model is not limited to the combination of the features of the utility model defined in the claims, but can be divided by all required combinations of all the specific features disclosed.
Claims (5)
1. A pressure sensor for detecting the pressure of a measurement object, the pressure sensor being connected to a circuit board built in a housing,
The sensor is disposed in the pressure chamber so as to receive the pressure of the object to be measured, the circuit board is disposed between the sensor and an external device in a liquid-tight arrangement space formed by filling the housing with a sealing material,
The circuit board is connected to a core wire of a coating connection member which is led out to the outside and connected to the external device, and the core wire of the coating connection member is coated by a coating portion to the front of the installation space.
2. The pressure sensor of claim 1, wherein the pressure sensor is configured to,
The conductive core wire of the coating connection member penetrates through the space forming member forming the installation space and is connected with the circuit substrate in a conductive manner.
3. The pressure sensor of claim 1, wherein the pressure sensor is configured to,
The conductive core wire of the coating connection member is connected to the circuit board in a conductive manner via an external connection member penetrating a space formation member forming the installation space.
4. The pressure sensor of claim 1, wherein the pressure sensor is configured to,
The coating connection member is constituted by an electric wire coated with a core wire constituted by stranded wires.
5. A pressure sensor according to claim 3, wherein,
The external connection member is a component of a connector that penetrates through a space forming member that forms the installation space and is connectable to the coating connection member.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-095664 | 2023-06-09 | ||
| JP2023095664A JP2024176839A (en) | 2023-06-09 | 2023-06-09 | Pressure Sensors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222528811U true CN222528811U (en) | 2025-02-25 |
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ID=93894654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421199605.3U Active CN222528811U (en) | 2023-06-09 | 2024-05-29 | Pressure sensor |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2024176839A (en) |
| CN (1) | CN222528811U (en) |
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2023
- 2023-06-09 JP JP2023095664A patent/JP2024176839A/en active Pending
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- 2024-05-29 CN CN202421199605.3U patent/CN222528811U/en active Active
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| JP2024176839A (en) | 2024-12-19 |
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