CN115790957A - Temperature and pressure sensor - Google Patents

Abstract

A temperature and pressure sensor, comprising: a housing; a top cover enclosing a working cavity together with the shell; the pressure sensitive assembly is arranged in the working cavity, divides the working cavity into a sealing cavity and a sensing cavity, and comprises a printed circuit board and a pressure core body which is arranged on one side of the front surface of the printed circuit board and is electrically connected with the printed circuit board; a pressure joint pipe with one end hermetically communicated to the sensing cavity; the temperature sensitive assembly comprises a temperature sensitive element and a plurality of second fisheye contact pins embedded in the shell, wherein the first ends of the second fisheye contact pins are upwards inserted and fixed in metal holes formed in the printed circuit board and are electrically connected with the printed circuit board through the metal holes; the temperature sensitive element is fixed at the lower part of the inner cavity of the pressure joint pipe; a plurality of leading-out terminals of the temperature sensitive element extend upwards and are connected with the second end of the second fisheye pin; the terminal button is connected with the shell; and a plurality of third fisheye pins. The structure is simple, and the cost is greatly reduced.

Description

Temperature and pressure sensor

Technical Field

The application relates to the technical field of sensors, in particular to a temperature and pressure sensor.

Background

Pressure sensors are sensors for measuring the pressure of an environment or medium, and are currently implemented by MEMS (micro electro mechanical systems), i.e. by measuring the pressure by the piezoresistive effect of semiconductor silicon. The middle part of the silicon core body is arranged in a diaphragm shape, the resistance value of the doped resistor on the silicon diaphragm is changed by the pressure applied to the silicon diaphragm by the two sides, and the current or voltage signal output by the measuring circuit formed by connecting a plurality of resistors can be further processed by the conditioning circuit and then output the measuring result. When a vacuum cavity is arranged on one side of the diaphragm in the silicon chip, the measured pressure is the pressure relative to the vacuum applied on the other side, namely absolute pressure; when atmospheric pressure is introduced into one side of the diaphragm, the measured pressure is relative to atmospheric pressure, namely gauge pressure; when other pressures are introduced to the two sides of the diaphragm respectively, the measured pressure is the difference between the pressures of the two sides, namely differential pressure.

For a pressure sensor incorporating a temperature sensing component, it may be referred to as a temperature pressure sensor. Known temperature and pressure sensors typically use a thermistor to measure the temperature of the medium being measured. The temperature and pressure sensor is characterized in that a medium channel is required to be communicated to a pressure chip to measure the pressure of a fluid to be measured, and a thermosensitive circuit is not required to be arranged in the medium channel to measure the temperature. In order to fix the connection terminals of the thermistor circuit without obstructing the medium passage, some thermistor devices use an intermediate base plate to fix the end of the thermistor, and connect the connection terminals and the probes passing downward through the intermediate base plate to the flexible circuit board, and connect the pins for outputting signals to the flexible circuit board, such as CN115127722a, which also needs to fix the connection terminals through an auxiliary structure. Therefore, the structure is complex and the cost is high.

The statements in this section merely provide background information related to the present application and may not constitute prior art.

Disclosure of Invention

To the not enough of prior art, this application provides a temperature pressure sensor to simplify its structure, reduce cost.

In order to achieve the above purpose, the present application provides the following technical solutions: a temperature and pressure sensor, comprising:

a housing;

a top cover enclosing a working chamber together with the housing;

the pressure sensitive assembly is arranged in the working cavity, divides the working cavity into a sealing cavity and a sensing cavity, and comprises a printed circuit board and a pressure core body which is arranged on one side of the front surface of the printed circuit board and is electrically connected with the printed circuit board;

a pressure joint pipe with one end hermetically communicated to the sensing cavity;

the temperature sensitive assembly comprises a temperature sensitive element and a plurality of second fisheye contact pins embedded in the shell, wherein the first ends of the second fisheye contact pins are upwards inserted and fixed in metal holes formed in the printed circuit board and are electrically connected with the printed circuit board through the metal holes; the temperature sensitive element is fixed at the lower part of the inner cavity of the pressure joint pipe; a plurality of leading-out terminals of the temperature sensitive element extend upwards and are connected with the second end of the second fisheye contact pin;

the terminal button is connected with the shell;

and one end of the third fisheye pin is electrically connected with the printed circuit board, and the other end of the third fisheye pin penetrates through the shell and then extends into the terminal button.

Preferably, an accommodating cavity is formed between the pressure sensitive assembly and the shell, and the leading-out terminal and the second end of the second fisheye contact pin are arranged in the accommodating cavity.

Preferably, one end of the leading-out terminal, which is far away from the temperature sensitive element, is upwards and correspondingly penetrates through a terminal through hole arranged in the shell and then is welded with the second end of the second fisheye pin.

Preferably, the second end of the second fisheye pin is horizontally disposed.

Preferably, the second end of the second fisheye pin is supported on a support plane correspondingly formed on the inner wall of the housing.

Preferably, the temperature sensitive assembly further comprises:

a printed circuit board;

the ceramic circuit board is adhered to one side of the printed circuit board in the forward direction, the printed circuit board is electrically connected with a bonding pad arranged on the ceramic circuit board through a conductor, and the back of the printed circuit board is provided with a conditioning element;

the pressure core body is fixed on the front surface of the ceramic circuit board and is electrically connected with the welding disc through an electric conductor;

the core body protecting cover is fixed on the front surface of the printed circuit board, the pressure core body is positioned in a glue filling hole formed in the core body protecting cover, and first protecting glue is filled and sealed in the glue filling hole; the edge of the front side end face of the glue filling hole protrudes towards one side in the positive direction to form a circle of positioning flange, and the inner side of the positioning flange correspondingly forms a positioning groove; the upper end of the pressure joint pipe is upwards protruded to form a protruded positioning part near the central part, and a groove is correspondingly formed at the edge of the upper end of the pressure joint pipe; the protruding positioning portion is upwards inserted into the positioning groove, the positioning flange is downwards inserted into the groove, and sealing adhesive glue is filled and sealed in the groove.

Preferably, the accommodating cavity is communicated with the groove, and the upper end of the leading-out terminal penetrates out of the pipe wall of the pressure joint pipe upwards and then sequentially passes through the groove and the accommodating cavity.

Preferably, the core protection cover comprises a cover plate and a circle of first skirt wall formed by vertically protruding the edge of the cover plate towards the back side; the cover plate is provided with a glue injection hole and a glue filling hole, and the periphery of the back side of the glue filling hole protrudes towards the back side to form a circle of second skirt wall; the back side end surface of the second skirt wall is positioned on the positive side of the back side end surface of the first skirt wall; the back side end face of the second skirt wall is hermetically fixed on the front side end face of the ceramic circuit board, and the back side end face of the first skirt wall is hermetically fixed on the front side end face of the printed circuit board; and a glue filling cavity is defined by the second skirt wall, the first skirt wall and the printed circuit board, the electric conductor is positioned in the glue filling cavity, and second protective glue is encapsulated in the glue filling cavity.

Preferably, the front side end surface of the glue filling hole is positioned at the front side of the front side end surface of the glue injection hole.

Preferably, the front side end face of the glue filling hole protrudes towards the front side to form a circle of positioning flanges, and the inner sides of the positioning flanges correspondingly form positioning grooves.

The temperature and pressure sensor is characterized in that the temperature sensitive component and the contact pin are connected to the printed circuit board through the second fisheye insert and the third fisheye contact pin which are embedded in the shell respectively, and the temperature and pressure sensor is simple in structure and greatly reduces cost.

Drawings

FIG. 1 is a perspective view of a temperature and pressure sensor in accordance with a preferred embodiment of the present application;

FIG. 2 is a top view of a temperature and pressure sensor according to a preferred embodiment of the present application;

FIG. 3 isbase:Sub>A cross-sectional view of the temperature and pressure sensor ofbase:Sub>A preferred embodiment of the present application taken along A-A shown in FIG. 2;

FIG. 4 is a perspective view of a portion of the structure of a temperature and pressure sensor in accordance with a preferred embodiment of the present application;

FIG. 5 is a sectional view of a partial structure of the temperature and pressure sensor according to a preferred embodiment of the present application, taken along B-B shown in FIG. 2;

FIG. 6 is a perspective view of a pressure sensitive assembly according to a preferred embodiment of the present application;

FIG. 7 is a top view of a pressure sensitive assembly according to a preferred embodiment of the present application;

FIG. 8 is a cross-sectional view of the pressure sensitive assembly of a preferred embodiment of the present application taken along C-C shown in FIG. 7;

FIG. 9 is a bottom view of the core shield of a preferred embodiment of the present application;

FIG. 10 is a cross-sectional view of the core shield of a preferred embodiment of the present application taken along D-D shown in FIG. 8;

FIG. 11 is a perspective view of a core shield of a preferred embodiment of the present application;

FIG. 12 is a perspective view of another perspective of a core shield of a preferred embodiment of the present application;

in the figure: 1. a pressure sensitive component; 10. a core protective cover; 100. a cover plate; 101. a first skirt wall; 102. a second skirt wall; 103. a positioning flange; 104. a first positioning portion; 105. a second positioning portion; 10a, injecting glue holes; 01a, a glue filling cavity; 10b, filling glue holes; 10c, positioning a groove; 10d, a top end surface; 10e, a first positioning surface; 10f, a second positioning surface; 10g, abdicating and opening; 11. a pressure core; 12. a printed circuit board; 13. a ceramic circuit board; 14. a conditioning element; 15. an electrical conductor; 16. a sealing cover; 17. a first protective glue; 18. a second protective adhesive; 2. a housing; 21. a cover body sealing groove; 3. a pressure connector tube; 30. a pressure channel; 31. a first window; 33. bonding a sealant; 34. a second window; 35. a lower tube wall; 36. sealing the ring groove; 37. a protruding positioning part; 4. an end button; 41. a guide portion; 5. a seal ring; 6. a temperature sensitive component; 64. a groove; 60. a terminal via hole; 61. a temperature sensitive element; 62. a lead-out terminal; 65. a support plane; 71. a first fisheye pin; 72. a second fisheye pin; 73. a third fisheye pin; 8. a top cover; 81. a plate body; 82. a sealing flange; 9. an installation part; 91. a bushing; 120. a metal hole; 66. a second end; 67. an accommodating cavity.

Detailed Description

The technical solution of the present application will be clearly and completely described below with reference to the accompanying drawings. The following examples are illustrative only and are not to be construed as limiting the present application. In the following description, the same reference numerals are used to designate the same or equivalent elements, and the repetitive description is omitted.

In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the present invention are conventionally placed in use, or the orientations or positional relationships that are conventionally understood by those skilled in the art, and are used for convenience of describing the present application and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

In addition, the terms "mounted," "connected," and "coupled" are to be construed broadly and may include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in this application can be understood as appropriate by one of ordinary skill in the art.

It should be further understood that the term "and/or" as used in this specification and the corresponding claims refers to any and all possible combinations of one or more of the listed items.

As shown in fig. 1-5. The temperature and pressure sensor comprises a shell (not marked), a pressure sensitive component 1, a pressure joint pipe 3, a temperature sensitive component 6 and a terminal button 4. Wherein, the shell can be by casing 2 and top cap 8 are constituteed, and top cap 8 encloses into the working chamber together with casing 2. The top cover 8 may include a plate 81 and a sealing flange 82 formed by an edge of the plate 81 protruding downward. In order to facilitate the combined sealing between the top cover 8 and the casing 2, the upper end of the casing 2 may be provided with a cover body sealing groove 21, the sealing flange 82 extends into the cover body sealing groove 21, and the cover body sealing groove 21 is filled with sealing adhesive.

The pressure sensitive component 1 is arranged in the working cavity, divides the working cavity into a sealed cavity and a sensing cavity, and at least comprises a printed circuit board 12 and a pressure core body 11 which is arranged on one side of the front surface of the printed circuit board 12 and is electrically connected with the printed circuit board 12.

The upper end of the pressure connection pipe 3 is connected to the sensing chamber in a sealing manner, so that the medium to be measured acts on one pressure sensing surface of the pressure core 11 via the lumen (pressure channel 30) in the pressure connection pipe 3. The outer wall of the pressure joint pipe 3 can be provided with a sealing ring groove 36, and a sealing ring 5 is arranged in the sealing ring groove 36, so that the sealing ring is sealed when being butted with a container of a medium to be measured.

The temperature sensing assembly 6 comprises a temperature sensing element 61 and a plurality of second fisheye pins 72 embedded in the housing 2. The temperature sensitive element 61 is fixed to the lower portion of the inner cavity of the pressure joint pipe 3. A plurality of lead terminals 62 of the temperature sensitive element 61 extend upwardly and are connected to the second end 66 of the second fisheye pin 72. One end of the third fisheye pins 73 is electrically connected to the printed circuit board 12, and the other end of the third fisheye pins passes through the housing 2 and then extends into the terminal 4, and a horizontally extending guide portion 41 can be arranged inside the terminal 4, so that the third fisheye pins can be conveniently guided when being electrically plugged with external equipment. First ends of the second fisheye pin 72 and the third fisheye pin 73 are respectively inserted upwards into a metal hole 120 formed in the printed circuit board 12 so that the printed circuit board 12 is fixed in the working cavity, the second fisheye pin 72 and the third fisheye pin 73 are electrically connected with the printed circuit board 12 through the metal hole 120, and therefore the temperature sensitive element 61 is electrically connected to the printed circuit board 12, and meanwhile the printed circuit board 12 outputs a measured pressure electric signal outwards through the third fisheye pin 73.

In order to laterally expose the temperature sensitive element 61 to the medium to be measured to more accurately measure the temperature of the medium to be measured, a plurality of first windows 31 and at least one second window 34 may be formed in the lower side wall of the pressure joint pipe 3. The second window 34 extends with its upper edge facing opposite to the first window 31, forming a lower duct wall 35. The terminal via hole 60 is filled with the adhesive sealant 33, and part of the adhesive sealant 33 fixedly adheres the part of the leading-out terminal 62 close to the temperature sensitive element 61 to the lower pipe wall 35 of the pressure joint pipe 3, so that the temperature sensitive element 61 is further fixed, and the flow velocity impact of a medium to be measured is prevented.

Please refer to fig. 6-12.

The pressure sensitive component 1 includes a printed circuit board 12, a pressure core 11, a ceramic circuit board 13, and a core protection cover 10. The ceramic circuit board 13 is bonded to the front side of the printed circuit board 12. The printed circuit board 12 is electrically connected to a pad provided on the ceramic circuit board 13 via an electrical conductor 15. The back side of the printed circuit board 12 is provided with a conditioning element 14. The pressure core 11 is fixed to the front surface of the ceramic circuit board 13, and is electrically connected to the pad through an electrical conductor 15 (e.g., a gold wire).

The core protection cover 10 includes a hood plate 100 and a ring of first skirt walls 101 formed by vertically projecting the edges of the hood plate 100 toward the rear side. Wherein, the cover plate 100 is provided with a glue injection hole 10a and a glue filling hole 10b. The back side periphery of the glue filling hole 10b protrudes toward the back side to form a ring of second skirt walls 102. The back-side end surface 10f of the second skirt wall 102 is located on the forward side of the back-side end surface 10e of the first skirt wall 101. The back-side end face 10f of the second skirt wall 102 is sealingly fixed to the front-side end face of the ceramic circuit board 13. The back-side end face 10e of the first skirt wall 101 is sealingly fixed to the front-side end face of the printed circuit board 12. The pressure core 11 is located in the glue filling hole 10b. The glue filling hole 10b is filled with a first protective glue 17. The second skirt wall 102, the first skirt wall 101 and the printed circuit board 12 define a glue filling cavity 01a therebetween. The conductive body 15 is located in the glue filling cavity 01a. The glue filling cavity 01a is filled with second protective glue 18.

The first protective glue 17 is poured into the glue filling hole 10b so that the pressure core body can be protected from damage under the condition of aggressive media (such as circulating gas in an engine intake manifold); the second protective glue 18 is encapsulated in the glue filling cavity 01a, so that the risks of falling off of welding points of the electric conductor 15 or breakage of the gold wires and the like in the assembling or using process can be avoided. In addition, the core protective cover 10 forms a double seal with the ceramic circuit board 13 and the printed circuit board 12, so that the corrosion risk of other electronic components (such as the conditioning element 14) to the medium to be measured under pressure is greatly reduced. Moreover, the ceramic circuit board is used as the mounting base body of the pressure core body, so that the adverse effect of high-temperature tail gas on the printed circuit board can be reduced.

Wherein, the housing 2 can be fixedly connected with a plate-shaped mounting part 9, the mounting part 9 can be opened with a mounting hole, and a bushing 91 is arranged in the mounting hole, so that the temperature and pressure sensor can be fixed on an external device through a fastener. In the embodiments of the present application, the terminal 4 and the pressure connector tube 3 are preferably integrally connected to the housing 2, but they may be fixedly connected separately.

In the present embodiment, the pressure core 11 is measured as absolute pressure, i.e. a vacuum chamber is provided on the other side of the measuring diaphragm of the pressure core as a pressure reference. In other embodiments, the pressure sensing surface on the other side of the pressure core may be connected to the atmosphere, for example, through holes formed in the printed circuit board 12 and the ceramic circuit board 13 and a waterproof, breathable film/through hole provided in the top cover 8.

In other embodiments, it is preferable that a receiving cavity 67 is provided between the pressure sensitive component 1 and the housing 2. The leading-out terminal 62 and the second end 66 of the second fisheye pin 72 are disposed in the accommodating cavity 67. One end of the outlet terminal 62 far away from the temperature sensitive element 61 is upward and penetrates through the terminal through hole 60 arranged in the shell 2 in a one-to-one correspondence mode, and then the outlet terminal is welded with the second end 66 of the second fisheye pin 72. The second end 66 of the second fisheye pin 72 may be horizontally disposed. The second end 66 of the second fisheye pin 72 is supported on a correspondingly formed support plane 65 on the inner wall of the housing 2.

In other embodiments, it is preferable that the edge of the front end face of the underfill hole 10b is protruded toward the front side to form a ring of positioning flanges 103. The positioning groove 10c is formed correspondingly on the inner side of the positioning flange 103. A protruding positioning portion 37 is formed at the upper end of the pressure joint pipe 3 protruding upward near the central portion. A groove 64 is correspondingly formed at the edge of the upper end of the pressure joint pipe 3. The protruding positioning portions 37 are inserted upward in the positioning grooves 10c. The positioning flange 103 is inserted downward into the groove 64. The groove 64 is filled with sealing adhesive glue. Thus, the pressure sensitive member 1 can be fixed to the projecting positioning portion 37 by the seal adhesive, with a larger bonding area, thereby improving the bonding strength, and at the same time, the sealing path can be relatively lengthened to improve the sealing effect.

In other embodiments, it is preferable that the front end surface of the underfill hole 10b is located on the front side of the front end surface of the underfill dispensing hole 10a, as shown in fig. 10. This makes it possible to prevent the sealing cap 16 from protruding from the positioning flange 103 after the sealing cap 16 is mounted on the glue injection hole 10 a.

Preferably, the receiving cavity 67 may communicate with the groove 64. The upper end of the leading-out terminal 62 passes through the groove 64 and the accommodating cavity 67 in sequence after passing through the pipe wall of the pressure joint pipe 3 upwards. Therefore, when the groove 64 is filled with the sealing adhesive glue, the accommodating cavity 67 can be filled with the sealing adhesive glue when the sealing adhesive glue is injected into the groove 64, so that the space between the leading-out terminal 62 and the terminal via hole 60 is sealed, and a medium to be measured is prevented from invading into the sealing cavity of the sensor through the terminal via hole 60.

In other embodiments, it is preferable that a side of one end of the front side of the positioning flange 103, which is close to the glue injection hole 10a, is provided with a yielding opening 10g for yielding the lead-out terminal 62.

In other embodiments, it is preferable that the sealing cover 16 is sealed outside the glue injection hole 10 a. Therefore, the sealing performance of the glue filling cavity 01a can be improved, and the phenomenon that the gold wire welding point falls off due to the fact that the glue in the accommodating cavity 67 is pressed against the second protective glue 18 from the glue injection hole 10a after being solidified during assembly is prevented.

In other embodiments, it is preferable that the front side end surface of the glue injection hole 10a is provided with a first positioning portion 104 protruding toward the front side, and the back side end surface of the first skirt wall 101 is provided with a second positioning portion 105 protruding toward the back side, so that the positioning between the core protection cover 10 and the printed circuit board 12 and between the core protection cover 10 and the sealing cover 16 in the horizontal position is realized.

In other embodiments, it is preferable that a side wall of the second skirt wall 102 away from the glue injection hole 10a is integrally connected to a corresponding side wall of the first skirt wall 101.

In the above embodiments of the present application, the temperature sensitive component 6 and the related structure may not be provided, and in this case, it is a pressure sensor.

The scope of the present disclosure is defined not by the detailed description but by the claims and their equivalents, and all modifications within the scope of the claims and their equivalents are to be construed as being included in the present disclosure.

Claims (10)

1. A temperature-pressure sensor, comprising:

a housing (2);

a top cover (8) enclosing a working cavity together with the shell (2);

the pressure sensitive component (1) is arranged in the working cavity, divides the working cavity into a sealed cavity and a sensing cavity, and comprises a printed circuit board (12) and a pressure core body (11) which is arranged on one side of the front surface of the printed circuit board (12) and is electrically connected with the printed circuit board (12);

a pressure joint pipe (3) with one end hermetically communicated to the sensing cavity;

the temperature sensitive assembly (6) comprises a temperature sensitive element (61) and a plurality of second fisheye pins (72) embedded in the shell (2), wherein the first ends of the second fisheye pins (72) face upwards and are inserted into metal holes (120) formed in the printed circuit board (12) and electrically connected with the printed circuit board (12) through the metal holes (120); the temperature sensitive element (61) is fixed at the lower part of the inner cavity of the pressure joint pipe (3); a plurality of leading-out terminals (62) of the temperature sensitive element (61) extend upwards and are connected with the second end of the second fisheye pin (72);

a terminal button (4) connected with the shell (2);

and one end of the third fisheye pin (73) is electrically connected with the printed circuit board (12), and the other end of the third fisheye pin penetrates through the shell (2) and then extends into the terminal button (4).

2. The temperature and pressure sensor according to claim 1, wherein a receiving cavity is provided between the pressure sensitive assembly (1) and the housing (2), and the leading-out terminal (62) and the second end of the second fisheye pin (72) are provided in the receiving cavity.

3. The temperature and pressure sensor according to claim 2, wherein one end of the leading-out terminal (62) far away from the temperature sensitive element (61) faces upwards and penetrates through a terminal through hole (60) arranged in the shell (2) in a one-to-one correspondence mode, and then the leading-out terminal is welded with the second end of the second fisheye pin (72).

4. Temperature-pressure sensor according to claim 3, characterized in that the second end of the second fisheye pin (72) is arranged horizontally.

5. Temperature-pressure sensor according to claim 3, characterized in that the second end of the second fisheye pin (72) is supported on a correspondingly formed support plane (65) on the inner wall of the housing (2).

6. The temperature-pressure sensor according to claim 3, characterized in that the temperature-sensitive component (6) further comprises:

a printed circuit board (12);

the ceramic circuit board (13) is adhered to one side of the printed circuit board (12) in the positive direction, the printed circuit board (12) is electrically connected with a welding disc arranged on the ceramic circuit board (13) through a conductor (15), and the back of the printed circuit board (12) is provided with a conditioning element (14);

a pressure core (11) fixed to the front surface of the ceramic circuit board (13), the pressure core being electrically connected to the pad through a conductor (15);

the core body protection cover (10) is fixed on the front surface of the printed circuit board (12), the pressure core body (11) is positioned in a glue filling hole (10 b) formed in the core body protection cover, and first protection glue (17) is filled and sealed in the glue filling hole (10 b); the edge of the front side end face of the glue filling hole (10 b) protrudes towards one side of the front direction to form a circle of positioning flange (103), and the inner side of the positioning flange (103) correspondingly forms a positioning groove (10 c); the upper end of the pressure joint pipe (3) is upwards protruded to form a protruded positioning part (37) near the central part, and a groove (64) is correspondingly formed at the edge of the upper end of the pressure joint pipe (3); the protruding positioning part (37) is upwards inserted into the positioning groove (10 c), the positioning flange (103) is downwards inserted into the groove (64), and sealing adhesive glue is filled in the groove (64) in a sealing mode.

7. The temperature and pressure sensor according to claim 6, wherein the accommodating cavity is communicated with the groove (64), and the upper end of the leading-out terminal (62) penetrates out of the pipe wall of the pressure joint pipe (3) upwards and then sequentially passes through the groove (64) and the accommodating cavity.

8. The temperature-pressure sensor according to claim 6, wherein the core protection cover includes a cover plate (100) and a ring of first skirt walls (101) formed by vertically projecting an edge of the cover plate (100) toward a back side; the cover plate (100) is provided with a glue injection hole (10 a) and a glue filling hole (10 b), and the periphery of the back side of the glue filling hole (10 b) protrudes towards the back side to form a circle of second skirt wall (102); the back-side end surface of the second skirt wall (102) is located on the forward side of the back-side end surface of the first skirt wall (101); the back side end face of the second skirt wall (102) is hermetically fixed on the front side end face of the ceramic circuit board (13), and the back side end face of the first skirt wall (101) is hermetically fixed on the front side end face of the printed circuit board (12); a glue filling cavity (01 a) is defined among the second skirt wall (102), the first skirt wall (101) and the printed circuit board (12), the electric conductor (15) is located in the glue filling cavity (01 a), and second protective glue (18) is encapsulated in the glue filling cavity (01 a).

9. The temperature-pressure sensor according to claim 1, wherein a front side end face of the glue filling hole (10 b) is located on a front side of a front side end face of the glue injection hole (10 a).

10. The temperature and pressure sensor according to claim 1, wherein the front side end surface of the glue filling hole (10 b) is formed with a ring of positioning flange (103) protruding toward the front side, and the inner side of the positioning flange (103) is correspondingly formed with a positioning groove (10 c).

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