CN222483389U - Stacked optocoupler for leadless packages - Google Patents
Stacked optocoupler for leadless packages Download PDFInfo
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- CN222483389U CN222483389U CN202421114282.3U CN202421114282U CN222483389U CN 222483389 U CN222483389 U CN 222483389U CN 202421114282 U CN202421114282 U CN 202421114282U CN 222483389 U CN222483389 U CN 222483389U
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Abstract
本实用新型提供一种无引脚封装的堆叠式光耦合装置，包括：堆叠式光耦合模组；模塑封装壳体，包覆堆叠式光耦合模组；以及多个接触垫，与堆叠式光耦合模组中的多个导电部电连接；其中，所述多个接触垫外露于模塑封装壳体，且与所述模塑封装壳体的外表面齐平。借此，本实用新型的无引脚封装的堆叠式光耦合装置可用于电子产品上，并可解决占用较大电路布局面积的问题。
The utility model provides a stacked optical coupling device with a pinless package, comprising: a stacked optical coupling module; a molded package shell, covering the stacked optical coupling module; and a plurality of contact pads, electrically connected to a plurality of conductive parts in the stacked optical coupling module; wherein the plurality of contact pads are exposed to the molded package shell and are flush with the outer surface of the molded package shell. Thus, the stacked optical coupling device with a pinless package of the utility model can be used in electronic products, and can solve the problem of occupying a large circuit layout area.
Description
Technical Field
The present utility model relates to an optocoupler, and more particularly to a stacked optocoupler with leadless packages.
Background
Along with the development of technology, many electronic products are designed to be miniaturized in order to meet the popular preference, and the optocoupler is a component widely applied to various electronic products, so that the volume of the optocoupler can be effectively reduced, and the volume of the electronic product can be relatively reduced.
In the prior art, the light coupler is provided with the light emitting element and the receiving element through the conductive frames, and the space between the light emitting element and the receiving element is also provided due to the space between the conductive frames, so that the design purpose of electric isolation of the light coupler is achieved.
In order to respond to the trend of light, thin and small electronic products, the optical coupler is also required to be greatly reduced in size, and is limited by the physical limit of the conductive frame besides considering the problem of electrical isolation.
Therefore, in another prior art, there is a stacked design that omits the use of a conductive frame inside the optical coupler, and the objective of improving the physical limitation of the conductive frame, which is not capable of reducing the volume, can be achieved.
Disclosure of utility model
However, the stacked design still employs Small Out-LINE PACKAGE (SOP) or Quad flat package (Quad FLAT PACKAGE, QFP) technology to package the optocoupler into an optocoupler. In the foregoing packaging technology, the power supply pins of the optocoupler are exposed and extend out of the packaging housing of the optocoupler, so that the optocoupler occupies a larger circuit layout area.
The utility model provides a stacked optical coupling device of a leadless package, which comprises a substrate, a first optical element arranged on the substrate, an insulating light-transmitting layer covering the first optical element, a second optical element arranged in a matching manner with the first optical element and arranged outside the insulating light-transmitting layer, a plurality of conductive parts arranged between the substrate and the second optical element, one ends of the conductive parts being electrically connected with the substrate, the other ends of the conductive parts being electrically connected with the second optical element, a molded package shell covering the stacked optical coupling module, and a plurality of contact pads electrically connected with the conductive parts, wherein the contact pads are exposed out of the molded package shell and are flush with the outer surface of the molded package shell.
In some embodiments, the leadless package is a two-sided flat leadless package (Dual Flat No leads, DFN) or a four-sided flat leadless package (Quad Flat No leads, QFN).
In some embodiments, a thermal pad is further included in contact with the plurality of contact pads and the substrate of the stacked optical coupling module.
In some embodiments, the first optical element includes a first top surface disposed away from the substrate and a first bottom surface disposed opposite the first top surface and electrically connected to the substrate.
In some embodiments, the second light element comprises a second top surface arranged far away from the insulating light-transmitting layer, and a second bottom surface arranged opposite to the second top surface and adhered with the insulating light-transmitting layer and arranged corresponding to the first top surface.
In some embodiments, the insulating light-transmitting layer includes an upper surface remote from the first light element and supporting the second bottom surface, and a side surface having one end adjacent to the substrate and the other end connected to the upper surface.
In some embodiments, the first light element is a light emitter and the second light element is a light detector.
In some embodiments, the first top surface is a light emitting surface and the second bottom surface is a light receiving surface.
In some embodiments, the first optical element is a photodetector and the second optical element is an optical transmitter.
In some embodiments, the first top surface is a light receiving surface and the second bottom surface is a light emitting surface.
In summary, according to the stacked optical coupling device of the leadless package of the present utility model, through the structural design of the conductive portion, the contact pad and the stacked optical coupling module, there is no need to additionally provide an independent conductive frame for each of the first optical element and the second optical element, so as to achieve the purpose of improving the physical limit limited by the conductive frame and not reducing the volume. In addition, since the plurality of contact pads of the present utility model are not exposed and extend out of the lead structure, the stacked optocoupler of the leadless package of the present utility model has a relatively small circuit layout area, thereby conforming to the trend of light, thin and small design. In addition, the heat conducting pad can conduct heat energy generated by the stacked optical coupling module and can be matched with the radiator to dissipate the heat energy, so that the service life of the stacked optical coupling module is prolonged.
Drawings
FIG. 1 is a schematic cross-sectional view of a stacked optocoupler of a leadless package of the present utility model.
Fig. 2 is a schematic cross-sectional view of another embodiment of a stacked optocoupler of the leadless package of the present utility model.
Fig. 3 is a schematic cross-sectional view of a stacked optocoupler of a leadless package of the utility model.
Fig. 4 is a schematic cross-sectional view of a stacked optocoupler of a leadless package of the present utility model.
Reference numerals
10. Substrate board
20. First optical element
21. A first top surface
22. A first bottom surface
30. Insulating light-transmitting layer
32. Insulating light-transmitting layer
34. Upper surface of
36. Side surfaces
40. Second optical element
41. A second top surface
42. A second bottom surface
50. Conductive part
52. Conductive part
55. Contact pad
57. Contact pad
60. Molded package housing
70. Heat conduction pad
100. Stacked optocoupler for leadless packages
110. Stacked optocoupler for leadless packages
120. Stacked optocoupler for leadless packages
130. Stacked optocoupler for leadless packages
150. Stacked optical coupling module
155. Stacked optical coupling module
Detailed Description
Referring to fig. 1, a schematic cross-sectional view of a stacked optocoupler of a leadless package according to an embodiment of the utility model is shown. The leadless packaged stacked optocoupler 100 includes a stacked optocoupler module 150, a molded package housing 60, and a plurality of contact pads 55. In this embodiment, two contact pads 55 are illustrated in fig. 1, but this is not a limitation. The leadless package may be, for example, a two-sided flat leadless package or a four-sided flat leadless package.
The stacked optical coupling module 150 includes a substrate 10, a first optical element 20, an insulating transparent layer 30, a second optical element 40, and a plurality of conductive portions 50. In this embodiment, two conductive portions 50 are illustrated in fig. 1, but this is not a limitation.
The first light element 20 is disposed on the substrate 10. The first light element 20 may be a light emitter (e.g., a light emitting diode) or a light detector (e.g., a phototransistor).
The insulating light-transmitting layer 30 covers the first light element 20. The insulating light-transmitting layer 30 may be, for example, titanium oxide, silicon nitride, or other insulating light-transmitting material, or the like. The insulating light-transmitting layer 30 can be used to electrically isolate the first light element 20 from the second light element 40.
The second light element 40 is disposed in matching with the first light element 20, and the second light element 40 is disposed outside the insulating light-transmitting layer 30. The second light element 40 may be a light emitter (e.g., a light emitting diode) or a light detector (e.g., a phototransistor). In the present embodiment, the first optical element 20 and the second optical element 40 are matched with each other. For example, if the first light element 20 is a light emitter, the second light element 40 that is matched to the first light element 20 is a light detector. In other embodiments, if the first optical element 20 is a photodetector, the second optical element 40 is an optical emitter.
The plurality of conductive parts 50 are disposed between the substrate 10 and the second optical element 40, and one end of each of the plurality of conductive parts 50 is electrically connected with the substrate 10. The other end of each of the plurality of conductive portions 50 is electrically connected to the second optical element 40. The plurality of conductive portions 50 may be selected from a metal or a composite metal such as silver, copper, gold, aluminum, tin, iron, and the like.
A stacked optical coupling module 150 is disposed within the molded package housing 60. The molded package housing 60 may serve as a protective housing for the stacked optical coupling module 150 to block air, impurities, moisture, or the like. The molded package housing 60 may be made of an insulating material such as epoxy or other resin, for example.
The contact pads 55 are disposed adjacent to the substrate 10 and electrically connected to the conductive portions 50 via the substrate 10, respectively, so that when the first optical element 20 is an optical emitter and the second optical element 40 is an optical detector, an external power circuit (not shown) can transmit an electrical signal to the first optical element 20 via the contact pads 55 and the substrate 10 to emit light, and the second optical element 40 performs photoelectric conversion according to the light to generate an output signal, and the output signal is transmitted to an external circuit (not shown) via the conductive portions 50, the substrate 10 and the contact pads 55. When the first optical element 20 is a photodetector and the second optical element 40 is a light emitter, the external power circuit transmits an electrical signal to the second optical element 40 via the plurality of contact pads 55, the substrate 10 and the plurality of conductive portions 50 to emit light, and the first optical element 20 performs photoelectric conversion according to the light to generate an output signal, and transmits the output signal to the external circuit via the substrate 10 and the plurality of contact pads 55. In this way, the first optical element 20 and the second optical element 40 pass through the common substrate 10 and the plurality of contact pads 55, so that the stacked optical coupling module 150 can be designed as a stacked structure (i.e. the second optical element 40 is matched with the first optical element 20), and an independent conductive frame is not required to be disposed for each of the first optical element 20 and the second optical element 40 to transmit the electrical signal. Furthermore, the plurality of contact pads 55 are exposed to the molded package housing 60 and are flush with the outer surface of the molded package housing 60. Therefore, the leadless packaged stacked optocoupler 100 has no exposed and protruding lead structure, and thus the leadless packaged stacked optocoupler 100 has a relatively small circuit layout area, which conforms to the light, thin, and small design trend. The plurality of contact pads 55 are made of conductive material. The plurality of contact pads 55 may be selected from metals or composite metals such as silver, copper, gold, aluminum, tin, iron, etc. In other embodiments, the plurality of contact pads 55 may have the same material as the plurality of conductive portions 50. In other embodiments, the plurality of contact pads 55 may form an integrally formed structure with the plurality of conductive portions 50.
Referring to fig. 2, a schematic cross-sectional view of a stacked optocoupler of a leadless package according to another embodiment of the utility model is shown. The leadless packaged stacked optocoupler 110 includes a stacked optocoupler module 150, a molded package housing 60, a plurality of contact pads 57, and a thermal pad 70. The embodiment of fig. 2 is illustrated by way of example, but not limitation, with two contact pads 57. The leadless package may be, for example, a two-sided flat leadless package or a four-sided flat leadless package.
The embodiment of fig. 2 is different from the embodiment of fig. 1 in that the contact pad 57 is used to replace the contact pad 55 of fig. 1, and the structural shape (e.g. L-shape) of the contact pad 57 is different from the structural shape (e.g. square shape) of the contact pad 55, and the number of heat conductive pads 70 is increased, and the remaining modules or elements are the same as those of the embodiment of fig. 1, which is not repeated herein.
The thermal pad 70 is in contact with one end of the stacked optical coupling module 150. More specifically, the upper surface (not shown) of the thermal pad 70 contacts the lower surface (not shown) of the substrate 10 and a portion of the inner surface of the contact pad 57 to conduct the heat energy generated by the stacked optical coupling module 150. In other embodiments, the thermal pad 70 may also cooperate with a heat sink (not shown) to dissipate the aforementioned thermal energy to the exterior of the leadless packaged stacked optocoupler 110. Thereby, the stacked optical coupling module 150 is prevented from being affected by the heat energy and the service life thereof is shortened. In addition, in order to match the size of the thermal pad 70, the structural shape of the contact pad 57 is adjusted (for example, if the area of the thermal pad 70 is larger or smaller than the area of the substrate 10, the structural shape of the contact pad 57 may be adjusted to be L-shaped, if the area of the thermal pad 70 is equal to the area of the substrate 10, the structural shape of the contact pad 57 may be adjusted to be square or L-shaped), but still is exposed out of the molding package housing 60 and is flush with the outer surface of the molding package housing 60.
Referring to fig. 3, a schematic cross-sectional view of a stacked optocoupler of a leadless package according to another embodiment of the utility model is shown. The leadless packaged stacked optocoupler 120 includes a stacked optocoupler module 155, a molded package housing 60, and a plurality of contact pads 55. The leadless package may be, for example, a two-sided flat leadless package or a four-sided flat leadless package.
The embodiment of FIG. 3 is different from the embodiment of FIG. 1 in that the stacked optical coupling module 150 of FIG. 1 is replaced by a stacked optical coupling module 155, and the same elements in the stacked optical coupling module 155 as those in the stacked optical coupling module 150 are denoted by the same reference numerals. The stacked optical coupling module 155 includes a substrate 10, a first optical element 20, an insulating transparent layer 32, a second optical element 40, and a plurality of conductive portions 52. The embodiment of fig. 3 is illustrated by taking two conductive portions 52 as an example, but is not limited thereto. The conductive portion 52 has a different structural shape (e.g., arc shape) from the conductive portion 50 (e.g., strip shape), and the insulating transparent layer 32 has a different structural shape from the insulating transparent layer 30, and the remaining modules or elements are the same as those of the embodiment of fig. 1, and the same description will not be repeated here.
The first light element 20 comprises a first top surface 21 and a first bottom surface 22. The first top surface 21 is disposed away from the substrate 10, and the first bottom surface 22 is symmetrical to the first top surface 21 and disposed on the substrate 10 and electrically connected to the substrate 10.
The second light element 40 comprises a second top surface 41 and a second bottom surface 42. The second top surface 41 is disposed away from the insulating light-transmitting layer 32. The second bottom surface 42 is symmetrical to the second top surface 41, is covered with the insulating transparent layer 32, and is disposed corresponding to the first top surface 21.
In the present embodiment, the first optical element 20 and the second optical element 40 are matched with each other. The first optical element 20 may be a light emitter and the second optical element 40 a light detector. In the foregoing matching case, the first top surface 21 is a light emitting surface, and the second bottom surface 42 is a light receiving surface. In other embodiments, the first light element 20 may be a light detector, and the second light element 40 is a light emitter, where the first top surface 21 is a light receiving surface and the second bottom surface 42 is a light emitting surface.
The insulating light-transmitting layer 32 includes an upper surface 34, and the upper surface 34 is far from the first light element 20 and supports a second bottom surface 42. The insulating light-transmitting layer 32 further comprises a side surface 36, and one end of the side surface 36 is connected to the substrate 10 and the other end is connected to the upper surface 34.
The plurality of conductive portions 52 are disposed proximate the side surface 36. In the present embodiment, the plurality of conductive portions 52 are disposed in an inward curve according to the side surface 36 of the insulating transparent layer 32 to be adjacent to the insulating transparent layer 32. Thereby, the distance between the first optical element 20 and the second optical element 40 can be shortened again, so as to further reduce the overall height of the stacked optical coupling module 155, and the design trend of light, thin and small is met. In other embodiments, the plurality of conductive portions 52 may be disposed convexly according to the convex shape of the side surface 36 of the insulating light-transmitting layer 32.
Fig. 4 is a schematic cross-sectional view illustrating a stacked optocoupler of a leadless package according to another embodiment of the utility model. The leadless packaged stacked optocoupler 130 includes a stacked optocoupler module 155, a molded package housing 60, a plurality of contact pads 57, and a thermal pad 70. The leadless package may be, for example, a two-sided flat leadless package or a four-sided flat leadless package.
The embodiment of fig. 4 is different from the embodiment of fig. 3 in that the contact pad 57 is used to replace the contact pad 55 of fig. 3, and the structural shape (e.g. L-shape) of the contact pad 57 is different from the structural shape (e.g. square shape) of the contact pad 55, and the number of heat conductive pads 70 is increased, and the remaining modules or elements are the same as those of the embodiment of fig. 3, which is not repeated herein.
The thermal pad 70 is in contact with one end of the stacked optical coupling module 155. More specifically, the upper surface (not shown) of the thermal pad 70 contacts the lower surface (not shown) of the substrate 10 and a portion of the inner surface of the contact pad 57 to conduct the heat energy generated by the stacked optical coupling module 155. In other embodiments, the thermal pad 70 may also cooperate with a heat sink to dissipate the aforementioned thermal energy to the exterior of the leadless packaged stacked optocoupler 130. Thereby, the stacked optical coupling module 155 is prevented from being affected by the heat energy to shorten the service life. In addition, the contact pads 57 are configured and shaped to match the size of the thermal pad 70, but are still exposed to the molded package housing 60 and flush with the outer surface of the molded package housing 60.
In summary, the stacked optical coupling device 100, 110 (120, 130) of the leadless package of the present utility model can achieve the objective of improving the physical limitation of the conductive frame and not reducing the volume by the structural design of the conductive portion 50, the contact pad 55 and the stacked optical coupling module 150 (155) without providing an additional conductive frame for each of the first optical element 20 and the second optical element 40. In addition, since the plurality of contact pads 55, 57 of the present utility model have no exposed and protruding pin structures, the stacked optocoupler of the leadless package of the present utility model has a relatively small circuit layout area, thereby conforming to the light, thin, and small design trend. In addition, the heat conducting pad 70 of the present utility model can conduct the heat energy generated by the stacked optical coupling module 150 (155) and cooperate with the heat sink to dissipate the heat energy, thereby prolonging the service life of the stacked optical coupling module 150 (155).
The present utility model has been disclosed in the foregoing in terms of preferred embodiments, however, it will be appreciated by those skilled in the art that the embodiments are merely illustrative of the utility model and should not be construed as limiting the scope of the utility model. It should be noted that all changes and substitutions equivalent to the embodiment are intended to be included in the scope of the present utility model. Accordingly, the scope of the utility model is defined by the claims.
Claims (10)
1. A stacked optocoupler of leadless package, characterized by comprising the following steps:
a stacked optical coupling module, comprising:
A substrate;
a first optical element disposed on the substrate;
an insulating transparent layer covering the first optical element;
A second optical element arranged outside the insulating transparent layer and matched with the first optical element, and
A plurality of conductive parts arranged between the substrate and the second optical element, wherein one end of each of the plurality of conductive parts is electrically connected with the substrate, and the other end of each of the plurality of conductive parts is electrically connected with the second optical element;
A molding package housing having the stacked optical coupling module disposed therein, and
A plurality of contact pads electrically connected to the plurality of conductive portions, respectively;
The contact pads are exposed out of the molded package housing and are flush with the outer surface of the molded package housing.
2. The leadless packaged stacked optocoupler of claim 1 wherein the leadless package is a two-sided flat leadless package or a four-sided flat leadless package.
3. The leadless packaged stacked optocoupler of claim 1 further comprising a thermally conductive pad in contact with the plurality of contact pads and the substrate of the stacked optocoupler module.
4. The leadless packaged stacked optical coupling device of claim 1 wherein the first optical element comprises:
A first top surface disposed away from the substrate, and
The first bottom surface is symmetrical with the first top surface, is arranged on the substrate and is electrically connected with the substrate.
5. The leadless packaged stacked optical coupling device of claim 4 wherein the second optical element comprises:
a second top surface disposed away from the insulating transparent layer, and
The second bottom surface is symmetrical with the second top surface, is covered with the insulating light-transmitting layer, and is arranged corresponding to the first top surface.
6. The leadless packaged stacked optical coupling device of claim 5 wherein the insulating light transmissive layer comprises:
an upper surface, which is far from the first optical element and supports the second bottom surface, and
One side surface, one end of which is connected with the substrate and the other end is connected with the upper surface.
7. The leadless packaged stacked optical coupling device of claim 5 or 6 wherein the first optical element is an optical transmitter and the second optical element is an optical detector.
8. The leadless packaged stacked optical coupling device of claim 7 wherein the first top surface is a light emitting surface and the second bottom surface is a light receiving surface.
9. The leadless packaged stacked optical coupling device of claim 5 or 6 wherein the first optical element is a photodetector and the second optical element is an optical transmitter.
10. The leadless packaged stacked optical coupling device of claim 9 wherein the first top surface is a light receiving surface and the second bottom surface is a light emitting surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW112205814 | 2023-06-08 | ||
| TW112205814U TWM646184U (en) | 2023-06-08 | 2023-06-08 | Stacked light coupling device using lead-free packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222483389U true CN222483389U (en) | 2025-02-14 |
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ID=88927080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421114282.3U Active CN222483389U (en) | 2023-06-08 | 2024-05-21 | Stacked optocoupler for leadless packages |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN222483389U (en) |
| TW (1) | TWM646184U (en) |
-
2023
- 2023-06-08 TW TW112205814U patent/TWM646184U/en unknown
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2024
- 2024-05-21 CN CN202421114282.3U patent/CN222483389U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM646184U (en) | 2023-09-11 |
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