CN106449778A - Photoelectric coupler package structure used for large-scale integration - Google Patents

Abstract

A photocoupler packaging structure for large-scale integration, the photocoupler packaging structure is composed of a ceramic substrate, a cover, a light-emitting diode, a photosensitive chip and a plurality of metal conduction strips; the beneficial technical effects of the present invention are: proposed An optocoupler packaging structure for large-scale integration, the solution is only a simple non-hermetic package for the optocoupler unit, and then the optocoupler unit is hermetically packaged with other components, benefiting from The size of the photocoupler unit is reduced, and the total volume of the device after large-scale integration can be greatly reduced.

Description

Optocoupler Package Structure for Large Scale Integration

technical field

The invention relates to a photoelectric coupler packaging technology, in particular to a photoelectric coupler packaging structure for large-scale integration.

Background technique

Optocoupler is a common optoelectronic device. In the prior art, when making optocoupler, the optocoupler is generally hermetically sealed independently. In order to ensure airtightness, the ceramic shell used for hermetic packaging must meet Certain thickness requirements, if the size of the ceramic shell continues to be reduced, it will be difficult to ensure the airtightness of the package, and as the volume decreases, the operation difficulty of device assembly will increase accordingly; the existing problem is: through the integrated package shell When the aforementioned hermetically sealed optocoupler and other circuit units are integrated and packaged, each component is distributed on a plane, because the size of the hermetically sealed structure of the optocoupler is large (the size of other components are relatively small) , making it difficult to further reduce the size of the integrated packaging structure, which not only causes a large amount of structural redundancy on the device, but also leads to a large overall size of the integrated package, which is not conducive to the application of the device.

Contents of the invention

Aiming at the problems in the background technology, the present invention proposes a photocoupler packaging structure for large-scale integration. Composed of metal conduction bands; the ceramic substrate is cube-shaped, and a groove with a rectangular cross-section is arranged on the upper end surface of the ceramic substrate, the groove is a through groove, and the axial direction of the groove is parallel to the length direction of the cube; The middle part of the bottom surface of the groove is provided with an installation groove, the width of the installation groove is the same as the groove, and the bottom surface of the groove other than the installation groove forms a connecting surface; the photosensitive chip is arranged at the bottom of the installation groove; the cover is a plate-shaped structure , the axial length of the cover matches the axial length of the groove, the width of the cover is smaller than the width of the groove, the cover is arranged in the groove, and the lower end surface of the cover is bonded to the connecting surface; the light-emitting diode is arranged on the cover The position of the light-emitting diode is opposite to the photosensitive chip on the lower end surface of the lower surface; the metal conduction strip is arranged on the surface of the ceramic substrate, the inner end of the metal conduction strip extends into the installation groove, and the outer end of the metal conduction strip extends to the upper end surface of the ceramic substrate , each metal conduction strip is independent of each other, and the electrical terminals of the light-emitting diode and the photosensitive chip are respectively drawn out through a plurality of metal conduction strips.

The principle of the present invention is: It is not difficult to see from the foregoing introduction that since the width of the cover is smaller than the width of the groove, when the cover is set in the groove, it can only partially cover the installation groove, and the installation groove is not completely sealed. Such a structure has three purposes. First, the cover is not used as a sealed cover, but only as a support for setting the light-emitting diodes. Second, for the optocoupler unit, the ceramic substrate and cover The formed shell does not need to be airtight. In the subsequent integrated package, the optocoupler and other components are hermetically packaged by the integrated package housing, so the thickness of the ceramic substrate and cover can be further reduced, so that the optoelectronic The size of the coupler unit is also reduced accordingly, which finally reduces the total volume of the large-scale integrated device, thereby reducing structural redundancy and reducing the installation space requirements of the integrated device. Third, since there is no need for photocouplers The unit is hermetically sealed, the structure of the ceramic substrate and the cover is relatively simple, and the processing and assembly are relatively convenient. Even if the photocoupler unit is small in size, the operation is very convenient.

The beneficial technical effects of the present invention are: a kind of optocoupler packaging structure for large-scale integration is proposed, the scheme only does simple non-airtight packaging for the optocoupler unit, and then the optocoupler unit is combined with other The components are hermetically sealed as a whole. Thanks to the size reduction of the optocoupler unit, the total volume of the device after large-scale integration can be greatly reduced.

Description of drawings

Figure 1. Schematic diagram of the photocoupler unit structure;

Figure 2. Schematic diagram of the cross-sectional structure of the optocoupler unit;

Figure 3. Schematic diagram of the ceramic substrate structure;

The names corresponding to each mark in the figure are: ceramic substrate 1, cover 2, light-emitting diode 3, photosensitive chip 4, and metal conductive strip 5.

detailed description

A photocoupler package structure for large-scale integration, the innovation of which is: the photocoupler package structure is composed of a ceramic substrate 1, a cover 2, a light emitting diode 3, a photosensitive chip 4 and a plurality of metal conduction strips; The ceramic substrate 1 is cube-shaped, and the upper end surface of the ceramic substrate 1 is provided with a groove with a rectangular cross section, the groove is a through groove, and the axial direction of the groove is parallel to the length direction of the cube shape; The middle part of the bottom surface is provided with an installation groove, the width of the installation groove is the same as the groove, and the bottom surface of the groove other than the installation groove forms a connecting surface; the photosensitive chip 4 is arranged at the bottom of the installation groove; the cover 2 is a plate-shaped structure, and the cover 2 The axial length of the cover matches the axial length of the groove, the width of the cover 2 is smaller than the width of the groove, the cover 2 is arranged in the groove, and the lower end surface of the cover 2 is bonded to the connecting surface; the light emitting diode 3 is set On the lower end surface of the cover 2, the position of the light-emitting diode 3 is opposite to the photosensitive chip 4; the metal conduction strip is arranged on the surface of the ceramic substrate 1, the inner end of the metal conduction strip extends into the installation groove, and the outer end of the metal conduction strip Extending to the upper end surface of the ceramic substrate 1, each metal conduction strip is independent of each other, and the electrical terminals of the light-emitting diode 3 and the photosensitive chip 4 are respectively drawn out through a plurality of metal conduction strips.

Claims (1)

1. a kind of photoelectrical coupler encapsulating structure for large-scale integrated it is characterised in that：Described photoelectrical coupler encapsulation knot Structure is by ceramic substrate（1）, lid（2）, light emitting diode（3）, photosensor chip（4）With a plurality of metal conduction band composition；Described pottery Substrate（1）For cube shaped, ceramic substrate（1）The groove of rectangular cross-section is provided with upper surface, described groove is groove, recessed The axial direction of groove is parallel with described cube shaped length direction；It is provided with mounting groove in the middle part of the bottom surface of described groove, mounting groove Width is identical with groove, and the groove floor beyond mounting groove forms joint face；Described photosensor chip（4）It is arranged on mounting groove bottom Portion；Described lid（2）For plate-like structure, lid（2）Axial length mate with the axial length of groove, lid（2）Width Degree is less than the width of groove, lid（2）It is arranged in groove, lid（2）Lower surface and described joint face bonding；Described luminous Diode（3）It is arranged on lid（2）Lower surface on, light emitting diode（3）Position and photosensor chip（4）Relatively；Described gold Belong to conduction band and be arranged on ceramic substrate（1）Surface, the inner of metal conduction band extends in mounting groove, and the outer end of metal conduction band extends To ceramic substrate（1）Upper surface, each bar metal conduction band is separate, light emitting diode（3）And photosensor chip（4）Electric terminal Outwards drawn by a plurality of metal conduction band respectively.