CN222364244U - A water cooling device - Google Patents
A water cooling device Download PDFInfo
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- CN222364244U CN222364244U CN202420290117.7U CN202420290117U CN222364244U CN 222364244 U CN222364244 U CN 222364244U CN 202420290117 U CN202420290117 U CN 202420290117U CN 222364244 U CN222364244 U CN 222364244U
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- water
- water cooling
- cooling device
- storage tank
- module
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 167
- 238000001816 cooling Methods 0.000 title claims abstract description 104
- 238000005057 refrigeration Methods 0.000 claims abstract description 84
- 239000007788 liquid Substances 0.000 claims abstract description 74
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 238000004140 cleaning Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001502 supplementing effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
本实用新型公开一种水冷装置，包括箱体，及装设在所述箱体内的储水箱及水冷机构；所述水冷机构包括水冷架、装设在所述水冷架上且上下叠放的上制冷模块与下制冷模块；所述上制冷模块及下制冷模块均包括温度传导鳍片、与所述温度传导鳍片相连的半导体芯片及设置在所述温度传导鳍片内的制冷流道。本实用新型通过在所述箱体内设置有上制冷模块与下制冷模块，从而可以通过上制冷模块及下制冷模块分别对对应的制冷流道内的液体进行制冷，极大的提高了制冷效率，且当其中一个制冷模块发生故障时，另一个制冷模块还能正常制冷，从而能够保证水冷装置能够继续运行，避免由于水冷装置完成损坏而给用户带来损失。
The utility model discloses a water cooling device, comprising a box body, and a water storage tank and a water cooling mechanism installed in the box body; the water cooling mechanism comprises a water cooling frame, an upper refrigeration module and a lower refrigeration module installed on the water cooling frame and stacked up and down; the upper refrigeration module and the lower refrigeration module both comprise temperature conduction fins, a semiconductor chip connected to the temperature conduction fins, and a refrigeration channel arranged in the temperature conduction fins. The utility model is provided with an upper refrigeration module and a lower refrigeration module in the box body, so that the upper refrigeration module and the lower refrigeration module can respectively refrigerate the liquid in the corresponding refrigeration channel, greatly improving the refrigeration efficiency, and when one of the refrigeration modules fails, the other refrigeration module can still refrigerate normally, thereby ensuring that the water cooling device can continue to operate, avoiding losses to users due to damage to the water cooling device.
Description
Technical Field
The utility model relates to the technical field of refrigeration, in particular to a water cooling device.
Background
With the development of society, the technology level is continuously improved, various technological equipment is continuously updated and iterated, the refrigerating equipment is also same, the water cooling device is used as one of the refrigerating equipment, the technology activity is also important, the water cooling device usually comprises a refrigerating module for refrigerating high-temperature liquid flowing into the water cooling device to form low-temperature liquid or heating the low-temperature liquid flowing into the water cooling device to form high-temperature liquid and then flowing out of the water cooling device, so that the effect of refrigerating or heating a liquid medium is achieved, the semiconductor chip can be widely used in the water cooling device due to the characteristic that the semiconductor chip can be refrigerated or heated by positive and negative electrification, the conventional semiconductor chip water cooling device only uses a plate refrigerating chip for refrigerating a built-in refrigerating runner, the refrigerating effect is common, and when the refrigerating chip is damaged, the water cooling device cannot operate, and therefore storage substances in a storage device connected with the water cooling device cannot be stored, and loss is caused to users.
Disclosure of utility model
The utility model provides a water cooling device for solving the technical problems in the background art.
The utility model provides a water cooling device, which comprises a box body, a water storage tank and a water cooling mechanism, wherein the water storage tank is arranged in the box body, a water inlet of the water storage tank is connected with a liquid inlet of the water cooling device, the water cooling mechanism is connected with a water outlet of the water storage tank, the water cooling mechanism comprises a water cooling frame arranged in the box body, an upper refrigerating module and a lower refrigerating module which are arranged on the water cooling frame and are stacked up and down, the upper refrigerating module and the lower refrigerating module respectively comprise temperature conduction fins, a semiconductor chip connected with the temperature conduction fins and a refrigerating runner arranged in the temperature conduction fins, runner inlets of the refrigerating runners of the upper refrigerating module and the lower refrigerating module are connected with the water outlet of the water storage tank, and runner outlets of the refrigerating runners of the upper refrigerating module and the lower refrigerating module are connected with a liquid outlet of the water cooling device.
Further, the water cooling device further comprises a water pump connected with the water outlet of the water storage tank, and the outlet of the water pump is communicated with the flow channel inlets of the refrigerating flow channels of the upper refrigerating module and the lower refrigerating module.
Further, the flow channel outlets of the upper refrigeration module and the lower refrigeration module are communicated with the liquid outlet through a liquid outlet pipe, and the liquid outlet pipe is provided with a flowmeter.
Further, the liquid inlet is communicated with the water inlet of the water storage tank through a liquid inlet pipe, and the water cooling device further comprises a filter which is arranged on the liquid inlet pipe.
Further, the water cooling device further comprises a filter, the flow channel outlets of the upper refrigeration module and the lower refrigeration module are communicated with the liquid outlet through a liquid outlet pipe, and the filter is arranged on the liquid outlet pipe.
Further, the water cooling mechanism also comprises a heat dissipation component, wherein the heat dissipation component comprises a heat dissipation fan group arranged on the temperature conduction fins.
Further, the cooling fan group comprises two cooling fans which are connected with the temperature conduction fins of the upper refrigerating module and are arranged in parallel, and the cooling fan group further comprises two cooling fans which are connected with the temperature conduction fins of the lower refrigerating module and are arranged in parallel.
Further, the water storage tank and the bottom of the tank body are arranged at intervals, a cleaning opening is formed in the bottom of the water storage tank, and the cleaning opening is communicated with a cleaning pipe.
Further, a water level sensor is arranged in the water storage tank, and/or an overflow-preventing water outlet is arranged on the side wall of the water storage tank.
Further, the upper refrigeration module and the lower refrigeration module each further comprise a control chip connected with the corresponding semiconductor chip, and the control chips of the upper refrigeration module and the lower refrigeration module are connected with the controller of the water cooling device.
By adopting the technical scheme, the upper refrigeration module and the lower refrigeration module are arranged in the box body, so that the liquid in the corresponding refrigeration flow channels can be respectively refrigerated through the upper refrigeration module and the lower refrigeration module, the refrigeration efficiency is greatly improved, when one refrigeration module fails, the other refrigeration module can also perform normal refrigeration, the water cooling device can continue to operate, the loss caused by the damage of the water cooling device is avoided, in particular, external liquid flows into the water storage tank through the liquid inlet and is stored in the water storage tank, when refrigeration is needed, the liquid in the water storage tank flows into the corresponding refrigeration flow channels through the water outlet respectively from the flow channel inlet of the upper refrigeration module and the flow channel inlet of the lower refrigeration module, and in the process that the liquid flows through the refrigeration flow channels, the refrigeration is performed by the semiconductor chip, namely the cold temperature generated by the semiconductor chip is conducted onto the liquid in the refrigeration flow channels through the stable conduction fins, the effect of refrigerating the liquid is achieved, and then the liquid in the upper refrigeration module and the lower refrigeration module flows into equipment to be cooled through the corresponding flow channel outlets respectively, and the equipment to be cooled.
Drawings
FIG. 1 is a perspective view of a water cooling apparatus according to the present utility model.
Fig. 2 is another perspective view of the water cooling apparatus of the present utility model.
Fig. 3 is a perspective view of a hidden case of the water cooling device of the present utility model.
Fig. 4 is another perspective view of the hidden case of the water cooling device of the present utility model.
Fig. 5 is a perspective view of the water cooling mechanism of the present utility model.
Fig. 6 is another perspective view of the water cooling mechanism of the present utility model.
Fig. 7 is a perspective view of an upper or lower refrigeration module of the present utility model.
Fig. 8 is a perspective view of the water storage tank of the present utility model.
Detailed Description
The utility model will be described in further detail below with reference to the drawings by means of specific embodiments. It should be understood that the embodiments described below by referring to the drawings are exemplary and intended to illustrate the utility model and not to be construed as limiting the utility model, and that features of embodiments of the utility model may be combined with each other without conflict.
As shown in fig. 1-8, the utility model provides a water cooling device, which comprises a box body 1, a water storage tank 13 arranged in the box body 1 and with a water inlet 131 connected with a liquid inlet 121 of the water cooling device, and a water cooling mechanism 14 connected with a water outlet 132 of the water storage tank 13, wherein the water cooling mechanism 14 comprises a water cooling frame 141 arranged in the box body 1, an upper refrigerating module 142 and a lower refrigerating module 143 which are arranged on the water cooling frame 141 and are stacked up and down, the upper refrigerating module 142 and the lower refrigerating module 143 respectively comprise a temperature conduction fin 1421, a semiconductor chip 1427 connected with the temperature conduction fin 1421, and a refrigerating runner 1422 arranged in the temperature conduction fin 1421, the runner inlets 1423 of the refrigerating runners 1422 of the upper refrigerating module 142 and the lower refrigerating module 143 are respectively connected with the water outlet 132 of the water storage tank 13, and the runner outlets 6 of the refrigerating runners 1422 of the upper refrigerating module 142 and the lower refrigerating module 143 are respectively connected with the liquid outlet 122 of the water cooling device.
In this embodiment, by arranging the upper refrigeration module 142 and the lower refrigeration module 143 in the box 1, the refrigeration efficiency can be greatly improved by respectively refrigerating the liquid in the corresponding refrigeration channels 1422 through the upper refrigeration module 142 and the lower refrigeration module 143, and when one refrigeration module fails, the other refrigeration module can also perform normal refrigeration, so that the water cooling device can continue to operate, the loss of the user caused by the damage of the water cooling device is avoided, in particular, the external liquid flows into the water storage tank 13 through the liquid inlet 121 and is stored in the water storage tank 13, when the refrigeration is required, the liquid in the water storage tank 13 flows into the corresponding refrigeration channels 1422 through the water outlet 132 from the channel inlets 1423 of the upper refrigeration module 142 and the channel inlets 1423 of the lower refrigeration module 143, and in the process that the liquid flows through the refrigeration channels 1422, the refrigeration temperature generated by the semiconductor chip 1427 is conducted onto the liquid in the refrigeration channels 1422 through the stable conduction fins, so that the effect of refrigerating the liquid is achieved, and then the liquid in the upper refrigeration module 142 and the required lower refrigeration module flows into the required cooling devices 122 through the corresponding cooling channels 1426 respectively.
The utility model can be used for refrigerating a reagent refrigerating pot and can also be used for refrigerating or heating other equipment, and specifically, only the liquid outlet 122 of the water cooling device is connected with the water cooling inlet of the corresponding equipment.
In a specific embodiment, the water cooling device further includes a water pump 15 connected to the water outlet 132 of the water tank 13, a pump outlet of the water pump 15 is connected to the flow channel inlets 1423 of the cooling flow channels 1422 of the upper cooling module 142 and the lower cooling module 143, in this embodiment, the water pump 15 may be connected to the flow channel inlets 1423 of the water tank 13 and the cooling flow channels 1422, so that the liquid in the water tank 13 may be pumped into the cooling flow channels 1422 of the upper cooling module 142 and the lower cooling module 143 by the water pump 15, the water pump 15 is connected to the flow channel inlets 1423 by a pump pipe, the water pump 15 may be connected to the controller 192, and the controller 192 may control the flow rate and the flow velocity of the liquid according to actual needs, thereby achieving the effect of auxiliary temperature control.
In a specific embodiment, the flow channel outlets 1426 of the upper refrigeration module 142 and the lower refrigeration module 143 are both communicated with the liquid outlet 122 through the liquid outlet pipe 172, the liquid outlet pipe 172 is provided with a flow meter 16, the flow meter 16 is used for measuring the liquid flow rate flowing out of the water cooling device, and the flow meter 16 may be disposed on a middle section of the liquid outlet pipe 172, or may be disposed at one end of the liquid outlet pipe 172 near the flow channel outlet 1426, or disposed at one end of the liquid outlet pipe 172 near the liquid outlet 122.
In a specific embodiment, the liquid inlet 121 is communicated with the water inlet 131 of the water storage tank 13 through a liquid inlet pipe 171, the water cooling device further includes a filter 18, the filter 18 is installed on the liquid inlet pipe 171, and the filter 18 is arranged on the liquid inlet pipe 171, so that the flowing liquid can be filtered, impurities are prevented from entering the water cooling device, the operation of the water cooling device is affected, and the filter 18 can be arranged on a middle section of the liquid inlet pipe 171, or can be arranged at one end of the liquid inlet pipe 171 close to the liquid inlet 121, or can be arranged at one end of the liquid inlet pipe 171 close to the water inlet 131.
In a specific embodiment, the water cooling device further includes a filter 18, the flow channel outlets 1426 of the upper refrigeration module 142 and the lower refrigeration module 143 are both communicated with the liquid outlet 122 through a liquid outlet pipe 172, the filter 18 is disposed on the liquid outlet pipe 172, and the filter 18 is disposed on the liquid outlet pipe 172, so that the liquid flowing into the corresponding device can be filtered, and impurities are prevented from entering the corresponding device, so that the refrigeration effect of the corresponding device is prevented from being affected.
In one embodiment, the water cooling mechanism 14 further includes a heat dissipating component, and the heat dissipating component includes a heat dissipating fan set mounted on the temperature conductive fins 1421, through which heat can be dissipated from the heating end of the semiconductor chip 1427, so that the semiconductor chip 1427 can operate normally.
In a specific embodiment, the cooling fan set includes two cooling fans 1424 connected to the temperature conductive fins 1421 of the upper refrigeration module 142 and arranged in parallel, and further includes two cooling fans 1424 connected to the temperature conductive fins 1421 of the lower refrigeration module 143 and arranged in parallel, and the upper refrigeration module 142 and the lower refrigeration module 143 respectively dissipate heat through the two cooling fans 1424, so that the heat dissipation uniformity during refrigeration of the semiconductor chip 1427 can be improved.
In a specific embodiment, the water storage tank 13 is arranged at intervals with the bottom of the tank body 1, a cleaning opening 136 is formed in the bottom of the water storage tank 13, the cleaning opening 136 is communicated with a cleaning pipe 173, the water storage tank 13 is arranged at intervals with the bottom of the tank body 1 to prevent the outside of the water storage tank 13 from being corroded by oxidation, the cleaning opening 136 is formed in the bottom of the water storage tank 13, when the liquid in the water storage tank 13 needs to be replaced, an outlet of the cleaning pipe 173 can be opened, so that the liquid in the water storage tank 13 can flow out from the cleaning pipe 173, and impurities in the water storage tank 13 are conveniently discharged due to the fact that the cleaning opening 136 is formed in the bottom of the tank body 1.
In a specific embodiment, the top of the water tank 13 is further provided with a fluid-filling port 135, and the fluid-filling port 135 is used for filling when the fluid in the water tank 13 is insufficient.
In a specific embodiment, a water level sensor 133 is disposed in the water tank 13, the water level sensor 133 is connected to the controller 192, so as to detect a water level change in the water tank 13, thereby controlling the fluid supplementing mechanism to supplement fluid through the fluid supplementing port 135, the side wall of the water tank 13 is provided with an anti-overflow drain outlet 134, the height of the anti-overflow drain outlet 134 is set according to requirements, when the liquid level in the water tank 13 is higher than a preset height, the liquid will flow out from the anti-overflow drain outlet 134 at this time, and the water level sensor 133 can be triggered at this time, so as to inform the controller 192 of making a corresponding instruction.
In a specific embodiment, the upper refrigeration module 142 and the lower refrigeration module 143 further include control chips 1425 connected to corresponding semiconductor chips 1427, the control chips 1425 of the upper refrigeration module 142 and the lower refrigeration module 143 are connected to the controller 192 of the water cooling device, and the upper refrigeration module 142 and the lower refrigeration module 143 can be independently controlled by providing corresponding control chips 1425, so that when one of them has a problem, the other refrigeration module can be independently operated.
In one embodiment, the flow channel inlets 1423 and the flow channel outlets 1426 of the upper refrigeration module 142 and the lower refrigeration module 143 are provided with electromagnetic valves, and when the corresponding refrigeration module fails, the controller 192 may control the corresponding electromagnetic valve to close the corresponding refrigeration flow channel 1422, thereby preventing the uncooled liquid from flowing into the corresponding device.
In a specific embodiment, a control panel 191 connected to the controller 192 is disposed outside the case 1, and a user can control the water cooling device according to the control panel 191.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A water cooling device is characterized by comprising a box body, a water storage tank and a water cooling mechanism, wherein the water storage tank is arranged in the box body, a water inlet of the water storage tank is connected with a liquid inlet of the water cooling device, the water cooling mechanism is connected with a water outlet of the water storage tank, the water cooling mechanism comprises a water cooling frame arranged in the box body, an upper refrigerating module and a lower refrigerating module which are arranged on the water cooling frame and are stacked up and down, the upper refrigerating module and the lower refrigerating module respectively comprise temperature conduction fins, a semiconductor chip connected with the temperature conduction fins and refrigerating channels arranged in the temperature conduction fins, channel inlets of the refrigerating channels of the upper refrigerating module and the lower refrigerating module are connected with the water outlet of the water storage tank, and channel outlets of the refrigerating channels of the upper refrigerating module and the lower refrigerating module are connected with a liquid outlet of the water cooling device.
2. The water cooling device according to claim 1, further comprising a water pump connected to the water outlet of the water tank, wherein a pump outlet of the water pump is communicated with the flow channel inlets of the refrigerating flow channels of the upper refrigerating module and the lower refrigerating module.
3. The water cooling device of claim 1, wherein the outlets of the flow channels of the upper refrigeration module and the lower refrigeration module are communicated with the liquid outlet through a liquid outlet pipe, and the liquid outlet pipe is provided with a flowmeter.
4. The water cooling device according to any one of claims 1 to 3, wherein the liquid inlet is communicated with the water inlet of the water storage tank through a liquid inlet pipe, and the water cooling device further comprises a filter, and the filter is arranged on the liquid inlet pipe.
5. The water cooling apparatus according to claim 3, further comprising a filter provided on the liquid outlet pipe.
6. The water cooling apparatus according to any one of claims 1 to 3, wherein the water cooling mechanism further comprises a heat dissipating assembly including a heat dissipating fan group mounted on the temperature conductive fins.
7. The water cooling device of claim 6, wherein the cooling fan set comprises two cooling fans connected with the temperature conduction fins of the upper refrigeration module and arranged in parallel, and the cooling fan set further comprises two cooling fans connected with the temperature conduction fins of the lower refrigeration module and arranged in parallel.
8. A water cooling device according to any one of claims 1 to 3, wherein the water storage tank is arranged at a distance from the bottom of the tank body, and a cleaning opening is arranged at the bottom of the water storage tank and is communicated with a cleaning pipe.
9. A water cooling device according to any one of claims 1 to 3, wherein a water level sensor is provided in the water storage tank and/or an overflow-preventing drain outlet is provided in a side wall of the water storage tank.
10. The water cooling apparatus as set forth in any one of claims 1-3, wherein the upper and lower cooling modules each further comprise a control chip connected to a corresponding semiconductor chip, and the control chips of the upper and lower cooling modules each are connected to a controller of the water cooling apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420290117.7U CN222364244U (en) | 2024-02-08 | 2024-02-08 | A water cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420290117.7U CN222364244U (en) | 2024-02-08 | 2024-02-08 | A water cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222364244U true CN222364244U (en) | 2025-01-17 |
Family
ID=94224355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420290117.7U Active CN222364244U (en) | 2024-02-08 | 2024-02-08 | A water cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222364244U (en) |
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2024
- 2024-02-08 CN CN202420290117.7U patent/CN222364244U/en active Active
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