CN221995691U - A packaging structure with surface metallization and welding of metal threaded needle seat - Google Patents
A packaging structure with surface metallization and welding of metal threaded needle seat Download PDFInfo
- Publication number
- CN221995691U CN221995691U CN202420448673.2U CN202420448673U CN221995691U CN 221995691 U CN221995691 U CN 221995691U CN 202420448673 U CN202420448673 U CN 202420448673U CN 221995691 U CN221995691 U CN 221995691U
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- China
- Prior art keywords
- needle seat
- metal threaded
- plastic package
- metallized
- threaded needle
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 238000001465 metallisation Methods 0.000 title abstract description 21
- 238000004021 metal welding Methods 0.000 title 1
- 239000002184 metal Substances 0.000 claims abstract description 86
- 229910052751 metal Inorganic materials 0.000 claims abstract description 86
- 239000004033 plastic Substances 0.000 claims abstract description 78
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000003466 welding Methods 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 238000007788 roughening Methods 0.000 claims description 13
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000001746 injection moulding Methods 0.000 claims description 4
- 238000010137 moulding (plastic) Methods 0.000 claims description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000000059 patterning Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920002730 Poly(butyl cyanoacrylate) Polymers 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a packaging structure of a surface metallization and welding metal thread needle seat. The packaging structure comprises a PCBA substrate, a plastic package body, a metallization coating and a metal thread needle seat assembly; the plastic package body wraps the upper surface and the lower surface of the PCBA substrate, and the surface of the plastic package body is provided with mechanical deep holes which are single-sided and double-sided symmetrical and are used for controlling the depth to the gold-plated PAD on the surface of the inner layer PCBA substrate; plastic package body wrapped by metal coating upper and lower surfaces and deep control holes; the metal thread needle seat component is welded in the metallized deep control hole on the surface of the plastic package body; wherein the metal threaded hub assembly includes a metal threaded hub that acts as an electrical pin and a metal threaded hub that acts as a GND terminal. The packaging structure has the advantages of small size, high heat dissipation efficiency of the metallization coating of the plastic package body, strong physical impact resistance of the welded metal threaded needle seat, shielding of external electromagnetic interference by grounding of the shell and the like, and can greatly improve the reliability of the electronic product in the use process.
Description
Technical Field
The utility model belongs to the technical field of packaging, and particularly relates to a packaging structure of a surface metallization and welding metal thread needle seat.
Background
In the current high-power-density module power supply product technology, a mode of attaching an electric pin assembly to the side of a module is adopted, and the module size of the side electric pin assembly is increased compared with that of a plastic package module; and in the mode of attaching the electric pin assembly to the side of the plastic package body module, the welding strength of the pin assembly is not high, and the requirements of high reliability characteristics in the fields of aviation, aerospace, military industry and the like cannot be completely met.
Disclosure of utility model
The utility model aims to solve the problems in the prior art and provides a packaging structure of a surface metallization and welding metal thread needle seat of a double-sided plastic package.
The technical solution for realizing the purpose of the utility model is as follows: a packaging structure of a surface metallization and welding metal thread needle seat comprises a PCBA substrate, a plastic package body, a metallization coating and a metal thread needle seat component; the plastic package body wraps the upper surface and the lower surface of the PCBA substrate; the surface of the plastic package is provided with mechanical deep holes with single-sided and double-sided symmetrical deep control to the gold-plated PAD on the surface of the inner PCBA substrate; the upper surface and the lower surface of the plastic package body and the hole wall of the mechanical deep control hole are wrapped by the metallized coating to obtain a metallized surface and a metallized hole; the metal threaded hub assembly being welded in the metallized bore; the metal threaded hub assembly includes a first metal threaded hub that acts as an electrical pin and a second metal threaded hub that acts as a GND terminal.
Further, the PCBA substrate is subjected to injection molding in a plastic molding die, and plastic packaging bodies are wrapped on the upper surface and the lower surface of the PCBA substrate after injection molding.
Further, the single-sided mechanical control deep hole and the double-sided symmetrical mechanical control deep hole on the surface of the plastic package body respectively correspond to the size of the part of the first metal thread needle seat embedded into the plastic package body and the size of the part of the second metal thread needle seat embedded into the plastic package body in terms of aperture specification; the rest part of the metal thread needle seat component except for the embedded plastic package body is a hollow stud protruding out and higher than the surface of the plastic package body.
Further, the double-sided symmetrical mechanical deep hole is controlled to be deep enough to plate PAD on the two sides of the element and the solder on the surface of the inner layer PCBA substrate.
Further, the single-sided mechanical control deep hole is communicated and conducted with a through hole of the PCBA substrate, and the first metal threaded needle seat welded in the metalized single-sided mechanical control deep hole is electrically connected with the circuit board main board;
The metallized plating layers on the upper surface and the lower surface of the plastic package body are communicated and conducted with the through hole of the PCBA substrate through the double-sided symmetrical mechanical control deep hole on the surface of the plastic package body, and the second metal threaded needle seat welded in the metallized double-sided symmetrical mechanical control deep hole is communicated with the ground.
Further, the metallized coating is obtained by performing roughening treatment on the surface of the plastic package, and then performing chemical deposition of a copper layer, electroplating of the copper layer and chemical plating of the gold layer.
Further, the surface of the plastic package body is subjected to patterning treatment, which comprises insulating treatment on the first metal thread needle seat and the metallized surface, and not treating the second metal thread needle seat and the metallized surface.
Further, the patterning process adopts a mechanical depth control fishing mode, the depth control depth is the thickness of the metallization coating, and the damage degree of the plastic package body does not exceed a set threshold value.
Further, the surface of the metal threaded needle hub assembly is treated with electroplated nickel gold.
Further, the first metal thread needle seat and the second metal thread needle seat are welded on one side, and the welding surfaces are consistent.
Compared with the prior art, the utility model has the remarkable advantages that:
(1) On the basis of the original microelectronic plastic package process, a surface metallization coating is added, single-sided and double-sided symmetrical deep control holes for conducting PCBA substrates and the upper surface and the lower surface of a plastic package body are formed, and metal thread components are welded in the metallization hole deep holes on the surface of the plastic package body to play roles in electric connection and GND; the module for welding the metal threaded needle seat further enhances the welding reliability, and has higher reliability and stronger physical impact resistance (the physical impact resistance of a module power supply in a severe environment is improved).
(2) The device that PCB base plate surface generated heat not only can dispel the heat to the metallized surface through the plastic envelope body heat conduction of top bottom surface, can effectually reduce the device temperature on PCBA base plate surface, can also conduct welded metal thread needle file through PCBA base plate internal circuit to dispel the heat through metal thread needle file and circuit board mainboard, radiating efficiency is higher.
(3) GND packaging structure for conducting the metallized coating on the surface of the PBCA substrate and the plastic package surface can effectively shield external electromagnetic interference.
The utility model is described in further detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram of a PCBA substrate in one embodiment.
Fig. 2 is a schematic diagram of a PCBA substrate after molding is completed in one embodiment.
Fig. 3 is a schematic diagram of a surface drilling and metallization process for a plastic package in one embodiment.
Fig. 4 is a schematic diagram of patterning a metal plating layer of a plastic package body in one embodiment.
Fig. 5 is a schematic view of the finished welded metal threaded hub assembly in one embodiment.
Fig. 6 is a schematic diagram of a metal threaded hub serving as an electrical pin for single-sided deep hole soldering in one embodiment.
Fig. 7 is a schematic diagram of a metal threaded ferrule serving as a GND terminal by double-sided hole deep-hole welding in one embodiment.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
It should be noted that, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is only for descriptive purposes, and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
In one embodiment, in combination with fig. 1-7, there is provided a package structure for surface metallization and soldering of a metal threaded hub, the package structure comprising a PCBA substrate 1, a plastic package 2, a metallization layer 3 and a metal threaded hub assembly 4; the plastic package body 2 wraps the upper surface and the lower surface of the PCBA substrate 1; the surface of the plastic package body 2 is provided with mechanical deep holes which are single-sided and double-sided symmetrical and are used for controlling the depth to the gold-plated PAD on the surface of the inner PCBA substrate 1; the metallized coating 3 wraps the upper surface and the lower surface of the plastic package body 2 and the hole wall of the mechanical deep control hole to obtain a metallized surface and a metallized hole; the metal threaded needle hub assembly 4 is welded in the metallized hole; the metal threaded hub assembly 4 comprises a first metal threaded hub 4.1 acting as an electrical pin and a second metal threaded hub 4.2 acting as a GND terminal.
The final molded module power supply product is obtained by welding metal threaded needle seat components 4 on the surface metalized holes of a plastic package body 2.
Further, in one embodiment, as shown in fig. 1 and 2, the PCBA substrate 1 is injection-molded in a molding mold, and the injection-molded plastic package body 2 is wrapped on the upper and lower surfaces of the PCBA substrate 1.
Further, in one embodiment, as shown in fig. 3, the single-sided mechanical deep control hole 2.1 and the double-sided symmetrical mechanical deep control hole 2.2 on the surface of the plastic package body 2 have pore sizes corresponding to the size of the portion of the first metal threaded needle seat 4.1 embedded in the plastic package body 2 and the size of the portion of the second metal threaded needle seat 4.2 embedded in the plastic package body 2, respectively; the rest part of the metal thread needle seat component 4 except for being embedded into the plastic package body 2 is a hollow stud protruding out and higher than the surface of the plastic package body 2 (the metal thread needle seat component can also be adaptively adjusted according to actual requirements).
Here, the single-sided mechanical deep hole control 2.1 is to perform single-sided mechanical deep control on the plastic package body 2 to reach the gold plating PAD 1.2 on the surface of the inner layer PCBA substrate 1; the double-sided symmetrical mechanical deep hole control 2.2 is to perform double-sided symmetrical mechanical deep control on the plastic package body 2 until the deep control reaches the element and solder two sides of the surface of the inner PCBA substrate 1 to plate PAD 1.2.
Here, the mechanical depth control is that the gold plating PAD1.2 contacts with the surface of the PCBA substrate at the inner layer of the plastic package, if the depth control is insufficient, the gold plating PAD1.2 is not contacted, and the conduction effect cannot be achieved, if the depth control exceeds the standard, the PCBA substrate at the inner layer is damaged, and the conduction performance is also affected.
Further, in one embodiment, as shown in fig. 6 and fig. 7, the single-sided mechanical deep hole 2.1 is communicated with the through hole 1.1 of the PCBA substrate 1, and is electrically connected with the circuit board main board through the first metal threaded needle seat 4.1 welded in the metallized single-sided mechanical deep hole 2.1;
The metallized plating layers 3 on the upper surface and the lower surface of the plastic package body 2 are communicated and conducted with the through hole 1.1 of the PCBA substrate 1 through the double-sided symmetrical mechanical control deep hole 2.2 on the surface of the plastic package body 2, and are communicated and conducted with the ground through the second metal threaded needle seat 4.1 welded in the metallized double-sided symmetrical mechanical control deep hole 2.2.
Further, in one embodiment, as shown in fig. 5, the metallized plating layer 3 is obtained by roughening the surface of the plastic package body 2, and then chemically depositing a copper layer 3.1.1, an electroplated copper layer 3.1.2, and an electroless gold plating layer 3.1.3.
Preferably, the metallized layer 3 comprises a conductive copper layer 3.1.1 of 0.5um to 0.7um, an electroplated copper layer 3.1.2 of 0.1mm to 0.15mm, and an electroplated gold layer 3.1.3 of 2.5mm to 3.0 mm. By depositing a conductive copper layer, the deposition of the electroplated copper layer 3.1.2 on the surface of the plastic package body 2 is easy, and the plastic package body 2 is made of epoxy resin material and has no conductivity.
The surface roughening treatment adopts physical and chemical modes for roughening, wherein the physical roughening modes comprise sand blasting roughening, brushing roughening and laser etching roughening; chemical roughening means include plasma roughening and chemical agent roughening.
Further, in one embodiment, as shown in fig. 4, the surface of the plastic package body 2 is subjected to patterning treatment, which includes insulating the first metal threaded hub 4.1 from the metallized surface, and not treating the second metal threaded hub 4.2 from the metallized surface.
Here, the insulation treatment is: the metallization layer 3 around the first metal screw mount 4.1, which serves as an electrical pin, is removed such that the electrical pin is insulated from the metallization layer 3 on the surface of the plastic package 2.
Preferably, the patterning process adopts a mechanical depth control drag-out mode, wherein the depth control depth is the thickness of the metallization layer 3, and the damage degree of the plastic package body 2 does not exceed a set threshold value (the plastic package body is not damaged too much).
Further, in one embodiment, the surface of the metallic threaded hub assembly 4 is treated with electroplated nickel gold.
Further, in one embodiment, the first metal threaded hub 4.1 and the second metal threaded hub 4.2 are both welded on one side, and the welding surfaces are consistent.
The following describes a packaging method of the packaging structure of the present utility model, and the specific process includes:
step 1, performing SMT processing and welding on a PCB substrate to obtain a PCBA substrate 1;
step 2, injection molding the PCBA substrate 1 in a plastic package mold;
Step 3, the plastic package body 2 performs mechanical depth control drilling to obtain a corresponding first metal threaded needle seat 4.1 serving as an electrical pin and a corresponding second metal threaded needle seat 4.2 serving as a GND terminal, wherein the depth control reaches a deep control hole of the PCBA substrate;
Step 4, after roughening treatment of deep holes and upper and lower surfaces of the plastic package body, depositing a layer of conductive metallized deposited copper layer 3.1.1 with 0.5-0.7 um;
Step 5, electroplating copper on the plastic package body 2 after the copper layer 3.1.1 is deposited, wherein the thickness of the electroplated copper layer 3.1.2 is controlled to be 0.1mm-0.15mm;
Step 6, carrying out electroplated gold plating 3.1.3 treatment on the electroplated plastic package body to form a metallized coating 3 of the plastic package body 2;
Step 7, removing the corresponding metallization coating 3 around the first metal thread hub 4.1 serving as the electrical pin by using a mechanical depth control fishing mode;
step 8, cutting the plastic package body by using a mechanical blade to obtain a single module of the plastic package body;
And 9, welding the metal threaded needle seat assembly on the metallized deep hole of the single module to obtain the final module power supply product.
The plastic package module product of the welding metal thread needle seat can not only carry out the mounting welding on the circuit board through the metal thread needle seat on the surface; simultaneously, a threaded PIN needle can be loaded to carry out splicing welding on the circuit board; in addition, the circuit board and the module power supply can be fixedly locked through screws; the assembly mode of the plastic package module product of the metal thread needle seat is suitable for various electronic systems, and has wider application scenes.
In summary, the packaging structure of the surface metallization and welding metal thread needle seat has the advantages of small size, high heat dissipation efficiency of the metallization coating of the plastic package body, strong physical impact resistance of the welded metal thread needle seat, shielding of external electromagnetic interference by grounding of a shell, and the like, and can greatly improve the reliability of an electronic product in the use process.
The foregoing has outlined and described the basic principles, features, and advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420448673.2U CN221995691U (en) | 2024-03-08 | 2024-03-08 | A packaging structure with surface metallization and welding of metal threaded needle seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420448673.2U CN221995691U (en) | 2024-03-08 | 2024-03-08 | A packaging structure with surface metallization and welding of metal threaded needle seat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221995691U true CN221995691U (en) | 2024-11-12 |
Family
ID=93337880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420448673.2U Active CN221995691U (en) | 2024-03-08 | 2024-03-08 | A packaging structure with surface metallization and welding of metal threaded needle seat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221995691U (en) |
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- 2024-03-08 CN CN202420448673.2U patent/CN221995691U/en active Active
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