CN221668827U - Low-voltage power module and electronic equipment - Google Patents

Abstract

The embodiment of the application relates to the technical field of module packaging, and discloses a low-voltage power module and electronic equipment. The low-voltage power module comprises a substrate, a chip, a first type pin, a second type pin and a plastic package body. The substrate comprises a first surface and a second surface which are oppositely arranged, the first surface is provided with a metal circuit layer, and the first surface comprises a first edge and a second edge which are oppositely arranged. The chip is arranged on the first surface and is electrically connected with the metal circuit layer. The first type pins are distributed along the first edge, and one ends of the first type pins are arranged on the first surface. The second type pins are distributed along the second edge, and one ends of the second type pins are arranged on the first surface. The plastic package body surrounds the substrate and wraps the chip, part of the first type pins and part of the second type pins. The low-voltage power module and the electronic equipment provided by the embodiment of the application can avoid the mutual influence among different signals and improve the performance of the power module.

Description

Low voltage power modules and electronic equipment

Technical Field

The embodiments of the present application relate to the field of module packaging technology, and in particular to a low-voltage power module and an electronic device.

Background Art

With the continuous development of electronic integration technology, more and more electronic components are integrated on circuit boards. By integrating different electronic components in the same circuit, specific electrical functions can be achieved. In order to reduce the space occupied in electronic equipment, these integrated electronic components are also moving towards smaller and smaller modularization. Modular design is not only convenient for installation, but also can reduce the cost of use.

The power module is formed by power devices in a certain packaging form. By packaging the power devices, it can play a protective role around the power devices. However, due to design reasons, the packaged power devices will cause mutual influence between different signals, affecting the performance of the power module. Therefore, how to avoid the mutual influence between different signals and improve the performance of the power module is an important issue.

Utility Model Content

The purpose of the embodiments of the present application is to provide a low-voltage power module and an electronic device, which can avoid mutual influence between different signals and improve the performance of the power module.

To solve the above technical problems, the embodiments of the present application provide a low-voltage power module, which includes a substrate, a chip, a first-class pin, a second-class pin and a plastic package. The substrate includes a first surface and a second surface arranged opposite to each other, the first surface has a metal circuit layer, and the first surface includes a first edge and a second edge arranged opposite to each other. The chip is arranged on the first surface and is electrically connected to the metal circuit layer. The first-class pins are distributed along the first edge, and one end of the first-class pins is arranged on the first surface. The second-class pins are distributed along the second edge, and one end of the second-class pins is arranged on the first surface. The plastic package is arranged around the substrate and wraps the chip, part of the first-class pins and part of the second-class pins.

An embodiment of the present application further provides an electronic device, which includes the above-mentioned low-voltage power module.

The low-voltage power module and electronic device provided by the embodiments of the present application have two different types of pins distributed on both sides of the substrate. That is, the power-end pins and the signal-end pins are distributed on opposite sides of the substrate, that is, separated on both sides of the package body, which is conducive to reducing the mutual interference between the power signal and the control information. At the same time, the power pins are packaged on the same side, which is conducive to the internal layout of the low-voltage power module and improves the performance of the low-voltage power module. Thereby, the mutual influence between different signals can be avoided and the performance of the low-voltage power module can be improved.

In some embodiments, a distance between two adjacent first-type pins and/or a distance between two adjacent second-type pins is greater than or equal to 1 mm and less than or equal to 2 mm.

In some embodiments, a width of the first type pin and/or the second type pin is greater than or equal to 2 mm and less than or equal to 6 mm.

In some implementations, the number of pins in the first category and/or the second category that maintain the same potential does not exceed 2.

In some embodiments, some of the first type pins used as DC terminals are disposed adjacent to each other at the first edge.

In some embodiments, the second type of pins includes pins for NTC.

In some embodiments, both the first type of pins and the second type of pins include a first section located in the plastic package body, and a second section extending out of the plastic package body from the end of the first section. After the second section is led out of the plastic package body, it extends in a direction away from the substrate and bends to form a third section for welding, and the third section extends into a notch at the edge of the plastic package body.

In some embodiments, the substrate includes an insulating ceramic plate, and a first metal plate and a second metal plate attached to opposite sides of the insulating ceramic plate, the first surface is the surface of the first metal plate facing away from the insulating ceramic plate, the second surface is the surface of the second metal plate facing away from the insulating ceramic plate, and the second surface is exposed on the surface of the plastic package.

In some embodiments, the chip is an IGBT device, a MOSFET device, or a SiC device.

BRIEF DESCRIPTION OF THE DRAWINGS

One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

FIG1 is a schematic diagram of a top view of a low-voltage power module provided in some embodiments of the present application;

FIG2 is a perspective structural diagram of a low-voltage power module provided in some embodiments of the present application;

FIG3 is a schematic diagram of a top view of another low-voltage power module provided in some embodiments of the present application;

FIG4 is a perspective structural diagram of another low-voltage power module provided in some embodiments of the present application;

FIG5 is a schematic top view of another low-voltage power module provided in some embodiments of the present application;

FIG6 is a schematic diagram of a top view of another low-voltage power module provided in some embodiments of the present application.

DETAILED DESCRIPTION

To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, each embodiment of the present application will be described in detail below in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in each embodiment of the present application, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can also be implemented. The division of the following embodiments is for convenience of description, and the specific implementation of the present application should not constitute any limitation, and the various embodiments can be combined with each other and referenced to each other without contradiction.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

In the description of the embodiments of the present application, the term "and/or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and/or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character "/" in this article generally indicates that the associated objects before and after are in an "or" relationship.

In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

In the field of new energy, such as small and medium power photovoltaic inverters, energy storage systems and on-board chargers (OBC, On-Board Charger), the power devices of the power converters are packaged in a certain form. The low-voltage power module formed after packaging is connected to the external device or external circuit through pins, and the pins transmit signals between the terminals of the module. These pins include power pins and control pins, among which the power pins are led out from multiple sides of the package body. Some power pins and control pins are packaged adjacent to each other on the same side, which will easily cause the power signal to cause EMI (Electromagnetic Interference, electromagnetic interference) to the control signal, which will affect the layout and routing of the control board. In addition, when the power pins are packaged on different sides, it is not conducive to the internal layout of the low-voltage power module, which will lead to an increase in the stray inductance of the low-voltage power module.

In order to avoid mutual influence between different signals and improve the performance of low-voltage power modules, some embodiments of the present application provide a low-voltage power module. The power end pins and signal end pins in the low-voltage power module are separated on both sides of the package body, which is conducive to reducing the mutual interference between the power signal and the control information. At the same time, the power pins are packaged on the same side, which is conducive to the internal layout of the low-voltage power module and improves the performance of the low-voltage power module.

The following describes a low-voltage power module provided by some embodiments of the present application in conjunction with FIG. 1 to FIG. 6 .

As shown in FIGS. 1 to 6 , some embodiments of the present application provide a low-voltage power module, which includes a substrate 11, a chip 12, a first-type pin 13, a second-type pin 14, and a plastic package 15. The substrate 11 includes a first surface 111 and a second surface 112 that are arranged opposite to each other, the first surface 111 having a metal circuit layer, and the first surface 111 includes a first edge 1111 and a second edge 1112 that are arranged opposite to each other. The chip 12 is arranged on the first surface 111 and is electrically connected to the metal circuit layer. The first-type pin 13 is distributed along the first edge 1111, and one end of the first-type pin 13 is arranged on the first surface 111. The second-type pin 14 is distributed along the second edge 1112, and one end of the second-type pin 14 is arranged on the first surface 111. The plastic package 15 is arranged around the substrate 11 and wraps the chip 12, part of the first-type pin 13, and part of the second-type pin 14.

The substrate 11 can be a functional substrate 11 with insulation, heat dissipation and patterned circuit layers such as DBC (Direct Bonded Copper), DBA (Direct Bonded Aluminum), AMB (Active Metal Brazing), etc. The upper and lower metal layers can be copper or aluminum, the insulating layer can be ceramic, and the ceramic can be alumina, toughened alumina with added zirconium oxide, aluminum nitride and silicon nitride, etc.

The chip 12 may be a driver chip 12 or a control chip 12, and the pins are used to realize the electrical connection between the power module and external electronic components. The pins and the chip 12 may be combined with the circuit layer of the copper-clad ceramic substrate 11 via a soldering reflow process (or a sintering process), that is, the pins and the chip 12 may be combined with the circuit layer of the substrate 11 via solder.

One of the first type pin 13 and the second type pin 14 is a power pin, and the other is a signal pin. The two different types of pins are distributed at different edges of the first surface 111 of the substrate 11. In other words, the first type pin 13 is distributed on one side of the substrate 11, and the second type pin 14 is distributed on the other side of the substrate 11.

The plastic package 15 defines the main appearance of the entire power module and can be formed by injection molding using epoxy resin. The plastic package 15 can protect the chip 12 inside and increase the service life of the power module.

In the low-voltage power module provided in some embodiments of the present application, two different types of pins are distributed on both sides of the substrate 11. That is, the power-end pins and the signal-end pins are distributed on opposite sides of the substrate 11, that is, separated on both sides of the package body, which is conducive to reducing the mutual interference between the power signal and the control information. At the same time, the power pins are packaged on the same side, which is conducive to the internal layout of the low-voltage power module and improves the performance of the low-voltage power module. Thereby, the mutual influence between different signals can be avoided and the performance of the low-voltage power module can be improved.

In some embodiments, the distance between two adjacent first-type pins 13 and/or two adjacent second-type pins 14 may be greater than or equal to 1 mm and less than or equal to 2 mm.

By setting the distance between two adjacent pins in the range of 1 mm to 2 mm, the distance between the pins can be reduced while satisfying the electrical clearance, so as to increase the width and number of the pins.

In addition, the width of the first type pins 13 and/or the second type pins 14 may be greater than or equal to 2 mm and less than or equal to 6 mm.

In this way, compared with some situations where the pin layout spacing is limited, resulting in a limited pin width and unable to meet the high output current application of low-voltage power modules, the pin spacing can be reduced while meeting the electrical clearance to widen the pins. In addition, the number of pins can be increased to match higher output currents.

In actual situations, the number of pins of the first type of pins 13 and/or the second type of pins 14 that maintain the same potential may be no more than 2.

That is, by controlling the pin spacing, the maximum number of pins can be obtained, and the number of pins with the same potential can be set to 1 or 2.

In some embodiments, some of the first type pins 13 used as DC terminals are disposed adjacent to each other at the first edge 1111 .

That is to say, the power-end pins are arranged on the same side of the substrate 11 , which is helpful to reduce the stray inductance of the low-voltage power module.

In addition, the second type of pins 14 may include NTC (Negative Temperature Coefficient, thermistor) pins.

The NTC pin can be used to monitor the application temperature of the low voltage power module.

In some embodiments, both the first type of pin 13 and the second type of pin 14 may include a first section located in the plastic package 15, and a second section led out of the plastic package 15 from the end of the first section. After the second section is led out of the plastic package 15, it extends in a direction away from the substrate 11 and bends to form a third section for welding. The third section extends into a notch at the edge of the plastic package 15.

The first section of the pin is wrapped inside the plastic package 15 during packaging, one of the two ends of the first section is welded on the circuit layer of the substrate 11, and the other of the two ends of the first section is located at the critical edge of the plastic package 15. The pin can be in a sheet shape as a whole, or in a sheet shape at the end position and a column shape at the middle position. The sheet shape is conducive to ensuring the bonding strength during welding, and the column shape is conducive to ensuring the structural strength of the pin itself.

The two ends of the first section are arranged in parallel, that is, the lead-out direction of the second section can be parallel to the plane where the substrate 11 is located, and can be led out from the edge of the plastic package 15 surrounding the substrate 11, maintaining a side-out state. At the same time, the second section as a whole extends in a direction away from the substrate 11 so as to reach the bottom position of the low-voltage power module as a whole, which is conducive to the subsequent installation and welding of the low-voltage power module.

The third section is the portion of the pin used for welding with a circuit board or other components. As shown in the figure, the third section can extend into the notch at the edge of the plastic package 15, that is, extend toward the edge of the plastic package 15 located at the bottom when the low-voltage power module is installed. In this way, the welding portion of the pin when the low-voltage power module is installed can be accommodated at the edge of the plastic package 15 to reduce space occupation. In actual situations, the third section of the pin can also extend toward the outside of the plastic package 15.

In some embodiments, the substrate 11 may include an insulating ceramic plate, and a first metal plate and a second metal plate attached to opposite sides of the insulating ceramic plate, the first surface 111 is the surface of the first metal plate facing away from the insulating ceramic plate, the second surface 112 is the surface of the second metal plate facing away from the insulating ceramic plate, and the second surface 112 exposes the surface of the plastic package 15.

The first metal plate and the second metal plate can be symmetrically arranged with respect to the insulating ceramic plate. Through the symmetrical arrangement, the heat transmitted to the first metal plate when the heat-generating device such as the chip 12 is working can be effectively transferred to the second metal plate, thereby avoiding the inability to effectively conduct heat at some positions due to the misalignment between the first metal plate and the second metal plate, thereby avoiding the phenomenon of heat concentration inside the low-voltage power module. As a result, there will be no problem of high thermal resistance of the device due to the lack of a built-in insulating sheet in conventional low-voltage devices, which are generally welded on the aluminum substrate 11 through SMT (Surface Mounted Technology), and then dissipated through the heat sink below, but are limited by the low heat dissipation coefficient of the insulating layer of the aluminum substrate 11, resulting in a problem of high thermal resistance of the device.

In addition, the circumferential edge of the first metal plate and the circumferential edge of the second metal plate may be spaced from the circumferential edge of the insulating ceramic plate, so as to ensure the insulation of the insulating ceramic plate and avoid electrical connection or creepage between the first metal plate and the second metal plate.

In actual situations, in order to ensure the heat dissipation effect of the low-voltage power module, the surface of the second metal plate away from the insulating ceramic plate can be exposed to the surface of the plastic package 15 and kept flush with the surface of the plastic package 15. In other words, the surface that plays a heat dissipation role in the entire low-voltage power module is a flat surface. The surface of the second metal plate away from the insulating ceramic plate and the annular surface in the plastic package 15 that is connected to the surface are both flat surfaces, and the two are located on the same plane. In this way, the position that plays a heat conduction role in the low-voltage power module will not form an uneven state, which is conducive to the connection between the low-voltage power module and the radiator, and the heat generated when the low-voltage power module is working is smoothly conducted to the outside world via the surface of the second metal plate away from the insulating ceramic plate. In actual situations, the surface of the second metal plate away from the insulating ceramic plate can also exceed the annular surface of the plastic package 15 by a certain distance, which can increase the area of the heat dissipation surface at the bottom of the low-voltage power module, which is also conducive to improving the heat dissipation performance.

In some embodiments, the chip 12 may be an IGBT (Insulated Gate Bipolar Transistor) device, a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) device, or a SiC (Silicon Carbide) device.

In addition, the chip 12 can be electrically connected to the metal circuit layer through the bonding wire 16. The bonding wire 16 can be a conductive tape or sheet, such as an aluminum tape or a copper sheet, and the purpose of electrical connection can be achieved through the bonding wire, so as to realize the electrical connection between the chip 12 and the circuit layer of the substrate 11.

Some embodiments of the present application further provide an electronic device, which includes the above-mentioned low-voltage power module.

The low-voltage power module in the electronic device can adopt the module structure of the top insulating substrate for heat dissipation and the lead pins on the side of the plastic package. In view of the problems of excessive thermal resistance, insufficient power density and limited current capacity of conventional low-voltage and high-current power converters in system applications, a new type of plastic package module is developed to meet the system application requirements. Among them, placing an insulating heat dissipation substrate on the top can increase the heat dissipation performance of the module, which is beneficial for high-power applications. Increasing the width and number of power pins can meet high output current applications. Adding NTC pins is conducive to monitoring the application temperature of the module.

In the actual manufacturing process, the chip and pins can be placed on an insulating heat dissipation substrate and soldered. After that, bonding is performed to connect the front of the chip with the insulating substrate layer pattern to form a complete electrical path. After that, it is placed in an injection molding machine to form a shell composed of fillers. Finally, rib cutting and molding are performed to form the final structure of the low-voltage power module.

Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present application, and in actual applications, various changes may be made thereto in form and detail without departing from the spirit and scope of the present application.

Claims (10)

1. A low voltage power module, comprising: The substrate comprises a first surface and a second surface which are arranged opposite to each other, wherein the first surface has a metal circuit layer, and the first surface comprises a first edge and a second edge which are arranged opposite to each other; A chip is disposed on the first surface and electrically connected to the metal circuit layer; A first type of pins, distributed along the first edge, one end of the first type of pins being arranged on the first surface; The second type of pins are distributed along the second edge, and one end of the second type of pins is arranged on the first surface; A plastic package, arranged around the substrate and encapsulating the chip, part of the first-type pins and part of the second-type pins; Of the first category of pins and the second category of pins, one category is a power pin, and the other category is a signal pin. 2 . The low-voltage power module according to claim 1 , wherein a distance between two adjacent first-type pins and/or two adjacent second-type pins is greater than or equal to 1 mm and less than or equal to 2 mm. 3 . The low-voltage power module according to claim 2 , wherein a width of the first type of pins and/or the second type of pins is greater than or equal to 2 mm and less than or equal to 6 mm. 4 . The low-voltage power module according to claim 2 , wherein the number of pins in the first category of pins and/or the second category of pins that maintain the same potential does not exceed 2. 5 . The low-voltage power module according to claim 1 , wherein some of the first-type pins used as DC terminals are arranged adjacent to each other at the first edge. 6 . The low-voltage power module according to claim 1 , wherein the second type of pins includes NTC pins. 7. The low-voltage power module according to claim 1 is characterized in that both the first type of pins and the second type of pins include a first section located in the plastic package body, and a second section led out of the plastic package body from the end of the first section, and the second section extends away from the substrate after being led out of the plastic package body and is bent to form a third section for welding, and the third section extends into a notch at the edge of the plastic package body. 8. The low-voltage power module according to claim 1 is characterized in that the substrate includes an insulating ceramic plate, and a first metal plate and a second metal plate attached to opposite sides of the insulating ceramic plate, the first surface is a surface of the first metal plate facing away from the insulating ceramic plate, the second surface is a surface of the second metal plate facing away from the insulating ceramic plate, and the second surface is exposed from the surface of the plastic package. 9 . The low-voltage power module according to claim 1 , wherein the chip is an IGBT device, a MOSFET device or a SiC device. 10. An electronic device, comprising the low-voltage power module according to any one of claims 1 to 9.