CN221566304U

CN221566304U - Wafer tray clamping device for coating wafer surface

Info

Publication number: CN221566304U
Application number: CN202323580825.9U
Authority: CN
Inventors: 王兆奇; 沈培忠
Original assignee: Jiaxing Jingkong Electronic Co ltd
Current assignee: Jiaxing Jingkong Electronic Co ltd
Priority date: 2023-12-27
Filing date: 2023-12-27
Publication date: 2024-08-20
Anticipated expiration: 2033-12-27

Abstract

The utility model relates to a wafer tray clamping device for coating a wafer surface, which comprises symmetrically arranged connecting seats, wherein movable seats are symmetrically arranged between adjacent connecting seats, the movable seats are provided with clamping seats, the clamping seats are provided with telescopic ejector rods, the ejector rods are arranged in a plurality of ways and are arranged at intervals in the vertical direction and the horizontal direction, two sides of each movable seat are provided with a first connecting flange and a second connecting flange, the first connecting flange is provided with a penetrating guide hole, the second connecting flange is provided with a penetrating threaded hole, a guide rod and a bidirectional screw rod are arranged between the adjacent connecting seats, the first connecting flange is sleeved on the periphery of the guide rod through the guide hole and forms sliding fit between the guide rod and the bidirectional screw rod, the second connecting flange is sleeved on the periphery of the bidirectional screw rod through the threaded hole and forms threaded fit between the guide rod and the bidirectional screw rod, and one side of the connecting seats is provided with a motor for driving the bidirectional screw rod to rotate. The utility model has the following advantages and effects: the wafer trays of different specifications and different types can be stably clamped, and the application range is improved.

Description

Wafer tray clamping device for coating wafer surface

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a wafer tray clamping device for plating a film on the surface of a wafer.

Background

Both the crystal oscillator and the wafer belong to microelectronic elements, and are manufactured by grinding, polishing and other processes of sliced monocrystalline silicon, so the crystal oscillator and the wafer are also called wafers, are basic materials for manufacturing semiconductor chips, the wafers serve as an optical base material, and film plating on the wafers becomes a basic requirement for improving the optical performance of the wafers.

In the process of coating a wafer, a wafer tray containing the wafer is placed in a reaction chamber by a robot arm, and the wafer is sputtered by a target material to complete coating of the surface of the wafer.

For example, chinese patent document with bulletin number CN219696437U discloses a fast clamping mechanism for coated wafers, which comprises two connecting plates, two clamping seats are arranged between the connecting plates, two clamping plates are arranged on one side of each clamping seat, a connecting rod is fixedly connected on one side of each clamping plate, and the connecting rod penetrates through the clamping seats and is rotationally connected with the clamping seats, and a rotating rod and a screw rod are arranged between the two connecting plates.

According to the technical scheme, the two clamping seats are driven to move relatively, so that the clamping plate on one side of the clamping seat clamps the wafer, the wafers with different sizes are clamped and fixed, and the clamping stability of the wafers is ensured.

However, the inventor found that in the process of implementing the above technical solution, the premise of performing stable clamping on the wafer tray is that the radian of the clamping seat needs to be set to be matched with the radian of the wafer tray, if the radian difference between the clamping seat and the wafer tray is large, the line contact distance between the clamping seat and the wafer tray is too short, so that the clamping stability of the wafer tray is affected, and therefore, a certain limitation exists in the application range.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model aims to provide a wafer tray clamping device for plating films on the surfaces of wafers, which can stably clamp different types of wafer trays with different specifications and improves the application range.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a wafer tray clamping device for wafer surface coating film, includes the connecting seat that the symmetry set up, and the symmetry is equipped with between the adjacent connecting seat and removes the seat, it is equipped with the grip slipper to remove the seat, the grip slipper is equipped with telescopic ejector pin, the ejector pin is a plurality of and sets up each other according to vertical direction and horizontal direction interval, it is equipped with first flange and second flange to remove the seat both sides, first flange is equipped with the guiding hole that runs through, the second flange is equipped with the screw hole that runs through, is equipped with guide bar and two-way lead screw between the adjacent connecting seat, first flange passes through the guiding hole suit at the guide bar periphery and constitutes the sliding fit between the two, the second flange passes through the screw hole suit at two-way lead screw periphery and constitutes screw between the two-way lead screw, one side the connecting seat is equipped with the motor, the motor is used for driving two-way lead screw and rotates.

The utility model is further provided with: the connecting seat is provided with a fixing plate, two electric push rods are fixedly connected to the tops of the fixing plates, a mounting plate is fixedly connected between the two electric push rods, and the mounting plate is fixedly connected with external equipment.

The utility model is further provided with: the movable seat is provided with a rotary cylinder, and the clamping seat is connected with the rotary cylinder.

The utility model is further provided with: the clamping seat comprises a first connecting portion, a first containing groove is formed in the first connecting portion, the number of the first containing grooves is matched with that of the ejector rods, a first spring is arranged in the first containing groove, one end of the first spring is fixed at the bottom of the first containing groove, and the other end of the first spring is fixed at the ejector rods.

The utility model is further provided with: the clamping seat comprises an arc-shaped second connecting portion and an adjusting portion, wherein a sliding groove is formed in one side, facing the adjusting portion, of the second connecting portion, a sliding block is arranged in one side, facing the sliding groove, of the adjusting portion, the sliding block is coupled to the sliding groove and can form running fit between the sliding groove and the sliding groove, a vertically arranged limiting rod is arranged on the second connecting portion, an arc-shaped waist hole is formed in the adjusting portion, facing the limiting rod, of the adjusting portion, the limiting rod is coupled to the arc-shaped waist hole and can form guiding fit between the limiting rod and the arc-shaped waist hole, a second accommodating groove is formed in the adjusting portion, the number of the second accommodating grooves is matched with the number of the ejector rods, a second spring is arranged in the second accommodating groove, one end of the second spring is fixed at the bottom of the second accommodating groove, and the other end of the second spring is fixed at the bottom of the ejector rods.

Compared with the prior art, the utility model has the beneficial effects that:

Because a plurality of telescopic ejector rods are arranged on the clamping seat, when the clamping seats on two sides are moved in opposite directions to clamp the wafer tray, the contact area between the clamping seat and the wafer tray can be divided into a plurality of units, and the clamping is performed more flexibly, so that each ejector rod can be extruded by the wafer tray in the clamping process of the clamping seat, and the corresponding distance is moved according to the shape of the contacted wafer tray, the number of the ejector rods contacted with the wafer tray is increased, the clamping seat can be fully contacted with the wafer tray, the contact range between the clamping seat and the wafer tray is improved, the wafer tray with different specifications and different types can be stably clamped, the technical problem that the radian of the clamping seat is required to be matched with the radian of the wafer tray in the prior art, and the wafer tray can be stably clamped is effectively solved, so that the application range can be improved, and the clamping structure enables the type of the clampable wafer tray not to be limited by the arc.

Drawings

FIG. 1 is a schematic overall structure of a first embodiment;

Fig. 2 is a schematic structural view of a wafer tray according to the first embodiment;

FIG. 3 is a schematic diagram of a partial front view structure of a second embodiment;

fig. 4 is a schematic structural diagram of a specific wafer tray according to the second embodiment.

Detailed Description

The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Example 1

As shown in fig. 1 to 2, this embodiment discloses a wafer tray clamping device for plating films on the surface of wafers, comprising symmetrically arranged connecting seats 1, wherein movable seats 2 are symmetrically arranged between adjacent connecting seats 1, the movable seats 2 are provided with clamping seats, one side of each connecting seat is provided with a motor 7, the plurality of the lifting seats 4 are arranged at intervals in the vertical direction and the horizontal direction, the two sides of each movable seat 2 are provided with a first connecting flange 21 and a second connecting flange 22, the first connecting flange 21 is provided with a penetrating guide hole, the second connecting flange 22 is provided with a penetrating threaded hole, a guide rod 5 and a bidirectional screw 6 are arranged between the adjacent connecting seats 1, the first connecting flange 21 is sleeved on the periphery of the guide rod 5 through the guide hole and forms sliding fit between the guide rod 5 and the two connecting seats, the second connecting flange is sleeved on the periphery of the bidirectional screw 6 through the threaded hole, one side of each connecting seat is provided with a motor 7, the motor 7 is used for driving the bidirectional screw 6 to rotate, when the clamping seats on two sides move in opposite directions to clamp wafer trays 100, the contact area between the clamping seats and the wafer trays 100 can be separated into a plurality of units, the contact area between the clamping seats and the wafer trays 100 can be more flexibly arranged, the wafer trays can be clamped between the clamping seats and the wafer trays 100, the wafer trays can be more flexibly contacted with the wafer trays 100, the wafer trays can be further contacted with the wafer trays 100, the wafer trays 100 can be clamped by the wafer trays 100 can be further can be pressed by the wafer trays 100, the wafer trays 100 can be further can be clamped 100 can be contacted with the wafer trays 100, and can be further can be clamped and can be further contacted with the wafer trays 100, and can be further contacted with the wafer trays 100, and the clamping structure allows the type of wafer pallet 100 that can be clamped to be no longer limited to an arc.

In this embodiment, a fixing plate 8 is disposed on the connection base 1, electric push rods 9 are fixedly connected to the tops of the two fixing plates 8, a mounting plate 11 is fixedly connected between the two electric push rods 9, the mounting plate 11 is fixedly connected to an external device, and the wafer tray 100 clamped by the clamping base is driven to lift by stretching and retracting of the electric push rods 9.

In this embodiment, the rotary cylinder 10 is further disposed on the moving seat 2, and the clamping seat is connected to the rotary cylinder 10, and can be driven to turn over by the rotary cylinder 10, so that after the wafer tray 100 is clamped by the clamping seat, the clamping seat is driven to turn over, and thus the front and back sides of the wafer can be adjusted during film plating, and compared with the prior art, the transmission structure can be simplified by adopting the direct driving mode of the rotary cylinder 10, and the stability of operation during the wafer turning over can be improved.

In this embodiment, the specific structure of this grip slipper includes first connecting portion 31, be equipped with first holding tank 311 in the first connecting portion 31, first holding tank 311 quantity and ejector pin 4 quantity looks adaptation are equipped with first spring 312 in the first holding tank 311, first spring 312 one end is fixed in first holding tank 311 tank bottom, the other end is fixed in ejector pin 4, ejector pin 4 is to the principle of wafer tray 100 centre gripping, ejector pin 4 receives the extrusion back and can remove in first holding tank 311, the effect of direction can be played to the removal of ejector pin 4 to the setting of first holding tank 311, make its removal steady, and ejector pin 4 is at the in-process that moves towards the spring, can extrude the spring, the reaction force that the spring produced because of deformation can act on wafer tray 100 again this moment, make ejector pin 4 can closely push in wafer tray 100, realize the centre gripping to wafer tray 100.

When the wafer in the reaction chamber needs to be grabbed or released, the electric push rod 9 drives the clamping seat to move along the vertical direction, after the clamping seat moves to a proper height, the motor 7 drives the bidirectional screw rod 6 to rotate, so that the moving seats 2 on two sides can move in opposite directions or move in opposite directions, the clamping seats on two sides are driven to be mutually close to the wafer tray 100 or far away from the wafer tray 100, grabbing or releasing of the wafer is realized, and when the front and back sides of the wafer need to be adjusted, the clamping seat is directly driven to overturn through the rotary cylinder 10.

Example two

As shown in fig. 3 to 4, the difference between this embodiment is that the specific structure of the clamping seat includes the arc-shaped second connecting portion 41 and the adjusting portion 42, the second connecting portion 41 is located at one side facing the adjusting portion 42 and is provided with the sliding groove 411, the adjusting portion 42 is located at one side facing the sliding groove 411 and is provided with the sliding block 421, the sliding block 421 is coupled to the sliding groove 411 and can form a running fit between the sliding groove 411 and the sliding groove 411, the second connecting portion 41 is provided with the vertically arranged limiting rod 412, the adjusting portion 42 is provided with the arc-shaped waist hole 422 facing the limiting rod 412, the limiting rod 412 is coupled to the arc-shaped waist hole 422 and can form a guiding fit between the two, so that the rotation of the adjusting portion 42 plays a role in guiding, the rotation of the adjusting portion 42 is more stable, the second accommodating groove is arranged in the adjusting portion 42, the number of the second accommodating groove is adapted to the number of the ejector rods 4, one end of the second spring is fixed at the bottom of the second accommodating groove, and the other end of the second spring is fixed at the bottom of the second accommodating groove, when the wafer tray 100 is clamped by the clamping seat in the embodiment, the ejector rods 4 contacts the wafer tray 100, and the wafer tray 100 is further contacted with the corresponding wafer tray 100, and the wafer tray 100 can not be contacted with the sliding groove 100, and the sliding seat can be further evenly, and the wafer tray 100 can be contacted with the sliding seat 100, and the wafer tray 100 can be further contacted with the corresponding sliding seat 100, and the sliding seat can not be rotated.

The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and modifications to the present embodiment, which may not creatively contribute to the present utility model as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present utility model.

Claims

1. A wafer tray clamping device for wafer surface coating film, its characterized in that, including the connecting seat that the symmetry set up, the symmetry is equipped with between the adjacent connecting seat and removes the seat, it is equipped with the grip slipper to remove the seat, the grip slipper is equipped with telescopic ejector pin, the ejector pin is a plurality of and sets up each other according to vertical direction and horizontal direction interval, it is equipped with first flange and second flange to remove the seat both sides, first flange is equipped with the guiding hole that runs through, the second flange is equipped with the screw hole that runs through, is equipped with guide bar and two-way lead screw between the adjacent connecting seat, first flange passes through the guiding hole suit at the guide bar periphery and constitutes sliding fit between the two-way lead screw periphery and constitutes screw fit between the two-way lead screw through the screw hole suit, one side the connecting seat is equipped with the motor, the motor is used for driving two-way lead screw and rotates.

2. The wafer tray clamping device for wafer surface coating according to claim 1, wherein a fixing plate is arranged on the connecting seat, electric push rods are fixedly connected to the tops of the two fixing plates, a mounting plate is fixedly connected between the two electric push rods, and the mounting plate is fixedly connected with external equipment.

3. The wafer tray clamping device for coating a wafer surface according to claim 1, wherein the movable base is provided with a rotary cylinder, and the clamping base is connected to the rotary cylinder.

4. The wafer tray clamping device for coating a wafer surface according to claim 1, wherein the clamping seat comprises a first connecting portion, a first accommodating groove is formed in the first connecting portion, the number of the first accommodating grooves is matched with that of the ejector rods, a first spring is arranged in the first accommodating groove, one end of the first spring is fixed at the bottom of the first accommodating groove, and the other end of the first spring is fixed at the ejector rods.

5. The wafer tray clamping device for coating a wafer surface according to claim 3, wherein the clamping seat comprises an arc-shaped second connecting portion and an adjusting portion, the second connecting portion is located at one side facing the adjusting portion and is provided with a sliding groove, the adjusting portion is located at one side facing the sliding groove and is provided with a sliding block, the sliding block is coupled with the sliding groove and can form running fit between the sliding groove and the sliding groove, the second connecting portion is provided with a vertically arranged limiting rod, the adjusting portion is provided with an arc-shaped waist hole facing the limiting rod, the limiting rod is coupled with the arc-shaped waist hole and can form guiding fit between the limiting rod and the arc-shaped waist hole, a second accommodating groove is formed in the adjusting portion, the number of the second accommodating grooves is matched with that of the ejector rods, a second spring is arranged in the second accommodating groove, one end of the second spring is fixed at the bottom of the second accommodating groove, and the other end of the second spring is fixed at the bottom of the ejector rod.