CN221351947U - Process cartridge and image forming apparatus - Google Patents

Abstract

The present application belongs to the technical field of electronic imaging equipment, and specifically relates to a processing box and an imaging device. The present application aims to solve the problem of unstable engagement between the terminals of the chip of the relevant processing box and the contacts of the imaging device. The processing box and the imaging device of the present application, when the processing box is placed on a horizontal placement surface, are supported by a supporting device, and no guide is used to support the processing box, so as to avoid damage to the guide when it contacts or collides with the horizontal placement surface, so as to ensure that the guide accurately positions the terminals of the chip, and achieves stable contact between the terminals of the chip and the contacts of the imaging device, so that the imaging device can accurately identify the processing box.

Description

Processing box and imaging device

Technical Field

The embodiments of the present application relate to the technical field of electronic imaging equipment, and in particular to a processing box and an imaging device.

Background technique

The electrophotographic imaging device forms an image on a recording material in a certain electrophotographic imaging manner. The electrophotographic imaging device includes an electrophotographic copier, an electrophotographic printer (LED printer, laser beam printer, etc.), a fax machine, a multifunctional machine having multiple functions of these machines, a word processor, etc. The electrophotographic imaging device is provided with a cartridge, which includes a process cartridge or a developing cartridge, and assists in the imaging process of forming an image on a recording material in a state where the cartridge is detachably mounted in the main assembly of the imaging device.

In the related art, the box includes a box body, a chip and a guide, and the chip and the guide are both arranged on the box body. The chip is mainly used to record the basic information of the box, such as the model of the imaging device that the box is suitable for, the number of prints, the toner reserve, the service life, etc. When the box is installed in the main component of the imaging device, the terminal of the chip contacts the contact of the imaging device to realize data communication. The guide is used to guide the box body to be installed in the imaging device, so that the terminal of the chip and the contact of the imaging device are stably engaged, so that the box can be recognized by the imaging device.

However, the guide is easy to wear, resulting in unstable contact between the chip terminals and the contacts of the imaging device during the disassembly and assembly process, which in turn causes the problem that the box cannot recognize the machine.

Utility Model Content

In view of this, the main purpose of the embodiments of the present application is to provide a processing box to solve the technical problem of unstable engagement between the terminals of the chip of the relevant processing box and the contacts of the imaging device.

To achieve the above-mentioned purpose, an embodiment of the present application provides a processing box, including a box body and a supporting device, wherein the box body has a driving end and a non-driving end, and the driving end and the non-driving end are respectively located at the two ends of the length direction of the box body; the supporting device includes a frame supporting part constructed at the bottom of the box body, and the supporting device is also arranged at at least one of the driving end and the non-driving end, and the bottom end of the supporting device located at the driving end and/or the non-driving end and the supporting side of the frame supporting part are both located in a set plane, and when the processing box is placed on a horizontal placement surface, the set plane is in contact with the horizontal placement surface.

In some embodiments that may include the above-mentioned embodiments, the supporting device includes a first bracket, which is arranged at the non-driving end, and the first bracket at least partially protrudes from the box body, and can support the box body together with the frame supporting part when the processing box is placed on the horizontal placement surface.

In some embodiments that may include the above embodiments, the first bracket is configured with a guide, the guide is disposed away from the setting plane, and the guide is configured to guide the first bracket to be installed on the imaging device.

In some embodiments that may include the above embodiments, the guide member is a pyramid-shaped structure, a cylindrical structure, a sheet-shaped structure, or a rectangular strip-shaped structure.

In some embodiments that may include the above embodiments, a first supporting portion and a second supporting portion are provided at the bottom of the first bracket; when the processing box is placed on a horizontal placement surface, the first supporting portion, the second supporting portion and the frame supporting portion jointly support the processing box.

In some embodiments that may include the above embodiments, the process box further includes a chip, and the chip is disposed on the first bracket.

In some embodiments that may include the above embodiments, the plane where the chip is located is parallel to the set plane, and when the processing box is placed on the horizontal placement surface, the chip faces the horizontal placement surface and has a distance between it and the horizontal placement surface.

In some embodiments that may include the above embodiments, the first bracket is configured with a chip mounting portion, and the chip is disposed on the chip mounting portion.

In some embodiments that may include the above embodiments, the supporting device includes a second bracket, and the second bracket is arranged at the driving end. When the processing box is placed on the horizontal placement surface, the second bracket can support the box body together with the frame supporting part.

In some embodiments that may include the above-mentioned embodiments, the processing box also includes a non-driving side developer cover and a chip, the non-driving side developer cover is arranged at the non-driving end, the non-driving side developer cover is constructed with a chip fixing portion, and the chip is arranged at the chip fixing portion.

In some embodiments that may include the above embodiments, when the process box is placed on the horizontal placement surface, the plane where the chip is located is perpendicular to the horizontal placement surface.

In some embodiments that may include the above embodiments, the processing box further includes a chip, and the chip is disposed on the second bracket. When the processing box is placed on a horizontal placement surface, there is a distance between the chip and the horizontal placement surface.

An embodiment of the present application also provides an imaging device, comprising a processing box as described in any one of the above embodiments.

The processing box and imaging device provided in the embodiment of the present application, the processing box includes a box body and a supporting device, the box body has a driving end and a non-driving end, the driving end and the non-driving end are respectively located at the two ends of the length direction of the box body; the supporting device includes a frame supporting part constructed at the bottom of the box body, and the supporting device is also arranged at at least one of the driving end and the non-driving end, the bottom end of the supporting device located at the driving end and/or the non-driving end and the supporting side of the frame supporting part are both located at a set plane, and when the processing box is placed on a horizontal placement surface, the set plane is in contact with the horizontal placement surface. When the processing box is placed on the horizontal placement surface, the processing box is supported by the supporting device, and the processing box is not supported by a guide to avoid damage to the guide when it contacts or collides with the horizontal placement surface, so as to ensure that the guide accurately positions the terminal of the chip, and realizes stable contact between the terminal of the chip and the contact of the imaging device, so that the imaging device can accurately identify the processing box.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

FIG1 is a structural schematic diagram of a process cartridge provided in Example 1 of the present application;

FIG2 is a second structural schematic diagram of a process cartridge provided in Example 1 of the present application;

FIG3 is a schematic diagram of the structure of a chip holder in a processing box provided in Example 1 of the present application;

FIG4 is a side view of the chip holder in the processing box provided in the first embodiment of the present application from the right side;

FIG5 is a side view of the process cartridge provided in the first embodiment of the present application when placed on a horizontal placement surface;

FIG6 is a first structural diagram of a process cartridge provided in Embodiment 2 of the present application;

FIG7 is a second structural schematic diagram of a process cartridge provided in Embodiment 2 of the present application;

FIG8 is a schematic structural diagram of a chip holder of a processing box provided in Example 2 of the present application;

9 is a schematic structural diagram of a bottom cover of a developing frame of a process cartridge provided in Example 2 of the present application;

FIG10 is a schematic diagram of a process cartridge provided in Example 2 of the present application as viewed from below;

FIG11 is a schematic diagram of a process cartridge provided in Embodiment 2 of the present application when placed on a horizontal surface;

FIG12 is a schematic diagram of the structure of a process cartridge provided in Embodiment 3 of the present application;

FIG13 is a schematic diagram of the split structure of the processing box provided in Example 3 of the present application;

FIG14 is a schematic diagram of the structure of a chip support frame in a processing box provided in Example 3 of the present application;

FIG15 is a schematic diagram of the structure of the chip support frame from another angle provided in the third embodiment of the present application;

FIG16 is a schematic diagram of the structure of a chip support frame in a processing box provided in Embodiment 4 of the present application;

FIG17 is a schematic diagram of the structure of a chip support frame in a processing box provided in Embodiment 4 of the present application from another angle;

FIG18 is a first structural diagram of a process cartridge provided in Embodiment 5 of the present application;

FIG19 is a second structural schematic diagram of a process cartridge provided in Embodiment 5 of the present application;

FIG20 is a third structural schematic diagram of a process cartridge provided in Embodiment 5 of the present application;

FIG21 is a schematic diagram of the structure of a chip support frame in a processing box provided in Embodiment 5 of the present application;

FIG22 is a schematic diagram of the structure of a chip support frame in a processing box provided in Embodiment 5 of the present application from another angle;

FIG23 is a first structural diagram of a process cartridge provided in Embodiment 6 of the present application;

FIG24 is a second structural schematic diagram of a process cartridge provided in Embodiment 6 of the present application;

FIG25 is a schematic diagram of the split structure of the processing box provided in Example 6 of the present application;

FIG26 is a schematic diagram of the driving side of the process cartridge provided in Embodiment 6 of the present application when it is placed on a horizontal placement surface;

FIG27 is a schematic diagram of the non-driving side of the process cartridge provided in Example 6 of the present application when it is placed on a horizontal placement surface;

FIG28 is a schematic diagram of the structure of a chip support frame in a processing box provided in Example 6 of the present application;

FIG29 is a schematic structural diagram of a chip support frame in a processing box provided in Embodiment 6 of the present application from another angle;

FIG30 is a first structural diagram of a process cartridge provided in Embodiment 7 of the present application;

FIG31 is a second structural schematic diagram of a process cartridge provided in Embodiment 7 of the present application;

32 is a diagram of the non-driving side of the process cartridge provided in Embodiment 7 of the present application when the process cartridge is placed on a horizontal placement surface in a state where the gripping portion is gripped;

33 is a diagram of the driving side of the process cartridge provided in Embodiment 7 of the present application when the process cartridge is placed on a horizontal placement surface in a state where the gripping portion is gripped;

FIG34 is a first structural diagram of a process cartridge provided in Embodiment 8 of the present application;

FIG35 is a second structural schematic diagram of a process cartridge provided in Embodiment 8 of the present application;

36 is a non-driven side view of the process cartridge provided in Embodiment 8 of the present application when placed on a horizontal placement surface;

37 is a driving side view of the process cartridge provided in Embodiment 8 of the present application when it is placed on a horizontal surface;

FIG38 is a first structural diagram of a process cartridge provided in Embodiment 9 of the present application;

FIG39 is a second structural schematic diagram of a process cartridge provided in Embodiment 9 of the present application;

FIG40 is a schematic diagram of the structure of a process cartridge driving end provided in Embodiment 9 of the present application;

41 is a schematic diagram of the non-driving end of the process cartridge provided in Embodiment 9 of the present application when the handle is grasped and placed on a horizontal placement surface;

42 is a schematic diagram of the driving end of the process cartridge provided in Embodiment 9 of the present application when the handle is grasped and placed on a horizontal placement surface;

Figure 43 is an overall schematic diagram of the positional relationship between the processing box and the conductive component provided in Example 9 of the present application.

Description of reference numerals:

1-Box body;

11-developing frame; 111-powder bin;

112-frame support portion; 113-bottom cover;

115- positioning hole;

12-photosensitive frame; 121-handle;

122-waste toner bin; 123-supporting part;

13-developing roller;

14-photosensitive drum;

21-driving side developing cover;

22- non-driving side developing cover;

221- chip fixing part;

3- first bracket;

310-installation positioning structure; 31-chip installation part;

311-first groove; 32-guide member;

33-first supporting portion; 34-supporting surface;

35-fixing part; 351-connecting hole;

36-positioning column; 37-second supporting portion;

4- Chip;

5- second bracket;

51-second bracket support end;

53-chip mounting frame; 531-second groove;

6- conductive member;

7-conductive support portion;

8-Gear set.

Detailed ways

First, those skilled in the art should understand that these implementations are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application. Those skilled in the art can make adjustments to them as needed to adapt to specific application scenarios.

Secondly, it should be noted that in the description of the embodiments of the present application, terms such as "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and does not indicate or imply that the device or component must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present application.

In addition, it should be noted that in the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

As described in the background technology, the related processing box has the problem of unstable engagement between the terminals of the chip of the processing box and the contacts of the imaging device. The applicant has found through research that the reason for this problem is that when the processing box is placed horizontally on the desktop, the entire processing box is supported by a guide. Since the guide is a roughly rectangular or chamfered thin sheet, the strength is relatively low. The guide is easily worn or damaged after long-term use of the guide to support the box body. On the one hand, the damage of the guide may cause poor guidance, that is, when the processing box is installed in the imaging device, the guide cannot accurately locate the chip terminal, resulting in unstable contact between the chip terminal and the contact of the imaging device, and the imaging device cannot recognize the processing box; on the other hand, it will cause the processing box to be placed unsteadily, which will cause the processing box to bump, or cause damage to the chip, resulting in unstable engagement between the chip terminal and the contact of the imaging device.

In response to the above technical problems, the embodiments of the present application provide a processing box and an imaging device. When the processing box is placed on a horizontal placement surface, the processing box is supported by a frame support portion and a supporting device at the bottom of the box body, and no guide is used to support the processing box to avoid damage to the guide when it contacts or collides with the horizontal placement surface, thereby ensuring that the guide accurately positions the terminals of the chip and achieves stable contact between the terminals of the chip and the contacts of the imaging device, so that the imaging device can accurately identify the processing box.

The principles and features of the embodiments of the present application are described below in conjunction with the accompanying drawings. The examples given are only used to explain the embodiments of the present application and are not used to limit the scope of the embodiments of the present application.

The imaging device forms an image on a recording material using, for example, an electrophotographic imaging process. The imaging device includes, for example, an electrophotographic copier, an electrophotographic printer (LED printer, laser printer, etc.), an electrophotographic printer-type fax machine, etc. The processing box is detachably installed in the imaging device, and the processing box includes a photosensitive drum, a developing roller for developing the electrostatic latent image formed on the photosensitive drum, etc. The main component of the imaging device includes a chip contact part (main component contact), and the main component contact is used to contact the electrical contact (chip terminal) of the processing box chip, so that the chip can communicate with the controller (information reading and writing part) of the main body of the imaging device to input and output information.

In order to better illustrate the processing box, the installation direction of the processing box installed in the imaging device is defined as the H direction, and an XYZ rectangular coordinate system is established. The processing box is roughly in the shape of a rectangular box, with the length of the processing box as the X-axis direction (left-right direction), the left side pointing to the right side as the +X-axis direction, one end of the processing box in the -X-axis direction is the driving end, and the other end in the +X-axis direction is the non-driving end; the width of the processing box is the Y-axis direction (front-back direction), the front end pointing to the rear end is the +Y-axis direction, one end of the processing box along the -Y-axis direction is the front end, and the other end along the +Y-axis direction is the rear end; the height of the processing box is the Z-axis direction (up-down direction), the lower end pointing to the upper end is the +Z-axis direction, one end of the processing box along the +Z-axis direction is the upper end, and the other end along the -Z-axis direction is the lower end, and the X-axis, Y-axis, and Z-axis are perpendicular to each other.

The processing box of the present application can be detachably installed on the imaging device. Referring to Figures 1 to 43, the processing box includes a box body 1, a driving side developer cover 21, a non-driving side developer cover 22, a driving component, a chip 4 and a supporting device. The box body 1 generally includes a developing frame 11 and a photosensitive frame 12.

The developing frame 11 includes a powder bin 111, a stirring frame (not shown) and a developing roller 13. The stirring frame and the developing roller 13 are rotatably supported at both ends of the developing frame 11 in the length direction, and the axial directions of the stirring frame and the developing roller 13 are along the X-axis direction. In the Y-axis direction, the developing roller 13 is arranged at the front end of the developing frame 11 (the end in the -Y-axis direction), and the developing roller 13 is arranged at the opening of the powder bin 111. The powder bin 111 is used to store toner so that toner is stored in the box body 1. The developing roller 13 is parallel to the X-axis. The developing roller 13 rotates axially at the opening of the powder bin 111 and is used to transport the toner in the powder bin 111 to the outside of the powder bin 111 to use the toner for imaging. The stirring frame is located in the powder bin 111. The stirring frame can stir the toner in the powder bin 111 to prevent the toner from agglomerating. At the same time, it can also transport the toner in the direction of the developing roller 13 so that the toner is adsorbed by the charged developing roller 13.

9 , the bottom cover 113 of the developing frame 11 in the -Z axis direction can be configured as a downwardly protruding arc surface structure, which can increase the volume of the powder bin, accommodate more toner, and increase the capacity of the processing box.

The photosensitive frame 12 is connected to the +Z side of the developing frame 11. The photosensitive frame 12 forms a waste toner bin for storing waste toner. The photosensitive frame 12 also has a length direction, and its length direction also extends along the X-axis direction. The photosensitive frame 12 is provided with a photosensitive drum 14, a charging roller (not shown), a handle 121 and a waste toner bin 122. The photosensitive drum 14 is rotatably supported at the front end of the photosensitive frame 12 in the Y-axis direction (one end in the -Y-axis direction). The toner adsorbed by the developing roller 13 transfers the toner to the photosensitive drum 14 through the potential difference between the developing roller 13 and the photosensitive drum 14. The toner on the photosensitive drum 14 is then transferred by the transfer belt of the imaging device to form an image on a recording material (such as paper). The waste toner remaining on the photosensitive drum 14 after the transfer is scraped off by a cleaning scraper and stored in the waste toner bin. The charging roller is opposite to the photosensitive drum 14. The charging roller is used to charge the surface of the photosensitive drum 14 with a uniform charge so that the photosensitive drum 14 can absorb carbon powder. When the developing frame 11 is connected to the photosensitive frame 12, the developing roller 13 is partially exposed outside the powder bin 111 and is opposite to the photosensitive drum 14. The photosensitive drum 14 and the developing roller 13 rotate relative to each other. The imaging device supplies power to the developing roller 13. The developing roller 13 and the photosensitive drum 14 use the potential difference to image the carbon powder, and the waste powder on the photosensitive drum 14 can fall into the waste powder bin 122. The waste powder bin 122 can store waste powder. The handle 121 is set at the rear end of the photosensitive frame 12 (one end in the +Y axis direction). The handle 121 is convenient for the user to hold. When the user disassembles and assembles the processing box, he holds the handle 121 to lift the entire processing box.

The driving component is arranged at the driving end of the processing box (one end in the -X axis direction), and can be arranged on the outer side of the end surface of the developing frame 11 and/or the photosensitive frame 12 in the -X axis direction. The driving component may include a power receiving member and a gear set 8 for receiving and transmitting the driving force of the imaging device, thereby driving the developing roller 13, the stirring frame and the photosensitive drum 14 to rotate, so that the processing box works.

Referring to Figures 34-37, the driving side developer cover 21 and the non-driving side developer cover 22 are respectively arranged at the two ends of the developer frame 11 along the length direction. The driving side developer cover 21 is located at the driving end of the developer frame 11, and the non-driving side developer cover 22 is located at the non-driving end of the developer frame 11. The driving side developer cover 21 surrounds the gear set 8 inside, which is used to cover or partially cover the gear set 8 of the driving component, and can play a role in protecting the driving component. The imaging device transmits the rotational power to the gear set 8, and the gear meshing transmission in the gear set 8 causes the developing roller 13, the stirring frame and the photosensitive drum 14 to rotate. The driving side developer cover 21 is also used to connect with the photosensitive frame 12, so as to assemble the developing frame 11 and the photosensitive frame 12 together.

Chip 4 is used to electrically connect to the imaging device when the processing box is installed in the imaging device, and transmit basic information such as the model, printing quantity, toner reserve remaining, service life, etc. of the processing box to the imaging device to facilitate the use of the processing box.

The specific structures and working modes of the imaging device, the developing frame 11 and the photosensitive frame 12 are prior art and will not be described in detail here.

Embodiment 1

1 to 5, the supporting device may include a first bracket 3 and a frame supporting portion 112. The first bracket 3 is arranged on the +X axis side of the box body 1 and can be used to install a chip (not shown) for identification by the imaging device. The first bracket 3 is detachably installed on the box body 1 and is installed by cooperating with the positioning column structure on the box body 1 and the positioning hole structure of the first bracket 3. The first bracket 3 has a width in the Y axis direction. The integrally formed extension portion on the +Y axis side of the first bracket 3 can serve as the right end cover of the box body 1. The first bracket 3 has a height in the Z axis direction. After being connected to the box body 1, the first bracket 3 is located on the -Z axis side of the photosensitive frame 12. The first bracket 3 has a length in the X axis direction, and the shape of the first bracket 3 is a cover structure. A vertical surface is provided on the -Y axis side of the first bracket 3, and the vertical surface is on the XZ plane. In this embodiment, the first bracket 3 is provided with a chip mounting portion 31 and a guide The chip mounting portion 31 is located on the -Y axis side of the first bracket 3, and is a snap-fit structure on a vertical plane. The chip can be detachably mounted on the -Y axis side of the chip mounting portion 31. The chip mounting portion 31 is a square structure, and its -Z axis side and Z axis side are both planes and perpendicular to the vertical plane. A groove structure is provided inside the chip mounting portion 31, and the chip can be snapped into the groove and inserted and removed through the X axis direction. After the chip mounting portion 31 is engaged with the imaging device, the terminal of the chip contacts the contact of the imaging device (not shown) so as to be identified; wherein, the processing box is guided by the guide 32 during installation, and the portion where the imaging device and the chip mounting portion 31 are engaged is provided with a groove structure, and the chip mounting portion 31 is correspondingly a protruding structure. After the two are engaged, the guide 32 is engaged with the outer wall of the groove structure of the imaging device to ensure that the terminal of the chip is stably engaged with the contact of the imaging device.

Specifically, the guide structure of the first bracket 3 can guide the chip mounting portion 31 to more accurately position and engage with the imaging device. The guide structure is located on the -Y axis side of the first bracket 3. The guide structure includes a guide member 32. One or more guide member structures can be provided. Preferably, in this embodiment, two guide members 32 can be provided, which are respectively located on the -X axis side and the +X axis side of the first bracket 3. Preferably, the guide member 32 has a rectangular strip structure. Optionally, the guide member can also be provided as a cylindrical structure or a claw structure. Taking the rectangular strip structure as an example, the guide member 32 is located on both sides of the chip mounting portion 31 along the X axis direction, and can be integrally formed with the +Z axis side of the chip mounting portion 31. The guide member 32 can be understood as a thin strip structure, with the largest size in the Y axis direction, protruding from both sides of the X axis direction of the first bracket 3, and the guide member 32 has a ZY plane formed by the Z axis and the Y axis. The planes of the guide members 32 on both sides are parallel to each other, and the guide member 32 has an XY plane formed by the X axis and the Y axis. The two side planes of the guide member 32 in the Z-axis direction are parallel to each other, and the +Y-axis side of the guide member 32 is a right-angle structure, which is convenient for engaging with the side wall of the groove structure of the imaging device.

Specifically, the imaging device has a guided portion, which can be a guide groove structure, similar to the internal frame of a rectangular parallelepiped. The guided portion is adapted to the size of the guide member 32. When the first bracket 3 is inserted into the imaging device, the two side planes of the chip mounting portion 31 in the Z-axis direction are gradually engaged with the inner wall of the groove structure of the imaging device. At this time, the plane of the guide member 32 is stably engaged with the side wall of the guided portion to prevent the chip mounting portion 31 from shifting during the engagement process. Therefore, the guide member 32 has the function of guiding the alignment of the chip mounting portion 31, that is, it plays a role in stable positioning and engagement, so that the terminals of the chip on the chip mounting portion 31 are stably positioned and contacted with the contacts of the imaging device, and then the electrical connection is recognized, avoiding the problem of unstable contact or even the inability to recognize the machine of the processing box.

Referring to Figure 5, in some embodiments, the box body 1 is further provided with a frame support portion 112 as a part of the supporting device, and the first bracket 3 and the frame support portion 112 jointly support the box body 1 to avoid the problem that when the box body 1 is placed on a horizontal plane, the box body 1 is placed unstable and components are easily damaged due to the arc structure. Specifically, the first bracket 3 includes a first support portion 33, and the first support portion 33 and the frame support portion 112 jointly support the box body 1. The first support portion 33 can be a partial structure of the chip mounting portion 31. The first support portion 33 is located on the -Y axis side of the first bracket 3, and can be a structure protruding toward the -Y axis direction of the first bracket 3. In the Y axis direction, the end of the first support portion 33 serves as a support point; since the box body 1 has a length in the X axis direction, the frame support portion 112 is the bottom of the arc of the box body 1, and the support point is the position of the arc intersection. An F axis is provided on the YZ plane formed by the Z axis and the Y axis directions. The end support point of the first support portion 33 and the support point of the frame support portion 112 are both on the F axis. The F axis and the X axis form an FX plane. The FX plane is the set plane formed by the frame support portion 112 and the first support portion 33. Therefore, the frame support portion 112 and the first support portion 33 are both on the FX plane to support the box body 1.

When the box body 1 is placed on a horizontal surface, the frame support portion 112 and the first support portion 33 jointly support the box body 1. On the YZ plane of the box body 1, the frame support portion 112 and the first support portion 33 are arranged opposite to each other to distribute the weight of the box body 1, thereby maintaining the balance of the box body 1, that is, stably supporting the box body 1.

Further, referring to Figure 4, in the present embodiment, the bottom supporting end of the first supporting portion 33 of the first bracket 3 is constructed as a supporting surface 34, and the supporting surface 34 is a planar structure. The supporting surface 34 coincides with the horizontal placement surface. By setting the supporting surface 34 to fit the horizontal placement surface for support, and supporting the box body 1 together with the frame supporting portion 112, the supporting stability of the first supporting portion 33 is improved, and the problem of damage to the components of the box body 1 due to unstable placement of the box body 1 is effectively avoided. Optionally, the supporting surface 34 and the horizontal placement surface can also be in line contact or point contact.

Furthermore, the guide structure is located at one end away from the horizontal placement surface, that is, the guide member 32 is located at one end away from the horizontal placement surface, and the guide member 32 does not have a supporting effect on the box body 1. Specifically, the guide member 32 is arranged on the +Z axis side of the first support portion 33, and when the frame support portion 112 and the first support portion 33 jointly support the box body 1, the guide member 32 is located above the horizontal placement surface and does not contact or intersect with the horizontal placement surface, so as to prevent the guide member 32 from being damaged when contacting or colliding with the horizontal placement surface, thereby reducing the accuracy of the engagement between the guide member 32 and the imaging device; in addition, after the chip is installed on the first bracket 3, it is also located above the horizontal placement surface and does not contact or intersect with the horizontal placement surface, so that the chip will not be damaged when the box body 1 is supported.

It should be noted that, in this embodiment, the non-driving side developing cover and the first bracket 3 are integrally formed.

Embodiment 2

6 to 11 , the first bracket 3 in the supporting device in this embodiment is substantially the same as that in the first embodiment, with the main difference being that the first bracket 3 in this embodiment eliminates the guide member 32 and further provides a second supporting portion 37 .

The supporting device in this embodiment may include a first bracket 3, a second supporting portion 37 and a frame supporting portion 112. In this embodiment, the chip 4 is mounted on the first bracket 3, and the first bracket 3 is fixedly mounted on the non-driving end of the developing frame 11, so that the chip 4 is mounted on the processing box.

Specifically, the first bracket 3 is a plate cover-shaped member that is roughly triangular. When the first bracket 3 is mounted on the developing frame 11, the first bracket 3 is at a position that intersects the Y-axis direction and the Z-axis direction. The first bracket 3 includes a chip mounting portion 31 and a fixing portion 35. The chip mounting portion 31 is provided at one end of the first bracket 3 facing the -Z-axis direction. A first groove 311 is provided in the chip mounting portion 31 for mounting the chip 4. The chip 4 can be mounted in the first groove 311 by means of snapping, pasting, etc. A positioning column 36 is provided on the inner side of one end of the first bracket 3 facing the +Z-axis direction (the side facing the developing frame 11), which is used to engage with the positioning hole on the developing frame 11 to position the first bracket 3, so as to facilitate the alignment of the first bracket 3 during assembly. The number of the positioning columns 36 can be set to one or more, and can be set at other positions of the first bracket 3. The chip mounting portion 31 and the positioning column 36 are roughly on the same straight line, and the connecting line between the two roughly extends obliquely from the -Y, -Z directions to the +Y, +Z directions. One end of the fixing portion 35 of the first bracket 3 is connected to the side of the first bracket 3 close to the chip mounting portion 31, and the other end extends obliquely downward (i.e., extends obliquely from the +Z, -Y direction toward the +Y, -Z direction), that is, the lowest end of the first bracket 3 in the -Z direction is the chip mounting portion 31 and the fixing portion 35, and in the Y-axis direction, the lower end of the chip mounting portion 31 is located on the +Y-axis side of the lower end of the fixing portion 35, the lowest end of the chip mounting portion 31 can be a plane, and the lowest end of the fixing portion 35 can be an arc surface; a connecting hole 351 is provided on the fixing portion 35, and a mounting hole is provided at a corresponding position of the developing frame 11, and the first bracket 3 is fixedly installed on the outer side of the end surface of the developing frame 11 along the +X-axis direction by passing a bolt through the connecting hole 351 and the mounting hole, so that the bottom cover 113 of the developing frame 11 has a certain distance from the first bracket 3 in the X-axis direction. In the Y-axis direction, the first bracket 3 is installed close to the front end (the -Y-axis end) of the developing frame 11. Optionally, the first bracket 3 may also be fixedly mounted on the developing frame 11 by means of snapping, gluing, welding, etc.

Referring to Figure 11, when the user replaces the processing box, he will hold the handle 121 at the rear end of the photosensitive frame 12 to lift the processing box, and then place the processing box on a horizontal placement surface s (desktop/tabletop, etc.). Since the handle 121 is located at the upper rear end of the processing box, according to usage habits, when the processing box is placed, its lower end (-Z axis end) will contact the horizontal placement surface s (that is, the horizontal placement surface s is located in the XY plane composed of the X-axis and the Y-axis). Therefore, it is necessary to set a support device at the lower end of the processing box to stabilize the processing box.

Referring to Figures 6, 7, 8, 10 and 11, in this embodiment, more specifically, the supporting device is configured as a first supporting portion 33, a second supporting portion 37 and a frame supporting portion 112 that are in contact with the horizontal placement surface s, wherein the first supporting portion 33 and the second supporting portion 37 are arranged on the first bracket 3, the frame supporting portion 112 is arranged on the developing frame 11, and the lower end of the developing frame 11 is configured as an arc surface structure. When placed on the horizontal placement surface s, the arc top position of the arc surface structure contacts the horizontal placement surface s, that is, the arc top position is the frame supporting portion 112. The lowermost end (one end in the -Z axis direction) of the chip mounting portion 31 is constructed as the first supporting portion 33, and the lowermost end (one end in the -Z axis direction) of the fixing portion 35 of the first bracket 3 is constructed as the second supporting portion 37. When the process cartridge is placed on the horizontal placement surface s, the first supporting portion 33 and the second supporting portion 37 simultaneously contact the horizontal placement surface s.

Referring to Figure 10, observing along the Y-axis direction, the first support portion 33 and the second support portion 37 are located on the same straight line (the straight line along the Y-axis), and the first support portion 33 is located on the -Y-axis side of the second support portion 37; the first support portion 33 and the second support portion 37 have no overlapping parts with the frame support portion 112 in the X-axis direction, that is, the projection of the frame support portion 112 on the XY plane does not overlap with the projection of the first support portion 33 and the second support portion 37 on the XY plane, and any point on the frame support portion 112 is not on the same straight line (the straight line along the Y-axis) as the first support portion 33 and the second support portion 37. Therefore, any point on the frame support portion 112 and the first support portion 33 and the second support portion 37 can form a stable triangular support structure on the horizontal placement surface s to stably support the processing box placed on the horizontal placement surface s, making the processing box less likely to roll, thereby improving the overall stability of the support.

In some other embodiments, the first support portion 33 and the second support portion 37 may not be located on the same straight line (a straight line along the Y-axis), but it is still necessary to arrange the first support portion 33 and the second support portion 37 so that they are not on the same straight line with any point on the frame support portion 112, and the effect of the three forming a stable triangular support structure can be achieved.

In some other embodiments, the first bracket 3 may also be disposed at the driving end of the processing box.

The supporting device of the processing box provided in this embodiment is composed of a first supporting part 33 on the first bracket 3, a second supporting part 37 and a frame supporting part 112 on the developing frame 11. The provided supporting device has three supporting parts, which together form a stable triangular supporting structure. The processing box is stably supported under this supporting device and is not easy to shake, which solves the technical problem that the processing box is placed on a horizontal surface to prevent the components of the processing box from being damaged due to unstable placement during operation.

Embodiment 3

12-15 , the first bracket 3 of the supporting device in this embodiment is substantially the same as that in the first embodiment, with the main difference being that the guide members 32 of the first bracket 3 in this embodiment are arranged on opposite sides of the chip mounting portion 31 along the Y direction.

The supporting device in this embodiment is the same as that in the second embodiment, including a first bracket 3, a second supporting portion 37 and a frame supporting portion 112. The first bracket 3 includes an installation positioning structure 310. The installation positioning structure 310 includes a guide 32 and an auxiliary portion for positioning on the first bracket 3 (including but not limited to a chip installation portion 31 in this embodiment).

In some embodiments, the first bracket 3 is a roughly triangular plate cover structure, the chip 4 is mounted on the first bracket 3, and when the first bracket 3 is mounted on the box body 1, the first bracket 3 at least partially protrudes from the box body 1 in the H direction, and the first bracket 3 is arranged on the non-driving side of the box body 1. Specifically, in this embodiment, the first bracket 3 is mounted on the non-driving side of the developing frame 11 of the box body 1. Alternatively, in some other embodiments, the first bracket 3 can also be arranged on the driving side or other parts of the box body 1 as needed, which is not limited here.

Referring to FIG. 13 , in some embodiments, the first bracket 3 is detachably mounted on the box body 1. Specifically, in this embodiment, a positioning column 36 is provided on one side of the first bracket 3, and a positioning hole 115 is provided on the box body 1. The diameter of the positioning hole 115 is slightly larger than the diameter of the positioning column 36. When the first bracket 3 is mounted on the box body 1, the positioning column 36 is embedded in the positioning hole 115 to mount the first bracket 3 on the box body 1.

Further, a plurality of positioning posts 36 may be provided on the first bracket 3, and the plurality of positioning posts 36 are evenly distributed on the first bracket 3, and a plurality of positioning holes 115 are correspondingly provided on the box body 1, and the plurality of positioning holes 115 correspond to the positions of the plurality of positioning posts 36, so that the first bracket 3 can be embedded in the positioning holes 115 through the positioning posts 36 and installed on the box body 1. Specifically, in this embodiment, referring to FIG. 13 and FIG. 14, three positioning posts 36 are provided on the first bracket 3, and the three positioning posts 36 are respectively provided at the three corners of the first bracket 3 of the roughly triangular plate structure, and three positioning holes 115 corresponding to the positions of the positioning posts 36 of the first bracket 3 are provided on the developing frame 11 of the box body 1, and the first bracket 3 is stably installed on the box body 1 by the positioning posts 36 being embedded in the positioning holes 115.

In some other embodiments, a positioning hole can be set on the first bracket 3, and a positioning column can be set on the box body 1, and the first bracket 3 can be installed on the box body 1 through the cooperation between the positioning column and the positioning hole; or, in some other embodiments, the first bracket 3 can also be fixedly installed on the box body 1 by welding, gluing, etc., which is not limited here.

In some embodiments, a chip mounting position is provided on the first bracket 3 for mounting the chip 4. Specifically, in this embodiment, the first bracket 3 has a chip mounting portion 31 extending in the H direction, and the chip mounting position is a first groove 311 provided on the chip mounting portion 31, and the chip 4 can be mounted in the first groove 311 by snapping or gluing.

Further, when the first bracket 3 is installed in the box body 1, the chip 4 on the first bracket 3 faces the installation direction of the processing box, that is, the first bracket 3 is provided with a chip installation position facing the H direction, and the chip 4 is arranged on the chip installation position. When the first bracket 3 is installed to the box body 1, the chip 4 faces the H direction. Specifically, in the present embodiment, the first groove 311 is arranged on the chip installation portion 31, and the opening of the first groove 311 faces the installation direction of the processing box. When the chip 4 is installed in the chip installation position, the chip 4 does not exceed the height of the first groove 311, so that after the chip 4 is installed in the first bracket 3, it is located in the first bracket 3 and is not easily contacted by the outside. It can only be abutted with the electrical contacts arranged on the imaging device, so that the chip 4 is not easily damaged, and the chip 4 is arranged in the first groove 311 with the opening facing the installation direction of the processing box, so that when the processing box is installed in the imaging device, the chip 4 is convenient to be electrically connected with the imaging device.

In some embodiments, a guide 32 is further provided on the first bracket 3, and the guide 32 can guide the chip mounting portion 31 and the chip 4 to position when the box body 1 is installed on the imaging device. Specifically, in this embodiment, the guide 32 is provided on the side of the chip mounting portion 31, and the shape of the guide 32 is a square column structure. The imaging device is provided with a guide groove (not shown) corresponding to the shape and position of the guide 32. When the box body 1 is installed on the imaging device, the guide 32 can be inserted into the guide groove to guide the first bracket 3 to be correctly installed, so that the chip 4 can be stably electrically connected to the electrical contact points provided on the imaging device, so that the imaging device can receive information from the processing box.

In some embodiments, the guide 32 is arranged along the installation direction of the process box. Specifically, in this embodiment, referring to Figures 14 and 15, the guide 32 is arranged on the side of the chip installation portion 31 of the first bracket 3, and when the first bracket 3 is installed in the box body 1, the length direction of the guide 32 of the square column structure is the installation direction of the process box, so that when the process box is installed in the imaging device, the guide 32 can guide the installation of the first bracket 3 and the chip 4 of the process box along the length direction.

Further, one or more guide members 32 may be provided. Specifically, in the present embodiment, two guide members 32 are provided, which are respectively provided on the two opposite sides of the chip mounting portion 31. Referring to FIG. 15 , two guide members 32 are provided on the two opposite sides of the chip mounting portion 31 on the first bracket 3. When the process box is installed in the imaging device, two guide grooves are provided on the imaging device to cooperate with the guide members 32, so that the guide members 32 guide the first bracket 3 of the process box and the chip 4 to be installed more stably and accurately.

The supporting device in this embodiment is the same as that in the second embodiment, and therefore will not be described in detail.

Embodiment 4

16 and 17 , the first bracket 3 in this embodiment is substantially the same as that in the third embodiment, with the main difference being that the guide member 32 of the first bracket 3 in this embodiment is a semi-cylindrical structure.

Specifically, in the present embodiment, the guide member 32 is a semi-cylindrical structure arranged on the side of the chip mounting portion 31 on the first bracket 3, and when the first bracket 3 is installed on the box body 1, the length direction of the guide member 32 is the installation direction of the processing box, so that when the processing box is installed in the imaging device, the guide member 32 can guide the installation of the first bracket 3 and the chip 4 of the processing box along the length direction; and preferably, in the present embodiment, two guide members 32 are provided, which are respectively arranged on the opposite side surfaces of the chip mounting portion 31, and when the processing box is installed to the imaging device, two guide grooves are provided on the imaging device to cooperate with the guide member 32, so that the guide member 32 can guide the first bracket 3 and the chip 4 of the processing box to be installed more stably and accurately.

In this embodiment, the box body 1, the supporting device and other structures are consistent with those in the third embodiment and will not be described again here.

Embodiment 5

18 to 22 , the first bracket 3 of the supporting device in this embodiment is substantially the same as that in the third embodiment, with the main difference being that the guide member 32 of the first bracket 3 in this embodiment is a pyramidal structure.

In this embodiment, the supporting device is substantially the same as that in the third embodiment, and the first bracket 3 is used to support the chip 4, and the first bracket 3 includes a guide 32. The chip 4 is used to be electrically connected to the imaging device when the cartridge body 1 is installed in the imaging device, and transmits basic information such as the model, print quantity, toner reserve, and service life of the processing cartridge to the imaging device, so as to facilitate the use of the processing cartridge.

In some embodiments, the first bracket 3 is a roughly triangular plate cover structure, the chip 4 is mounted on the first bracket 3, and when the first bracket 3 is mounted on the box body 1, the first bracket 3 at least partially protrudes from the box body 1 in the H direction, and the first bracket 3 is arranged on the non-driving side of the box body 1. Specifically, in this embodiment, the first bracket 3 is mounted on the non-driving side of the developing frame 11 of the box body 1. In some other embodiments, the first bracket 3 can also be arranged on the driving side or other parts of the box body 1 as needed, which is not limited here.

Referring to FIG20 , in some embodiments, the first bracket 3 is detachably mounted on the box body 1. Specifically, in this embodiment, a positioning column 36 is provided on one side of the first bracket 3, and a positioning hole 115 is provided on the box body 1. The diameter of the positioning hole 115 is slightly larger than the diameter of the positioning column 36. When the first bracket 3 is mounted on the box body 1, the positioning column 36 is embedded in the positioning hole 115 to mount the first bracket 3 on the box body 1.

Further, a plurality of positioning posts 36 may be provided on the first bracket 3, and the plurality of positioning posts 36 are evenly distributed on the first bracket 3, and a plurality of positioning holes 115 are correspondingly provided on the box body 1, and the plurality of positioning holes 115 correspond to the positions of the plurality of positioning posts 36, so that the first bracket 3 can be embedded in the positioning holes 115 through the positioning posts 36 and installed on the box body 1. Specifically, in this embodiment, referring to FIG. 20, FIG. 21 and FIG. 22, three positioning posts 36 are provided on the first bracket 3, and the three positioning posts 36 are respectively provided at the three corners of the first bracket 3 of the roughly triangular plate structure, and three positioning holes 115 corresponding to the positions of the positioning posts 36 of the first bracket 3 are provided on the developing frame 11 of the box body 1, and the first bracket 3 is stably installed on the box body 1 by the positioning posts 36 being embedded in the positioning holes 115.

In some other embodiments, a positioning hole 115 can be set on the first bracket 3, and a positioning column 36 can be set on the box body 1, and the first bracket 3 can be installed on the box body 1 through the cooperation between the positioning column 36 and the positioning hole 115; or, in some other embodiments, the first bracket 3 can also be fixedly installed on the box body 1 by welding, gluing, etc., which is not limited here.

In some embodiments, a chip mounting position is provided on the first bracket 3 for mounting the chip 4. Specifically, in this embodiment, the first bracket 3 has a chip mounting portion 31 extending in the H direction, and the chip mounting position is a first groove 311 provided on the chip mounting portion 31, and the chip 4 can be mounted in the first groove 311 by snapping or gluing.

Further, when the first bracket 3 is installed in the box body 1, the chip 4 on the first bracket 3 faces the installation direction of the process box, that is, the first bracket 3 is provided with a chip installation position facing the H direction, and the chip 4 is provided on the chip installation position. When the first bracket 3 is installed to the box body 1, the chip 4 faces the H direction. Specifically, in the present embodiment, the first groove 311 is provided on the chip installation portion 31, and the opening of the first groove 311 faces the installation direction of the process box. When the chip 4 is installed in the chip installation position, the chip 4 does not exceed the height of the first groove 311, so that after the chip 4 is installed in the first bracket 3, it is located in the first bracket 3 and is not easily contacted by the outside. It can only be abutted with the electrical contacts provided on the imaging device, so that the chip 4 is not easily damaged, and the chip 4 is provided in the first groove 311 with the opening facing the installation direction of the process box, so that when the process box is installed in the imaging device, the chip 4 is convenient to be electrically connected with the imaging device.

In some embodiments, a guide 32 is further provided on the first bracket 3, and the guide 32 can guide the first bracket 3 and the chip 4 to position when the box body 1 is installed on the imaging device. Specifically, in this embodiment, the guide 32 is provided on the side of the chip installation position, and the shape of the guide 32 is a pyramidal structure. The imaging device is provided with a guide groove (not shown) corresponding to the shape and position of the guide 32. When the box body 1 is installed on the imaging device, the guide 32 can be inserted into the guide groove to guide the first bracket 3 to be correctly installed, so that the chip 4 can be stably electrically connected to the electrical contact points provided on the imaging device, so that the imaging device can receive information from the processing box.

In some embodiments, the guide 32 is arranged along the installation direction of the process box. Specifically, in this embodiment, referring to Figures 21 and 22, the guide 32 is arranged on the side of the chip installation portion 31 of the first bracket 3, and when the first bracket 3 is installed in the box body 1, the length direction of the guide 32 of the pyramid structure is the installation direction of the process box, so that when the process box is installed in the imaging device, the guide 32 can guide the installation of the first bracket 3 and the chip 4 of the process box along the length direction.

Further, one or more guide members 32 may be provided. Specifically, in the present embodiment, two guide members 32 are provided, which are respectively provided on the two opposite sides of the chip mounting portion 31. Referring to FIG. 22 , the two guide members 32 are provided on the two opposite sides of the chip mounting portion 31 on the first bracket 3. When the process box is installed in the imaging device, two guide grooves are provided on the imaging device to cooperate with the guide members 32, so that the guide members 32 guide the first bracket 3 of the process box and the chip 4 to be installed more stably and accurately.

Therefore, the processing box provided in this embodiment is provided with a first bracket 3 including a guide, and when the processing box is installed in the imaging device, the guide can guide the first bracket 3 to be installed on the imaging device, so that the chip on the first bracket 3 is in stable contact with the electrical contacts of the imaging device to ensure the normal operation of the imaging device.

Embodiment 6

Referring to Figures 23 to 29, the first bracket 3 of the supporting device of this embodiment is substantially the same as that of the first embodiment, and the driving side developer cover constitutes the second bracket 5 of the supporting device. The main difference of this embodiment is that when the process cartridge is placed alone on the horizontal placement surface s, the non-driving side of the cartridge body 1 is supported by the supporting portion 123 and the first bracket 3, and the driving side of the cartridge body 1 is supported by the supporting portion 123 and the second bracket 5. In addition, when the process cartridge is supported by the supporting device, the chip 4 is parallel to the horizontal placement surface s.

In this embodiment, the supporting device includes a first bracket 3, a second bracket 5 and a supporting portion 123. The first bracket 3 is arranged on the non-driving side of the box body 1, and the second bracket 5 is arranged on the driving side of the box body 1. The chip 4 is arranged on the first bracket 3.

In some embodiments, the first bracket 3 is a roughly triangular plate cover structure, the chip 4 is mounted on the first bracket 3, and when the first bracket 3 is installed in the box body 1, the first bracket 3 at least partially protrudes from the box body 1 in the -Z axis direction, and the first bracket 3 is arranged at the non-driving end of the box body 1.

In some embodiments, a frame support portion is further provided on the box body 1, and the frame support portion includes a support portion 123, and the support portion 123 can support the box body 1 together with the first bracket 3 when the box body 1 is placed on the horizontal placement surface s. In this embodiment, the support portion 123 is provided on the photosensitive frame 12, and specifically, the support portion 123 is a first protrusion provided in the -Z axis direction. After the first bracket 3 is installed in the box body 1, the first bracket 3 part protrudes outside the box body 1 in the -Z direction, and together with the first protrusion, it constitutes the support end of the box body 1, so that the box body 1 can be supported when it is placed on the horizontal placement surface s; and after the photosensitive drum 14 is installed in the photosensitive frame 12, the first protrusion is located on the outside of the photosensitive drum 14, so that when the box body 1 is placed with the photosensitive drum 14 facing the horizontal placement surface, the posture of the box is stable and will not fall down, so as to protect the photosensitive drum 14.

In some embodiments, when the box body 1 is placed on the horizontal placement surface s, the second bracket 5 and the support portion 123 jointly support the box body 1. Specifically, in this embodiment, the second bracket 5 is a second protrusion provided on the box body 1, and two support portions 123 are provided on the box body 1, and the two support portions 123 are respectively provided at both ends of the length direction of the box body 1, that is, the support portions 123 are provided at the driving end and the non-driving end of the box body 1, and one of the two support portions 123 at the driving end together with the second bracket 5 constitutes a support device for the driving end of the box body 1, supporting the driving end of the box body 1, and the other support portion 123 at the non-driving end together with the first bracket 3 constitutes a support device for the non-driving end of the box body 1, supporting the non-driving end of the box body 1, so that the box body 1 can be supported by the support portion 123, the first bracket 3 and the second bracket 5, so that the box body 1 can be stably placed on the horizontal placement surface s.

Furthermore, in the present embodiment, the second bracket 5 is arranged on the developing frame 11. Specifically, the second bracket 5 is a second protrusion arranged in the -Z axis direction, and the second protrusion includes a second bracket supporting end 51. When the box body 1 is placed on the horizontal placement surface s, the second bracket supporting end 51 is parallel to the horizontal placement surface s and abuts against the horizontal placement surface s, so that the second bracket 5 is more stable when supporting the box body 1.

Referring to FIG25 , in some embodiments, the first bracket 3 is detachably mounted on the box body 1. Specifically, in this embodiment, a positioning column 36 is provided on one side of the first bracket 3, and a positioning hole 115 is provided on the box body 1. The diameter of the positioning hole 115 is slightly larger than the diameter of the positioning column 36. When the first bracket 3 is mounted on the box body 1, the positioning column 36 is embedded in the positioning hole 115 to mount the first bracket 3 on the box body 1.

Further, a plurality of evenly distributed positioning posts 36 may be provided on the first bracket 3, and a plurality of positioning holes 115 may be correspondingly provided on the box body 1, so that the first bracket 3 can be embedded in the positioning holes 115 through the positioning posts 36 and installed on the box body 1. Specifically, in this embodiment, referring to FIG. 28 and FIG. 29, three positioning posts 36 are provided on the first bracket 3, and the three positioning posts 36 are respectively provided at the three corners of the first bracket 3 of the roughly triangular plate structure, and three positioning holes 115 corresponding to the positions of the positioning posts 36 of the first bracket 3 are provided on the developing frame 11, and the first bracket 3 is installed on the box body 1 by the positioning posts 36 being embedded in the positioning holes 115.

In some other embodiments, the positioning hole can also be set on the first bracket 3, and the positioning column can be set on the box body 1, and the first bracket 3 can be installed on the box body 1 through the cooperation between the positioning column and the positioning hole; in some other embodiments, the first bracket 3 can also be fixed on the box body 1 by welding, gluing, etc.

In some embodiments, a chip mounting portion is provided on the first bracket 3, and a chip mounting position is configured on the chip mounting portion, and the chip mounting position is used to mount the chip 4, and when the box body 1 is placed on the horizontal placement surface s, the plane where the chip 4 is located is parallel to the horizontal placement surface s. Specifically, in this embodiment, the chip 4 is arranged on the first bracket 3, and when the first bracket 3 is mounted on the box body 1, the first bracket 3 is at the bottom of the box body 1 and faces the -Z axis direction, and the chip mounting position where the chip 4 is mounted is perpendicular to the Z axis direction, so that the plane h where the chip 4 is located is perpendicular to the Z axis direction, so that when the box body 1 is placed on the horizontal placement surface s, the plane h where the chip 4 is located is parallel to the horizontal placement surface s.

Furthermore, when the first bracket 3 supports the box body 1, the chip 4 faces the horizontal placement surface s and does not contact the horizontal placement surface s, that is, there is a gap between the chip 4 and the horizontal placement surface s. Specifically, in this embodiment, the chip installation position is the first groove 311 set on the first bracket 3, and the chip 4 can be installed in the first groove 311 by snapping or gluing; and when the chip 4 is installed in the first groove 311, it does not exceed the height of the first groove 311, so that after the chip 4 is installed in the first bracket 3, it is located inside the first bracket 3, therefore, the chip 4 can only be abutted with it through the electrical contacts set on the image forming device, and when the box body 1 is placed on the horizontal placement surface s, the chip 4 does not contact the horizontal placement surface s, so that the chip 4 is not easily damaged.

In some embodiments, a guide 32 is further provided on the first bracket 3, and the guide 32 can guide the installation of the first bracket 3 when the box body 1 is installed on the image forming device. Specifically, in this embodiment, the guide 32 is provided on the outside of the chip installation portion, and the image forming device is provided with a guide groove corresponding to the shape and position of the guide 32. When the box body 1 is installed on the image forming device, the guide 32 can be inserted into the guide groove, and the position of the first bracket 3 is guided to be correctly installed in the image forming device, so that the chip 4 can be electrically connected to the electrical contact point provided on the image forming device, so that the image forming device can receive the information of the processing box.

Referring to Figures 26 and 27, the processing box is removed from the image forming device and placed on a horizontal placement surface s. The non-driving side of the box body 1 is supported by the support portion 123 and the first bracket 3, and the driving side of the box body 1 is supported by the support portion 123 and the second bracket 5, so that the box body 1 can be stably placed on the horizontal placement surface s.

The present application provides a support portion 123, a second bracket 5 and a first bracket 3 to jointly form a support device for supporting the box body. The support portion 123, the second bracket 5 and the first bracket 3 support the box body so that when the box body is placed on a horizontal surface, the support structure is stable and not prone to shaking, and the box body can be kept in a stable state, thereby solving the technical problem that the components of the processing box are damaged due to unstable placement when the user places the processing box on a horizontal surface during operation.

Embodiment 7

30-33 , the processing box of this embodiment is substantially the same as that of the first embodiment, with the main difference being that the first bracket 3 of this embodiment no longer has a chip mounting portion 31 , and the chip mounting portion is disposed on the developing frame 11 .

The processing box is provided with a chip mounting portion 31, a chip 4, a conductive member 6 and a conductive support portion 7. The chip mounting portion 31 is mounted on the processing box. The chip 4 is mounted on the chip mounting portion 31 and is used to communicate with the controller (information reading and writing part) of the imaging device body; one end of the conductive member 6 is electrically connected to the main component contact, and the other end is electrically connected to the chip 4, so that the chip 4 of the processing box and the main component of the imaging device are electrically communicated; the conductive support portion 7 supports one end of the conductive member 6.

In some embodiments, the conductive support portion 7 is disposed on the first bracket 3, and guides 32c and 32d are provided on both sides of the conductive support portion 7. In this embodiment, the conductive support portion 7 is disposed on the non-driving side to support one end of the conductive member 6; the guides 32c and 32d are disposed adjacent to the conductive support portion 7 to guide the main component contact of the imaging device and the conductive member 6 to engage with each other when the process cartridge is installed in the imaging device. One end of the conductive member 6 is electrically connected to the main component contact of the imaging device, and the other end is electrically connected to the chip 4, so that basic information such as the model, print quantity, toner reserve, and service life of the process cartridge is transmitted to the imaging device, which facilitates the use of the process cartridge.

In some embodiments, the processing box is provided with a handle 121. Specifically, in this embodiment, when the processing box is placed on a horizontal placement surface s of a table or a floor with the handle 121 being grasped, the bottom of the processing box moves toward the horizontal placement surface s, and the conductive support portion 7, the guide member 32c, the first bracket 3 and the powder bin 111 jointly support the processing box.

That is to say, referring to Figure 32, when the processing box is placed on the horizontal placement surface s in a state where the first bracket 3, the conductive support portion 7, the guide 32c and the powder bin 111 are in contact with the horizontal placement surface s, the posture of the box body 1 is stable, and the conductive support portion 7, the guide 32c, the first bracket 3 and the powder bin 111 relative to the position of the center of gravity W form a posture that makes the box body 1 not rotate and move in the direction of the photosensitive drum 14, thereby preventing the photosensitive drum 14 (component member) from being damaged due to the falling of the processing box, and the conductive support portion 7, the guide 32c, the first bracket 3 and the powder bin 111 jointly support the processing box, so that the posture of the processing box is stable and not easy to shake.

Furthermore, in the present embodiment, the chip mounting portion 31 is provided on the developing frame 11, and in the Z direction of the process cartridge, the chip 4 is mounted on the chip mounting portion 31. When the process cartridge is placed on the horizontal placement surface s, the plane 2C where the conductive support portion 7 is located is inclined relative to the horizontal placement surface s and is not in the same plane as the plane 1c where the chip 4 is located.

That is, referring to FIG32 , when the process box is placed on a horizontal placement surface s on a table or floor with the handle 121 being grasped, the chip 4 is located in the Z direction of the process box, not opposite to the horizontal placement surface s, but above the horizontal placement surface s and at a certain distance from the horizontal placement surface s. This can effectively prevent the chip 4 from being damaged due to the collision between the external component and the chip 4.

Here, in this embodiment, the conductive support portion 7 supports one end of the conductive member 6, which is made of metal material, and in this embodiment, is made of copper sheet. One end of the conductive member 6 is electrically connected to the main component contact, and one end is connected to the chip 4, so that the controller of the imaging device body can communicate with the chip 4 of the process box and use the registration service information and print data information stored in the chip 4.

In addition, in this embodiment, referring to Figure 33, at the driving end of the processing box, when the processing box is placed on a horizontal placement surface s of a table or a floor with the handle 121 grasped, the second bracket support end 51 on the second bracket 5 and the powder bin 111 together constitute a support for the processing box, so that the posture of the processing box is stable.

The processing box of this embodiment changes the placement position of the chip 4. When the processing box is placed alone on the horizontal placement surface s, the chip 4 is located in a hidden position that is not opposite to the horizontal placement surface s, so the chip 4 can be well protected. The supporting structure is stable and not easy to shake, which can avoid the situation where the chip 4 is damaged due to the collision between the external components and the chip 4, making the processing box unusable.

Embodiment 8

Referring to Figures 34 to 37, the process cartridge in this embodiment is substantially the same as that in the third embodiment, with the main difference being that the process cartridge in this embodiment, when the process cartridge is placed alone on the horizontal placement surface s, is no longer supported by the driving side developer cover 21 and the non-driving side developer cover 22, but is supported by the first bracket 3 and the second bracket 5 included in the supporting device. In addition, the chip 4 is disposed on the developing frame 11, and when the process cartridge is supported by the supporting device, the chip 4 is perpendicular to the horizontal placement surface s.

The supporting device of the processing box in this embodiment includes a first bracket 3, a second bracket 5 and a powder bin 111. It should be noted that the first bracket 3 of this embodiment no longer serves to install the chip 4. The first bracket 3 and the second bracket 5 are arranged on the powder bin 111 and/or the driving side developer cover 21.

In some embodiments, the chip 4 is disposed on the chip fixing portion 221 of the non-drive side developing cover 22 on the box body 1, and is used to transmit basic information such as the model, print quantity, toner reserve remaining, and service life of the box body 1 to the imaging device when the box body 1 is installed on the imaging device and the chip 4 is electrically connected to the imaging device, so as to facilitate the use of the processing box.

In some embodiments, the first bracket 3 and the second bracket 5 of the supporting device are respectively provided on the driving side and the non-driving side, the driving side is the second bracket 5, and the non-driving side is the first bracket 3. When the box body 1 is placed on the horizontal placement surface s, the supporting device composed of the first bracket 3, the second bracket 5 and the powder bin 111 supports the box body 1. Specifically, in this embodiment, the second bracket 5 is a long strip rod provided in the -Z axis direction of the powder bin 111, protruding from the outside of the box body 1 in the -Z axis direction, and supporting the box body 1 together with the powder bin 111 on the driving side; similarly, the first bracket 3 is also provided in the -Z axis direction of the non-driving side, and supporting the box body 1 together with the powder bin 111.

36 and 37, when the box body 1 is placed on the horizontal placement surface F in a state where the first bracket 3, the second bracket 5 and the powder bin 111 are in contact with the horizontal placement surface F, the position of the center of gravity W of the box body 1 is located on the opposite side of the photosensitive drum 14 relative to the first bracket 3, the second bracket 5 and the powder bin 111. For this reason, the box body 1 has a tendency to rotate in the direction of arrow K due to the force M exerted by the center of gravity W, so the posture in which the box body 1 is in contact with the horizontal placement surface F and the supporting device and the powder bin 111 is stabilized.

Therefore, the position support device relative to the center of gravity W prevents the box body 1 from rotating and moving in the direction of the photosensitive drum 14, thereby preventing the photosensitive drum 14 (component member) from being damaged due to the falling of the box body 1. The second bracket 5 on the driving side of the box body 1 and the first bracket 3 on the non-driving side together with the powder bin support the box body 1, so that the posture of the box body 1 is stable and not easy to shake.

In addition, when the box body 1 is placed on the horizontal placement surface F, the chip 4 is not facing the horizontal placement surface s, and the plane where the surface 4c of the chip 4 is located is perpendicular to the horizontal placement surface s, which can avoid the situation where the chip 4 is damaged due to collision between external components and the chip 4, making the box body 1 unusable.

The present application provides a supporting device to support the box body, so that when the box body is placed on a horizontal surface, the supporting structure is stable and not prone to shaking, thereby maintaining the box body in a stable state. This solves the technical problem that when the user places the processing box on a horizontal surface during operation, the components of the processing box may be damaged due to unstable placement.

Embodiment 9

38-43, the processing box of this embodiment is substantially the same as that of the seventh embodiment, with the main difference being that the chip mounting frame 53 in this embodiment is disposed at the driving end of the processing box, that is, the chip is mounted at the driving end of the processing box.

The supporting device of the processing box in this embodiment is the same as that in the seventh embodiment, and will not be described in detail. The second bracket 5 can be used to cover or partially cover the gear set 8 of the driving assembly, and can also be used to connect with the photosensitive frame 12, so as to assemble the developing frame and the photosensitive frame 12 together.

Referring to Figures 38 and 39, the processing box is also provided with an identification component, which includes a chip mounting frame 53, a chip and a conductive component 6. The chip is mounted on the chip mounting frame 53 and is used to communicate with the controller of the main component of the imaging device (the information reading box writing part); one end of the conductive component 6 is electrically connected to the chip, and the other end is electrically connected to the contact of the main component of the imaging device. When the processing box is installed to the imaging device, the chip of the processing box and the main component of the imaging device are electrically communicated, and basic information such as the model, print quantity, toner reserve remaining, and service life of the processing box are transmitted to the electronic imaging device.

Referring to FIG40 , specifically, in this embodiment, the chip mounting frame 53 is fixedly mounted on the driving end of the developing frame 11, preferably, it is arranged on the second bracket 5. Specifically, the chip mounting frame 53 is arranged on the side of the second bracket 5 close to the rear end of the developing frame 11 (i.e., the side facing the +Y axis direction). Optionally, the chip mounting frame 53 and the second bracket 5 can be integrally injection molded, or can be fixedly connected by bonding, welding, etc. A second groove 531 is provided in the chip mounting frame 53 for placing the chip, and the notch of the second groove 531 faces the lower end (the end in the -Z direction) of the developing frame 11. Referring to FIG43 , when the processing box is placed on the horizontal placement surface s, there is a certain distance between the chip mounting frame 53 and the horizontal placement surface s. One end of the conductive member 6 is also arranged in the second groove 531 and is arranged above the chip, and the other end of the conductive member 6 is supported by the conductive support portion 7.

Further, referring to Figure 41, in some embodiments, the conductive support portion 7 is disposed on the first bracket 3, and guide members 32c and 32d are provided on both sides of the conductive support portion 7. In this embodiment, the guide members 32c and 32d are disposed adjacent to the conductive support portion 7, and are used to guide the conductive member 6 and the main assembly contact of the imaging device to engage with each other when the process cartridge is installed in the imaging device.

Further, referring to Figure 43, the chip communicates with the imaging device with the help of the conductive component 6. In the present embodiment, the conductive component 6 extends from the conductive support portion 7 along the outer surface of the first bracket 3 to the powder bin 111, and then extends through the interior of the powder bin 111 to the second groove 531 of the chip mounting frame 53. That is, the conductive component 6 located on the conductive support portion 7 extends along the length direction of the developing frame 11 (-X axis direction) to the second groove 531 of the chip mounting frame 53. Specifically, inside the powder bin 111, the conductive component 6 is arranged in contact with the bottom cover 113.

In some embodiments, the processing box is provided with a handle 121. Specifically, in this embodiment, the handle 121 is located at the upper rear end of the processing box. According to usage habits, when the processing box is placed on the horizontal placement surface s by holding the handle 121, the lower end of the processing box will contact the horizontal surface. Therefore, it is necessary to provide a frame support portion 112 at the lower end of the processing box to stabilize the processing box.

Further, in some embodiments, the second bracket 5 and the first bracket 3 are respectively provided at both ends of the process box in the length direction. Referring to Figures 41 and 42, in this embodiment, the first bracket 3 includes a fixing portion 35, the fixing portion 35 and the conductive support portion 7 are arranged opposite to each other in the Y-axis direction, and the fixing portion 35 is located in front of the conductive support portion 7 in the +Y-axis direction. When the process box is placed on the horizontal placement surface s, the conductive support portion 7, the guide 32c, and the fixing portion 35 jointly support the process box, and the bottom cover 113 is an arc surface structure, and its arc top position also provides support for the process box. Therefore, the conductive support portion 7, the guide 32c, the fixing portion 35 and the bottom cover 113 jointly support the non-driving end of the process box. The second bracket 5 includes a second bracket support end 51 protruding toward the lower end of the process box. When the process box is placed on the horizontal plane F, the second bracket support end 51 will contact the horizontal plane, and the contact portion is a plane. Therefore, the second bracket support end 51 and the bottom cover 113 jointly support the driving end of the process box. The processing box is supported by the above-mentioned supporting device, and its posture is stable and not easy to shake, which can prevent the damage of the photosensitive drum 14 and other components caused by the falling of the processing box.

Furthermore, when the processing box is placed on the horizontal plane F, the plane 7c on the conductive support part 7 is inclined relative to the horizontal placement surface s, and 7c is close to the horizontal placement surface s; the second groove 531 of the chip mounting frame 53 is opposite to the horizontal placement surface s, that is, the plane 4c where the chip is located is opposite to and parallel to the horizontal placement surface s, and the plane 4c where the chip is located is at a certain distance from the horizontal placement surface s. Therefore, the above structure is used to set the chip to effectively avoid chip damage caused by collision between external components and the chip.

In some embodiments, the conductive member 6 can be made of metal material, and in this embodiment, it is made of copper sheet; and in order to ensure that the conductive member 6 located on the conductive support portion 7 is stably electrically connected to the main component contact, the width of the conductive member 6 can be set according to actual needs.

The processing box of this embodiment places the chip in a more concealed position by changing the placement position of the chip. When the processing box is placed alone on the horizontal placement surface s, there is a certain distance between the chip and the horizontal placement surface s, which can better protect the chip. The supporting structure of the processing box is stable and not easy to shake, which can avoid the situation where the chip is damaged due to collision between external components and the chip, making the processing box unusable.

The imaging device in this embodiment includes the processing box in the above embodiment, wherein the specific structure, working principle and function of the processing box have been described in detail in the above embodiment and will not be described again here.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims (13)

1. A process cartridge, comprising: A box body, wherein the box body has a driving end and a non-driving end, wherein the driving end and the non-driving end are respectively located at two ends of the length direction of the box body; A supporting device, wherein the supporting device includes a frame supporting portion constructed at the bottom of the box body, and the supporting device is also arranged at at least one of the driving end and the non-driving end. The bottom end of the supporting device located at the driving end and/or the non-driving end and the supporting side of the frame supporting portion are both located on a set plane. When the processing box is placed on a horizontal placement surface, the set plane is in contact with the horizontal placement surface. 2. The processing box according to claim 1 is characterized in that the supporting device includes a first bracket, the first bracket is arranged at the non-driving end, and the first bracket at least partially protrudes from the box body, and can support the box body together with the frame supporting part when the processing box is placed on the horizontal placement surface. 3 . The process cartridge according to claim 2 , wherein the first support is configured with a guide, the guide being disposed away from the set plane, the guide being configured to guide the first support to be mounted on the image forming device. 4 . The processing box according to claim 3 , wherein the guide member is a pyramidal structure, a cylindrical structure, a sheet structure or a rectangular strip structure. 5. The processing box according to claim 3 is characterized in that the bottom of the first bracket is provided with a first supporting portion and a second supporting portion; when the processing box is placed on a horizontal placement surface, the first supporting portion, the second supporting portion and the frame supporting portion jointly support the processing box. 6 . The processing box according to claim 2 , characterized in that the processing box further comprises a chip, and the chip is arranged on the first bracket. 7. The processing box according to claim 6 is characterized in that the plane where the chip is located is parallel to the set plane, and when the processing box is placed on the horizontal placement surface, the chip faces the horizontal placement surface and has a distance between it and the horizontal placement surface. 8 . The process cartridge according to claim 6 , wherein the first bracket is configured with a chip mounting portion, and the chip is disposed on the chip mounting portion. 9. A processing box according to claim 1 or 2, characterized in that the supporting device includes a second bracket, and the second bracket is arranged at the driving end, and when the processing box is placed on the horizontal placement surface, the second bracket can support the box body together with the frame supporting part. 10. The processing box according to claim 9 is characterized in that the processing box also includes a non-driving side developer cover and a chip, the non-driving side developer cover is arranged at the non-driving end, the non-driving side developer cover is constructed with a chip fixing part, and the chip is arranged at the chip fixing part. 11 . The processing box according to claim 10 , wherein when the processing box is placed on the horizontal placement surface, the plane where the chip is located is perpendicular to the horizontal placement surface. 12. The processing box according to claim 9, characterized in that the processing box further comprises a chip, wherein the chip is arranged on the second bracket, and when the processing box is placed on a horizontal placement surface, there is a distance between the chip and the horizontal placement surface. 13. An imaging device, characterized in that it comprises a processing box as described in any one of claims 1 to 12.