CN217425935U - Processing box and chip bracket installed on same - Google Patents

Abstract

The utility model discloses a handle box and install the chip support on handling the box, wherein, handle box detachably and install in imaging device, include: a frame having a first wall surface; a photosensitive member rotatably supported by the frame; an electrical contact part mounted to the frame and electrically connected to the image forming apparatus; a storage portion electrically connected to the electrical contact portion and configured to store information related to the process cartridge; the storage part is positioned on one side of the electric contact part facing the processing box; a projection size of the storage portion is smaller than a projection size of the electrical contact portion as viewed in a normal direction of the first wall surface; and/or, in the axial direction of the photosensitive member, the projection of the storage portion is located between the projection ranges of the electrical contact portions. The utility model discloses a processing box can protect storage portion well, can avoid leading to the condition that storage portion damaged because of the collision between external component and the storage portion.

Description

A processing box and a chip support mounted on the processing box

technical field

The utility model relates to the technical field of imaging equipment, in particular to a processing box and a chip support mounted on the processing box.

Background technique

In electrophotographic type image forming apparatuses, there is known a configuration in which a photosensitive member and a process member that can act on the photosensitive member are integrally assembled as a unit as a process cartridge, and the process cartridge can be installed in the image forming apparatus and Detachable from the image forming apparatus. With this configuration, the maintenance operation can be performed by the user himself in the case of running out of toner or in the case of damage to the processing member, and thus the maintenance performance can be remarkably improved.

In addition, in recent years, a configuration has also been realized in which a storage section for storing information related to the process cartridge (for example, various information such as service information and processing information) is mounted on the process cartridge. In this configuration, electrical connection is formed between the electrical contact portion provided on the apparatus main assembly side of the image forming apparatus and the electrical contact portion provided on the process cartridge side and electrically connected to the storage portion. Then, electrical communication is performed between the apparatus main assembly of the image forming apparatus and the storage portion of the process cartridge, and the information stored in the storage portion is used, so that image quality and maintenance performance can be further improved.

Furthermore, in the process cartridge disclosed in Japanese Laid-Open Application (JP-A) 2004-37876, the electrical contact portion and the storage portion are flush with each other, and protrusions protruding in the mounting direction of the process cartridge are provided. With this configuration, during a process cartridge drop or the like, the contact member contacts the external member before the storage portion, and thus breakage of the storage portion due to collision between the external member and the storage portion is avoided. However, in the configuration disclosed in JP-A 2004-37876, the storage portion and the electrical contact portion are provided on the same plane, and thus the degree of freedom of arrangement is low, and the demand for ease of installation or removal cannot be satisfied.

Utility model content

According to one aspect of the present invention, there is provided a process cartridge detachably mounted on an image forming apparatus, comprising: a frame having a first wall surface; a photosensitive member rotatably supported by the frame; and an electrical contact portion mounted on the the frame and used for electrical connection with the image forming apparatus; a storage portion electrically connected to the electrical contact portion and configured to store information related to the process cartridge; the storage portion located on the electrical contact portion facing the process one side of the box; viewed along the normal direction of the first wall surface, the projected size of the storage portion is smaller than the projected size of the electrical contact portion; and/or, in the axial direction of the photosensitive member, The projection of the storage portion is located between the projection ranges of the electrical contact portion.

In some embodiments, viewed along the normal direction of the first wall surface, in the axial direction of the photosensitive member, the projected range of the electrical contact portion is 3.5mm-5.5mm.

In some embodiments, the frame includes a developing frame and a photosensitive frame; the electrical contact portion and the storage portion are jointly disposed on the developing frame or the photosensitive frame.

In some embodiments, the storage portion is located outside the confines of the gap between the photosensitive frame and the developing frame.

In some embodiments, the electrical contacts are located outside the first wall surface in a direction normal to the first wall surface.

In some embodiments, the electrical contact is parallel to the first wall surface.

In some embodiments, the electrical contact portion and the storage portion are electrically connected through a flexible conductive medium.

In some embodiments, the developing frame or photosensitive frame includes an end cap to which the electrical contacts and storage are mounted.

According to another aspect of the present invention, a chip holder mounted on a process cartridge is provided, and the chip holder is used to install and fix the electrical contact portion and the storage portion on the process cartridge, the process cartridge being such as any of the above.

In some embodiments, the chip holder can be separately provided with the frame or can be integrally formed.

The beneficial effects of the present invention: the process cartridge of the present invention can protect the storage part well, and can avoid the damage of the storage part due to the collision between the external components and the storage part.

Description of drawings

1 is an overall structural diagram of a process cartridge according to Embodiment 1 of the present invention;

2 is a cross-sectional view of the process cartridge according to the first embodiment of the present invention;

FIG. 3 is an overall structural diagram of the process cartridge according to the first embodiment of the present invention from another angle;

Fig. 4 is the enlarged schematic diagram at A place in Fig. 3;

5 is a schematic structural diagram of a chip of the process cartridge according to the first embodiment of the present invention;

6 is a schematic view of the process cartridge according to the first embodiment of the present invention viewed from the Z direction;

Fig. 7 is the enlarged schematic diagram at B in Fig. 6;

8 is a schematic diagram of the chip of the process cartridge according to the first embodiment of the present invention viewed from the Z direction;

9 is a structural diagram of a chip holder of the process cartridge according to the first embodiment of the present invention;

10 is a schematic diagram of the installation of a chip and a chip support of the process cartridge according to the first embodiment of the present invention;

11 is a partial exploded view of the process cartridge according to the first embodiment of the present invention;

12 is a cross-sectional view of the chip position of the process cartridge according to the first embodiment of the present invention;

13 is an overall structural diagram of the process cartridge according to the second embodiment of the present invention;

Fig. 14 is the enlarged schematic diagram at C in Fig. 11;

15 is a schematic structural diagram of a chip of the process cartridge according to the second embodiment of the present invention;

16 is a partial schematic view of the process cartridge according to the second embodiment of the present invention viewed from the Z direction;

Fig. 17 is the enlarged schematic diagram at D in Fig. 16;

18 is a schematic diagram of the chip of the process cartridge according to the second embodiment of the present invention viewed from the Z direction;

19 is a schematic structural diagram of an angle of a chip support of the process cartridge according to the second embodiment of the present invention;

20 is a schematic structural diagram of another angle of the chip holder of the process cartridge according to the second embodiment of the present invention;

21 is a schematic diagram of the installation of a chip and a chip support of the process cartridge according to the second embodiment of the present invention;

22 is a partial exploded view of the process cartridge according to the second embodiment of the present invention;

23 is a schematic diagram of the overall structure of the process cartridge according to the third embodiment of the present invention from one angle;

24 is a schematic diagram of the overall structure of another angle of the process cartridge according to the third embodiment of the present invention;

Figure 25 is an enlarged schematic view at E in Figure 24;

26 is a schematic structural diagram of a chip of the process cartridge according to the third embodiment of the present invention;

27 is a partial schematic view of the process cartridge according to the third embodiment of the present invention, viewed from the Z direction;

Figure 28 is an enlarged schematic diagram at F in Figure 27;

29 is a schematic structural diagram of a chip holder of a process cartridge according to Embodiment 3 of the present invention;

30 is a partial exploded view of the process cartridge according to the third embodiment of the present invention;

31 is a schematic diagram of the overall structure of the process cartridge according to the fourth embodiment of the present invention;

32 is a partial schematic view of the process cartridge according to the fourth embodiment of the present invention, viewed from the Z direction;

Figure 33 is an enlarged schematic diagram at G in Figure 32;

34 is a schematic structural diagram of a chip of the process cartridge according to the fourth embodiment of the present invention;

35 is a schematic diagram of the chip of the process cartridge according to the fourth embodiment of the present invention viewed from the Z direction;

FIG. 36 is a schematic diagram of the installation of the end cover and the chip of the process cartridge according to the fourth embodiment of the present invention.

Detailed ways

The present utility model will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present utility model, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

It should be noted that the terms "first", "second", etc. are only used for descriptive purposes, and should not be understood as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.

In the present utility model, unless otherwise expressly specified and limited, the terms "installation", "connection", "fixation" and other terms should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or a Integral; may be mechanically or electrically connected or communicable with each other; may be directly connected or indirectly connected through an intermediate medium, may be internal communication between two elements or an interactive relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the present invention, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may be in direct contact with the first and second features, or the first and second features through an intermediary indirect contact. Also, the first feature being "above", "over" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

In the above description, descriptions with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean the specific features, structures described in connection with the embodiment or example , material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other.

Example 1

Electronic imaging devices form images on recording materials using, for example, electrophotographic imaging processes. The electronic image forming apparatuses include, for example, electrophotographic copiers, electrophotographic printers (LED printers, laser printers, etc.), facsimile machines of the electrophotographic printer type, and the like. A process cartridge, which is detachably mounted in an electronic image forming apparatus, contains a photosensitive member, a developing member for developing an electrostatic latent image formed on the photosensitive member, and the like. The electronic imaging device includes a driving head, and the driving head is used for transmitting the driving force of the electronic imaging device to the process cartridge to make the process cartridge work.

As shown in FIG. 1 and FIG. 2 , this embodiment provides a process cartridge including a frame, a toner container assembly, a waste toner container assembly, a driving unit 30 , a chip 40 and a chip holder 50 .

As shown in FIGS. 1 and 2 , the frame includes a developing frame 10 and a photosensitive frame 20 . The powder container assembly includes a powder container 11 for storing toner, a developing roller 12 , a powder discharge knife 13 and a stirring frame 14 installed in the powder container 11 . The waste toner bin assembly includes a waste toner bin 21 for collecting waste toner, a photosensitive drum 22 , a charging roller 23 , and a cleaning blade 24 .

As shown in FIG. 2 , the developing frame 10 encloses a toner bin 11 for storing toner, the developing frame 10 is roughly in the shape of a long box, and the developing frame 10 has end faces at both ends in the longitudinal direction. The developing frame 10 may be provided with a toner feeding port through which toner is replenished into the toner bin 11 , and the toner feeding port may be opened on one of the end faces of the developing frame 10 . The stirring frame 14 and the developing roller 12 are rotatably supported at both ends of the developing frame 10 in the length direction. The stirring frame 14 and the developing roller 12 can be rotated under the action of the driving unit 30 , and the axial directions of the stirring frame 14 and the developing roller 12 are both along the The length direction of the developing frame 10 . The toner in the powder bin 11 is stirred by the stirring frame 14 to prevent the toner in the powder bin 11 from agglomerating.

As shown in FIG. 1 and FIG. 2 , the photosensitive frame 20 surrounds a waste toner bin 21 for collecting waste toner. The photosensitive frame 20 also has a longitudinal direction, which is consistent with the longitudinal direction of the developing frame 10 , and the photosensitive drum 22 is rotatably supported. At both ends of the photosensitive frame 20 in the longitudinal direction, the axial direction of the photosensitive drum 22 is consistent with the longitudinal direction of the photosensitive frame 20 .

In order to better describe the process cartridge, a coordinate system is established as shown in FIG. 3 , wherein the axial direction of the photosensitive drum 22 is the X-axis direction, the direction perpendicular to the axial direction X of the photosensitive drum 22 is the Y-direction, and the X-axis direction is The direction perpendicular to the Y-axis direction is the Z-axis direction. The plane composed of the X axis and the Y axis is the XY plane, the plane composed of the Y axis and the Z axis is the YZ plane, and the plane composed of the X axis and the Z axis is the XZ plane.

As shown in FIGS. 3 and 4 , the photosensitive frame 20 has a first wall surface 20a, the first wall surface 20a is located on the XY plane, the first wall surface 20a has a mounting position 20a1 combined with the chip holder 50, the first wall surface 20a is The normal direction of the surface 20a is along the Z-axis direction.

The waste toner bin 21 is disposed along the length direction of the photosensitive frame 20 , and the waste toner bin 21 is located on one side of the photosensitive drum 22 . The toner adsorbed by the developing roller 12 transfers the toner to the photosensitive drum 22 through the potential difference with the photosensitive drum 22. After transfer, the cleaning blade 24 is in linear contact with the photosensitive drum 22 to clean the surface of the photosensitive drum 22 that has not been completely transferred. Toner, namely waste toner, the cleaned waste toner is stored in the waste toner bin 21 . The charging roller 23 is used to charge the surface of the photosensitive drum 22 uniformly, so that the photosensitive drum 22 can absorb toner.

There are gaps 60 between some parts of the photosensitive frame 20 and some parts of the developing frame 10 , which are not completely fitted. As shown in FIG. 3 , there are gaps 60 in the Y direction between the photosensitive frame 20 and the developing frame 10 .

As shown in FIG. 1 , the driving unit 30 is located on the outside of the end face of the frame in the length direction. Specifically, it can be disposed on the outside of one or both end faces of the developing frame 10 in the length direction, and can also be disposed on one or two sides of the photosensitive frame 20 in the length direction. outside of the end face. The driving unit 30 is used to receive and transmit the driving force of the image forming apparatus (such as a laser printer) to make the process cartridge work. The driving unit 30 may include a power receiving member and a gear set, so as to receive and transmit the driving force of the image forming apparatus to drive the photosensitive drum 22 , the developing roller 12 , the stirring frame 14 and the like to rotate.

Further, the photosensitive frame 20 may also include an end cap, and the end cap is provided on the outer side of the end face in the length direction of the photosensitive frame 20, and a part or all of the gears of the drive unit 30 are covered in the end cap for protection. It is provided integrally with the photosensitive frame 20, or can be a separate structure, and is fixedly installed on the photosensitive frame 20 by welding, pasting, snapping, plugging or other methods.

Alternatively, the developing frame 10 may include an end cap, and the end cap is provided on the outer side of the end face of the developing frame 10 in the longitudinal direction.

As shown in FIG. 5 , the chip 40 includes a storage portion 41 and an electrical contact portion 42 , the storage portion 41 is electrically connected to the electrical contact portion 42 through a flexible conductive medium 43 , and the storage portion 41 is configured to store information related to the process cartridge.

When the process cartridge is mounted to the imaging device, the electrical contacts 42 are electrically connected to the imaging device, thereby establishing communication between the chip 40 and the imaging device.

The flexible conductive medium 43 may be a conductive wire or a conductive foil. The storage part 41 is connected to the electrical contact part 42 through the flexible conductive medium 43 , so that the position of the storage part 41 can be set more flexibly.

The storage part 41 includes a first substrate 411 and a wafer 412 and a battery 413 provided on the first substrate 411 .

The electrical contact portion 42 is disposed on one surface of the second substrate 421, and the number of the electrical contact portion 42 is two.

As shown in FIG. 7 and FIG. 8 , the chip holder 50 is used to install and fix the chip 40 , and the chip holder 50 is detachably connected to the photosensitive frame 20 . The photosensitive frame 20 has a first wall surface 20a, and the first wall surface 20a has a mounting position 20a1 combined with the chip holder 50. Specifically, the mounting position 20a1 is a hole or groove formed on the first wall surface 20a, and the chip holder A part of the chip 50 is inserted into the photosensitive frame 20 from the hole or groove and fixed on the photosensitive frame 20, so that the chip 40 is mounted on the photosensitive frame 20, that is, the storage part 41 and the electrical contact part 42 of the chip 40 are located in the photosensitive frame 20 on.

As shown in FIGS. 3 and 4 , after the chip 40 is mounted on the photosensitive frame 20, the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 20a, the electrical The contact portion 42 is located outside the first wall surface 20a, and the electrical contact portion 42 is completely exposed outside the first wall surface 20a. The electrical contact portion 42 is substantially parallel to the first wall surface 20a. A part of the storage part 41 may be inserted into the hole or groove on the first wall surface 20a, and part of it may be exposed on the first wall surface 20a, or all the storage part 41 may be inserted into the hole or groove on the first wall surface 20a.

The storage portion 41 is located inside the electrical contact portion 42 in the normal direction Z of the first wall surface 20a, and does not protrude from the electrical contact portion 42. Therefore, the electrical contact portion 42 can form a shield for the storage portion 41 and avoid external components. Collision storage unit 41 .

As shown in FIGS. 6 and 7 , further, viewed along the normal direction Z of the first wall surface 20 a, the projected size S1 of the storage portion 41 is smaller than the projected size S2 of the electrical contact portion 42 . Specifically, when viewed along the normal direction Z of the first wall surface, the area of the portion where the storage portion 41 can be observed is its projected size S1, the area of the portion where the electrical contact portion 42 can be observed is its projected size S2, and the storage portion 41 has its projected size S2. The projected dimension S1 (area) of the portion 41 is smaller than the projected dimension S2 (area) of the electrical contact portion 42 .

As shown in FIG. 8 , further, viewed along the normal direction Z of the first wall surface 20 a , in the axial X direction of the photosensitive drum, the projection of the storage portion 41 is located between the projection ranges of the electrical contact portion 42 . The projections of the storage portion 41 and the electrical contact portion 42 are located on the XY plane, and in the X-axis direction, the projection D1 of the storage portion 41 completely falls within the range of the projection D2 of the electrical contact portion 42 .

As shown in FIG. 8 , preferably, the projection range of the electrical contact portion 42 in the X-axis direction is 3.5 mm-5.5 mm, and the projection D1 of the storage portion 41 in the X-axis direction is smaller than that of the electrical contact portion 42 in the X-axis direction. The projection D2 is completely within the projection range of the electrical contact portion 42 .

By setting the positional relationship between the storage portion 41 and the electrical contact portion 42 described above, the electrical contact portion 42 can effectively shield the storage portion 41 to prevent the storage portion 41 from being damaged due to collision between external components and the storage portion 41 .

As shown in FIGS. 9 and 10 , in this embodiment, the chip holder 50 includes a main body, and the main body is provided with a first mounting portion 51 , a second mounting portion 52 , a first engaging portion 53 and a second engaging portion 54 .

The first mounting portion 51 is used to mount the electrical contact portion 42 of the chip 40 , the second mounting portion 52 is used to mount the storage portion 41 , and the first snap portion 53 and the second snap portion 54 are used to connect with the photosensitive frame 20 . The chip holder 50 is installed on the photosensitive frame 20 by snapping together.

As shown in FIGS. 9 and 10 , in the Z direction, the first mounting portion 51 is located on the side of the main body away from the process cartridge, and the second mounting portion 52 is located inside the first mounting portion 51 . The first engaging portion 53 and the second engaging portion 54 are located at both ends of the main body in the Y direction. One of the first engaging portions 53 is a protrusion and the other is an elastic arm. Bit raised.

As shown in FIG. 10 to FIG. 12 , during installation, the storage part 41 of the chip 40 can be installed into the second installation part 52 first, and the electrical contact part 42 of the chip 40 can be installed into the first installation part 51 , that is, the first installation part 51 can be installed. The chip 40 is mounted on the chip holder 50 , and then the chip holder 50 together with the chip 40 is mounted on the photosensitive frame 20 . It is easy to meet the requirement of convenient installation or disassembly of the chip 40 as a whole.

As shown in FIG. 3 and FIG. 12 , in this embodiment, the chip 40 and the chip holder 50 are mounted on the photosensitive frame 20 , the storage portion 41 is surrounded by the photosensitive frame 20 , and the chip 40 is located in the gap 60 between the photosensitive frame 20 and the developing frame 10 as a whole. Outside the range, it will not be exposed in the gap 60 between the photosensitive frame 20 and the developing frame 10 , and some external components can be prevented from colliding with the storage part 41 from the gap 60 .

In some other embodiments, the chip holder 50 may also be integrally provided with the photosensitive frame 20 .

Embodiment 2

The present embodiment provides another process cartridge. The difference from the first embodiment is that the chip 40 and the chip holder 50 of the present embodiment are mounted on the developing frame 10 .

As shown in FIG. 13 and FIG. 14 , in this embodiment, the developing frame 10 has a first wall surface 10a, the first wall surface 10a is located on the XY plane, and the first wall surface 10a has a mounting position combined with the chip holder 50 10a1, the normal direction of the first wall surface 10a is along the Z-axis direction.

As shown in FIGS. 13 and 14 , after the chip 40 is mounted on the developing frame 10, the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 10a, the electrical The contact portion 42 is located outside the first wall surface 10a, and the electrical contact portion 42 is completely exposed outside the first wall surface 10a. The electrical contact portion 42 is substantially parallel to the first wall surface 10a. A part of the storage part 41 may be inserted into the installation position 10a1 on the first wall surface 10a, and a part of the storage part 41 may be inserted into the installation position 10a1 on the first wall surface 10a. The storage portion 41 is located inside the electrical contact portion 42 in the normal direction Z of the first wall surface 10a, and does not protrude from the electrical contact portion 42. Therefore, the electrical contact portion 42 can form a shield for the storage portion 41 and avoid external components. Collision storage unit 41 .

As shown in FIGS. 15 to 17 , further, viewed along the normal direction Z of the first wall surface 10 a , the projected size S1 of the storage portion 41 is smaller than the projected size S2 of the electrical contact portion 42 . Specifically, when viewed along the normal direction Z of the first wall surface, the area of the portion where the storage portion 41 can be observed is its projected size S1, the area of the portion where the electrical contact portion 42 can be observed is its projected size S2, and the storage portion 41 has its projected size S2. The projected dimension S1 (area) of the portion 41 is smaller than the projected dimension S2 (area) of the electrical contact portion 42 .

As shown in FIGS. 15 and 18 , further, viewed along the normal direction Z of the first wall surface 10a, in the axial X direction of the photosensitive drum, the projection of the storage portion 41 is located between the projection ranges of the electrical contact portion 42 . The projections of the storage portion 41 and the electrical contact portion 42 are located on the XY plane, and in the X-axis direction, the projection D1 of the storage portion 41 completely falls within the range of the projection D2 of the electrical contact portion 42 .

As shown in FIG. 15 and FIG. 18 , preferably, the projection range of the electrical contact portion 42 in the X-axis direction is 3.5 mm-5.5 mm, and the projection D1 of the storage portion 41 in the X-axis direction is smaller than that of the electrical contact portion 42 in the X-axis direction. D2 is projected in the axial direction, and completely falls within the projected range of the electrical contact portion 42 .

Another difference from the first embodiment is that the structure of the chip holder 50 in this embodiment is different. As shown in FIGS. 19 and 20 , in this embodiment, the chip holder 50 includes a main body, and the main body is provided with a first mounting portion 51 , a second mounting portion 52 , a first engaging portion 53 and a second engaging portion 54 . The first mounting portion 51 is used for mounting the electrical contact portion 42 of the chip 40 , the second mounting portion 52 is used for mounting the storage portion 41 , and the first engaging portion 53 and the second engaging portion 54 are used for engaging with the developing frame 10 . so that the chip holder 50 is mounted on the developing frame 10 .

As shown in FIGS. 19 and 20 , in the Z direction, the first mounting portion 51 is located on the side of the main body away from the process cartridge, and the second mounting portion 52 is located inside the first mounting portion 51 . In the X direction, the second mounting portion 52 is located on one side of the main body, and the first engaging portion 53 and the second engaging portion 54 are located on the other side of the main body. The first engaging portion 53 and the second engaging portion 54 are respectively facing the two sides of the main body in the Y direction. One of the first engaging portions 53 is a protrusion, and the other is an elastic arm. The elastic arm is also provided with a locking protrusion.

As shown in FIG. 21 and FIG. 22 , during installation, the storage part 41 of the chip 40 can be installed into the second installation part 52 first, and the electrical contact part 42 of the chip 40 can be installed into the first installation part 51 , that is, the first installation part 51 can be installed. The chip 40 is mounted to the chip holder 50 , and then the chip holder 50 is mounted on the developing frame 10 together with the chip 40 . It is easy to meet the requirement of convenient installation or disassembly of the chip 40 as a whole.

As shown in FIG. 22 , in this embodiment, the chip 40 and the chip holder 50 are mounted on the developing frame 10 , and the chip 40 is located outside the range of the gap 60 between the developing frame 10 and the photosensitive frame 20 , and will not be exposed to the developing frame 10 In the gap 60 between the photosensitive frame 20 and the photosensitive frame 20 , some external components can be prevented from colliding with the storage part 41 from the gap 60 .

In some other embodiments, the chip holder 50 may also be integrally provided with the developing frame 10 .

Other structures of the process cartridge of this embodiment are the same as those of the first embodiment, and are not repeated here.

Embodiment 3

This embodiment provides another process cartridge, which is different from Embodiment 1 and Embodiment 2 in that the structure of the chip 40 and the structure of the chip holder 50 in this embodiment are different.

As shown in FIG. 23 and FIG. 24 , in this embodiment, the photosensitive frame 20 may further include an end cover 70 on which the chip 40 and the chip holder 50 are mounted, and the end cover 70 has a first wall surface 70 a . The wall surface 70a is located on the XY plane, the first wall surface 70a has a mounting position combined with the chip holder 50, and the normal direction of the first wall surface 70a is along the Z-axis direction.

As shown in FIGS. 24 to 26 , after the chip 40 is mounted on the end cap 70, the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 70a, the electrical The contact portion 42 is located outside the first wall surface 70a, and the electrical contact portion 42 is completely exposed outside the first wall surface 70a. The electrical contacts 42 are generally parallel to the first wall surface 70a. A part of the storage part 41 may be inserted into the installation position on the first wall surface 70a, and part of the storage part 41 may be exposed on the first wall surface 70a, or the storage part 41 may be completely inserted into the installation position on the first wall surface 70a. The storage portion 41 is located inside the electrical contact portion 42 in the normal direction Z of the first wall surface 70a, and does not protrude from the electrical contact portion 42. Therefore, the electrical contact portion 42 can form a shield for the storage portion 41 and avoid external components. Collision storage unit 41 . In the Y-axis direction, the electrical contact portion 42 is located on one side of the storage portion 41 .

As shown in FIGS. 27 and 28 , further, when viewed along the normal direction Z of the first wall surface 70 a, the projected size S1 of the storage portion 41 is smaller than the projected size S2 of the electrical contact portion 42 . Specifically, when viewed along the normal direction Z of the first wall surface, the area of the portion where the storage portion 41 can be observed is its projected size S1, the area of the portion where the electrical contact portion 42 can be observed is its projected size S2, and the storage portion 41 has its projected size S2. The portion 41 (dotted line in FIG. 28 ) is basically blocked by the first baffle 55, and the area that can be observed is basically zero, that is, the projected size S1 of the storage portion 41 is basically zero, and the projected size S1 of the storage portion 41 ( area) is smaller than the projected dimension S2 (area) of the electrical contact portion 42 .

Another difference from the first embodiment is that the structure of the chip holder 50 in this embodiment is different. As shown in FIG. 24 , in this embodiment, the chip holder 50 includes a main body, and the main body is provided with a first mounting portion 51 , a first baffle 55 , a first engaging portion 53 and a second engaging portion 54 . The first mounting portion 51 is used for mounting the electrical contact portion 42 of the chip 40 , and the first clamping portion 53 and the second clamping portion 54 are used for engaging with the end cover 70 , so that the chip holder 50 is mounted on the end cover 70 . superior.

As shown in FIG. 29 , in the Z direction, the first mounting portion 51 is located on the side of the main body away from the process cartridge. The first engaging portion 53 and the second engaging portion 54 are respectively facing the two sides of the main body in the Y direction. Both the first engaging portion 53 and the second engaging portion 54 are engaging protrusions. The first baffle 55 is located on the side of the first mounting portion 51 in the Y-axis direction, and is located on the side of the main body away from the process cartridge in the Z-axis direction. The first baffle 55 is used to block the storage of the chips 40 in the Z-axis direction. Section 41.

As shown in FIG. 30, further, the end cover 70 is further provided with a second baffle plate 72, the second baffle plate 72 extends along the YZ plane, and the second baffle plate 72 and the inner side of the end face of the end cover 70 in the X-axis direction There is a space 71 therebetween, and when the chip 40 and the chip holder 50 are installed at the installation position of the end cap 70, the storage part 41 is inserted into the space 71 inside the second baffle 72 and the end cap 70, so that the second baffle 72 can be in The storage unit 41 is shielded in the X-axis direction. The second baffle 72 and the end cover 70 are integrally formed.

As shown in FIG. 29 , during installation, the storage part 41 of the chip 40 can be installed on the main body by sticking or welding, and the electrical contact part 42 of the chip 40 can be installed in the first installation part 51, that is, the chip 40 is mounted to the chip holder 50 , and then the chip holder 50 is mounted together with the chip 40 on the end cap 70 . It is easy to meet the requirement of convenient installation or disassembly of the chip 40 as a whole.

As shown in FIG. 25 and FIG. 30 , in this embodiment, the chip 40 and the chip holder 50 are mounted on the end cover 70 , and the first baffle 55 and the second baffle 72 cover the storage part 41 of the chip 40 so that the storage part 41 is not exposed in the gap 60 between the photosensitive frame 20 and the developing frame 10 , and some external components can be prevented from colliding with the storage part 41 from the gap 60 .

In some other embodiments, the developing frame 10 may also include an end cap on which the chip and the chip holder are mounted.

Other structures of the process cartridge of this embodiment are the same as those of the first embodiment, and are not repeated here.

Embodiment 4

This embodiment provides another process cartridge. The difference from the third embodiment is that the structure of the chip 40 in this embodiment is different, and the chip holder 50 and the end cover 70 are integrally formed.

As shown in FIGS. 31 to 36 , in this embodiment, a first mounting portion 51 for mounting the electrical contact portion 42 of the chip 40 is formed on the first wall surface 70 a of the end cap 70 , and the first wall surface 70 a is located on the XY On a plane, the first mounting portion 51 is provided protruding from the first wall surface 70a in the Z-axis direction.

As shown in FIGS. 31 and 32 , the end cover 70 is further provided with a second baffle plate 72 , the second baffle plate 72 extends along the YZ plane, and the second baffle plate 72 and the inner side of the end face of the end cover 70 in the X-axis direction There is a space 71 therebetween, and when the chip 40 is installed at the installation position of the end cap 70, the storage part 41 is inserted into the second baffle 72 and the space 71 inside the end cap 70, so that the second baffle 72 can be in the X-axis direction The storage unit 41 is shielded.

As shown in FIGS. 31 to 36 , after the chip 40 is mounted on the end cap 70, the storage portion 41 is located on the side of the electrical contact portion 42 facing the process cartridge, that is, in the normal direction Z along the first wall surface 70a, the electrical The contact portion 42 is located outside the first wall surface 70a, and the electrical contact portion 42 is completely exposed outside the first wall surface 70a. The electrical contacts 42 are generally parallel to the first wall surface 70a. The storage portion 41 is located inside the electrical contact portion 42 in the normal direction Z of the first wall surface 70a, and does not protrude from the electrical contact portion 42. Therefore, the electrical contact portion 42 can form a shield for the storage portion 41 and avoid external components. Collision storage unit 41 .

As shown in FIGS. 32 to 34 , further, when viewed along the normal direction Z of the first wall surface 70 a , the projected size S1 of the storage portion 41 is smaller than the projected size S2 of the electrical contact portion 42 . The area of the portion of the storage portion 41 that can be observed is its projected size S1, the area of the portion of the electrical contact portion 42 that can be observed is its projected size S2, and the storage portion 41 is basically blocked by the electrical contact portion 42 and the chip holder 50. , the observable area is substantially zero, that is, the projected size S1 of the storage portion 41 is substantially zero, and the projected size S1 (area) of the storage portion 41 is smaller than the projected size S2 (area) of the electrical contact portion 42 .

As shown in FIG. 35 , further, viewed along the normal direction Z of the first wall surface 70 a , in the axial X direction of the photosensitive drum, the projection of the storage portion 41 is located between the projection ranges of the electrical contact portion 42 . The projections of the storage portion 41 and the electrical contact portion 42 are located on the XY plane, and in the X-axis direction, the projection D1 of the storage portion 41 completely falls within the range of the projection D2 of the electrical contact portion 42 .

As shown in FIG. 35 , preferably, the size of the projection range of the electrical contact portion 42 in the X-axis direction is 3.5 mm-5.5 mm, and the projection D1 of the storage portion 41 in the X-axis direction is smaller than that of the electrical contact portion 42 in the X-axis direction. The projection D2 in the direction falls completely within the projection range of the electrical contact portion 42 .

By setting the positional relationship between the storage portion 41 and the electrical contact portion 42 described above, the electrical contact portion 42 can effectively shield the storage portion 41 to prevent the storage portion 41 from being damaged due to collision between external components and the storage portion 41 .

As shown in FIG. 36 , in this embodiment, the chip 40 is mounted on the end cap 70 , and the electrical contact portion 42 and the second baffle 72 shield the storage portion 41 of the chip 40 so that the storage portion 41 is not exposed to the photosensitive frame 20 In the gap 60 with the developing frame 10 , some external members can be prevented from colliding with the storage part 41 from the gap 60 .

The structure of the process cartridge of this embodiment is the same as that of the first embodiment, and will not be repeated here.

The above are only some embodiments of the present invention. For those skilled in the art, without departing from the inventive concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention.

Claims (10)

1. A process cartridge, detachably mounted on an imaging device, characterized in that, comprising: a frame having a first wall surface; a photosensitive member rotatably supported by the frame; an electrical contact mounted on the frame and used for electrical connection with the imaging device; a storage portion electrically connected to the electrical contact portion and configured to store information related to the process cartridge; the storage part is located on the side of the electrical contact part facing the process cartridge; Viewed along the normal direction of the first wall surface, the projected size of the storage portion is smaller than the projected size of the electrical contact portion; and/or, in the axial direction of the photosensitive member, the storage portion has a The projections lie between the projection ranges of the electrical contacts. 2 . The process cartridge according to claim 1 , wherein, viewed along the normal direction of the first wall surface, in the axial direction of the photosensitive member, the projected range of the electrical contact portion is 3.5 mm-5.5mm. 3. The process cartridge according to claim 1, wherein the frame comprises a developing frame and a photosensitive frame; The electrical contact portion and the storage portion are jointly disposed on the developing frame or the photosensitive frame. 4. The process cartridge according to claim 3, wherein the storage portion is located outside the range of the gap between the photosensitive frame and the developing frame. 5 . The process cartridge according to claim 1 , wherein, in a normal direction along the first wall surface, the electrical contact portion is located outside the first wall surface. 6 . 6. The process cartridge of claim 5, wherein the electrical contact portion is parallel to the first wall surface. 7 . The process cartridge of claim 5 , wherein the electrical contact portion and the storage portion are electrically connected through a flexible conductive medium. 8 . 8. The process cartridge of claim 3, wherein the developing frame or the photosensitive frame comprises an end cap, and the electrical contact portion and the storage portion are mounted on the end cap. 9 . A chip support mounted on a process cartridge, wherein the chip support is used to mount and fix the electrical contact portion and the storage portion on the process cartridge, and the process cartridge is as claimed in any one of claims 1 to 8 said. 10 . The chip holder according to claim 9 , wherein the chip holder and the frame are provided separately or integrally formed. 11 .

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