CN221306168U

CN221306168U - Multimedia board card and electronic equipment

Info

Publication number: CN221306168U
Application number: CN202322644347.7U
Authority: CN
Inventors: 邱佩仪; 杨清梅
Original assignee: Guangzhou Shikun Electronic Technology Co Ltd
Current assignee: Guangzhou Shikun Electronic Technology Co Ltd
Priority date: 2023-09-26
Filing date: 2023-09-26
Publication date: 2024-07-09
Anticipated expiration: 2033-09-26

Abstract

The utility model relates to the field of circuit boards, and discloses a multimedia board card and electronic equipment. The multimedia board card comprises a circuit board, a main control chip, a conversion chip bonding pad structure, a first multimedia interface, a second multimedia interface and an exclusion bonding pad structure, wherein the main control chip, the conversion chip bonding pad structure, the first multimedia interface, the second multimedia interface and the exclusion bonding pad structure are arranged on the circuit board, the conversion chip bonding pad structure comprises an input pin bonding pad unit, a first output pin bonding pad unit and a second output pin bonding pad unit, the input pin bonding pad unit is electrically connected with the main control chip, the first output pin bonding pad unit is electrically connected with the first multimedia interface, the second output pin bonding pad unit is electrically connected with the second multimedia interface, and the exclusion bonding pad structure is electrically connected with the input pin bonding pad unit and the first output pin bonding pad unit respectively. Therefore, the arrangement of the pieces on the arrangement anti-bonding pad structure can be realized by using only one path of interface without wire tails, and the arrangement anti-bonding pad structure is a circuit breaking node, so that the wire tails can be shortened.

Description

Multimedia board card and electronic equipment

Technical Field

The utility model relates to the field of circuit boards, in particular to a multimedia board card and electronic equipment.

Background

HDMI (High Definition Multimedia Interface ) is a high definition video interface, and is mainly applied to electronic devices such as set top boxes, televisions, notebook computers, game hosts, comprehensive expanders, digital sound equipment and the like at present. HDMI is a digital video/audio interface technology that can transmit audio and video signals simultaneously. When the user needs to use the multi-channel HDMI, an HDMI conversion chip is usually required to be introduced, and the HDMI conversion chip is used for converting signals output by the main control chip and then supplying the signals to the multi-channel HDMI to realize one-to-many conversion.

Although the user only uses one path of HDMI, does not need to introduce an HDMI conversion chip, in order to be compatible with the requirements of one path of HDMI and multiple paths of HDMI, in the research and development stage, a welding pad capable of welding the HDMI conversion chip is generally arranged on a circuit board in advance, and lines compatible with the two conditions of welding the HDMI conversion chip and not welding the HDMI conversion chip are arranged.

However, when the HDMI conversion chip is not mounted, since the circuit board is still provided with the circuit for compatible soldering of the HDMI conversion chip, such a design generally introduces a long tail, which may introduce a problem of signal reflection, and the reflected signal and the normal signal will interfere with each other, which may easily cause a decrease in the rate of the signal transmitted on the circuit, thereby causing distortion of the picture and adversely affecting the overall circuit performance of the circuit board.

Disclosure of utility model

An object of the embodiment of the utility model is to provide a multimedia board card and electronic equipment, which can solve the technical problem of introducing a longer tail on a circuit board in the prior art.

In a first aspect, an embodiment of the present utility model provides a multimedia board card, including:

a circuit board;

the main control chip is arranged on the circuit board;

the conversion chip bonding pad structure is arranged on the circuit board and comprises an input pin bonding pad unit, a first output pin bonding pad unit and a second output pin bonding pad unit, and the input pin bonding pad unit is electrically connected with the main control chip;

The first multimedia interface is arranged on the circuit board and is electrically connected with the first output pin pad unit;

The second multimedia interface is arranged on the circuit board and is electrically connected with the second output pin pad unit;

The anti-pad arrangement structure is arranged on the circuit board and comprises a first anti-pad arrangement unit and a second anti-pad arrangement unit, wherein the first anti-pad arrangement unit is respectively electrically connected with the input pin pad unit and the second anti-pad arrangement unit, and the second anti-pad arrangement unit is also electrically connected with the first output pin pad unit.

Optionally, the device further comprises a conversion chip;

The conversion chip comprises an input pin group, a first output pin group and a second output pin group, wherein the input pin group is welded with an input pin bonding pad unit, the first output pin group is welded with the first output pin bonding pad unit, and the second output pin group is welded with the second output pin bonding pad unit.

Optionally, the method further comprises:

A first row of resistors soldered to the first row of anti-pad units;

and the second row of resistors are welded with the second row of anti-pad units.

Optionally, the input pin pad unit includes a first input pin pad and a second input pin pad, where the first input pin pad and the second input pin pad are electrically connected with the main control chip;

The first anti-pad unit comprises a first anti-pad group and a second anti-pad group, the first anti-pad group is electrically connected with the first input pin pad and the second anti-pad unit respectively, and the second anti-pad group is electrically connected with the second input pin pad and the second anti-pad unit respectively.

Optionally, the first anti-pad group includes a first anti-pad and a second anti-pad, where the first anti-pad is connected to the first input pin pad through a signal trace, and the second anti-pad is electrically connected to the second anti-pad unit;

The second anti-bonding pad group comprises a third anti-bonding pad and a fourth anti-bonding pad, the third anti-bonding pad is connected with the second input pin bonding pad through a signal wiring, and the fourth anti-bonding pad is electrically connected with the second anti-bonding pad unit.

Optionally, the first anti-pad group includes a fifth anti-pad and a sixth anti-pad, the fifth anti-pad overlaps with the first input pin pad, and the fifth anti-pad is electrically connected with the second anti-pad unit;

The second anti-bonding pad group comprises a seventh anti-bonding pad and an eighth anti-bonding pad, the seventh anti-bonding pad is overlapped with the second input pin bonding pad, and the eighth anti-bonding pad is electrically connected with the second anti-bonding pad unit.

Optionally, the first output pad unit includes a first output pin pad and a second output pin pad, and the first output pin pad and the second output pin pad are electrically connected with the first multimedia interface;

The second anti-bonding pad unit comprises a third anti-bonding pad group and a fourth anti-bonding pad group, wherein the third anti-bonding pad group is respectively and electrically connected with the first output pin bonding pad and the first anti-bonding pad unit, and the fourth anti-bonding pad group is respectively and electrically connected with the second output pin bonding pad and the first anti-bonding pad unit.

Optionally, the third anti-pad group includes a ninth anti-pad and a tenth anti-pad, where the ninth anti-pad is connected to the first output pin pad through a signal trace, and the tenth anti-pad is electrically connected to the first anti-pad unit;

The fourth anti-bonding pad group comprises an eleventh anti-bonding pad and a twelfth anti-bonding pad, the eleventh anti-bonding pad is connected with the second output pin bonding pad through a signal wiring, and the twelfth anti-bonding pad is electrically connected with the first anti-bonding pad unit.

Optionally, the third anti-pad group includes a thirteenth anti-pad and a fourteenth anti-pad, where the thirteenth anti-pad overlaps the first output pin pad, and the fourteenth anti-pad is electrically connected to the first anti-pad unit;

The fourth anti-bonding pad group comprises a fifteenth anti-bonding pad and a sixteenth anti-bonding pad, the fifteenth anti-bonding pad is overlapped with the second output pin bonding pad, and the sixteenth anti-bonding pad is electrically connected with the first anti-bonding pad unit.

In a second aspect, an embodiment of the present utility model provides an electronic device, including a multimedia board card as described above.

The multimedia board card provided by the embodiment of the utility model comprises a circuit board, a main control chip, a conversion chip bonding pad structure, a first multimedia interface, a second multimedia interface and an exclusion bonding pad structure, wherein the main control chip, the conversion chip bonding pad structure, the first multimedia interface, the second multimedia interface and the exclusion bonding pad structure are arranged on the circuit board, the conversion chip bonding pad structure comprises an input pin bonding pad unit, a first output pin bonding pad unit and a second output pin bonding pad unit, the input pin bonding pad unit is electrically connected with the main control chip, the first multimedia interface is electrically connected with the first output pin bonding pad unit, the second multimedia interface is electrically connected with the second output pin bonding pad unit, the exclusion bonding pad structure comprises a first exclusion bonding pad unit and a second exclusion bonding pad unit, the first exclusion bonding pad unit is respectively electrically connected with the input pin bonding pad unit and the second exclusion bonding pad unit, and the second exclusion bonding pad unit is also electrically connected with the first output pin bonding pad unit. Therefore, when only one path of interface is used, the first row of anti-pad units and the second row of anti-pad units are welded and anti-blocked, at this time, signals output by the main control chip pass through the output pin pad units, the row of anti-blocking units and the first output pin pad units in sequence and are directly connected to the path of interface, so that a line tail cannot exist, the problem of signal reflection cannot be introduced, the rate of signal transmission is favorably improved, and therefore, the picture distortion is favorably avoided.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to be taken in a limiting sense, unless otherwise indicated.

Fig. 1a and fig. 1b are schematic structural diagrams of a multimedia board card provided in the prior art;

fig. 2 is a schematic structural diagram of a multimedia board card according to an embodiment of the present utility model;

fig. 3 is a schematic structural diagram of a multimedia board card according to another embodiment of the present utility model;

Fig. 4 is a schematic structural diagram of a multimedia board card according to another embodiment of the present utility model;

Fig. 5 is a schematic structural diagram of a multimedia board card according to another embodiment of the present utility model;

fig. 6 is a schematic structural diagram of a multimedia board card according to another embodiment of the present utility model;

Fig. 7 is a schematic structural diagram of a multimedia board card according to another embodiment of the present utility model.

Detailed Description

In order that the application may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.

Fig. 1a and fig. 1b are schematic structural diagrams of a multimedia board card according to an embodiment of the present utility model. As shown in fig. 1a and 1b, the main control chip is connected with the HDMI1 and the conversion chip through signal wires, and the conversion chip is also connected with the HDMI1 and the HDMI2 through signal wires.

When only one path of interface is used, as shown in fig. 1a, the signal output by the main control chip directly enters the HDMI through the signal path formed by the signal trace, and does not pass through the conversion chip, so that the signal trace between the signal path and the conversion chip becomes a wire tail, the wire tail is generally longer, and the longer wire tail affects the signal transmitted on the signal path, which easily leads to a reduction in the signal transmission rate, thereby causing the distortion of the picture.

When multiple interfaces are needed, as shown in fig. 1b, the signals output by the main control chip enter the conversion chip through the signal paths formed by the signal wires, and are respectively output to the HDMI1 and the HDMI2 after being converted by the conversion chip, so that multiple rotations are realized, however, the signal wires between the signal paths and the HDMI1 also become wire tails, which are generally longer, and the signal transmission rate is also reduced, so that the picture distortion is caused.

Fig. 2 is a schematic structural diagram of a multimedia board card according to an embodiment of the present utility model. As shown in fig. 2, the multimedia board card 100 includes a circuit board 10, a main control chip 20, a conversion chip pad structure 30, a first multimedia interface 40, a second multimedia interface 50, and an anti-pad structure 60.

The circuit board 10 may be called a printed circuit board or a printed circuit board, and the english name is (Printed Circuit Board) PCB, and the FPC (Flexible Printed Circuit board) is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility.

The circuit board 10 can be processed by copper coating, gold plating, etching and other processes by adopting glass fiber as a base material, and is used as a support carrier for connecting electronic components and circuits together, and is used for realizing the functions of layout design, electric signal transmission and the like of complex circuits in electric appliances and electronic equipment.

The circuit board 10 may be formed by laminating a plurality of wiring layers (conductive pattern layers) with insulating materials therebetween at intervals and interconnecting the conductive patterns therebetween as required to form a complex circuit network.

The main control chip 20 is arranged on the circuit board 10 and is used for outputting audio and video signals, wherein the main control chip 20 is an operation and control core of the multimedia board 100 and is a final execution unit for information processing and program running.

The conversion chip pad structure 30 is a region reserved for the upper conversion chip and arranged on the circuit board 10, the conversion chip pad structure 30 is used for selecting and welding the conversion chip, and the conversion chip is a chip for converting an audio/video signal in one format into an audio/video signal in another format.

The conversion chip pad structure 30 includes an input lead pad unit 31, a first output lead pad unit 32, and a second output lead pad unit 33.

The input pin pad unit 31 is connected with the main control chip 20 through a signal wire, and is used for transmitting audio and video signals output by the main control chip 20.

The first multimedia interface 40 is disposed on the circuit board 10 and connected to the first output pin pad unit 32 through a signal trace, and the first multimedia interface 40 may be any type of interface for transmitting audio/video signals, such as HDMI.

The second multimedia interface 50 is disposed on the circuit board 10 and connected to the second output pin pad unit 33 through a signal trace, and the second multimedia interface 50 may be any type of interface for transmitting audio/video signals, such as HDMI.

The pad-layout structure 60 is disposed on the circuit board 10, and the pad-layout structure 60 includes a first pad-layout unit 61 and a second pad-layout unit 62, where the first pad-layout unit 61 is electrically connected to the input pin pad unit 31 and the second pad-layout unit 62, and the second pad-layout unit 62 is also electrically connected to the first output pin pad unit 32.

The first row of anti-pad units 61 and the second row of anti-pad units 62 are used for selecting the solder resist. The resistor is a network resistor which can be assembled by packaging together a plurality of resistors with identical parameters.

When the multi-path interface is needed, the conversion chip may be welded on the conversion chip pad structure 30 without welding the first and second anti-pad units 61 and 62, and the conversion chip is mounted on the conversion chip, and the signals output by the main control chip 20 may enter the conversion chip through the signal trace and the input pin pad unit 31, enter the first multimedia interface 40 through the first output pin pad unit 32 and the signal trace after being converted by the conversion chip, and enter the second multimedia interface 50 through the second output pin pad unit 33 and the signal trace, thereby realizing one-to-many conversion.

Because no piece is arranged at this time, the first row of anti-pad units 61 and the second row of anti-pad units 62 are all break nodes, and signals output by the main control chip 20 cannot pass through the first row of anti-pad units 61 and the second row of anti-pad units 62 and are directly connected with the first multimedia interface 40.

When only one path of interface is needed, the first and second pad units 61 and 62 can be respectively welded with the pad arrangement without welding the conversion chip on the conversion chip pad structure 30, and at this time, the signal output by the main control chip 20 can directly enter the first multimedia interface 40 through the path formed by the signal routing, the input pin pad unit 31, the pad arrangement welded with the first pad unit 61, the pad arrangement welded with the second pad unit 62, the first output pin pad unit 32 and the signal routing, and no extra line is introduced when the signal is transmitted through the path, so that no line tail exists, no signal reflection problem is introduced, the signal transmission rate is improved, and the frame distortion is avoided.

Fig. 3 is a schematic structural diagram of a multimedia board card according to another embodiment of the present utility model. As shown in fig. 3, the input pin pad unit 31 includes a first input pin pad 311 and a second input pin pad 312, the first output pin pad unit 32 includes a first output pin pad 321 and a second output pin pad 322, and the second output pin pad unit 33 includes a third output pin pad 331 and a fourth output pin pad 332.

The first input pin pad 311 and the second input pin pad 312 are connected with the main control chip 20 through signal wiring and electrically connected with the first row anti-pad unit 61, the first output pin pad 321 and the second output pin pad 322 are electrically connected with the first multimedia interface 40 and electrically connected with the second row anti-pad unit 62, and the third output pin pad 331 and the fourth output pin pad 332 are electrically connected with the second multimedia interface 50.

Fig. 4 is a schematic structural diagram of a multimedia board card according to another embodiment of the present utility model. As shown in fig. 4, the multimedia board 100 further includes a conversion chip 70.

The conversion chip 70 is a chip capable of converting one input audio/video signal into multiple audio/video signals for output to different interfaces, i.e. a chip with multiple rotations.

The conversion chip 70 includes an input pin set 71, a first output pin set 72, and a second output pin set 73.

Referring to fig. 3 and 4, the input pin set 71 includes a first input pin 711 and a second input pin 712, the first input pin 711 is soldered to the first input pin pad 311, and the second input pin 712 is soldered to the second input pin pad 312.

The first output pin group 72 includes a first output pin 721 and a second output pin 722, the first output pin 721 is soldered to the first output pin pad 321, and the second output pin 722 is soldered to the second output pin pad 322.

The second output pin group 73 includes a third output pin 731 and a fourth output pin 732, the third output pin 731 is soldered to the third output pin pad 331, and the fourth output pin 732 is soldered to the fourth output pin pad 332.

For each set of audio/video signals output by the main control chip 20, one path of signals output by the main control chip 20 enters the first input pin 711 through the signal wiring and the first input pin pad 311, and after being converted by the conversion chip 70, one path of signals are output at the first output pin 721 and the other path of signals are output at the third output pin 731, one path of signals output at the first output pin 721 enters the first multimedia interface 40 through the first output pin pad 321 and the signal wiring, and the other path of signals output at the third output pin 731 enters the second multimedia interface 50 through the third output pin pad 331 and the signal wiring.

The other path of signal output by the main control chip 20 enters the second input pin 712 through the signal wiring and the second input pin pad 312, and after being converted by the conversion chip 70, one path of signal is output at the second output pin 722 and the other path of signal is output at the fourth output pin 732, the one path of signal output at the second output pin 722 enters the first multimedia interface 40 through the second output pin pad 322 and the signal wiring, and the other path of signal output at the fourth output pin 732 enters the second multimedia interface 50 through the fourth output pin pad 332 and the signal wiring.

Therefore, each set of signals output by the main control chip 20 is converted by the conversion chip 70 to output two sets of signals, one set of signals output by the conversion chip 70 enters the first multimedia interface 40, and the other set of signals output by the conversion chip 70 enters the second multimedia interface 50, so that one rotation is realized.

It is understood that the multimedia board 100 of the present embodiment does not include the resistor, i.e. the first resistor pad unit 61 and the second resistor pad unit 62 are not soldered with the resistor, and the multimedia board can be applied to an electronic device with multiple requirements, i.e. multiple interfaces are needed.

For convenience of description, such a multimedia board card is hereinafter referred to as a "one-turn multimedia board card".

In some embodiments, the conversion chip is prone to heat during operation, and if the heat of the conversion chip cannot be effectively dissipated, the operation stability of the conversion chip is adversely affected.

In some embodiments, to better dissipate heat from the conversion chip, the multimedia board card 100 further includes a ground pad (not shown).

The grounding pad can be arranged on the circuit board 10 and positioned below the conversion chip 70, the grounding pad is electrically connected with the conversion chip 70, the grounding pad can conduct heat of the conversion chip 70 to a metal plane connected with the grounding pad, and if the metal plane is connected with the shell metal or the external metal frame, the heat is further conducted to the outside, so that heat dissipation of the conversion chip is facilitated.

In some embodiments, first row of anti-pad cells 61 and second row of anti-pad cells 62 are disposed on circuit board 10 in areas reserved for the upper conversion chip, wherein first row of anti-pad cells 61 is disposed proximate to input pin pad cells 31 and second row of anti-pad cells 62 is disposed proximate to first output pin pad cells 32.

In some embodiments, with continued reference to fig. 3, the first row of anti-pad units 61 includes a first row of anti-pad groups 611 and a second row of anti-pad groups 612, and the second row of anti-pad units 62 includes a third row of anti-pad groups 621 and a fourth row of anti-pad groups 622.

The first row of anti-pad groups 611 are electrically connected to the first input pin pad 311 and the third row of anti-pad groups 621, respectively, and the second row of anti-pad groups 612 are electrically connected to the second input pin pad 312 and the fourth row of anti-pad groups 622, respectively.

As shown in fig. 3, the first-row anti-pad group 611 includes a first-row anti-pad 6111 and a second-row anti-pad 6112, the second-row anti-pad group 612 includes a third-row anti-pad 6121 and a fourth-row anti-pad 6122, the third-row anti-pad group 621 includes a ninth-row anti-pad 6211 and a tenth-row anti-pad 6212, and the fourth-row anti-pad group 622 includes an eleventh-row anti-pad 6221 and a twelfth-row anti-pad 6222.

The first anti-pad 6111 is disposed near the first input pin pad 311 and connected to the first input pin pad 311 through a signal trace, the second anti-pad 6112 is connected to the ninth anti-pad 6211 through a signal trace, and the tenth anti-pad 6212 is disposed near the first output pin pad 321 and connected to the first output pin pad 321 through a signal trace.

The third row of anti-pads 6121 is routed proximate to the second input pin pad 312 and is connected to the second input pin pad 312 by a signal trace, the fourth row of anti-pads 6122 is connected to the eleventh row of anti-pads 6221 by a signal trace, and the twelfth row of anti-pads 6222 is routed proximate to the second output pin pad 322 and is connected to the second output pin pad 322 by a signal trace.

When the structure is applied to a one-turn multimedia board card, since the first row of anti-pads 6111, the third row of anti-pads 6121, the tenth row of anti-pads 6212 and the twelfth row of anti-pads 6222 are non-welded, signal traces between the first input pin pad 311 and the first row of anti-pads 6111, signal traces between the second input pin pad 312 and the third row of anti-pads 6121, signal traces between the tenth row of anti-pads 6212 and the first output pin pad 321 and signal traces between the twelfth row of anti-pads 6222 and the second output pin pad 322 do not form signal paths to become wire tails.

However, although some wire tails are introduced in the structure, compared with the prior art, the wire tails are greatly shortened, so that the problem of signal reflection is not introduced, the signal transmission rate is improved, and the picture distortion is avoided.

Fig. 5 is a schematic structural diagram of a multimedia board card according to another embodiment of the present utility model. As shown in fig. 5, the first-row anti-pad group 611 includes a fifth-row anti-pad 6113 and a sixth-row anti-pad 6114, the second-row anti-pad group 612 includes a seventh-row anti-pad 6123 and an eighth-row anti-pad 6124, the third-row anti-pad group 621 includes a thirteenth-row anti-pad 6213 and a fourteenth-row anti-pad 6214, and the fourth-row anti-pad group 622 includes a fifteenth-row anti-pad 6223 and a sixteenth-row anti-pad 6224.

Fifth row of anti-pads 6113 overlaps first input pin pad 311, sixth row of anti-pads 6114 is electrically connected to thirteenth row of anti-pads 6213, and fourteenth row of anti-pads 6214 overlaps first output pin pad 321.

The seventh row of anti-pads 6123 coincides with the second input pin pad 312, the eighth row of anti-pads 6124 is electrically connected to the fifteenth row of anti-pads 6223, and the sixteenth row of anti-pads 6224 coincides with the second output pin pad 322.

When the structure is applied to a one-turn multimedia board card, as the fifth row of anti-bonding pads 6113 is overlapped with the first input pin bonding pads 311, the fourteenth row of anti-bonding pads 6214 is overlapped with the first output pin bonding pads 321, the seventh row of anti-bonding pads 6123 is overlapped with the second input pin bonding pads 312, and the sixteenth row of anti-bonding pads 6224 is overlapped with the second output pin bonding pads 322, the structure does not have any line tail, thereby not introducing the problem of signal reflection, being beneficial to improving the speed of signal transmission and avoiding the picture distortion.

Fig. 6 is a schematic structural diagram of a multimedia board card according to another embodiment of the present utility model. As shown in fig. 6, the multimedia board 100 further includes a first resistor 80 and a second resistor 90.

Referring to fig. 3 and 6, the first resistor 80 is soldered to the first pad unit 61, and the second resistor 90 is soldered to the second pad unit 62.

It is understood that the multimedia board 100 of the present embodiment does not include a conversion chip, i.e. the conversion chip pad structure 30 is not soldered with the resistor, and the multimedia board can be applied to an electronic device that only needs to use one path of interface.

As shown in fig. 6, the first resistor 80 includes a first resistor 81, a second resistor 82, a first resistor pin 83, a second resistor pin 84, a third resistor pin 85, and a fourth resistor pin 86.

The second resistor 90 includes a third resistor 91, a fourth resistor 92, a fifth resistor pin 93, a sixth resistor pin 94, a seventh resistor pin 95, and an eighth resistor pin 96.

Referring to fig. 3 and 6, the first row of resistive pins 83 is soldered to the first row of resistive pads 6111, the second row of resistive pins 84 is soldered to the second row of resistive pads 6112, the third row of resistive pins 85 is soldered to the third row of resistive pads 6121, the fourth row of resistive pins 86 is soldered to the fourth row of resistive pads 6122, the fifth row of resistive pins 93 is soldered to the ninth row of resistive pads 6211, the sixth row of resistive pins 94 is soldered to the tenth row of resistive pads 6212, the seventh row of resistive pins 95 is soldered to the eleventh row of resistive pads 6221, and the eighth row of resistive pins 96 is soldered to the twelfth row of resistive pads 6222.

For each group of audio and video signals output by the main control chip 20, one path of signals output by the main control chip 20 enters the first multimedia interface 40 through a signal path formed by a signal wiring, a first input pin pad 311, a first resistor 83, a first resistor 81, a second resistor 84, a signal wiring, a fifth resistor pin 93, a third resistor 91, a sixth resistor pin 94, a signal wiring, a first output pin pad 321 and a signal wiring.

Because no extra line is introduced when the signal path transmits signals, no line tail exists, so that the problem of signal reflection is not introduced, the signal transmission rate is improved, and the picture distortion is avoided.

The other signal output by the main control chip 20 enters the first multimedia interface 40 through a signal path formed by the signal trace, the second input pin pad 312, the third resistor 82, the fourth resistor 86, the signal trace, the seventh resistor 95, the fourth resistor 94, the eighth resistor 96, the signal trace, the second output pin pad 322 and the signal trace.

Because no extra line is introduced when the signal path transmits signals, no line tail exists, and the problem of signal reflection is not introduced, thereby being beneficial to improving the signal transmission rate and avoiding the picture distortion.

Fig. 7 is a schematic structural diagram of a multimedia board card according to another embodiment of the present utility model. Referring to fig. 5 and 7, the first row of resistive pins 83 is soldered to the fifth row of resistive pads 6113/first input pin pads 311, the second row of resistive pins 84 is soldered to the sixth row of resistive pads 6114, the third row of resistive pins 85 is soldered to the seventh row of resistive pads 6123/second input pin pads 312, the fourth row of resistive pins 86 is soldered to the eighth row of resistive pads 6124, the fifth row of resistive pins 93 is soldered to the thirteenth row of resistive pads 6213, the sixth row of resistive pins 94 is soldered to the fourteenth row of resistive pads 6214/first output pin pads 321, the seventh row of resistive pins 95 is soldered to the fifteenth row of resistive pads 6223, and the eighth row of resistive pins 96 is soldered to the sixteenth row of resistive pads 6224/second output pin pads 322.

For each set of audio and video signals output by the main control chip 20, one path of signals output by the main control chip 20 enters the first multimedia interface 40 through a signal path formed by a signal wire, a fifth-row anti-pad 6113/a first input pin pad 311, a first-row anti-pin 83, a first resistor 81, a second-row anti-pin 84, a signal wire, a fifth-row anti-pin 93, a third resistor 91, a sixth-row anti-pin 94, a signal wire, a fourteenth-row anti-pad 6214/a first output pin pad 321 and a signal wire.

The other signal output by the main control chip 20 enters the first multimedia interface 40 through a signal path formed by the signal trace, the seventh anti-pad 6123/the second input pin pad 312, the third anti-pin 85, the second resistor 82, the fourth anti-pin 86, the signal trace, the seventh anti-pin 95, the fourth resistor 94, the eighth anti-pin 96, the signal trace, the sixteenth anti-pad 6224/the second output pin pad 322, and the signal trace.

As another aspect of the embodiments of the present utility model, the embodiments of the present utility model provide an electronic device including the multimedia board card as described above.

Finally, it is to be noted that the present utility model may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, which are not to be construed as additional limitations on the scope of the utility model, but rather as providing for a more thorough understanding of the present utility model. And under the idea of the utility model, the technical features described above are continuously combined with each other, and many other variations exist in different aspects of the utility model as described above, which are all considered as the scope of the description of the utility model; further, modifications and variations of the present utility model may be apparent to those skilled in the art in light of the foregoing teachings, and all such modifications and variations are intended to be included within the scope of this utility model as defined in the appended claims.

Claims

1. A multimedia board card, comprising:

a circuit board;

the main control chip is arranged on the circuit board;

2. The multimedia board card of claim 1, further comprising a conversion chip;

3. The multimedia board card of claim 1, further comprising:

A first row of resistors soldered to the first row of anti-pad units;

4. The multi-media card of claim 1, wherein,

The input pin pad unit comprises a first input pin pad and a second input pin pad, and the first input pin pad and the second input pin pad are electrically connected with the main control chip;

5. The multi-media card of claim 4, wherein,

The first anti-bonding pad group comprises a first anti-bonding pad and a second anti-bonding pad, the first anti-bonding pad is connected with the first input pin bonding pad through a signal wiring, and the second anti-bonding pad is electrically connected with the second anti-bonding pad unit;

6. The multi-media card of claim 4, wherein,

The first anti-bonding pad group comprises a fifth anti-bonding pad and a sixth anti-bonding pad, the fifth anti-bonding pad is overlapped with the first input pin bonding pad, and the fifth anti-bonding pad is electrically connected with the second anti-bonding pad unit;

7. The multi-media card of claim 1, wherein,

The first output pin pad unit comprises a first output pin pad and a second output pin pad, and the first output pin pad and the second output pin pad are electrically connected with the first multimedia interface;

the second anti-bonding pad unit comprises a third anti-bonding pad group and a fourth anti-bonding pad group, wherein the third anti-bonding pad group is respectively electrically connected with the first output pin bonding pad and the first anti-bonding pad unit, and the fourth anti-bonding pad group is respectively electrically connected with the second output pin bonding pad and the first anti-bonding pad unit.

8. The multi-media card of claim 7, wherein,

The third anti-bonding pad group comprises a ninth anti-bonding pad and a tenth anti-bonding pad, the ninth anti-bonding pad is connected with the first output pin bonding pad through a signal wiring, and the tenth anti-bonding pad is electrically connected with the first anti-bonding pad unit;

9. The multi-media card of claim 7, wherein,

The third anti-bonding pad group comprises a thirteenth anti-bonding pad and a fourteenth anti-bonding pad, the thirteenth anti-bonding pad is overlapped with the first output pin bonding pad, and the fourteenth anti-bonding pad is electrically connected with the first anti-bonding pad unit;

10. An electronic device comprising the multimedia board card of claim 9.