CN220915489U - Bonding pad structure and packaging PCB - Google Patents

Abstract

The pad structure provided in the present application includes a main pad and an auxiliary pad, and a signal via is provided on the main pad. The auxiliary pad is a plurality of auxiliary pads arranged at intervals, and each auxiliary pad is provided with a through hole. The auxiliary pad is arranged around the main pad, and each auxiliary pad is connected to the side wall of the main pad. Wherein, the sum of the areas of the signal via and the through hole is A, the sum of the areas of the main pad and the auxiliary pad is B, and A/B≧0.75. When the structure of the auxiliary pad surrounding the main pad is adopted, the sum of the areas of the signal via and the through hole is greater than or equal to 0.75 than the sum of the areas of the main pad and the auxiliary pad, which can meet the design requirements of the overcurrent capability of large currents in the circuit and the low EMC grounding impedance. Further, the auxiliary pad is not directly fully connected to the main pad, and the setting of the through hole alleviates the situation of cold soldering caused by too fast heat dissipation, thereby improving the welding yield.

Description

Pad structure and package PCB board

Technical Field

The present application relates to the field of circuit boards, and in particular to a pin pad structure on a PCB board.

Background technique

Printed Circuit Board (PCB), also known as printed circuit board, is an important part of the physical support and signal transmission of electronic products. With the development of hardware circuits, more and more through-hole connectors have appeared on PCB boards, such as HDMI, USB, network port, audio/video interface, etc. These through-hole connectors need to be fully connected with copper foil when soldering.

However, the pins of the through-hole device are coppered over a large area, with increased copper thickness and number of copper layers. When soldering, the pins are not easily tinned due to too fast heat dissipation, resulting in cold soldering. In terms of technology, some problems can be solved by increasing the working temperature of the wave soldering or selective soldering machine, but this may damage the PCB board. Therefore, it is necessary to improve the pin pad structure on the PCB board.

Utility Model Content

The purpose of the present application is to provide a PCB pad structure to solve the problem of cold solder joints caused by too fast heat dissipation on the PCB board.

In one aspect of the present application, a pad structure is provided, comprising a main pad and an auxiliary pad, wherein the main pad is provided with a signal via. The auxiliary pad is a plurality of auxiliary pads arranged at intervals, each of which is provided with a through hole. The auxiliary pad is arranged around the main pad, and each of the auxiliary pads is connected to the side wall of the main pad. The sum of the areas of the signal via and the through hole is A, the sum of the areas of the main pad and the auxiliary pad is B, and A/B≧0.75.

Furthermore, the centers of the through holes are arranged in a circle with the center of the signal via hole as the center.

Furthermore, the signal via hole and the through hole are both round holes.

Furthermore, each of the auxiliary pads has the same size and shape.

Furthermore, the intervals between any two adjacent auxiliary pads are uniform and equal.

Furthermore, the diameter of the signal via hole is larger than the diameter of the through hole, and the diameter of the through hole is 0.4 mm.

Furthermore, along the orthographic projection direction, the main pad and the auxiliary pad are both circular pads. The distance between the center of each auxiliary pad and the center of the main pad is L, where L≦R+r, R is the radius of the main pad, and r is the radius of the auxiliary pad.

Furthermore, the diameter of the through hole is 1/2 of the diameter of the corresponding auxiliary pad.

Furthermore, the main pad further includes an annular solder resist layer, the solder resist layer surrounds the side wall of the main pad, and the solder resist layer coincides with the center of the signal via. The distance between the center of each auxiliary pad and the center of the main pad is L, L = R + r + X, where R is the radius of the main pad, r is the radius of the through hole, and X is the width of the solder resist layer.

Furthermore, the present application also provides a packaged PCB board, which includes the above-mentioned pad structure.

The pad structure provided in the present application includes a main pad and an auxiliary pad, and a signal via is provided on the main pad. The auxiliary pad is a plurality of auxiliary pads arranged at intervals, and each auxiliary pad is provided with a through hole. The auxiliary pad is arranged around the main pad, and each auxiliary pad is connected to the side wall of the main pad. Wherein, the sum of the areas of the signal via and the through hole is A, the sum of the areas of the main pad and the auxiliary pad is B, and A/B≧0.75. When the structure of the auxiliary pad surrounding the main pad is adopted, the sum of the areas of the signal via and the through hole is greater than or equal to 0.75 than the sum of the areas of the main pad and the auxiliary pad, which can meet the design requirements of the overcurrent capability of large currents in the circuit and the low EMC grounding impedance. Further, the auxiliary pad is not directly fully connected to the main pad, and the setting of the through hole alleviates the situation of cold soldering caused by too fast heat dissipation, thereby improving the welding yield.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present utility model, and together with the specification, are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

FIG1 is a schematic diagram of the pad structure of the present application.

Description of reference numerals:

1. Pad structure; 2. Main pad; 3. Auxiliary pad;

21. Signal via; 22. Solder mask; 31. Through hole.

Detailed ways

Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of example embodiments to those skilled in the art.

In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be understood as limiting the present application.

It should be noted that the "multiple" mentioned in this article refers to two or more. "And/or" describes the association relationship of the associated objects, indicating that there can be three relationships. For example, A and/or B can mean: A exists alone, A and B exist at the same time, and B exists alone. The character "/" generally indicates that the associated objects before and after are in an "or" relationship.

Please refer to FIG. 1 . One aspect of the present application provides a pad structure 1, which includes a main pad 2 and an auxiliary pad 3, and the main pad 2 is provided with a signal via 21. The auxiliary pad 3 is a plurality of auxiliary pads 3 arranged at intervals, and each auxiliary pad 3 is provided with a through hole 31. The auxiliary pads 3 are arranged around the main pad 2, and each auxiliary pad 3 is connected to the side wall of the main pad 2. Among them, the sum of the areas of the signal via 21 and the through hole 31 is A, the sum of the areas of the main pad 2 and the auxiliary pad 3 is B, and A/B≧0.75. When the structure in which the auxiliary pad 3 surrounds the main pad 2 is adopted, the sum of the areas of the signal via 21 and the through hole 31 is greater than or equal to 0.75 than the sum of the areas of the main pad 2 and the auxiliary pad 3, which can meet the design requirements of the overcurrent capability of large currents in the circuit and low EMC grounding impedance. Furthermore, the auxiliary pad 3 is not directly fully connected to the main pad 2, and the provision of the through hole 31 alleviates the situation of cold solder joints caused by too fast heat dissipation, thereby improving the soldering yield.

Please continue to refer to FIG. 1 , the center of the through hole 31 is arranged in a circle with the center of the signal via 21 as the center. The shapes of the through hole 31 and the signal via 21 may not be fixed, and the through hole 31 and the signal via 21 are circular, with the center of the through hole 31 being the center of the circle. The through holes 31 are arranged in a circle with the center of the signal via 21 as the center, which can ensure that the arrangement distance of the through holes 31 is equal and uniform, and the overcurrent capacity requirements are met during welding.

Further, referring to FIG. 1 , the signal via hole 21 and the through hole 31 are both round holes, which are convenient for soldering the pins and realizing a full connection design.

Preferably, each auxiliary pad 3 has the same size and shape to ensure the symmetry of the pad and balance the surface tension during soldering. Further, the size and shape of the auxiliary pad 3 are designed according to actual needs so that the overcurrent capacity and heat dissipation capacity meet the requirements and meet the impedance design requirements.

In some embodiments, referring to FIG. 1 , the intervals between any two adjacent auxiliary pads 3 are uniform and equal. The uniform intervals between the auxiliary pads 3 play a role of thermal isolation, and can effectively prevent cold solder joints caused by excessive heat dissipation during welding. Further, the intervals between the auxiliary pads 3 are designed to effectively prevent excessive heat dissipation during welding and ensure the current carrying capacity of the pad structure 1.

Furthermore, the diameter of the signal via hole 21 is larger than the diameter of the through hole 31, and the diameter of the through hole 31 is 0.4 mm. The diameter of the signal via hole 21 is larger than the diameter of the through hole 31, which is convenient for processing.

Please refer to Figure 1. Along the orthographic projection direction, the main pad 2 and the auxiliary pad 3 are both circular pads. The distance between the center of each auxiliary pad 3 and the center of the main pad 2 is L, where L≦R+r, R is the radius of the main pad 2, and r is the radius of the auxiliary pad 3. That is, the main pad 2 and the auxiliary pad 3 partially overlap, so that the pins can be copper-plated over a large area, meeting the design requirements of large current overcurrent capability and low EMC grounding impedance.

Specifically, the diameter of the through hole 31 is 1/2 of the diameter of the corresponding auxiliary pad 3. That is, the diameter of the through hole 31 is 0.4 mm, and the diameter of the auxiliary pad 3 is 0.8 mm. Usually, the diameter of the through hole 31 plus 0.2 mm is the diameter of the auxiliary pad 3. The diameter of the auxiliary pad 3 depends on the diameter of the through hole 31, and the diameter of the through hole 31 can be designed according to actual needs.

Preferably, referring to FIG. 1 , the main pad 2 further includes an annular solder resist layer 22, the solder resist layer 22 surrounds the side wall of the main pad 2, and the solder resist layer 22 coincides with the center of the signal via 21. The distance between the center of each auxiliary pad 3 and the center of the main pad 2 is L, L=R+r+X, where R is the radius of the main pad 2, r is the radius of the through hole 31, and X is the width of the solder resist layer 22. The setting of the assembly welding part can play a role in thermal isolation, which not only reduces the heat dissipation speed but also meets the overcurrent capacity design requirements, so that the pad structure 1 is balanced.

Another aspect of the present application provides a packaged PCB board, which includes the above-mentioned pad structure 1.

Since the packaged PCB board of the present application includes the above-mentioned pad structure 1, the packaged PCB board of the present application must also have all the beneficial effects of the above-mentioned pad structure 1, which will not be repeated here.

In the present invention, unless otherwise clearly specified and limited, the terms "disposed (provided with)", "connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

In the description of this specification, the description of reference terms such as "some embodiments" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention. Therefore, any changes or modifications made according to the claims and description of the present invention should fall within the scope of the present invention.

Claims (10)

1. A pad structure, comprising: A main pad, wherein a signal via is provided on the main pad; A plurality of auxiliary pads are arranged at intervals, each of which is provided with a through hole; the auxiliary pads are arranged around the main pad, and each of the auxiliary pads is connected to the side wall of the main pad; The sum of the areas of the signal via and the through hole is A, the sum of the areas of the main pad and the auxiliary pad is B, and A/B≧0.75. 2 . The pad structure according to claim 1 , wherein the centers of the through holes are arranged in a circle with the center of the signal via as the center. 3 . The pad structure according to claim 2 , wherein the signal via and the through hole are both round holes. 4 . The pad structure according to claim 1 , wherein each of the auxiliary pads has the same size and shape. 5 . The pad structure according to claim 1 , wherein the intervals between any two adjacent auxiliary pads are uniform and equal. 6 . The pad structure according to claim 1 , wherein a diameter of the signal via hole is larger than a diameter of the through hole, and the diameter of the through hole is 0.4 mm. 7. The pad structure according to any one of claims 1 to 6, characterized in that, along the orthographic projection direction, the main pad and the auxiliary pad are both circular pads; The distance between the center of each auxiliary pad and the center of the main pad is L, where L≦R+r, R is the radius of the main pad, and r is the radius of the auxiliary pad. 8 . The pad structure according to claim 7 , wherein a diameter of the through hole is 1/2 of a diameter of the corresponding auxiliary pad. 9. The pad structure according to claim 1, characterized in that the main pad further comprises a ring-shaped solder resist layer; the solder resist layer surrounds the side wall of the main pad, and the solder resist layer coincides with the center of the signal via; The distance between the center of each auxiliary pad and the center of the main pad is L, L=R+r+X, where R is the radius of the main pad, r is the radius of the through hole, and X is the width of the solder resist layer. 10. A packaged PCB board, characterized in that the packaged PCB board comprises the pad structure according to any one of claims 1 to 9.