CN221304625U - Automatic wafer carrying device - Google Patents

Abstract

The utility model discloses an automatic wafer carrying device which comprises a lifting mechanism, a plurality of arms, a wrist arm and a vacuum adsorption claw, wherein the vacuum adsorption claw is fixed at the front end of the wrist arm, a laser sensor for ranging is also fixed at the upper end of the rear end of the wrist arm, and the laser sensor guides the vacuum adsorption claw to the wafer box for taking and placing wafers after automatically ranging the wafer box. According to the utility model, the laser sensor and the controller thereof are used for automatically measuring the distance of the wafer in the wafer box, and then the vacuum adsorption claw is guided to the wafer box to take and put the wafer, so that the automatic carrying work of the wafer is realized, and the frequent setting and calibration of the position parameters are not needed, so that the carrying work of the wafer in the wafer boxes with different sizes is convenient, and the carrying efficiency of the wafer is greatly improved.

Description

Automatic wafer carrying device

Technical Field

The utility model relates to the field of conveying devices, in particular to an automatic wafer conveying device.

Background

In the semiconductor wafer test process, in order to realize a large-scale automatic test operation, it is generally necessary to carry a semiconductor wafer by a robot carrying device. The existing manipulator carrying device generally adopts a preset position to carry out carrying work on a wafer, and the method can realize carrying of the wafer, but has lower efficiency in the actual testing process. When wafer chips are replaced or wafers of different sizes are replaced, the wafer cassettes used are also different in size, and therefore, the positional parameters of the handling and calibration work are required to be continuously modified.

Disclosure of utility model

The utility model provides a wafer conveying device capable of automatically measuring distance and conveying.

The technical scheme adopted for solving the technical problems is as follows:

The utility model provides an automatic handling device of wafer, includes elevating system, a plurality of arm, cantilever and vacuum absorption claw hand, the vacuum absorption claw hand is fixed the cantilever front end, the upper end of cantilever rear end still is fixed with the laser sensor that is used for the range finding, after the laser sensor is to the automatic range finding of wafer box, guide the vacuum absorption claw hand extremely get in the wafer box and put the wafer.

Further, the laser sensor is controlled and adjusted through a sensor controller, the sensor controller is clamped and fixed at the upper end of the wrist arm through a clamp, a clamp positioning groove for conveniently installing the clamp is formed in the upper end of the wrist arm, and the clamp is fixed in the clamp positioning groove through a fastener.

Further, the front end of the vacuum adsorption claw is a C-shaped claw, the surface of the C-shaped claw is flat, a vacuum port and a C-shaped vacuum groove are formed in the upper surface of the C-shaped claw, and the vacuum port is communicated with the C-shaped vacuum groove; the front end chamfer design of C shape claw hand forms buffer part, buffer part is along the upper end of C shape claw hand to its front end presents the chamfer.

Further, the upper end of the front part of the wrist arm is also provided with a vacuum connector, the outside of the vacuum connector is communicated with a vacuum generator through a pipeline, the inside of the vacuum connector is communicated with the vacuum port on the C-shaped claw hand through a vacuum pipeline, and the vacuum pipeline is arranged in the vacuum adsorption claw hand and the wrist arm.

Further, the upper end of the wrist arm is formed by installing a cover plate, the cover plate covers the sensor controller, and a window opening convenient for checking parameters and states of the sensor controller is formed in the upper end of the cover plate.

Preferably, the cover plate is designed along the shape of the wrist and is integrally formed with the wrist after being assembled.

The beneficial effects of the utility model are as follows:

according to the utility model, the laser sensor and the controller thereof are used for automatically measuring the distance of the wafer in the wafer box, and then the vacuum adsorption claw is guided to the wafer box to take and put the wafer, so that the automatic carrying work of the wafer is realized, and the frequent setting and calibration of the position parameters are not needed, so that the carrying work of the wafer in the wafer boxes with different sizes is convenient, and the carrying efficiency of the wafer is greatly improved.

Drawings

FIG. 1 is a block diagram of the present utility model;

Fig. 2 is an enlarged view of a portion a in fig. 1;

FIG. 3 is an exploded view of a portion of the structure of FIG. 1;

Marked in the figure as:

11. lifting structure, 12, first arm, 13, second arm, 14, wrist arm, 141, clamp positioning groove, 15, vacuum adsorption claw, 21, laser sensor, 22, sensor controller, 23, clamp, 3, cover plate, 301, view window, 4, vacuum joint, 151, C-shaped claw, 152, vacuum port, 153, vacuum groove, 154 and buffer part.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1 to 3, the present utility model provides an automatic wafer handling device, which includes a lifting mechanism 11, a first arm 12, a second arm 13, a wrist arm 14, and a vacuum chuck jaw 15. The lifting mechanism drives the first arm, the second arm, the wrist arm and the vacuum adsorption claw (actuator) to move up and down, and the lifting mechanism 11, the first arm 12, the second arm 13 and the wrist arm 14 form a three-axis driving device to drive the vacuum adsorption claw 15 to carry out wafer conveying work.

Further, as shown in fig. 1, a vacuum suction claw 15 is fixed to the front end of the arm 14, and a laser sensor 21 is fixed to the upper surface of the rear end of the arm. According to the automatic wafer conveying device, distance measurement is firstly carried out on a wafer box through the laser sensor 21, the distance between wafers in the wafer box is measured, the distance position is recorded, and then the vacuum adsorption claw at the front end of the wrist arm is driven to carry out picking and placing actions on the wafers in the wafer box.

The specific workflow of the manipulator device is as follows:

1. The laser sensor behind the arm is driven by the manipulator device to align with the wafer box, the wafer in the wafer box is subjected to laser ranging detection by moving from a low point to a high point (or moving from a high point to a low point), and then the accurate position of the wafer and the accuracy of the verification position are measured and calculated by comparing preset data with signals actually fed back by the laser sensor.

2. The manipulator device drives the arm and the wrist arm according to the wafer position just calculated, moves the vacuum adsorption claw hand to the lower part of the wafer, and opens the vacuum generating device. And then driving the vacuum adsorption claw to lift a certain distance, and supporting and adsorbing and fixing the wafer.

3. The manipulator device moves the arm to withdraw, and the wafer is vacuum adsorbed, grabbed and taken out from the wafer box.

As shown in fig. 3, in the present utility model, the laser sensor 21 performs control and adjustment operations by the sensor controller 22. For this purpose, the sensor controller 22 is clamped and fixed to the upper end of the wrist arm 14 by the clamp 23, the upper end of the wrist arm 14 is provided with a clamp positioning groove 141 for conveniently installing the clamp 23, and the clamp 23 is installed and fixed in the clamp positioning groove 141 by a fastener such as a screw.

Further, the upper end of the cantilever 14 is formed by installing the cover plate 3, and the shape of the cover plate 3 is designed along the shape of the cantilever 14, so that the cover plate 3 is conveniently integrated with the cantilever 14, and the cover plate 3 is also provided with a window 301 for conveniently checking the parameters and the states of the sensor controller 22.

As shown in fig. 1 and 2, in the present utility model, the front end of the vacuum adsorption claw 15 adopts a C-shaped claw 151 with a C-shaped opening, the upper surface of the C-shaped claw 151 is flat, and a vacuum opening 152 and a vacuum groove 153 are formed, the vacuum opening 152 is communicated with the vacuum groove 153, and the vacuum groove 153 is slotted along the C-shaped claw to form a C-shaped vacuum groove. Further, the vacuum port 152 is provided at a rear intermediate position of the vacuum tank 153.

As shown in fig. 2, the front end of the C-shaped claw 151 is further provided with a buffer portion 154, and the buffer portion 154 adopts a chamfer design, and is chamfered along the upper end of the C-shaped claw to the front end thereof, so that a certain buffer effect is provided when the C-shaped claw is inserted into the wafer box to grasp a wafer, and the C-shaped claw is prevented from colliding with the wafer, thereby damaging the wafer.

As shown in fig. 2 and 3, the upper end of the wrist arm 14 is also provided with a vacuum connector 4, and the vacuum connector 4 is communicated with a vacuum generating device through a pipeline. Because the vacuum connector 4 is fixed on the cantilever 14, in order to communicate the vacuum port 152 at the front end of the vacuum adsorption claw hand at the front end of the cantilever, a vacuum pipeline is further arranged between the vacuum adsorption claw hand 15 and the cantilever 14 for communication, so that the vacuum generating device can conveniently sequentially pass through the pipeline, the vacuum connector, the vacuum pipeline and the vacuum port, and vacuum is formed in the vacuum groove 153 at the upper end of the C-shaped claw hand to perform vacuum adsorption grabbing on the lower end of the wafer.

While the foregoing is directed to embodiments of the present utility model, other and further details of the utility model may be had by the present utility model, it should be understood that the foregoing description is merely illustrative of the present utility model and that no limitations are intended to the scope of the utility model, except insofar as modifications, equivalents, improvements or modifications are within the spirit and principles of the utility model.

Claims (6)

1. The utility model provides an automatic handling device of wafer, includes elevating system, a plurality of arms, wrist arm and vacuum adsorption claw hand, its characterized in that: the vacuum adsorption claw is fixed at the front end of the cantilever, the upper end of the rear end of the cantilever is also fixed with a laser sensor for ranging, and the laser sensor guides the vacuum adsorption claw to the wafer box for taking and placing wafers after automatically ranging the wafer box.

2. An automatic wafer handling device according to claim 1, wherein: the laser sensor is controlled and adjusted through a sensor controller, the sensor controller is clamped and fixed at the upper end of the wrist arm through a clamp, a clamp locating groove convenient for installing the clamp is formed in the upper end of the wrist arm, and the clamp is fixed in the clamp locating groove through a fastener.

3. An automatic wafer handling device according to claim 2, wherein: the front end of the vacuum adsorption claw is a C-shaped claw, the surface of the C-shaped claw is flat, a vacuum port and a C-shaped vacuum groove are formed in the upper surface of the C-shaped claw, and the vacuum port is communicated with the C-shaped vacuum groove; the front end chamfer design of C shape claw hand forms buffer part, buffer part is the chamfer face along the upper end of C shape claw hand to its front end.

4. An automatic wafer handling device according to claim 3, wherein: the upper front end of the wrist arm is also provided with a vacuum connector, the outside of the vacuum connector is communicated with a vacuum generator through a pipeline, the inside of the vacuum connector is communicated with the vacuum port on the C-shaped claw hand through a vacuum pipeline, and the vacuum pipeline is arranged in the vacuum adsorption claw hand and the wrist arm.

5. An automatic wafer handling device according to any one of claims 2 to 4, wherein: the upper end of the wrist arm is formed by installing a cover plate, the cover plate covers the sensor controller, and a window convenient for checking parameters and states of the sensor controller is formed in the upper end of the cover plate.

6. An automatic wafer handling device according to claim 5, wherein: the shape of the cover plate is designed along the shape of the wrist arm, and is integrally formed after being assembled with the wrist arm.