CN221263778U - Packaging structure of filter and filter - Google Patents

Abstract

The utility model relates to a filter packaging structure and a filter, wherein the filter packaging structure comprises a filter chip, a packaging substrate for packaging the filter chip and conductive bumps, the filter chip comprises a first surface metal layer, the first surface metal layer corresponds to a radiating area, the conductive bumps comprise connecting bumps and a preset number of suspension bumps, the connecting bumps are used for realizing the electric connection between an internal circuit of the filter chip and the packaging substrate, and the suspension bumps are in suspension state and cannot enable the internal circuit of the filter chip to be connected with the outside. Because the setting of unsettled bump, unsettled bump itself does not have the function of electricity connection, consequently can set up in any region, can not influence the normal work of filter chip, simultaneously, be convenient for derive heat, improve the radiating effect of chip.

Description

Packaging structure of filter and filter

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a packaging structure of a filter and the filter.

Background

The filter is used as a power device and is mainly applied to the front end of radio frequency communication transceiver to inhibit out-of-band interference spurious signals and allow useful signals to pass through, and the type of the filter comprises a bulk acoustic wave filter, a surface acoustic wave filter and the like. At present, the SAW filter is mainly divided into SAW (Surface Acoustics Wave, surface acoustic wave filter) and BAW (Bulk Acoustics Wave, bulk acoustic wave filter), and the SAW filter is low in cost, applicable to low frequency bands, good in insertion loss low inhibition and temperature-sensitive; BAW behaves better than SAW at high frequencies, has a high Q, decreases in size with increasing frequency, and has low temperature sensitivity, but is more expensive, including both FBAR (Film bulk acoustic resonator, thin film bulk acoustic resonator) and SMR (solid state assembled resonator) structures.

The filter can produce a large amount of heat at the during operation, if the heat can't effectively derive, can lead to the filter to become invalid, especially SAW filter at present stage, because SAW filter operating frequency's improvement and device integrated level's improvement cause the radiating effect not good to restrict the filter performance. While the filter device generates a lot of heat during operation, if the heat cannot be effectively conducted out, the temperature rise greatly affects the performance of the filter.

In the prior art, the heat dissipation effect cannot meet the heat dissipation requirement of the product, which is gradually improved, due to the fact that the area of the metal foil in the through hole is limited and the problem that the through hole is necessarily arranged at a welding connection point.

Disclosure of utility model

In order to solve the above-mentioned prior art problems, the present utility model provides a packaging structure of a filter and the filter, so that the heat dissipation effect of the filter is improved.

According to a first aspect of the present application, there is provided in an embodiment a filter package structure including: the filter chip comprises a first surface metal layer, wherein the first surface metal layer corresponds to the radiating area; the packaging substrate is used for packaging the filter chip; the conductive bumps comprise connecting bumps and a preset number of suspension bumps, the connecting bumps are used for realizing the electric connection between the internal circuit of the filter chip and the packaging substrate, and the suspension bumps are in suspension states and cannot enable the internal circuit of the filter chip to be connected with the outside.

Optionally, the suspension bump is disposed on the first surface metal layer.

Optionally, the filter chip further includes a second surface metal layer, the second surface metal layer is a heat dissipation radiation area, the surface area of the second surface metal layer is larger than the surface area of the first surface metal layer, and the suspended bump is disposed on the second surface metal layer.

Optionally, the filter chip includes a dedicated connection layer, and the suspension bump is connected to the dedicated connection layer.

Optionally, the filter chip further includes a ground layer and a vertical interconnection layer, and the suspended bump is connected to the ground layer through the vertical interconnection layer.

Optionally, the dedicated connection layer is connected to the ground layer.

Optionally, the material of the suspension bump is a heat conductive metal.

Alternatively, the filter chip is a SAW chip or a BAW chip.

Optionally, the number of the suspension bumps is one, two or more than two.

According to a second aspect of the present application, there is provided in one embodiment a filter comprising the filter package structure of any one of the above.

According to the filter packaging structure and the filter of the embodiment, the filter packaging structure comprises a filter chip, a packaging substrate and conductive bumps, wherein the packaging substrate is used for packaging the filter chip, the conductive bumps are used for enabling the filter chip to be in a suspended state, the filter chip comprises a first surface metal layer, the first surface metal layer corresponds to a radiating area, the conductive bumps comprise connecting bumps and a preset number of suspended bumps, the connecting bumps are used for enabling an internal circuit of the filter chip to be electrically connected with the packaging substrate, and the suspended bumps are not capable of enabling the internal circuit of the filter chip to be connected with the outside. Because the setting of unsettled bump, unsettled bump itself does not have the function of electricity connection, consequently can set up in any region, can not influence the normal work of filter chip, simultaneously, be convenient for derive heat, improve the radiating effect of chip.

Drawings

Fig. 1 is a layout area of a metal pad of a SAW filter chip of the prior art;

FIG. 2 is a schematic cross-sectional view of a SAW filter chip of the prior art;

FIG. 3 is a schematic diagram illustrating a suspension bump disposed in a heat dissipation and radiation area according to an embodiment of the present utility model;

FIG. 4 is a schematic cross-sectional view of a heat dissipation radiation area with suspension bumps according to an embodiment of the utility model

FIG. 5 is a schematic cross-sectional view of a heat dissipation radiation area with suspension bumps according to another embodiment of the present utility model;

FIG. 6 is a schematic cross-sectional view illustrating a suspension bump disposed in a heat dissipation and radiation area according to another embodiment of the present utility model;

FIG. 7 is a schematic cross-sectional view illustrating a suspension bump disposed in a heat dissipation and radiation area according to another embodiment of the present utility model;

FIG. 8 is a graph of simulated heat dissipation effects for a SAW filter in the prior art, simulated heat distribution in a 55 degrees Celsius environment;

fig. 9 is a graph showing the heat dissipation simulation effect of the heat distribution simulation of the SAW filter in the present embodiment in the environment of 55 degrees celsius.

Reference numerals: a 100-filter chip; 101-a first surface metal layer; 102-a second surface metal layer; 110-a dedicated connection layer; 120-vertical interconnect layers; 200-packaging a substrate; 300-connecting the convex points; 400-suspending convex points.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Chip BUMP (BUMPing, BUMP or BUMP) is a connection point or pin technique that connects metal on the chip to the inside of the package. The BUMP process is accomplished by physically BUMP connections, which are made of metal or other materials. When the chip is manufactured, the BUMP technology can improve the connection efficiency of the chip and reduce the volume and weight of the chip.

The chip PAD is a connection point or pin of the chip for connection to an external circuit. PAD is a physical structure of a chip and can be made of metal, silicon or ceramic. In chip design, PAD structure and layout need to be selected according to the requirements of the circuit and the requirements of signal transmission. Such as PAD, bump connections on the chip can be directly soldered to the circuit board inside the package for better electrical performance and higher integration.

As known from the background art, the current filter, especially SAW filter, has high integration of devices due to the increase of the working frequency, and the filter device generates a lot of heat during the working process, if the heat cannot be effectively led out, the temperature rise will also greatly affect the performance of the filter, so that the heat dissipation effect becomes one of the key factors restricting the performance of the filter.

Referring to fig. 1 and fig. 2, a layout design of a SAW filter chip in the prior art is shown, in which a first metal layer 101 is a set area of a metal PAD, and particularly, when the SAW filter works at high power, a large amount of heat is generated, if the heat cannot be effectively led out, the resonator finger is damaged, and the filter is disabled; however, SAW filters cannot add BUMP to the high heat transfer path of the filter due to size and limited effective operating area, and conduct heat directly off-chip in a heat conduction manner, thus requiring an additional heat dissipation design. However, in the prior art, heat dissipation is often performed through the welded through hole part, but the heat dissipation effect is limited by the area of the metal foil in the through hole and the problem that the through hole must be arranged at the welding connection point, so that the heat dissipation effect cannot meet the heat dissipation requirement of the product which is gradually improved.

In this embodiment, a BUMP 400 (BUMP) is designed, and the BUMP 400 is in a suspended state, so that the internal circuit of the filter chip 100 cannot be connected to the outside. The suspending bump 400 does not have an electric connection function, so that the suspending bump can be arranged in any area, normal operation of the filter chip 100 is not affected, heat can be better conducted out due to the suspending bump 400, and the heat dissipation effect of the chip is improved.

Referring to fig. 3 and 4, in the present embodiment, a filter package structure is provided, which includes a filter chip 100, a package substrate 200 for packaging the filter chip 100, and conductive bumps.

In this embodiment, the filter chip 100 may be a SAW (Surface Acoustics Wave, SAW filter) chip or a BAW (Bulk Acoustics Wave, bulk acoustic wave filter) chip. It is known that the filter chip 100 includes an internal circuit with various preset functions, and the filter chip 100 has a front surface and a back surface opposite to the front surface, and the front surface has a first surface metal layer 101, where the first surface metal layer 101 may correspond to a heat dissipation radiation area, and the heat dissipation radiation area may be understood as an area with high heat generation and needs heat dissipation.

The conductive BUMPs include a connection BUMP 300 and a predetermined number of suspension BUMPs 400, and the connection BUMP 300 can electrically connect the internal circuit of the filter chip 100 with the package substrate 200, that is, the connection BUMP 300 can be understood as a BUMP connecting the chip and the package substrate 200. The suspension bump 400 is suspended (as shown in fig. 4), and the internal circuit of the filter chip 100 cannot be connected to the outside. The suspension BUMP 400 can be understood as a heat dissipation function BUMP provided specifically for heat dissipation, which does not affect the circuit connection inside the chip. Since the suspended BUMP itself does not have an electrical connection function, it can be disposed in many areas that cannot be disposed in the prior art because it affects the SAW or BAW normal operation area.

It is understood that the shape of the suspended BUMP may be the same as the shape and structure of the connection BUMP 300, except that the chip internal circuit is not electrically connected to the package substrate 200 outside the chip.

In this embodiment, the material of the suspended bump 400 is a heat conductive metal. For example, in some embodiments, the material of the suspended bump 400 may be aluminum, titanium, or copper.

In some embodiments, since the first surface metal layer 101 corresponds to a heat radiation area with higher heat generation and needs to radiate heat, the suspended bump 400 is disposed on the first surface metal layer 101, that is, the suspended bump 400 is disposed on a heat radiation area with larger heat radiation area, so as to satisfy the heat radiation requirement of the heat radiation area with larger heat radiation area.

It is understood that the number of the suspension bumps 400 may be one, two or more. The number and positions of the suspension bumps 400 may be changed according to actual needs, for example, in a region with a large heat radiation, i.e. a region with a high heat dissipation requirement, a larger number of suspension bumps 400 may be disposed, and in order to save cost, in a region with a low heat dissipation requirement, a smaller number of suspension bumps 400 may not be disposed or disposed. The suspended bump 400 is not limited by the metal area of the through hole, and is not required to be arranged on the welding connection point, so that the problem that the suspended bump 400 cannot be arranged in the area due to the influence on the normal operation of the chip in the prior art is solved.

Referring to fig. 5, in some embodiments, the filter chip 100 further includes a second surface metal layer 102, the second surface metal layer 102 is a heat dissipation radiation area, the surface area of the second surface metal layer 102 is larger than the surface area of the first surface metal layer 101, and the suspension bump 400 is disposed on the second surface metal layer 102. The suspended bump 400 is matched with the design of the second surface metal layer 102 with larger area, so that a better heat dissipation effect can be realized.

Referring to fig. 6, in some embodiments, the filter chip 100 includes a dedicated connection layer 110, and the suspension bump 400 is connected to the dedicated connection layer 110. The dedicated connection layer 110 may be understood as a heat conducting layer that does not form an effective electrical connection with other electrical connection layers in the chip, and may be a connection layer specially configured to achieve heat dissipation, so that the heat dissipation performance of the chip is better. Further, the cooperation between the suspension bump 400 and the dedicated connection layer 110 can expand the setting positions and the number of the suspension bumps 400, thereby better realizing the heat dissipation effect of the chip.

Referring to fig. 7, in some embodiments, the filter chip 100 further includes a ground layer and a vertical interconnect layer 120, and the suspension bump 400 is connected to the ground layer through the vertical interconnect layer 120. The vertical interconnect 120 can lead the suspended bump 400 to the ground layer to conduct heat to the other side of the chip, i.e., to the side away from the package substrate 200, so that the filter package achieves better heat dissipation.

In some embodiments, when the dedicated connection layer 110 is disposed, the dedicated connection layer 110 may be connected to the ground layer, for example, in fig. 7, the dedicated connection layer 110 is connected to the ground layer by using the vertical interconnection layer 120, so that heat is conducted to a side far from the package substrate 200, so that the filter package achieves a better heat dissipation effect.

In this embodiment, the suspension BUMP 400 (BUMP) is designed in the chip packaging process, and the suspension BUMP 400 is in a suspension state, so that the internal circuit of the filter chip 100 cannot be connected with the outside. The suspending bump 400 does not have an electric connection function, so that the suspending bump can be arranged in any area, normal operation of the filter chip 100 is not affected, heat can be better conducted out due to the suspending bump 400, and the heat dissipation effect of the chip is improved.

A filter, such as SAW or BAW, is also provided in this embodiment. The filter includes the filter package structure as described in any of the embodiments above. Since the filter includes the filter chip 100, the package substrate 200 for packaging the filter chip 100, and the conductive bump, the filter chip 100 includes the first surface metal layer 101, the first surface metal layer 101 corresponds to the heat dissipation radiation area, the conductive bump includes the connection bump 300 and a preset number of suspension bumps 400, the connection bump 300 is used for realizing the electrical connection between the internal circuit of the filter chip 100 and the package substrate 200, and the suspension bump 400 is in a suspension state, so that the internal circuit of the filter chip 100 cannot be connected with the outside. Because the suspending convex point 400 is arranged, the suspending convex point 400 does not have the function of electric connection, so that the suspending convex point 400 can be arranged in any area, the normal operation of the filter chip 100 can not be influenced, meanwhile, the heat is conveniently led out, and the heat dissipation effect of the chip is improved.

As shown in fig. 8 and 9, which are graphs of heat dissipation simulation effects of the heat distribution simulation of the SAW filter in the 55 ℃ environment in the prior art, fig. 9 is a graph of heat dissipation simulation effects of the heat distribution simulation of the SAW filter in the 55 ℃ environment in the scheme of the embodiment, comparing it is obvious that the highest temperature of the SAW filter is reduced from 96.9 to 81.5, and the red high temperature area is obviously reduced.

In describing embodiments of the present utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "center", "top", "bottom", "inner", "outer", "inside", "outside", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Wherein "inside" refers to an interior or enclosed area or space. "peripheral" refers to the area surrounding a particular component or region.

In the description of embodiments of the present utility model, the terms "first," "second," "third," "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", "a third" and a fourth "may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing embodiments of the present utility model, it should be noted that the terms "mounted," "connected," and "assembled" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, unless otherwise specifically indicated and defined; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the description of embodiments of the utility model, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

In the description of the embodiments of the present utility model, it is to be understood that "-" and "-" denote the same ranges of the two values, and the ranges include the endpoints. For example, "A-B" means a range greater than or equal to A and less than or equal to B. "A-B" means a range of greater than or equal to A and less than or equal to B.

In the description of embodiments of the present utility model, the term "and/or" is merely an association relationship describing an association object, meaning that three relationships may exist, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. A package structure of a filter, comprising: the filter comprises a filter chip, a packaging substrate and conductive bumps, wherein the packaging substrate is used for packaging the filter chip;

The filter chip comprises a first surface metal layer, and the first surface metal layer corresponds to the radiating area;

The conductive bumps comprise connecting bumps and a preset number of suspension bumps, the connecting bumps are used for realizing the electric connection between the internal circuit of the filter chip and the packaging substrate, and the suspension bumps are in suspension state and cannot enable the internal circuit of the filter chip to be connected with the outside.

2. The filter package structure according to claim 1, wherein: the suspension salient points are arranged on the first surface metal layer.

3. The filter package structure according to claim 1, wherein: the filter chip further comprises a second surface metal layer, the second surface metal layer is a heat radiation area, the surface area of the second surface metal layer is larger than that of the first surface metal layer, and the suspension salient points are arranged on the second surface metal layer.

4. The filter package structure according to claim 1, wherein: the filter chip comprises an exclusive connecting layer, and the suspension protruding points are connected with the exclusive connecting layer.

5. The filter package structure according to claim 4, wherein: the filter chip also comprises a grounding layer and a vertical interconnection layer, and the suspension convex points are connected with the grounding layer through the vertical interconnection layer.

6. The filter package structure according to claim 5, wherein: the exclusive connection layer is connected with the grounding layer.

7. The filter package structure according to claim 1, wherein: the material of the suspension convex points is heat conduction metal.

8. The filter package structure according to claim 1, wherein: the filter chip is a SAW chip or a BAW chip.

9. The filter package structure according to claim 1, wherein: the number of the suspension convex points is one, two or more than two.

10. A filter, characterized by: packaging structure comprising a filter according to any of claims 1-9.