CN221231778U - ROSA hot-press welding device - Google Patents

Abstract

The utility model relates to the technical field of module hot-press welding, and particularly discloses a ROSA hot-press welding device which comprises a loading main body for hot-press welding, a welding module arranged on the loading main body and a hot-press welding assembly arranged on the loading main body; the loading main body comprises a base, one side of the top of the base is provided with a positioning protrusion, and the positioning protrusion is matched with the welding module; the welding module comprises a PCB and a diode, wherein the pin of the diode is matched with the welding spot of the PCB; according to the utility model, through the improved design of the pressing plate, the pressure applied in the welding process is ensured to be uniform, and the contact performance with a welding area is improved, so that the welding quality and consistency are improved, and the use of the pressing plate can damage an oxide layer in the fine adjustment process, so that the interference of the oxide layer on tin materials is avoided in the damage mode, tin hanging is easier, and the use requirement is met.

Description

ROSA hot-press welding device

Technical Field

The utility model relates to the technical field of module hot-press welding, in particular to a ROSA hot-press welding device.

Background

ROSA thermocompression bonding is a microelectronic packaging technique used to attach chips and substrates together. It combines hot pressing and optical alignment methods.

In the ROSA thermocompression bonding process, first the chip and the substrate are pre-coated with a solder paste. They are then placed on a hot heated table and the solder paste is melted by heating. The chip and the substrate are pressed together by the melted solder paste.

When the pressfitting, sometimes the in-process of heating, welded tin material appears melting, and the oxidation layer appears because of the time of heating between welded solder joint and the pin this moment, and tin coating is inhomogeneous probably appears to appear welding insecure problem, based on this, need improve it.

Disclosure of utility model

Aiming at the defects of the prior art, the utility model provides a ROSA hot-press welding device which is used for solving the problems proposed by the background art.

The ROSA hot-press welding device comprises a loading main body for hot-press welding, a welding module arranged on the loading main body, and a hot-press welding assembly arranged on the loading main body;

The loading main body comprises a base, one side of the top of the base is provided with a positioning protrusion, and the positioning protrusion is matched with the welding module;

The welding module comprises a PCB and a diode, wherein the pin of the diode is matched with the welding spot of the PCB;

the hot-press welding assembly comprises a pressing plate, wherein a limiting cover is arranged on one side of the bottom of the pressing plate and is matched with the outer side of the diode, and a telescopic assembly is arranged on the other side of the pressing plate and used for realizing hot-press welding;

and the pressing plate is provided with a hot-pressing assembly at the position corresponding to the welding point of the pin and the PCB, and is used for hot-pressing welding the welding point and the pin.

As a further improvement of the utility model, the top of one side of the base is also provided with a mounting area which is adapted to the thermocompression bonding assembly.

As a further improvement of the utility model, two symmetrically arranged convex points are arranged at the top of the positioning bulge, and the convex points are matched with the holes of the PCB.

As a further improvement of the utility model, an inserting block is arranged at one side of the pressing plate at the installation area, and a vertical clamping groove for the pressing plate to reciprocate is arranged at the top of the inserting block and used for keeping the pressing plate stably pressed down.

As a further improvement of the utility model, the hot pressing assembly comprises a clamping frame and a bottom frame arranged below the clamping frame, and the bottom frame is matched with the clamping frame through a sealing groove and a sealing bulge.

As a further improvement of the utility model, the bottom plate is arranged on the inner side of the bottom frame, and the opposite corners of the frame of the bottom frame are provided with the abutting pieces for supporting the bottom plate.

As a further improvement of the utility model, two symmetrically arranged mounting holes are arranged at the top of the clamping frame, and a control assembly for controlling the bottom plate to move left and right is arranged at the inner side of the mounting holes and used for assisting the formation of welding spots of hot press welding.

As a further improvement of the utility model, the pressing plate comprises a plate body, wherein soft strips are arranged on two sides of the plate body, and the soft strips are matched with the inner side of the bottom frame and used for assisting in fixing the pressing plate.

As a further improvement of the utility model, the two ends of the plate body, which are positioned on the soft strip, are respectively provided with a collision groove, and the collision grooves are matched with the collision pieces.

As a further improvement of the utility model, the inner side of the plate body is hollow, and the hollow part of the pressing plate is provided with a heating component for assisting the pressing plate to process welding spots.

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, through the improved design of the pressing plate, the pressure applied in the welding process is ensured to be uniform, and the contact performance with a welding area is improved, so that the welding quality and consistency are improved, and the use of the pressing plate can damage an oxide layer in the fine adjustment process, so that the interference of the oxide layer on tin materials is avoided in the damage mode, tin hanging is easier, and the use requirement is met.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

FIG. 1 is a schematic perspective view of a combination of a loading body and a welding module according to the present utility model;

FIG. 2 is a schematic view of the combined structure of the loading body, the welding module and the thermocompression bonding assembly of the present utility model;

FIG. 3 is a schematic top view of a combination of a loading body and a welding module according to the present utility model;

FIG. 4 is a schematic perspective view of a hot press assembly according to the present utility model;

FIG. 5 is a schematic top view of a hot press assembly according to the present utility model;

FIG. 6 is a schematic view of the cross-sectional structure A-A of FIG. 5 according to the present utility model;

FIG. 7 is a schematic view showing the bottom structure of the hot press unit according to the present utility model;

FIG. 8 is a schematic view of a bottom plate in a three-dimensional structure according to the present utility model;

FIG. 9 is a schematic top view of the base plate of the present utility model;

FIG. 10 is a schematic view of the structure A-A of FIG. 9 according to the present utility model.

In the figure: 1. a loading body; 2. a welding module; 3. hot-press welding the assembly;

11. a base; 12. positioning the bulge; 13. a mounting area;

21. A diode; 22. a PCB board;

31. a pressing plate; 32. a limiting cover; 33. a plug block; 34. a telescoping assembly; 35. a hot pressing assembly;

351. a clamping frame; 352. a mounting hole; 353. a bottom plate; 354. a sealing protrusion; 355. a bottom frame; 356. sealing grooves; 357. a contact member;

3531. A plate body; 3532. a collision groove; 3533. a soft strip; 3534. and a heating assembly.

Detailed Description

Various embodiments of the present utility model are disclosed in the following drawings, which are presented in sufficient detail to provide a thorough understanding of the present utility model. However, it should be understood that these physical details should not be used to limit the utility model. That is, in some embodiments of the present utility model, these physical details are not necessary. Moreover, for the sake of simplicity of illustration, some well-known and conventional structures and components are shown in the drawings in a simplified schematic manner.

In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

Referring to fig. 1 to 10, during the press-fit, sometimes the solder material to be welded melts during the heating process, and at this time, an oxide layer is formed between the soldered spot and the pin due to the heating time, so that uneven tin coating may occur, and thus, the problem of unstable welding occurs;

The loading main body 1 comprises a base 11, a positioning protrusion 12 is arranged on one side of the top of the base 11, and the positioning protrusion 12 is matched with the welding module 2;

the welding module 2 comprises a PCB 22 and a diode 21, wherein the pin of the diode 21 is matched with the welding spot of the PCB 22;

The hot press welding assembly 3 comprises a pressing plate 31, wherein a limiting cover 32 is arranged on one side of the bottom of the pressing plate 31, the limiting cover 32 is matched with the outer side of the diode 21, and a telescopic assembly 34 is arranged on the other side of the pressing plate 31 and used for realizing hot press welding;

The pressing plate 31 is provided with a hot pressing assembly 35 at the position corresponding to the welding point of the pin and the PCB, and is used for hot pressing welding the welding point and the pin.

The base 11 of the loading body 1 has a stable structure, and a positioning protrusion 12 is provided at a top side. This positioning projection 12 is designed to ensure that the welding module 2 is accurately aligned and fixed in the welding position. The soldering module 2 comprises a PCB board 22 and a diode 21, the pins of the diode 21 being adapted to the soldering points of the PCB board 22 to ensure a good electrical connection.

The thermocompression bonding assembly 3 is a core part of the apparatus, and includes a platen 31 and a thermocompression bonding assembly 35. The bottom side of the press plate 31 is provided with a limit cap 32, which limit cap 32 is adapted to the outside of the diode 21 to ensure that the pins of the diode 21 are correctly aligned on the solder joints. The other side of the pressing plate 31 is provided with a telescopic component 34, and the hot press welding process can be realized through the adjustment of the telescopic component 34.

A thermo-compression assembly 35 is provided at the location of the pins of the platen 31 corresponding to the PCB pads and provides the necessary heat and pressure to melt and bond the solder surfaces between the pads and pins. Such a hot press assembly 35 may employ structures such as heating elements and pressure control mechanisms to ensure accurate control of temperature and pressure during welding.

The base 11 of the loading body 1 has a stable structure, and a positioning protrusion 12 is provided at a top side. This positioning projection 12 is designed to ensure that the welding module 2 is accurately aligned and fixed in the welding position. The soldering module 2 comprises a PCB board 22 and a diode 21, the pins of the diode 21 being adapted to the soldering points of the PCB board 22 to ensure a good electrical connection.

The thermocompression bonding assembly 3 is a core part of the apparatus, and includes a platen 31 and a thermocompression bonding assembly 35. The bottom side of the press plate 31 is provided with a limit cap 32, which limit cap 32 is adapted to the outside of the diode 21 to ensure that the pins of the diode 21 are correctly aligned on the solder joints. The other side of the pressing plate 31 is provided with a telescopic component 34, and the hot-press welding process can be realized through the adjustment of the telescopic component 34;

The telescopic assembly 34 is a common assembly used for adjustment in the mechanical field, such as a cylinder or a hydraulic cylinder;

A thermal compression assembly 35 is provided at the location of the pins of the platen 31 corresponding to the PCB pads and provides the necessary heat and pressure to melt and bond the solder between the pads and pins. Such a hot press assembly 35 may employ structures such as heating elements and pressure control mechanisms to ensure accurate control of temperature and pressure during welding.

The top of one side of the base 11 is also provided with a mounting area 13, the mounting area 13 being adapted to the thermocompression bonding assembly 3.

The top of the positioning bulge 12 is provided with two symmetrically arranged convex points, and the convex points are matched with the open holes of the PCB 22.

One side of the pressing plate 31 is provided with an inserting block 33 at the mounting area 13, and a vertical clamping groove for the pressing plate 31 to reciprocate is formed at the top of the inserting block 33 for keeping the pressing plate 31 stably pressed down.

In addition to the base 11 and the positioning projections 12 of the loading body 1 mentioned above, a mounting area 13 may also be provided on top of one side of the loading body 1, which mounting area 13 is adapted to the thermocompression bonding assembly 3. This mounting area 13 provides a stable support platform ensuring proper mounting and alignment of the thermocompression bonding assembly 3.

At the top of the positioning protrusion 12, two symmetrically arranged bumps are designed. These bumps are adapted to the openings of the PCB 22, so that additional positioning support can be provided, and accurate alignment of the solder module 2 and the PCB 22 is ensured.

The press plate 31 side of the thermocompression bonding module 3 is adapted to the mounting region 13 and is provided with an insertion block 33. The top of these plug-in blocks 33 has vertical clamping grooves for the reciprocating movement of the pressing plate 31. By placing the platen 31 in the vertical clamping groove, stable pressing down of the platen 31 can be maintained and the required force and stability can be provided during the thermocompression bonding process.

Such a design may provide better positioning and stability, ensure accurate position and motion control of the welding assembly and the platen 31, and thus achieve a more reliable thermocompression welding process. At the same time, with these designs, the operator can easily install and replace the welding module 2, improving production efficiency and convenience.

In the above embodiment, it is also conceivable to add a component;

temperature sensor and control system: a temperature sensor and a control system are added in the loading body 1 for monitoring the temperature of the welding area in real time and automatically adjusting the heating or cooling system as required. This ensures the accuracy and stability of the welding temperature to obtain a higher quality welded connection.

Pressure sensor and control system: a pressure sensor and a control system are added in the hot press welding assembly 3 for monitoring the pressure during welding and automatically adjusting the pressure as required to ensure uniformity and consistency of welding. This helps to improve the reliability and stability of the soldered connection.

Intelligent feedback control: by integrating the intelligent algorithm and the feedback control technology, the self-adaptive welding process can be realized. The system can be adjusted and optimized in real time according to the actual welding condition so as to obtain the optimal welding result. Such intelligent feedback control can maximize weld quality and consistency.

Data recording and traceability system: the data recording and tracing functions are introduced, and parameters and actual conditions of each welding can be traced back by recording key data (such as temperature, pressure, time and the like) and establishing a data tracing system. This is of great importance for quality control, product traceability and fault analysis.

And (3) automatic process control: by integrating the automation control system and the process control software, the automation process control and adjustment can be realized. This can improve productivity and uniformity and reduce the workload of operators.

The sensor, control software, etc. used in the above improvement are conventional components, and are not described here.

The hot press assembly 35 includes a card frame 351 and a bottom frame 355 disposed under the card frame 351, and the bottom frame 355 is fitted with the card frame 351 through a seal groove 356 and a seal protrusion 354.

A bottom plate 353 is installed on the inner side of the bottom frame 355, and a supporting member 357 is provided on the diagonal position of the side frame of the bottom frame 355 for supporting the bottom plate 353.

The top of card frame 351 is provided with two mounting holes 352 that are the symmetry setting, and the control assembly of control bottom plate 353 side-to-side removal is installed to the inboard of mounting hole 352 for the solder joint shaping of supplementary hot press.

The hot press assembly 35 includes a card frame 351 and a bottom frame 355 disposed under the card frame 351. The sealing groove 356 and the sealing protrusion 354 are matched between the bottom frame 355 and the clamping frame 351, so that the sealing performance and stability of a welding area are ensured. A bottom plate 353 is installed at the inner side of the bottom frame 355 for supporting and fixing the welding assembly, ensuring stability and consistency of welding.

To further strengthen the supporting force of the bottom plate 353, the opposite corners of the rim of the bottom frame 355 are provided with interference members 357. These abutments 357 can exert proper pressure on the base plate 353 during the welding process, ensuring intimate contact between the welded assembly and the base plate 353 for improved weld quality and stability;

In the hot pressing process, through the use of the abutting piece 357, the abutting groove 3532 arranged at the bottom plate 353 is matched, so that the bottom plate 353 can realize certain movement, and the oxidation layer existing in the heating process is rolled and extruded in the initial welding period, so that the damage is carried out, and the welding efficiency is improved;

At the top of the card frame 351, two symmetrically arranged mounting holes 352 are designed. Inside these mounting holes 352 are mounted control members for controlling the movement of the bottom plate 353 in the left-right direction. By precise control of the base plate 353, spot formation by hot press welding can be assisted, ensuring the accuracy of the position and shape of the spot.

The clamp plate 31 includes plate body 3531, and the both sides of plate body 3531 are provided with soft strip 3533, and soft strip 3533 and the inboard adaptation of underframe 355 for supplementary clamp plate 31 removes, thereby destroys the oxide layer, improves welding quality.

The plate 3531 is provided with interference grooves 3532 at both ends of the soft strip 3533, and the interference grooves 3532 are adapted to the interference members 357.

The inner side of the plate body 3531 is hollow, and a heating component 3534 is arranged at the hollow part of the pressing plate 31 and used for assisting the pressing plate 31 in processing welding spots.

The platen 31 is an important component of the ROSA thermocompression bonding apparatus and includes a plate body 3531. Soft strips 3533 are arranged on two sides of the plate body 3531, and the soft strips 3533 are matched with the inner side of the bottom frame 355 to assist the pressing plate 31 in moving. The presence of the soft strips 3533 can effectively destroy the oxide layer of the welded area to improve the welding quality and contact performance.

To enhance stability of the pressing plate 31 and transmission of effective pressure, the plate body 3531 is provided at both ends with interference grooves 3532. These interference grooves 3532 fit against the interference members 357 and ensure, by contact with the bottom plate 353, that sufficient pressure is generated during the welding process to achieve good formation of the weld.

At the same time, the inner side of the plate 3531 is hollow. This hollow is provided with a heating assembly 3534 for assisting the handling of the solder joints by the platen 31. The heating assembly 3534 facilitates the progress of the weld and the formation of a stable spot by providing the proper heat to bring the temperature of the weld region to the desired weld temperature.

In the hot press welding, in order to further improve the welding efficiency, the surface of the plate body 3531 may be treated, and a special coating, a nanostructure, a plating layer or the like may be used to further improve the contact performance and the oxidation resistance. This allows for better disruption of the oxide layer and increased contact area with the weld area as the platen 31 moves.

The hollow heating assembly 3534 may be further optimized, for example, using rapid heating and cooling techniques, to reduce welding cycles and heating energy consumption. In addition, an accurate temperature control system may adjust the temperature profile of the heating assembly 3534 to match the requirements of the welding process. For example, a semiconductor refrigeration/heating technology is adopted, and the welding efficiency is improved by matching with the original heating measures;

Meanwhile, when in hot press welding, an accurate pressure sensor and an automatic control system can be introduced for monitoring and adjusting welding pressure in real time. By accurate pressure control, a constant and even distribution of the pressure applied during the welding process can be ensured, thereby obtaining a more consistent welding result.

The foregoing description is only illustrative of the utility model and is not to be construed as limiting the utility model. Various modifications and variations of the present utility model will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, or the like, which is within the spirit and principle of the present utility model, should be included in the scope of the claims of the present utility model.

Claims (10)

1. A ROSA thermocompression bonding apparatus comprising a loading body (1) for thermocompression bonding, a bonding module (2) provided on the loading body (1), and a thermocompression bonding assembly (3) mounted on the loading body (1);

The method is characterized in that:

The loading main body (1) comprises a base (11), a positioning protrusion (12) is arranged on one side of the top of the base (11), and the positioning protrusion (12) is matched with the welding module (2);

the welding module (2) comprises a PCB (22) and a diode (21), wherein the pin of the diode (21) is matched with the welding point of the PCB (22);

The hot-press welding assembly (3) comprises a pressing plate (31), wherein a limiting cover (32) is arranged on one side of the bottom of the pressing plate (31), the limiting cover (32) is matched with the outer side of the diode (21), and a telescopic assembly (34) is arranged on the other side of the pressing plate (31) and used for realizing hot-press welding;

And the pressing plate (31) is provided with a hot-pressing assembly (35) at the position corresponding to the welding point of the pin and the PCB, and is used for hot-pressing welding the welding point and the pin.

2. The ROSA thermocompression bonding device of claim 1, wherein: and a mounting area (13) is further arranged at the top of one side of the base (11), and the mounting area (13) is matched with the hot-press welding assembly (3).

3. The ROSA thermocompression bonding device of claim 1, wherein: two symmetrically arranged protruding points are arranged at the top of the positioning protrusion (12), and the protruding points are matched with the holes of the PCB (22).

4. The ROSA thermocompression bonding device of claim 1, wherein: one side of the pressing plate (31) is provided with an inserting block (33) at the installation area (13), and the top of the inserting block (33) is provided with a vertical clamping groove capable of enabling the pressing plate (31) to reciprocate for keeping stable pressing of the pressing plate (31).

5. The ROSA thermocompression bonding device of claim 1, wherein: the hot pressing assembly (35) comprises a clamping frame (351) and a bottom frame (355) arranged below the clamping frame (351), and the bottom frame (355) is matched with the clamping frame (351) through a sealing groove (356) and a sealing protrusion (354).

6. The ROSA thermocompression bonding device of claim 5, wherein: the bottom plate (353) is installed to the inboard of underframe (355), the frame diagonal department of underframe (355) is provided with conflict piece (357) for bearing bottom plate (353).

7. The ROSA thermocompression bonding device of claim 5, wherein: the top of card frame (351) is provided with two mounting holes (352) that are the symmetry setting, control assembly that control bottom plate (353) left and right movement is installed to the inboard of mounting hole (352) for the solder joint shaping of supplementary hot press.

8. The ROSA thermocompression bonding device of claim 1, wherein: the clamp plate (31) includes plate body (3531), the both sides of plate body (3531) are provided with soft strip (3533), the inboard adaptation of soft strip (3533) and underframe (355) is used for the fixed of supplementary clamp plate (31).

9. The ROSA thermocompression bonding device of claim 8, wherein: both ends of the plate body (3531) positioned at the soft strip (3533) are provided with abutting grooves (3532), and the abutting grooves (3532) are matched with the abutting pieces (357).

10. The ROSA thermocompression bonding device of claim 8, wherein: the inner side of the plate body (3531) is hollow, and a heating component (3534) is arranged at the hollow part of the pressing plate (31) and is used for assisting the pressing plate (31) in processing welding spots.