CN221039968U - Heat abstractor for computer processor - Google Patents

Abstract

The utility model discloses a heat radiator of a computer processor, which is provided with a processor and an IO interface on an ITX main board, and is arranged on the ITX main board and comprises an outer shell top cover, a copper heat pipe, a heat pipe supporting block and a connecting device. The heat pipe limit groove is formed in the inner side of the top cover of the outer shell, and the heat radiation fins are fixed on the outer side of the top cover of the outer shell, so that the processor can radiate heat to the outside. The copper heat pipe is internally filled with phase change medium and comprises a hot pipe connecting part, a cold pipe connecting part and a bending pipe part which are integrally formed, and a heat pipe lining plate is brazed below the hot pipe connecting part. The heat pipe supporting block is positioned between the top cover of the outer shell and the hot joint pipe part and is fixedly connected to the top cover of the outer shell and the hot joint pipe part so as to support and fix the hot joint pipe part. The ITX mainboard is fixed to the top cover of the outer shell through the connecting device, and when the connecting device is in an installation state, the bottom of the heat pipe lining plate is attached to the upper surface of the processor, so that the long-distance fanless heat dissipation of the processor is realized.

Description

Heat abstractor for computer processor

Technical Field

The utility model belongs to the technical field of computer processor heat dissipation, and particularly relates to a computer processor heat dissipation device.

Background

With the development of edge computing technology, edge devices are increasingly widely used in traffic, finance, railway, communities and other scenes, and the edge devices are started up for 24 hours in 365 days all the year round, so that the requirement on the reliability of products is extremely high. Because the service life of the fans is limited, the edge equipment is limited by the use scene, the size is small, the layout is compact, and the number of the fans cannot be increased like that of general computer equipment so as to improve the reliability of the whole machine, so that the edge equipment adopts a fanless heat dissipation design for ensuring high reliability.

The common practice for a fanless design is: the heat dissipation fins are arranged outside the outer shell of the edge equipment, the heat conduction copper block is arranged on the inner surface of the outer shell and is in close contact with the upper surface of the computer processor welded on the main board, the heat of the computer processor is conducted to the heat dissipation fins of the outer shell by utilizing the characteristic that the copper material conducts heat quickly, and then the heat is dissipated to the outside air through the surfaces of the heat dissipation fins. The heat dissipation mode needs to ensure that the height of the heat conducting copper block cannot be too large, namely the distance between the upper surface of the processor and the inner surface of the outer shell cannot be too large. The heat conducting copper block can not be larger than 10mm according to practical engineering experience. If the heat conduction copper block exceeds 10mm, the thermal resistance is increased, and under the limited area (the sectional area of the heat conduction copper block is slightly larger than that of the processor), the rapid conduction of the heat emitted by the processor cannot be realized, so that the normal operation of the processor cannot be ensured. The standard ITX motherboard processor and the IO interface are arranged on the same side of the motherboard PCB, and the height of the IO interface is generally more than 10mm and is about 20mm. Therefore, the main board of the fanless computer cannot directly adopt the standardized ITX main board in the market, and most of the main boards are customized products, so that the cost of fanless equipment is increased, and the research and development period is prolonged. Because the customized ITX mainboard is far smaller than the standard ITX mainboard in use amount, the reliability is lower than that of the standard ITX mainboard, and the development of the fanless heat dissipation device of the computer is limited.

Disclosure of utility model

In order to overcome the defects, the utility model provides the heat dissipation device for the computer processor, which does not need to adopt a fan for heat dissipation, and adopts a copper heat pipe between the processor and the top cover of the outer shell for heat dissipation, so that the heat conduction resistance is small, the remote heat conduction of the processor is realized, and the heat dissipation of the processor is facilitated.

The utility model is realized by the following technical scheme:

a heat radiator for computer processor is composed of an ITX main board, a processor and an IO interface, and a heat radiator installed to ITX main board and consisting of top cover of external casing, copper heat pipe, heat pipe supporting block and connector. The heat pipe limit groove is formed in the inner side of the top cover of the outer shell, and the heat radiation fins are fixed on the outer side of the top cover of the outer shell, so that the processor can radiate heat to the outside. The copper heat pipe is flat, the phase change medium is filled in the copper heat pipe, and the heat conduction efficiency of the copper heat pipe is improved through the principle of phase change heat absorption. The copper heating pipe comprises a hot connecting pipe part, a cold connecting pipe part and a bending pipe part which are integrally formed, wherein the hot connecting pipe part and the cold connecting pipe part are in a horizontal state, the bending pipe part is obliquely arranged to connect the hot connecting pipe part and the cold connecting pipe part, the cold connecting pipe part is embedded and fixedly arranged in a heat pipe limiting groove, a heat pipe lining plate is brazed below the hot connecting pipe part, and the distance between the heat pipe lining plate and a top cover of an outer shell body is larger than the height of an IO interface protruding out of an ITX main board. The heat pipe supporting block is positioned between the top cover of the outer shell and the hot joint pipe part and is fixedly connected to the top cover of the outer shell and the hot joint pipe part so as to support and fix the hot joint pipe part. The ITX mainboard is fixed to the top cover of the outer shell through a connecting device, and when the connecting device is in an installation state, the bottom of the heat pipe lining plate is attached to the upper surface of the processor. The remote heat dissipation of the processor without fans is realized.

Further, the copper heat pipes are provided with a plurality of heat pipe limiting grooves, and the number of the heat pipe limiting grooves is consistent with that of the copper heat pipes, so that the heat conduction efficiency of the processor is improved.

Further, the shapes of the heat pipe limit groove and the cold joint pipe part are consistent, the contact area of the cold joint pipe part and the heat pipe limit groove is S, and the contact area of the hot joint pipe part and the heat pipe lining plate is D, so that S is more than 5D. So that the copper heat pipe can fully dissipate heat at the radiating fins.

Further, the top cover of the outer shell is an aluminum milling part or a magnesium aluminum alloy die casting part, and the heat conduction performance is good. The cold connecting pipe part and the top cover of the outer shell are fixed through brazing. The brazing mode is adopted, the chemical properties of the cold joint pipe part and the top cover of the outer shell are basically not adversely affected, the heating temperature is low during brazing, the whole welding part can be heated, the induced stress and deformation are small, and the dimensional accuracy of the welding part is easy to ensure; has low requirements on heat sources and simple process.

Further, the heat pipe support block is an aluminum milling part, the upper end face of the heat pipe support block is fixed with the top cover of the outer shell body through brazing, and the lower end face of the heat pipe support block is fixed with the heat pipe connecting part through brazing.

Further, the connecting device comprises a stainless steel nut column and a spring flat pad combined screw, the stainless steel nut column is located between the top cover of the outer shell and the ITX main board, and the height of the stainless steel nut column is larger than that of the IO interface protruding out of the ITX main board. And during assembly, the IO interface on the ITX main board is not interfered with the top cover of the outer shell.

Further, the upper surface of the processor and the lower surface of the heat pipe lining plate are coated with heat-conducting silicone grease, so that seamless contact between the processor and the heat pipe lining plate is ensured, and heat generated by the processor is facilitated to be emitted into the outside air through the copper heat pipe.

Further, the heat pipe limiting groove extends to the side edge of the top cover of the outer shell, and the cold joint pipe part is consistent with the extending direction of the heat pipe limiting groove, so that heat transferred by the copper heat pipe can be conveniently dissipated.

Further, the height difference between the hot joint pipe part and the cold joint pipe part is larger than 10mm so as to adapt to a standardized ITX main board and improve the application range of the heat dissipating device.

The utility model has the beneficial effects that:

1. The heat dissipation is carried out by adopting a copper heat pipe between the processor and the top cover of the outer shell without adopting a fan, so that the heat transfer resistance is small, the remote heat conduction of the processor is realized, and the heat dissipation of the processor is facilitated;

2. the copper heat pipe still has good heat conduction performance when the heat conduction distance is more than 10mm, is suitable for the standardized ITX main board, has wide application range, does not need to independently customize the ITX main board, and further has low cost and high reliability of computer edge equipment produced by adopting the heat radiating device and the standardized ITX main board, and greatly shortens the research and development period of the edge equipment;

3. The copper heat pipe is internally filled with a phase change medium, and heat is quickly transferred from one end to the other end through the principle of phase change heat absorption, so that the heat dissipation capacity of the heat dissipation device is improved.

Drawings

FIG. 1 is a front view of an exemplary embodiment of a heat sink for a computer processor in accordance with the present utility model;

FIG. 2 is a side view of an exemplary embodiment of a heat sink for a computer processor in accordance with the present utility model;

FIG. 3 is a top view of an exemplary embodiment of a heat sink for a computer processor according to the present utility model;

fig. 4 is an assembly diagram illustrating an exemplary embodiment of a heat sink for a computer processor according to the present utility model.

List of parts and reference numerals:

1. An ITX motherboard; 2. a processor; 3. an IO interface; 4. an outer housing top cover; 41. a heat pipe limit groove; 5. a heat radiation fin; 6. copper heat pipe; 61. a hot junction pipe portion; 62. a cold connecting pipe part; 63. bending the pipe part; 7. a heat pipe lining plate; 8. a heat pipe support block; 9. a connecting device; 91. stainless steel nut columns; 92. spring and level the pad combination screw.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, in the embodiments of the present utility model, terms such as left, right, up, down, front, and back are merely relative terms or references to a normal use state of a product, i.e. a traveling direction of the product, and should not be construed as limiting.

In addition, the dynamic terms such as "relative movement" in the embodiments of the present utility model include not only a change in position but also a movement in which a state is changed without a relative change in position such as rotation or rolling.

Finally, it is noted that when an element is referred to as being "on" or "disposed on" another element, it can be on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

As shown in fig. 1 to 4, a heat dissipating device for a computer processor is provided on an ITX motherboard 1, wherein the heat dissipating device is mounted on the ITX motherboard 1 and comprises an outer housing top cover 4, a copper heat pipe 6, a heat pipe supporting block 8 and a connecting device 9. The heat pipe limit groove 41 is formed in the inner side of the top cover 4 of the outer shell, and the heat radiation fins 5 are fixed on the outer side of the top cover 4 of the outer shell, so that the processor 2 can radiate heat to the outside. The copper heat pipe 6 is flat, the phase change medium is filled in the copper heat pipe 6, and the heat conduction efficiency of the copper heat pipe 6 is improved through the principle of phase change heat absorption. The copper heat pipe 6 includes integrated into one piece's hot takeover portion 61, cold takeover portion 62 and kink pipe portion 63, and hot takeover portion 61 and cold takeover portion 62 all are the horizontality, and kink pipe portion 63 slope sets up in order to connect hot takeover portion 61 and cold takeover portion 62, and cold takeover portion 62 embedded installation is fixed to heat pipe spacing groove 41, and the below of hot takeover portion 61 has brazed heat pipe lining plate 7, and the distance between heat pipe lining plate 7 and the shell body top cap 4 is greater than IO interface 3 and protrudes in the height of ITX mainboard 1. The heat pipe support block 8 is located between the outer case top cover 4 and the heat pipe connection portion 61, and the heat pipe support block 8 is fixedly connected to the outer case top cover 4 and the heat pipe connection portion 61 to support and fix the heat pipe connection portion 61. The ITX motherboard 1 is fixed to the outer housing top cover 4 by a connection device 9, and when the connection device 9 is in an installed state, the bottom of the heat pipe lining 7 is attached to the upper surface of the processor 2. The remote and fanless heat dissipation of the processor 2 is realized.

In an embodiment, when preparing the heat dissipating device, first, the heat pipe limiting groove 41 is opened in the top cover 4 of the outer housing, and the layout of the heat pipe limiting groove 41 is designed, so that the heat pipe limiting groove 41 extends along the periphery of the top cover 4 of the outer housing as much as possible, so as to facilitate the heat dissipation of the copper heat pipe 6 to the outside. Secondly, the copper heat pipe 6 is processed into the matched copper heat pipe 6 through working procedures such as flattening and bending according to actual needs. The flat copper heat pipe 6 is further helpful for the bonding of the copper heat pipe 6 with the heat pipe limiting groove 41 and the heat pipe lining plate 7. The copper heat pipe 6 is bent to form a hot pipe portion 61, a cold pipe portion 62, and a bent pipe portion 63. Then, the cold joint pipe portion 62 of the copper heat pipe 6 is fitted into the heat pipe stopper groove 41 matched with the cold joint pipe portion, and is fixed by brazing. In order to prevent the thermal pipe connection portion 61 of the copper heat pipe 6 from being deformed due to suspension, the height dimension actually required cannot be accurately achieved, the heat pipe connection portion 61 and the outer case top cover 4 are mounted with the heat pipe support block 8, and the heat pipe support block 8, the thermal pipe connection portion 61 and the outer case top cover 4 are fixed by brazing. Finally, the ITX motherboard 1 is mounted to the heat sink, so that the processor 2 is just attached to the heat pipe lining 7. The heat generated by the processor 2 is dissipated to the outside air through the heat pipe lining plate 7, the heat pipe connecting portion 61, the bent pipe portion 63, the cold pipe connecting portion 62, the outer housing top cover 4 and the heat dissipation fins 5 in sequence.

The heat pipe lining plate 7 is a copper sheet, and the heat pipe lining plate 7 is used between the heat pipe connecting portion 61 and the processor 2, so as to perform the function of compensating the flatness, and facilitate the heat generated by the processor 2 to be transferred to the copper heat pipe 6.

Preferably, a plurality of copper heat pipes 6 are provided, and the number of the heat pipe limit grooves 41 is consistent with that of the copper heat pipes 6, so that the heat conduction efficiency of the processor 2 is improved.

Preferably, the shapes of the heat pipe limit groove 41 and the cold joint pipe portion 62 are consistent, the contact area between the cold joint pipe portion 62 and the heat pipe limit groove 41 is set as S, the contact area between the heat joint pipe portion 61 and the heat pipe lining plate 7 is set as D, and S > 5D. So that the copper heat pipe 6 can sufficiently dissipate heat at the heat dissipation fins 5.

In an embodiment, the cold joint pipe portion 62 of the copper heat pipe 6 may be uniformly distributed on the top cover 4 of the outer casing, so that the heat dissipation of the copper heat pipe 6 is faster, and under the same casing, compared with the existing heat conduction mode of the heat conduction copper block, more heat can be dissipated, and the ITX motherboard 1 can be matched with the processor 2 with higher power consumption, thereby improving the overall performance of the computer edge device.

Preferably, the top cover 4 of the outer shell is an aluminum milling part or a magnesium aluminum alloy die casting part, and has good heat conduction performance. The cold junction pipe portion 62 is fixed to the outer case top cover 4 by brazing. The brazing mode is adopted, the chemical properties of the cold pipe part 62 and the top cover 4 of the outer shell are basically not adversely affected, the heating temperature is low during brazing, the whole welding part can be heated, the induced stress and deformation are relatively small, and the dimensional accuracy of the welding part is easy to ensure; has low requirements on heat sources and simple process.

Preferably, the heat pipe support block 8 is an aluminum milling part, the upper end surface of the heat pipe support block 8 is fixed with the top cover 4 of the outer shell body through brazing, and the lower end surface of the heat pipe support block 8 is fixed with the hot joint pipe portion 61 through brazing.

Preferably, the connecting device 9 comprises a stainless steel nut post 91 and a spring flat pad combination screw 92, the stainless steel nut post 91 is located between the top cover 4 of the outer shell and the ITX main board 1, and the height of the stainless steel nut post 91 is larger than the height of the IO interface 3 protruding out of the ITX main board 1. And when the assembly is ensured, the IO interface 3 on the ITX main board 1 is not interfered with the top cover 4 of the outer shell.

In one embodiment, the ITX motherboard 1 is secured to the heat sink by 4M 3 stainless steel nut posts 91 and M3×8 spring flat pad set screws 92. The height of the M3 stainless steel nut post 91 enables the upper surface of the processor 2 of the ITX main board 1 to be in close contact with the lower surface of the heat pipe lining plate 7 of the heat dissipation device, and heat conduction silicone grease is coated between the upper surface and the lower surface, so that the two are ensured to be in seamless contact, and heat generated by the processor 2 of the ITX main board 1 can be dissipated into the outside air through the heat dissipation device.

Preferably, the upper surface of the processor 2 and the lower surface of the heat pipe lining plate 7 are coated with heat-conducting silicone grease, so that seamless contact between the processor 2 and the heat pipe lining plate 7 is ensured, and heat generated by the processor 2 is facilitated to be emitted into the outside air through the copper heat pipe 6.

Preferably, the heat pipe limiting groove 41 extends to the side edge of the top cover 4 of the outer shell, and the cold joint pipe portion 62 is consistent with the extending direction of the heat pipe limiting groove 41, so that heat dissipation treatment is conveniently carried out on heat transferred by the copper heat pipe 6.

Preferably, the height difference between the hot joint pipe portion 61 and the cold joint pipe portion 62 is greater than 10mm, so as to adapt to the standardized ITX motherboard 1 and improve the application range of the heat dissipating device.

When the heat dissipation device for the computer processor is adopted, a fan is not required to dissipate heat, and the copper heat pipe 6 is adopted between the processor 2 and the top cover 4 of the outer shell body to dissipate heat, so that the heat transfer resistance is small, the long-distance heat conduction of the processor 2 is realized, and the heat dissipation of the processor 2 is facilitated. The copper heating pipe 6 still has good heat conduction performance when the heat conduction distance is more than 10mm, is suitable for the standardized ITX main board 1, has wide application range, and does not need to independently customize the ITX main board 1. The copper heat pipe 6 is internally filled with a phase change medium, and heat is quickly transferred from one end to the other end through the principle of phase change heat absorption, so that the heat dissipation capacity of the heat dissipation device is improved.

The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.

Claims (9)

1. A computer processor heat sink having a processor and an IO interface on an ITX motherboard, the heat sink mounted to the ITX motherboard, the heat sink comprising:

The heat pipe limiting groove is formed in the inner side of the outer shell top cover, and the heat radiating fins are fixed on the outer side of the outer shell top cover;

The copper heat pipe is flat, a phase change medium is filled in the copper heat pipe, the copper heat pipe comprises a hot pipe connecting part, a cold pipe connecting part and a bending pipe part which are integrally formed, the hot pipe connecting part and the cold pipe connecting part are in a horizontal state, the bending pipe part is obliquely arranged to connect the hot pipe connecting part and the cold pipe connecting part, the cold pipe connecting part is embedded and fixed to the heat pipe limiting groove, a heat pipe lining plate is brazed below the hot pipe connecting part, and the distance between the heat pipe lining plate and the top cover of the outer shell is larger than the height of the IO interface protruding out of the ITX main board;

A heat pipe support block located between the outer housing top cover and the thermal pipe connection portion, the heat pipe support block being fixedly connected to the outer housing top cover and the thermal pipe connection portion;

And the ITX main board is fixed to the top cover of the outer shell body through the connecting device, and when the connecting device is in an installation state, the bottom of the heat pipe lining board is attached to the upper surface of the processor.

2. The heat sink of claim 1, wherein a plurality of the copper heat pipes are provided, and the heat pipe limit grooves are identical to the copper heat pipes in number.

3. The heat dissipating device of claim 1, wherein the heat pipe limiting groove and the cold pipe portion are identical in shape, and the contact area between the cold pipe portion and the heat pipe limiting groove is S, and the contact area between the hot pipe portion and the heat pipe lining plate is D, and S > 5D.

4. The heat sink of claim 1, wherein the top cover of the outer housing is an aluminum mill or a magnesium aluminum alloy die casting, and the cold joint pipe portion and the top cover of the outer housing are fixed by brazing.

5. The heat dissipating device for a computer processor of claim 1, wherein the heat pipe support block is an aluminum milling member, an upper end surface of the heat pipe support block is fixed to the top cover of the outer case by brazing, and a lower end surface of the heat pipe support block is fixed to the heat pipe connecting portion by brazing.

6. The computer processor heat sink of claim 1, wherein the connection means comprises a stainless steel nut post and spring flat pad combination screw, the stainless steel nut post is located between the outer housing top cover and the ITX motherboard, and the height of the stainless steel nut post is greater than the height of the IO interface protruding from the ITX motherboard.

7. The heat sink of claim 1 wherein the upper surface of the processor and the lower surface of the heat pipe liner are coated with a thermally conductive silicone.

8. The heat dissipating device of claim 1, wherein the heat pipe limiting groove extends to a side of the top cover of the outer housing, and the cold joint pipe portion is aligned with the extending direction of the heat pipe limiting groove.

9. The computer processor heat sink of claim 1, wherein a height difference between the hot junction and the cold junction is greater than 10mm.