CN220551803U

CN220551803U - UV LED lamp and copper substrate module thereof

Info

Publication number: CN220551803U
Application number: CN202322195551.5U
Authority: CN
Inventors: 陈正平; 李孟瑶; 刘芳; 孙雷蒙
Original assignee: Huayinxin Zhangjiagang Semiconductor Co ltd
Current assignee: Huayinxin Zhangjiagang Semiconductor Co ltd
Priority date: 2023-08-15
Filing date: 2023-08-15
Publication date: 2024-03-01
Anticipated expiration: 2033-08-15

Abstract

The utility model provides a UV LED lamp and a copper substrate module thereof. The second cover plate is arranged on the copper substrate, and the first cover plate is arranged on one side, far away from the copper substrate, of the second cover plate; the first cover plate is provided with a first mounting hole, and the second cover plate is correspondingly provided with a second mounting hole; the circumferential dimension of the second mounting hole is smaller than that of the first mounting hole, and the second cover plate positioned at the first mounting hole forms a step part; the UV LED luminous body is arranged on the copper substrate at the second mounting hole, and the lens cover is arranged on the step part. The UV LED lamp and the copper substrate module thereof provided by the utility model have the advantages of simple manufacturing flow, low manufacturing cost and good waterproof effect.

Description

UV LED lamp and copper substrate module thereof

Technical Field

The utility model relates to the technical field of semiconductor lighting equipment, in particular to a UV LED lamp and a copper substrate module thereof.

Background

The UV LED, ultraviolet light emitting diode, is a light source having a light emission wavelength of a certain wavelength in a wavelength band of 200nm to 450nm, and is widely used in fields such as UV curing, printing, wiring boards, plant illumination, sterilization, and the like in industrial fields. But the calorific capacity of UV LED lamp is bigger than ordinary LED lamp, and the too high light intensity decay that can accelerate the UV LED lamp of temperature reduces its life simultaneously, therefore strengthens the heat dissipation and is particularly important to the UV LED lamp.

In the process of observing similar products, the influence of penetrability of the UV LED is found, and most of the UV LED products in the prior art adopt a structure that the lamp beads are directly exposed in the air, so that the UV LED products cannot have a waterproof effect. Some UV LED products are packaged in a mode of firstly manufacturing lamp beads, then carrying out SMT (surface mount technology) paster and integrally covering lenses, so that the manufacturing process is complex, the cost is high, and the reliability of the product is difficult to guarantee.

Disclosure of Invention

The utility model aims to overcome the defects in the prior art and provide a UV LED lamp and a copper substrate module thereof, thereby solving at least one of the problems of complex manufacturing flow, high cost, poor waterproof effect and the like of the UV LED lamp in the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

in one aspect, the utility model provides a copper substrate module, which comprises a copper substrate, a first cover plate, a second cover plate, a UV LED luminous body and a lens;

the second cover plate is arranged on the copper substrate, and the first cover plate is arranged on one side, far away from the copper substrate, of the second cover plate; the first cover plate is provided with a first mounting hole, and the second cover plate is correspondingly provided with a second mounting hole; the circumferential dimension of the second mounting hole is smaller than that of the first mounting hole, and the second cover plate positioned at the first mounting hole forms a step part; the UV LED luminous body is arranged on the copper substrate at the second mounting hole, and the lens cover is arranged on the step part.

Further, the copper substrate comprises a circuit layer, an insulating layer and a matrix layer; the circuit layer is made of conductive metal, is arranged towards the direction of the second cover plate and is electrically connected with the UV LED luminous body; the substrate layer is a copper layer.

Further, the first cover plate and the second cover plate are both aluminum plates.

Further, the surface of the first cover plate far away from one side of the copper substrate is mirror aluminum with the reflectivity not less than 80%.

Further, a plurality of first mounting holes are formed in the first cover plate and are distributed at intervals on the same axis; the second cover plate is correspondingly provided with a plurality of second mounting holes.

Further, a light emitter unit is respectively arranged on the copper substrate at each second mounting hole, and each light emitter unit at least comprises one UV LED light emitter.

Further, the UV LED luminous body comprises a UV LED chip or a UV LED lamp bead.

Further, the number of the first mounting holes on the first cover plate is one, and the number of the second mounting holes on the second cover plate is also one; and a plurality of illuminant units are arranged on the copper substrate in the second mounting hole, each illuminant unit at least comprises a UV LED illuminant, and the plurality of illuminant units are connected into a whole.

Further, the copper substrate is provided with an anode pin and a cathode pin, and the anode pin and the cathode pin are respectively arranged at two ends of the copper substrate in the length direction.

On the other hand, the utility model also provides a UV LED lamp, which comprises the copper substrate module.

According to the technical scheme of the utility model, the copper substrate module has the advantages that the copper substrate with high heat dissipation is adopted as the substrate, so that the heat dissipation effect of the UV LED lamp is effectively enhanced, and the service life is prolonged. Simultaneously, the mode that uses first apron and second apron is assembled, makes the module more integrative, makes the structure of module succinct more, pleasing to the eye, simultaneously, is equipped with first mounting hole and second mounting hole on first apron and the second apron respectively, and the step portion that two mounting holes formed can be used to install the lens for the lens has suitable installation height, and can fix a position lens position, makes lens mounted position more accurate, and the degree of depth of step still can strengthen the installation reliability of lens, thereby strengthen overall structure's stability. The UV LED luminous body is integrally arranged in the second mounting hole below the lens, and the circuit part of the UV LED luminous body is completely sealed between the lens and the copper substrate, so that the reliability and the waterproofness of the whole UV LED luminous body are greatly improved. The UV LED lamp provided by the utility model comprises the copper substrate module, so that the UV LED lamp also has the effects.

Drawings

Fig. 1 is a schematic cross-sectional view of a copper substrate module according to an embodiment of the utility model.

Fig. 2 is a schematic cross-sectional view of a copper substrate module according to another embodiment of the utility model.

Fig. 3 is an exploded view of the copper substrate module of fig. 1.

Fig. 4 is an exploded view of the copper substrate module of fig. 2.

The meaning of the reference numerals in the drawings are:

1. a copper substrate; 11. a circuit layer; 12. an insulating layer; 13. a base layer; 14. a bonding pad; 15. a positive electrode pin; 16. a negative electrode pin; 2. a second cover plate; 21. a step portion; 22. a second mounting hole; 3. a first cover plate; 31. a first mounting hole; 4. a light emitting body unit; 5. and a lens.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Preferred embodiments of the present utility model are shown in the drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

The UV LED lamp of this embodiment includes lighting fixture (not shown), power plug (not shown), lamp shade (not shown) and copper base plate module, and the lamp shade is located on the lighting fixture, and copper base plate module installs in the lamp shade, and the lamp shade can play the effect of protection copper base plate module and increase spotlight, and power plug is connected with copper base plate module electricity for the power supply of UV LED lamp.

As shown in fig. 1 and 3, the copper substrate module of the present embodiment includes a copper substrate 1, a first cover plate 3, a second cover plate 2, a UV LED light emitter and a lens 5. The second cover plate 2 is arranged on the copper substrate 1, and the first cover plate 3 is arranged on one side of the second cover plate 2 away from the copper substrate 1; the first cover plate 3 is provided with a first mounting hole 31, and the second cover plate 2 is correspondingly provided with a second mounting hole 22; the circumferential dimension of the second mounting hole 22 is smaller than the circumferential dimension of the first mounting hole 31, i.e., the aperture of the second mounting hole 22 is smaller than the aperture of the first mounting hole 31. The second cover plate 2 located at the first mounting hole 31 forms a stepped portion 21; the UV LED light emitter is provided on the copper substrate 1 at the second mounting hole 22, and the lens 5 is provided on the stepped portion 21. The step portion 21 is used for installing and fixing the lens 5, and the step portion 21 has a certain depth, so that on one hand, the lens 5 is fixed, and on the other hand, the mounting height of the lens 5 can be ensured, and a proper gap distance is formed between the lens 5 and the UV LED luminous body.

The copper substrate 1 in the present embodiment includes a wiring layer 11, an insulating layer 12, and a base layer 13. The wiring layer 11 is made of a conductive metal, for example, the conductive metal may be copper foil. The circuit layer 11 is arranged towards the second cover plate 2 and is electrically connected with the UV LED luminary. The conductive layers at both ends of the copper substrate 1 in the length direction are respectively connected with a positive electrode pin 15 and a negative electrode pin 16, and the positive electrode pin 15 and the negative electrode pin 16 are used for being conducted with an external power supply. The base layer 13 is a copper layer, copper has good thermal conductivity, and the embodiment adopts copper as a substrate material, so that the cost is lower, the thermal conductivity is better, and the UV LED lamp with larger heating value can be satisfied, the light intensity attenuation is reduced, and the service life is prolonged compared with a ceramic substrate.

In this embodiment, the first cover plate 3 and the second cover plate 2 are both aluminum plates, so as to improve the reflectivity of the copper substrate module, and the surface of the first cover plate 3 on one side far away from the second cover plate 2 can be treated to form a mirror aluminum structure, so that the reflectivity of the mirror aluminum structure reaches more than 80%, thereby improving the radiation intensity of the UV LED lamp.

The number and positions of the first mounting holes 31 on the first cover plate 3 and the second mounting holes 22 on the second cover plate 2 are respectively correspondingly set, and the specific number is set according to actual needs. For example, as shown in fig. 3, in one embodiment, the first cover plate 3 is provided with a plurality of first mounting holes 31, the centers of the plurality of first mounting holes 31 are all distributed on the same axis, and the plurality of first mounting holes 31 are uniformly spaced along the same axis, and in this embodiment, the first mounting holes 31 and the second mounting holes 22 are all circular holes. Each of the second mounting holes 22 is provided with a light emitter unit 4 on the copper substrate 1, and each light emitter unit 4 at least includes one UV LED light emitter, for example, one light emitter unit 4 may include only one UV LED light emitter, or may include a plurality of UV LED light emitters, which is specifically designed according to practical needs. The UV LED luminous body can be a UV LED chip or a UV LED lamp bead, preferably a UV LED chip, and has the advantages of low cost, simple manufacturing flow and high production efficiency. In this structure, one lens 5 needs to be mounted in each first mounting hole 31, that is, the number of lenses 5 is the same as the number of first mounting holes 31.

As shown in fig. 4, in some embodiments, only one first mounting hole 31 and one second mounting hole 22 may be provided, for example, the first mounting hole 31 and the second mounting hole 22 may be provided as rectangular holes, and a plurality of light emitting body units 4 may be mounted on the copper substrate 1 within the rectangular holes. The plurality of light emitting units 4 are connected into an integral structure, for example, the light emitting units 4 can be connected in series, parallel and the like, the plurality of light emitting units 4 are connected with the copper substrate 1 through a group of positive and negative electrodes, and the plurality of light emitting units 4 can be uniformly distributed along the length direction of the copper substrate 1. Likewise, each illuminant unit 4 may include only one UV LED illuminant, or may include a plurality of UV LED illuminants, which are set as needed. In this structure, only one lens 5 is required, and the lens 5 may be a planar lens 5 or a hemispherical lens 5, and the lens 5 is preferably made of quartz glass. The lens 5 seals the UV LED luminous body and the circuit thereof completely, thereby playing a good role in waterproof, and enhancing the condensation effect of the UV LED lamp.

The copper substrate module of this application embodiment, its first mounting hole 31 and second mounting hole 22 have different apertures, have formed step 21, can be used to place and fix a position lens 5, and when fixed lens 5, can carry out glue filling in this position, increase the viscidity to improve the reliability of lens 5. The upper surface of the first cover plate 3 is mirror-finished, effectively improving reflectivity.

The preparation process of the copper substrate module of this embodiment is as follows:

copper substrate 1 manufacturing:

1. opening the plate: cutting the substrate material into the size required by the work according to the design planning requirement before manufacture;

2. and (3) line manufacturing: completing the circuit manufacture according to the planning requirement of the pre-manufacture design;

3. and (3) line inspection: checking whether the circuit is normally manufactured;

4. etching: etching and removing the copper foil layer at the non-circuit part by using a chemical reaction reagent to form a circuit layer 11;

5. etching inspection: checking whether the etched circuit layer 11 is normal;

6. and (3) resistance welding: the ultraviolet rays of the exposure machine sensitize the patterns on the film through the negative film, and the patterns on the film are conveyed to the circuit layer 11, so that the effects of maintaining the circuit and preventing the circuit from being tin-plated when the parts are welded are achieved;

7. and (5) solder mask inspection: checking whether the circuit board is normal after the solder mask;

8. characters: lettering characters to facilitate recognition; for example, positive and negative electrode marks, identification codes, size marks, lamp bead information marks and the like can be printed;

9. surface treatment: nickel palladium gold, a layer of alloy plating is plated on the surface of the bonding pad 14 of the circuit layer 11;

10. appearance treatment: cutting the copper substrate 1 into corresponding shapes and sizes according to the planning requirements of the pre-manufacturing design;

11. and (3) checking finished products and checking circuits: checking according to the planned requirements of the pre-system design;

12. packaging and warehousing: packaging and warehousing according to the planned requirements of the pre-system design.

The first cover plate 3 and the second cover plate 2 are manufactured: cutting two aluminum plate materials into the required size according to the planning requirement of the pre-manufacturing design;

manufacturing a combined copper substrate: the second cover plate 2 is adhered to one side surface of the circuit layer 11 of the copper substrate 1 through the adhesive heat-conducting glue, the first cover plate 3 is adhered to the Ornith cover plate through the adhesive heat-conducting glue, and the two cover plates are pressed through a hot press.

When the UV LED luminous body is a UV LED chip, the method further comprises chip die bonding manufacture:

1. and (3) die bonding: according to the planned requirement of the pre-control design, the chip is fixed to a corresponding position;

2. welding wire: bonding gold wires to the surface pads 14 of the copper substrate 1 and the UV LED chip by a wire bonding machine;

3. dispensing: firstly, dispensing a layer of glue on the step part 21 of the second cover plate 2, placing the lens 5 on the step part 21, and finally dispensing and fixing the edge ring of the lens 5;

4. curing: and (5) placing the copper substrate module after dispensing into an oven for curing.

When the UV LED luminous body is a UV LED lamp bead, the method further comprises the SMT paster step: when the lamp beads are packaged, the lens 5 is not covered, the packaged UV LED lamp beads are attached to the bonding pads 14 of the circuit layer 11 of the copper substrate 1, then the lamp beads are sealed through dispensing and curing processes, and finally the lens 5 is covered.

According to the copper substrate module and the UV LED lamp, the copper material is used as the material of the substrate, so that the substrate has good thermal conductivity, and the service life of the UV LED lamp is greatly prolonged. And only one copper substrate is used as a carrier, and ceramic substrate packaging is not needed, so that die bonding of a chip or the surface mounting of a lamp bead can be realized, and the manufacturing cost and packaging cost of the module are greatly saved. The process mode of bonding the two layers of cover plates is adopted, so that the module is more integrated, and the simplicity and the attractiveness of the module are greatly improved. The other two layers of cover plates are respectively provided with mounting holes with different apertures, and the two layers of mounting holes can form a step part, so that the lens can be placed at a proper height, the position of the lens can be positioned, the offset of the lens is controlled, and meanwhile, the step depth can enhance the fixability of the lens. The utility model adopts the mode that the chip is firstly solidified (when the UV LED luminous body is the UV LED chip) and then the lens is covered, so that the integral waterproof effect of the module can be achieved. The upper surface of the first cover plate is mirror surface aluminum subjected to mirror surface treatment, so that the reflectivity is greatly improved, and the radiation intensity of the lamp is enhanced. The positive and negative pins of the copper substrate are arranged at two ends of the copper substrate, the width of the module is reduced better (if one end is provided with the positive and negative electrodes, the circuit of the negative electrode is required to be wound back from the bottom), the series connection between the copper substrate modules is facilitated, and the cost is greatly saved.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples only represent preferred embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. A copper substrate module, characterized in that: the LED lamp comprises a copper substrate, a first cover plate, a second cover plate, a UV LED luminous body and a lens;

2. The copper substrate module according to claim 1, wherein: the copper substrate comprises a circuit layer, an insulating layer and a matrix layer; the circuit layer is made of conductive metal, is arranged towards the direction of the second cover plate and is electrically connected with the UV LED luminous body; the substrate layer is a copper layer.

3. The copper substrate module according to claim 1, wherein: the first cover plate and the second cover plate are all aluminum plates.

4. A copper substrate module according to claim 3, wherein: the surface of the first cover plate far away from one side of the copper substrate is mirror aluminum with reflectivity not less than 80%.

5. The copper substrate module according to claim 1, wherein: the first cover plate is provided with a plurality of first mounting holes which are distributed at intervals on the same axis; the second cover plate is correspondingly provided with a plurality of second mounting holes.

6. The copper substrate module according to claim 5, wherein: and each light-emitting body unit at least comprises one UV LED light-emitting body is arranged on the copper substrate at each second mounting hole.

7. The copper substrate module according to claim 6, wherein: the UV LED luminous body comprises a UV LED chip or a UV LED lamp bead.

8. The copper substrate module according to claim 1, wherein: the number of the first mounting holes on the first cover plate is one, and the number of the second mounting holes on the second cover plate is also one; and a plurality of illuminant units are arranged on the copper substrate in the second mounting hole, each illuminant unit at least comprises a UV LED illuminant, and the plurality of illuminant units are connected into a whole.

9. The copper substrate module according to claim 1, wherein: the copper substrate is provided with an anode pin and a cathode pin, and the anode pin and the cathode pin are respectively arranged at two ends of the copper substrate in the length direction.

10. The utility model provides a UV LED lamps and lanterns which characterized in that: a copper substrate module comprising any one of claims 1 to 9.