CN220473956U - Heating structure and electronic equipment - Google Patents

Abstract

The application provides a heating structure and electronic equipment, relates to electronic equipment technical field. Wherein, the heating structure includes: the fan module is used for being arranged in the electronic equipment; the heating component is arranged in the electronic equipment and is positioned at the air outlet side of the fan module; the fan module provides air flow, and the air flow can flow through the heating component and blow to the inside of the electronic equipment. According to the technical scheme, the fan module is utilized to provide air flow, the heating component is located on the air outlet side of the fan module, so that the air flow can exchange heat through the heating component to form heating air flow, the heating air flow is blown into the electronic equipment, and therefore the electronic equipment can be heated, and the electronic equipment can be started at a low temperature.

Description

Heating structure and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a heating structure and electronic equipment.

Background

The reinforced computer is a computer which adopts corresponding assurance measures to various factors which influence the performance of the computer, such as the system structure, the electrical characteristics, the mechanical physical structure and the like, so as to adapt to the severe environment, namely the computer which is also called a severe environment resistant computer.

The reinforced computer has a low temperature of-40 deg.c. In a ruggedized computer, some of the electronic modules are not operational at low temperatures and, therefore, it is necessary to heat such electronic modules to enable low temperature start-up. In the conventional heating scheme, a heating film is used to heat, as shown in fig. 1, a heating film 100 is covered on the surface of an electronic module to be heated, and the heating film 100 generates heat and conducts the heat to the electronic module, so that a heating effect is achieved. However, the number of the electronic modules to be heated in the reinforced computer is too many, and the number of the electronic modules to be heated in part of the model is 7-8, even up to more than ten, and the scale of each electronic module is not uniform, if each electronic module is correspondingly covered with the heating film 100, the structure is too complex for the design and assembly of the reinforced computer, and the production and the manufacture are not facilitated; the cost of heating the film is high, and the more heating the film requires more cost; the specifications of the heating films corresponding to different electronic modules are also different, which is not beneficial to the management of parts.

Therefore, there is a need for a heating structure to address at least the above-mentioned problems.

Disclosure of Invention

The embodiment of the application aims to provide a heating structure and electronic equipment, so as to solve the problems that the heating mode of each electronic module corresponding to a heating film is complex in structure, high in cost and unfavorable for management when a reinforced computer is started at a low temperature.

In order to solve the technical problems, the embodiment of the application provides the following technical scheme:

a first aspect of the present application provides a heating structure comprising: the fan module is used for being arranged in the electronic equipment; the heating component is arranged in the electronic equipment and is positioned at the air outlet side of the fan module; the fan module provides air flow, and the air flow can flow through the heating component and blow into the electronic equipment.

In some embodiments of the present application, the fan module is disposed near the first side of the electronic device or at a junction of adjacent first and second sides of the electronic device.

In some embodiments of the present application, the heat generating component is disposed parallel to and adjacent to the fan module, and the heat generating component is located at an air outlet side of the fan module.

In some embodiments of the present application, the heat generating component is attached to the fan module.

In some embodiments of the present application, the heat generating component is provided with a vent therethrough, and the air flow provided by the fan module is capable of blowing into the electronic device through the vent.

In some embodiments of the present application, a heat generating element is disposed within the heat generating component or within the vent.

In some embodiments of the present application, the heat generating element comprises a heat generating wire and/or a heat generating sheet.

In some embodiments of the present application, the heating structure further comprises: the temperature monitoring device is arranged in the electronic equipment; the control module, the fan module, the heating component and the temperature monitoring device are respectively and electrically connected with the control module, and the control module controls the starting and stopping of the heating component and the fan module according to the temperature signals detected by the temperature monitoring device.

In some embodiments of the present application, the heating structure further comprises: and the power supply is electrically connected with the control module, the fan module and the heating component.

A second aspect of the present application provides an electronic device comprising the heating structure provided in the first aspect of the present application.

Compared with the prior art, the heating structure that this application first aspect provided utilizes the fan module to provide the air current, and the heating element is located the air-out side of fan module to make the air current carry out the heat transfer through the heating element, form the heating air current, the heating air current blows to electronic equipment inside, thereby can heat each electronic module, so that electronic equipment can the low temperature start.

The electronic device provided in the second aspect of the present application has the same or similar technical effects as the heating structure provided in the first aspect of the present application.

Drawings

The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like reference numerals refer to similar or corresponding parts and in which:

FIG. 1 is a schematic diagram of a prior art heating scheme;

FIG. 2 shows a schematic structural view of a heating structure provided by an embodiment of the present application;

FIG. 3 shows a schematic structural diagram of a heating structure provided in an embodiment of the present application when inside an electronic device;

FIG. 4 illustrates a top view of a heating structure provided by an embodiment of the present application within an electronic device;

FIG. 5 shows an exploded schematic view of a heating structure provided by an embodiment of the present application;

FIG. 6 is a schematic view showing a first surface side structure of a heat generating component in a heating structure according to an embodiment of the present application;

fig. 7 shows a schematic view of a second surface side structure of a heat generating component in a heating structure provided in an embodiment of the present application.

Reference numerals illustrate:

1. a fan module; 2. a heat generating component; 3. a vent hole; 4. a circuit board; 5. a heat dissipation fan module; 6. an electronic module; 7. a mounting bracket; 8. a first surface; 9. a second surface; 10. a heating element; 11. a first bore section; 12. a second bore section;

100. the film is heated.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs.

In order to solve among the prior art when facing the low temperature start demand, adopt the heating membrane to heat electronic module 6 cover, the quantity of heating membrane is many, the specification is different, leads to the problem that the structure is complicated, with high costs, management cost increases, the embodiment of this application provides a heating structure, utilizes the heating air current to heat electronic module 6 that electronic equipment is inside to wait to heat to the cost is reduced, and simple structure easily implements.

As shown in fig. 2 to 7, the heating structure provided in the embodiment of the present application includes: the fan module 1, the fan module 1 is used for setting up in the electronic equipment; the heating component 2 is arranged in the electronic equipment, and the heating component 2 is positioned at the air outlet side of the fan module 1; wherein the fan module 1 provides an air flow which can flow through the heat generating component 2 and blow to the inside of the electronic device.

In the embodiments of the present application, the electronic device may be a rugged computer, or other device that requires low temperature startup.

The fan module 1 may be a commercially available fan module 1 for providing air flow. It is worth to say that, the fan module 1 is not the inside radiator fan module 5 of electronic equipment, and the embodiment of the application provides the fan module 1 and the inside radiator fan module 5 of electronic equipment mutually independent, and not simultaneous working, avoid heat loss to guarantee the heating effect.

The heating component 2 can generate heat, the heat provided by the heating component 2 can heat the airflow flowing through the heating component 2 to form heating airflow, and the heating airflow is blown out from the heating component 2 to the inside of the electronic equipment under the action of the fan module 1, so that the electronic module 6 can meet the low-temperature starting requirement, and the electronic module 6 can be a functional module which is difficult to start at a low temperature, such as a chip, a CPU, a GPU, a memory module and the like.

The embodiment of the application provides a heating structure, utilizes fan module 1 to provide the air current, and heating element 2 is located the air-out side of fan module 1 to make the air current can carry out the heat transfer through heating element 2, form the heating air current, the heating air current blows to electronic equipment inside, thereby can heat each electronic module 6, so that can the low temperature start. Compared with the existing heating scheme, the application omits the use of the heating film, so that the production cost can be reduced, the fan module 1 and the heating component 2 are convenient to lay out, the structure is simple, the electronic equipment is heated in a heating airflow mode, and all electronic modules 6 which are required to be started at low temperature in the electronic equipment can be heated, so that the heating effect is uniform and reliable.

In the embodiment of the application, the fan module 1 is disposed at a first side surface close to the electronic device or at a connection position between the adjacent first side surface and the second side surface of the electronic device.

As shown in fig. 3 and 4, the fan module 1 is disposed near the edge of the electronic device, so that the air flow can be blown toward the inside of the electronic device, and the air flow can flow through a wide area of the inside of the electronic device. For example, the electronic device is of a rectangular structure including four sides connected to each other, wherein the first side and the second side are adjacent to each other and connected to each other, and the fan module 1 may be disposed near any one of the sides or may be disposed at a corner to enable the blown air flow to blow toward a larger area inside the electronic device.

In the embodiment of the present application, the fan module 1 may be disposed near the cooling fan module 5 of the electronic device so as to be uniformly laid out.

As shown in fig. 4, in the embodiment of the present application, the heat generating component 2 is disposed parallel to and adjacent to the fan module 1, and the heat generating component 2 is located at the air outlet side of the fan module 1. The heating component 2 is adjacent to the fan module 1, so that most of the air flow provided by the fan module 1 can obtain heat through the heating component 2, thereby ensuring the heating effect.

In the embodiment of the application, the heating component 2 is attached to the fan module 1.

Inside the electronic equipment, the electronic module 6 to be started at low temperature is connected to the circuit board 4, the fan module 1 is arranged at the edge of the electronic equipment and faces the inside of the electronic equipment, and the fan module 1 is located on one side of the circuit board 4, to which the electronic module 6 is connected. Taking the circuit board 4 as a reference plane, the bottom of the fan module 1 is close to the circuit board 4, the top of the fan module is far away from the circuit board 4, and the bottom of the heating component 2 is close to the circuit board 4, and the top of the heating component is far away from the circuit board 4; wherein the top of the fan module 1 is flush with the top of the heating component 2; and/or, two sides of the fan module 1 perpendicular to the air outlet direction are flush with the heating component 2, so that the heating component 2 is aligned with the fan module 1, and the installation space is saved.

As shown in fig. 5, in the embodiment of the present application, the heat generating component 2 is provided with a ventilation hole 3 therethrough, and the air flow provided by the fan module 1 can be blown into the electronic device through the ventilation hole 3.

As shown in fig. 3, a vent hole 3 may be provided in the middle of the heat generating part 2, and an air flow provided by the fan module 1 can pass through the vent hole 3 and absorb heat while flowing through the heat generating part 2. The heat generating component 2 has a preset thickness, and the air flow at the wall of the vent hole 3 or the attachment can absorb the heat of the heat generating component 2.

In the embodiment of the application, the fan module 1 can be attached to the heating component 2, and the air outlet side of the fan module 1 is provided with an air outlet corresponding to the vent hole 3, so that the air flow provided by the fan module 1 is blown into the electronic equipment through the vent hole 3.

As shown in fig. 2 and 5, in the embodiment of the present application, the heating structure further includes a mounting bracket 7, and the fan module 1 may be mutually attached to the heat generating component 2 and connected to one body through the mounting bracket 7, thereby forming an integral structure, and being convenient for assembly.

In the embodiment of the application, the mounting bracket 7 may be in an L-shaped structure, including a third side and a fourth side that are connected to each other, and the heating component 2 is connected to the third side of the mounting bracket 7, and correspondingly, the fan module 1 is connected to the fourth side of the mounting bracket 7. The third side and/or the fourth side of the mounting bracket 7 may be provided with a plurality of first connection holes connected with the heat generating part 2 or the fan module 1 and a plurality of second connection holes for connection with a target mounting structure to achieve fixation. The second connection hole may be a waist-shaped hole or a circular hole.

In the embodiment of the application, the heating component 2 is provided with a connecting lug, the connecting lug is connected with a first connecting hole corresponding to the mounting bracket 7, and the fan module 1 is connected with the heating component 2.

It should be noted that the mounting bracket 7 has a clearance hole corresponding to the vent hole 3, which can provide an airflow channel on the one hand, and limit the heat generating component 3 on the other hand. The vent hole 3 is arranged at one end of the fan module 1 in a protruding mode, and the mounting bracket 7 is sleeved corresponding to the vent hole 3, so that positioning between the mounting bracket 7 and the heating component 2 is achieved.

The third side of the mounting bracket 7 is also provided with a first flanging structure, the first flanging structure is arranged opposite to the fourth side and used for being matched with the fourth side to limit the displacement of the heating component 2, the third side is also provided with a pair of second flanging structures which are arranged opposite to each other, the pair of second flanging structures, the first flanging structure and the fourth side form four sides of the heating component 2 to limit the position, so that the heating component 2 is embedded in the third side of the mounting bracket 7, and the purpose of accurately positioning and limiting the displacement of the heating component 2 is realized through the avoidance hole.

In the embodiment of the application, the fan module 1 and the heat generating component 2 may be connected to an internal frame of the electronic device, for example, the fan module 1 and the heat generating component 2 are fixed to the internal frame of the electronic device by using a bolt connection or a clamping connection, respectively. Alternatively, the fan module 1 or the heat generating component 2 is connected to other electronic equipment internal components such as the cooling fan module 5 through the mounting bracket 7, thereby facilitating the assembly layout.

In the embodiment of the application, a heating element 10 is arranged in the heating component 2 or the ventilation hole 3, and the heating element 10 comprises a heating wire and/or a heating sheet.

In embodiments of the present application, the heating element 10 may be made of metal or ceramic. For example, it may be made of a metal heating wire or a ceramic heating sheet. The heating component 2 is heated by electric heating, so that the heating stability is ensured, and the heating effect is further ensured.

As shown in fig. 6 and 7, in the embodiment of the present application, the heat generating component 2 includes a first surface 8 and a second surface 9 that are oppositely disposed, the first surface 8 faces the fan module 1, the second surface 9 faces the inside of the electronic device, the ventilation hole 3 includes a first hole section 11 and a second hole section 12 that are mutually communicated, the first hole section 11 is communicated with the first surface 8, the second hole section 12 is communicated with the second surface 9, and the projection range of the first hole section 11 on the fan module 1 is not less than the aperture of the air outlet of the fan module 1, so that the air current passes through the heat generating component 2 first and then blows into the inside of the electronic device.

As shown in fig. 6 and 7, in the embodiment of the present application, the vent hole 3 is provided with a heating element 10. The heating element 10 includes a plurality of heating sheets disposed in the first hole section 11 in parallel to the air outlet direction, so that the contact area of the air flow and the heating unit can be increased.

As shown in fig. 6, for convenience of layout, the first hole section 11 may be a rectangular hole, and a plurality of heat generating fins are distributed in the first hole section 11 in a rectangular array, so as to ensure the heating effect on the air flow. For example, the first hole segment 11 is partitioned into a plurality of sections adjacent to each other in the first direction by a partition plate, and a plurality of heat generating fins are provided in each section at intervals, and the first direction may be a horizontal direction or a vertical direction, and the air flow passes through the spaces between the heat generating fins, so that the contact area with the heat generating component 2 can be increased.

In the embodiment of the application, the first hole section 11 can be square hole, and the side length of the first hole section 11 is slightly less than the aperture of the air outlet, and the first hole section 11 is further provided with an arc section arranged on each side, and the arc section is matched with the aperture of the air outlet, so that the air flow blown out from the air outlet is ensured, and the air flow can be basically fully heated in the ventilation hole 3.

As shown in fig. 7, the second hole section 12 may be a circular hole corresponding to the air outlet of the fan module 1, a rectangular hole corresponding to the first hole section 11, or a variable diameter hole to adjust the flow rate of the air flow.

Alternatively, the first hole section 11 may be a circular hole corresponding to the air outlet of the fan module 1, and the plurality of heat generating fins are uniformly distributed in the first hole section 11 in a rectangular array, and by the design of the circular hole, the air flow can keep a stable flow velocity when being blown out through the heat generating component 2.

In an embodiment of the present application, a grille structure may be disposed in the second hole section 12, for guiding the airflow, so that the airflow blows into the electronic device along a preset direction.

In the embodiment of the application, the piece that generates heat can be rectangular form, and the length direction of piece that generates heat can be on a parallel with vertical direction, also can be on a parallel with the horizontal direction, forms the clearance between the adjacent piece that generates heat, and the clearance is on a parallel with the air-out direction setting to increase the area of contact of air current and heating element 2, improve the heating effect to the air current, and can reduce the resistance that the air current received.

In the embodiment of the application, the heating element 10 includes a plurality of heating wires, the first hole section 11 may be a round hole corresponding to the air outlet of the fan module 1, and the plurality of heating wires are arranged in the first hole section 11 in a splicing net structure.

In the embodiment of the application, the net structure formed by splicing the heating wires can be a plurality of net structures arranged along the air outlet direction.

In the embodiment of the present application, the heat generating component 2 is provided with the heat generating element 10 therein. The heating element 2 further includes a housing, the heating element 10 is disposed in the housing, the ventilation hole 3 is disposed in the middle of the housing, and the heating element 10 may include a plurality of heating wires, or at least one heating sheet. The heating element 10 is disposed adjacent to or around the vent hole 3 so that the air flow passing through the vent hole 3 is heated. The housing may be made of a heat conductive material so that heat provided by the heating wire is dissipated into the air to heat the air flowing through the heating element 2.

In the embodiment of the application, the ventilation holes 3 of the heating component 2 can be multiple, and the ventilation holes 3 are uniformly distributed in the air outlet direction perpendicular to the fan module 1, so that the flow area of air flow and the contact area with the heating component 2 can be increased, and the heating effect on the inside of the electronic equipment is improved.

In the embodiment of the application, the heating component 2 comprises a plurality of heating units, wherein the plurality of heating units are uniformly distributed in the direction perpendicular to the air outlet, and two adjacent heating units are provided with gaps so as to facilitate the air flow to pass through. The plurality of heat generating units may be independent of each other or may be connected to each other at the top and/or bottom to form a unit for easy installation.

Each of the heat generating units includes a heat generating element 10, respectively, so that heat can be generated in the form of electric heating by a heat generating wire or a heat generating sheet.

In the embodiment of the application, the heating unit also can be the cylinder, and adjacent cylinder interval sets up in perpendicular to air-out direction, and the air current can be passed through between the adjacent heating unit to guarantee the heating effect, the inside or the surface of cylinder can set up the heater strip, in order to realize generating heat.

In an embodiment of the present application, the heating structure further comprises: the temperature monitoring device is arranged in the electronic equipment; the control module, the fan module 1, the heating component 2 and the temperature monitoring device are respectively and electrically connected with the control module, and the control module controls the starting and stopping of the heating component 2 and the fan module 1 according to the temperature signal detected by the temperature monitoring device.

The temperature monitoring device may be a temperature sensor provided in the electronic device or further may be provided on the target electronic module 6 to be activated at a low temperature for detecting the temperature inside the electronic device or the target electronic module 6. When the electronic equipment needs to be started, the temperature sensor detects the temperature of the electronic equipment or the target electronic module 6 and transmits a temperature signal to the control module, when the temperature signal is lower than a low temperature value which can be started by the target electronic module 6, the control module can control the heating component 2 and the fan module 1 to be started according to the temperature signal, the air outlet side of the fan module 1 provides air flow, the air flow is blown out and then absorbs heat through the heating component 2, and then the air flow is blown into the electronic equipment, so that each electronic module 6 in the electronic equipment can be heated and heated, and the electronic equipment can be started.

The starting of the electronic equipment can be realized through a singlechip or a starting switch, when the electronic equipment needs to be started, the singlechip or the starting switch transmits a starting signal to a control module, and the control module starts and receives a temperature signal transmitted by a temperature sensor, so that whether the heating system is started or not is judged.

In an embodiment of the present application, the heating structure further comprises: and the power supply is electrically connected with the control module, the fan module 1 and the heating component 2.

The heating structure obtains electric energy through the power supply, and the power supply can be independent of the power supply sources used by the power supply circuit board 4, the electronic module 6 and the like of the electronic equipment, and the power supply can only supply power to the fan module 1, the heating component 2 and the control module, so that the fan module 1 can work independently of the cooling fan module 5 of the electronic equipment, and the cooling fan module 5 does not work when the fan module 1 supplies air flow to the heating component 2, thereby avoiding heat dissipation. The fan module 1 may also be disposed near the radiator fan module 5, so as to facilitate uniform layout.

Compared with the existing heating scheme, the heating structure provided by the embodiment of the application has the advantages that the use of the heating film is canceled, and the purchasing cost and the management cost are reduced; since the fan module 1 only provides the air flow blowing to the heat generating component 2, the fan noise is not lifted, and the negative effect is small. The heating structure provided by the embodiment of the application simplifies the design, has a simple structure, is convenient to install, is convenient for engineering, is simple and easy to design and assemble, is low in cost, and is convenient for mass production.

The embodiment of the application also provides electronic equipment, which comprises the heating structure.

The electronic device provided by the embodiment of the application can be a reinforced computer or other devices needing low-temperature heating. The fan module 1 is arranged in the electronic equipment and is close to the edge, the heating component 2 is arranged adjacent to the fan module 1, the air flow provided by the fan module 1 absorbs heat through the heating component 2 to form heating air flow, and then the heating air flow is blown into the electronic equipment under the action of the fan module 1, so that the electronic modules 6 to be started at low temperature in the electronic equipment can be uniformly heated, and the electronic modules 6 can be started.

The heating structure provided by the embodiment of the application is wide in application, can be used for reinforcing a computer, can be used for other similar products needing low-temperature heating, and is convenient to assemble, low in cost and easy to produce in mass.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A heating structure, comprising:

the fan module is used for being arranged in the electronic equipment;

the heating component is arranged in the electronic equipment and is positioned at the air outlet side of the fan module;

the fan module provides air flow, and the air flow can flow through the heating component and blow into the electronic equipment.

2. The heating structure of claim 1, wherein the heating structure comprises a plurality of heating elements,

the fan module is arranged at a position close to the first side surface of the electronic equipment or at a joint of the adjacent first side surface and the second side surface of the electronic equipment.

3. The heating structure of claim 1, wherein the heating structure comprises a plurality of heating elements,

the heating component is parallel to and adjacent to the fan module, and is positioned on the air outlet side of the fan module.

4. The heating structure of claim 1, wherein the heating structure comprises a plurality of heating elements,

the heating component is attached to the fan module.

5. A heating structure according to claim 3 or 4, wherein,

the heating component is provided with a ventilation hole which penetrates through the heating component, and air flow provided by the fan module can pass through the ventilation hole to blow into the electronic equipment.

6. The heating structure of claim 5, wherein the heating structure comprises a heating element,

and a heating element is arranged in the heating component or the ventilation hole.

7. The heating structure of claim 6, wherein the heating structure comprises a plurality of heating elements,

the heating element comprises a heating wire and/or a heating sheet.

8. The heating structure of claim 1, further comprising:

the temperature monitoring device is arranged in the electronic equipment;

the control module, the fan module, the heating component and the temperature monitoring device are respectively and electrically connected with the control module, and the control module controls the starting and stopping of the heating component and the fan module according to the temperature signals detected by the temperature monitoring device.

9. The heating structure of claim 8, further comprising:

and the power supply is electrically connected with the control module, the fan module and the heating component.

10. An electronic device characterized by comprising a heating structure according to any one of claims 1 to 9.