CN220303596U

CN220303596U - Radiating mechanism of UVLED curing lamp

Info

Publication number: CN220303596U
Application number: CN202321767825.7U
Authority: CN
Inventors: 杨亿欣
Original assignee: Okur Uv Taizhou Technology Co ltd
Current assignee: Okur Uv Taizhou Technology Co ltd
Priority date: 2023-07-06
Filing date: 2023-07-06
Publication date: 2024-01-05
Anticipated expiration: 2033-07-06

Abstract

The utility model discloses a heat dissipation mechanism of a UVLED curing lamp, which comprises a chassis, wherein the LED curing lamp is arranged at the bottom end of the interior of the chassis, a water cooling heat dissipation mechanism extending to the interior of the chassis is arranged on the chassis, and the water cooling heat dissipation mechanism comprises: the heat absorption device comprises a water storage tank, a heat absorption pipe, a water pump, a backflow pipe, spherical shells and semiconductor refrigerating sheets, wherein the water storage tank is fixed at the top of a case, the water pump is installed in the water storage tank and connected with the heat absorption pipe through a pipeline, the heat absorption pipe is attached to an LED curing lamp, the left end of the heat absorption pipe is connected with the backflow pipe, the backflow pipe is communicated with the water storage tank, a plurality of spherical shells are arranged on the backflow pipe, a plurality of semiconductor refrigerating sheets are installed on the outer side of each spherical shell, a plurality of radiating fins extending to the inner portion of the case are installed on the case, and a fan is installed on the right end of the inner portion of the case. According to the utility model, heat dissipation is performed in a mode of combining air cooling and water cooling, so that the cooling effect is better.

Description

Radiating mechanism of UVLED curing lamp

Technical Field

The utility model relates to the field of curing lamps, in particular to a heat dissipation mechanism of a UVLED curing lamp.

Background

The working principle of the light curing lamp is to cure the light curing resin by utilizing the characteristic of purple light, so the light curing lamp is purple light and also has blue light. Generally, a light curing lamp for ultraviolet light is industrially used, and the wavelength of ultraviolet light is within 400nm, and the ultraviolet light and visible light are close to each other about 400, so that blue light is received by human eyes.

The UVLED curing lamp is a single-wavelength light source, only effective wavelength is generated, the use is safer, and the power consumption is lower, so the UVLED curing lamp is one of the most commonly used curing lamps. However, a large amount of heat is generated when the LED curing lamp works, the service life is influenced, and the phenomena of expansion deformation, purple fog and the like of the lamp tube can also occur. The existing UVLED curing lamp dissipates heat in an air-cooling mode, when the temperature of the external environment is high, the air-cooling heat dissipation effect is poor, the temperature of the UVLED curing lamp is quickly increased, and the use is affected, so that aiming at the current situation, the development of a heat dissipation mechanism of the UVLED curing lamp, which dissipates heat in a mode of combining air cooling and water cooling, is urgently needed, and the heat dissipation mechanism of the UVLED curing lamp is better in cooling effect, so that the defects in the current practical application are overcome, and the current requirements are met.

Disclosure of Invention

The utility model aims to provide a radiating mechanism of a UVLED curing lamp, which aims to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a heat dissipation mechanism of UVLED curing lamp, includes the quick-witted case, the LED curing lamp is installed to the inside bottom of machine case, install the water cooling mechanism that extends to its inside on the machine case, water cooling mechanism includes: the solar heat collecting device comprises a water storage tank, a heat absorption pipe, a water pump, a return pipe, spherical shells and semiconductor refrigerating sheets, wherein the water storage tank is fixed at the top of a case, the water pump is installed in the water storage tank and connected with the heat absorption pipe through a pipeline, the heat absorption pipe is attached to an LED curing lamp, the left end of the heat absorption pipe is connected with the return pipe, the return pipe is communicated with the water storage tank, a plurality of spherical shells are arranged on the return pipe, each spherical shell is provided with a plurality of semiconductor refrigerating sheets on the outer side, a plurality of radiating fins extending into the case are installed on the case, and a fan is installed on the right end of the case.

As a further scheme of the utility model: and heat dissipation grooves are formed in the left side and the right side of the case.

As still further aspects of the utility model: the heat absorption pipe is formed by splicing a plurality of U-shaped pipes.

As still further aspects of the utility model: the heat absorption pipe, the return pipe, the spherical shell and the radiating fins are all made of copper.

The beneficial effects are that: this heat radiation mechanism of UVLED curing lamp, when LED curing lamp work distributes a large amount of heat, heat conduction to outside with quick-witted incasement through radiating fin, through the fan air-blowing quickens the air velocity, and then reduce quick-witted incasement temperature, simultaneously, carry cold water to the heat absorption intraductal through the water pump, heat on the LED curing lamp is absorbed through the heat absorption pipe, the rivers after the heat absorption get back to in the water storage tank through the back flow, when hot water passes through the back flow, refrigerate the spherical shell through the semiconductor refrigeration piece, heat in the rivers is absorbed through the spherical shell, and then make rivers cooling, thereby make cold water circulate, reduce the temperature of LED curing lamp. In conclusion, the cooling effect is better by radiating in a mode of combining air cooling and water cooling.

Drawings

Fig. 1 is a schematic perspective view of the present utility model.

Fig. 2 is a schematic perspective view of a second embodiment of the present utility model.

Fig. 3 is an internal view of the chassis of the present utility model.

Fig. 4 is a schematic view of a part of the structure of the present utility model.

In the figure: 1. a chassis; 101. a heat sink; 2. an LED curing lamp; 3. a water-cooling heat dissipation mechanism; 301. a water storage tank; 302. a heat absorbing pipe; 303. a water pump; 304. a return pipe; 305. a spherical shell; 306. a semiconductor refrigeration sheet; 4. a heat radiation fin; 5. a fan.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

Referring to fig. 1 to 4, in an embodiment of the present utility model, a heat dissipation mechanism of a uv LED curing lamp includes a chassis 1, an LED curing lamp 2 is installed at an inner bottom end of the chassis 1, heat dissipation grooves 101 are provided at left and right sides of the chassis 1, air circulation is facilitated through the heat dissipation grooves 101, so that heat in the chassis 1 is dissipated, a water cooling heat dissipation mechanism 3 extending into the chassis 1 is installed, and the water cooling heat dissipation mechanism 3 includes: the water storage tank 301, the heat absorption pipe 302, the water pump 303, the return pipe 304, the spherical shell 305 and the semiconductor refrigerating sheet 306, wherein the water storage tank 301 is fixed at the top of the case 1, a water inlet is arranged on the water storage tank 301, the water pump 303 is arranged in the water storage tank 301, the water pump 303 is connected with the heat absorption pipe 302 through a pipeline, the heat absorption pipe 302 is attached to the LED curing lamp 2, the heat absorption pipe 302 is formed by splicing a plurality of U-shaped pipes, the flowing time of water flow in the heat absorption pipe 302 is further prolonged, the left end of the heat absorption pipe 302 is connected with the return pipe 304, the return pipe 304 is communicated with the water storage tank 301, a plurality of spherical shells 305 are arranged on the return pipe 304, the spherical design of the spherical shells 305 enables the surface area of the spherical shells to be larger, the contact area with air is enlarged, the heat dissipation speed is improved, a plurality of semiconductor refrigerating sheets 306 are arranged on the outer side of each spherical shell 305, during the use, carry cold water to the heat absorption pipe 302 through the water pump 303, absorb the heat on the LED curing lamp 2 through the heat absorption pipe 302, the rivers after the heat absorption get back to in the water storage tank 301 through the back flow 304, when hot water passes through the back flow 304, refrigerate spherical shell 305 through semiconductor refrigeration piece 306, absorb the heat in the rivers through spherical shell 305, and then make the rivers cool off, install a plurality of radiating fins 4 that extend to its inside on the machine case 1, the fan 5 is installed to the inside right-hand member of machine case 1, and accelerate the air velocity of flow through the fan 5 bloies, and then reduce the temperature in the machine case 1, heat conduction outside in machine case 1 through radiating fins 4, and then the temperature of LED curing lamp 2, heat absorption pipe 302, back flow 304, spherical shell 305 and radiating fins 4 all adopt copper to make it have good heat conductivity.

The working principle of the utility model is as follows: this heat radiation mechanism of UVLED curing lamp, when LED curing lamp 2 work distributes a large amount of heat, heat conduction to outside in with quick-witted case 1 through fin 4, it accelerates the air velocity to blow through fan 5, and then reduce quick-witted incasement temperature, simultaneously, carry cold water to the heat absorption intraductal 302 through water pump 303, heat on the LED curing lamp 2 is absorbed through the heat absorption pipe 302, the rivers after the heat absorption get back to in the water storage tank 301 through back flow 304, when hot water passes through back flow 304, refrigerate spherical shell 305 through semiconductor refrigeration piece 306, absorb the heat in the rivers through spherical shell 305, and then make the rivers cool off, thereby make cold water circulate, reduce the temperature of LED curing lamp 2.

Claims

1. A heat dissipation mechanism of UVLED curing lamp, its characterized in that: including quick-witted case (1), LED curing lamp (2) are installed to the inside bottom of machine case (1), install on machine case (1) and extend to its inside water cooling mechanism (3), water cooling mechanism (3) include: the novel solar heat collector comprises a water storage tank (301), a heat absorption pipe (302), a water pump (303), a return pipe (304), spherical shells (305) and semiconductor refrigerating sheets (306), wherein the water storage tank (301) is fixed at the top of a case (1), the water pump (303) is installed in the water storage tank (301), the water pump (303) is connected with the heat absorption pipe (302) through a pipeline, the heat absorption pipe (302) is attached to an LED curing lamp (2), the left end of the heat absorption pipe (302) is connected with the return pipe (304), the return pipe (304) is communicated with the water storage tank (301), a plurality of spherical shells (305) are arranged on the return pipe (304), a plurality of semiconductor refrigerating sheets (306) are installed on the outer side of each spherical shell (305), a plurality of radiating fins (4) extending to the inner portion of the case (1) are installed on the case (1), and a fan (5) is installed on the right end of the inner portion of the case (1).

2. The heat dissipation mechanism of a uv led curing lamp of claim 1, wherein: the left side and the right side of the case (1) are provided with radiating grooves (101).

3. The heat dissipation mechanism of a uv led curing lamp of claim 1, wherein: the heat absorption tube (302) is formed by splicing a plurality of U-shaped tubes.

4. The heat dissipation mechanism of a uv led curing lamp of claim 1, wherein: the heat absorption pipe (302), the return pipe (304), the spherical shell (305) and the radiating fins (4) are all made of copper.