CN219793163U - High-speed copper plating equipment for quickly supplementing metal ions - Google Patents
High-speed copper plating equipment for quickly supplementing metal ions Download PDFInfo
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- CN219793163U CN219793163U CN202321334276.4U CN202321334276U CN219793163U CN 219793163 U CN219793163 U CN 219793163U CN 202321334276 U CN202321334276 U CN 202321334276U CN 219793163 U CN219793163 U CN 219793163U
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- Prior art keywords
- copper
- plating
- electroplating
- auxiliary tank
- ion
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 106
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 94
- 239000010949 copper Substances 0.000 title claims abstract description 94
- 238000007747 plating Methods 0.000 title claims abstract description 77
- 229910021645 metal ion Inorganic materials 0.000 title claims abstract description 20
- 230000001502 supplementing effect Effects 0.000 title claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 55
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 45
- 239000007788 liquid Substances 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 27
- 239000003814 drug Substances 0.000 claims abstract description 23
- 238000007733 ion plating Methods 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000000047 product Substances 0.000 claims description 13
- 238000001914 filtration Methods 0.000 claims description 8
- 229910000510 noble metal Inorganic materials 0.000 claims description 7
- 239000011253 protective coating Substances 0.000 claims description 7
- 239000013589 supplement Substances 0.000 claims description 5
- 238000004090 dissolution Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 claims description 3
- 229910000457 iridium oxide Inorganic materials 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 abstract description 4
- 238000005086 pumping Methods 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000036632 reaction speed Effects 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
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- Chemically Coating (AREA)
Abstract
The utility model relates to the technical field of electroplating, in particular to a device for quickly supplementing metal ions for high-speed copper plating, which comprises an electroplating bath and a copper-dissolving auxiliary tank positioned at the outer side of the electroplating bath, wherein electroplating liquid is contained in the electroplating bath, the copper-dissolving auxiliary tank is filled with blending liquid and copper-dissolving materials, the copper-dissolving materials react with the blending liquid and dissolve and release copper ions to form high-concentration metal copper ion plating solution, the copper-dissolving auxiliary tank is communicated with the electroplating bath through a liquid supply pipeline, an automatic adding system is arranged on the liquid supply pipeline, and the automatic adding system is used for pumping the metal copper ion plating solution in the copper-dissolving auxiliary tank into the electroplating bath, so that the copper ion content in the electroplating liquid is changed. Above-mentioned equipment sets up and dissolves copper auxiliary tank outside current plating bath, through dissolving copper auxiliary tank and preparing the metal copper ion plating solution of high concentration in advance to according to the copper plating demand of different electroplating products, carry out regularly, quantitative quick replenishment copper ion liquid medicine for the plating bath through automatic adding system, thereby improved copper plating efficiency.
Description
Technical Field
The utility model relates to the technical field of electroplating, in particular to a device for rapidly supplementing metal ions in high-speed copper plating.
Background
In the new energy battery industry, the copper electroplating process of the product is a key technology. In the prior art, each individual copper plating tank is used for dissolving copper by utilizing a preset amount of anodes and phosphorus copper balls with preset specifications, so that copper ions are released for electroplating, the content and the speed of the released copper ions are limited, and the copper plating speed is further limited. In addition, the conventional electroplating bath is used for dissolving copper, the deep-processing formed phosphor copper ball is high in use cost, and optimization is needed.
Disclosure of Invention
Based on the problems, the utility model aims to provide a device for rapidly supplementing metal ions in high-speed copper plating, which meets the requirement of rapidly filling the copper ion content in a copper plating bath solution so as to improve the high-speed copper plating effect.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a high-speed copper plating supplements metal ion equipment fast, it includes plating bath and the copper auxiliary tank that dissolves that is located the outside of plating bath, the splendid attire has electroplating liquid medicine in the plating bath, it has allotment liquid medicine and dissolves copper material to dissolve copper auxiliary tank, dissolve copper material and allotment liquid medicine reaction and dissolve release copper ion, form high concentration metal copper ion plating solution, dissolve copper auxiliary tank and plating bath between through the feed liquor pipeline intercommunication, be provided with automatic addition system on the feed liquor pipeline, automatic addition system is arranged in with the metal copper ion plating solution pump in the copper auxiliary tank of dissolving to the plating bath, thereby change the copper ion content in the electroplating liquid medicine.
Optionally, the automatic adding system comprises a liquid medicine adding pump, a copper ion measuring instrument is arranged in the electroplating bath, and the copper ion measuring instrument is in signal connection with the liquid medicine adding pump.
Optionally, the copper-dissolving material in the copper-dissolving auxiliary tank comprises copper wire copper material rim, high-purity clean copper powder, phosphor copper material rim or industry standard deep-processing phosphor copper balls.
Optionally, a heater and a stirrer are arranged in the copper dissolving auxiliary tank and are used for assisting in preparing the metal copper ion plating solution.
Optionally, a shut-off valve is arranged on the liquid supply pipeline.
Optionally, the electroplating bath further comprises a circulating filtration system positioned at the outer side of the electroplating bath, wherein the circulating filtration system is communicated with the electroplating bath through a circulating pipeline and is used for purifying electroplating liquid in the electroplating bath.
Optionally, the electroplating liquid is immersed with an electroplating product cathode and an insoluble copper plating anode, and the surface of the insoluble copper plating anode is provided with a rare noble metal protective coating.
Optionally, the insoluble copper plating anode is positioned at two sides of the cathode of the electroplated product, and the distance between the insoluble copper plating anode and the cathode of the electroplated product is adjustable.
Optionally, the rare noble metal protective coating is an iridium oxide coating material.
In summary, the high-speed copper plating rapid metal ion supplementing device has the beneficial effects that the copper dissolving auxiliary tank is arranged outside the existing electroplating tank, high-concentration metal copper ion plating solution is prepared in advance through the copper dissolving auxiliary tank, and copper ion liquid medicine is timely and quantitatively supplemented for the electroplating tank through the automatic adding system according to copper plating requirements of different electroplating products, so that copper plating efficiency is improved, besides deep processing of phosphor copper balls, copper material copper wire rim charge, high-purity clean copper powder or phosphor copper material rim charge and the like can be adopted for the copper dissolving material of the copper dissolving auxiliary tank, so that copper plating raw material cost is saved, and electroplating quality is ensured.
Drawings
FIG. 1 is a schematic diagram of a high-speed copper plating rapid metal ion replenishing device according to an embodiment of the present utility model.
In the figure:
1. plating bath; 2. a copper dissolving auxiliary tank; 3. electroplating liquid medicine; 4. a metallic copper ion plating solution; 5. a liquid supply pipeline; 6. an automatic adding system; 7. a shut-off valve; 8. a circulating filtration system; 9. electroplating a cathode of the product; 10. insoluble copper plated anode.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar parts throughout, or parts having like or similar functions. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, mechanically connected, electrically connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present utility model, unless explicitly stated and limited otherwise, a first feature "above" or "below" a second feature may include the first feature and the second feature being in direct contact, or may include the first feature and the second feature not being in direct contact but being in contact by another feature therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature. The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
Referring to fig. 1, the present preferred embodiment provides a rapid metal ion replenishing apparatus for high-speed copper plating, which comprises a plating tank 1 and a copper dissolution sub-tank 2 located outside the plating tank 1.
Wherein, electroplating solution 3 is contained in electroplating bath 1, and the auxiliary copper dissolving tank 2 contains the blending solution and the copper dissolving material, and the copper dissolving material reacts with the blending solution and dissolves and releases copper ions to form high-concentration metal copper ion plating solution 4, and the auxiliary copper dissolving tank 2 is communicated with electroplating bath 1 through a liquid supply pipeline 5, and an automatic adding system 6 is arranged on the liquid supply pipeline 5, and the automatic adding system 6 is used for pumping the metal copper ion plating solution 4 in the auxiliary copper dissolving tank 2 into the electroplating bath 1, thereby changing the copper ion content in the electroplating solution 3 and effectively improving the copper plating rate.
Specifically, the automatic adding system 6 comprises a liquid medicine adding pump, a copper ion measuring instrument is arranged in the electroplating bath 1, the copper ion measuring instrument is in signal connection with the liquid medicine adding pump, and when the actual measured value of the copper ion measuring instrument is smaller than a set value, the liquid medicine adding pump is started to supplement copper ions in the electroplating bath 1; when the actual measured value of the copper ion measuring instrument reaches a set value, the liquid medicine adding pump is stopped, so that the copper ion content in the electroplating tank 1 meets the electroplating requirement, and the electroplating efficiency is improved. Further, a cut-off valve 7 is arranged on the liquid supply pipeline 5 to avoid the back flow of the plating liquid.
It should be noted that, the deep processing phosphor copper ball of industry standard can be adopted as general copper plating material in the copper dissolving auxiliary tank 2 here, but considering that the raw material cost of the deep processing phosphor copper ball is high, copper wire copper material rim charge, high purity clean copper powder or phosphor copper material rim charge and the like can also be adopted, copper ions can be provided, the effects of environmental protection recovery, rim charge recycling and cost saving are achieved, and the metal copper ion plating solution 4 in the copper dissolving auxiliary tank 2 is a pre-prepared solution, and can be pumped into the electroplating tank 1 after the detection content reaches the standard, so that the accurate and quantitative quick copper ion supplement for the electroplating liquid 3 is realized.
Further, a heater, a stirrer and the like are arranged in the copper dissolution auxiliary tank 2 and are used for assisting in preparing the metal copper ion plating solution 4, and through mild and cyclic stirring and the like, the copper dissolution material is ensured to be fully and uniformly dissolved.
In addition, this quick replenishment metal ion equipment of high-speed copper plating still includes the circulation filtration system 8 that is located the outside of plating bath 1, and circulation filtration system 8 and plating bath 1 pass through circulation pipeline intercommunication for the electroplating liquid 3 in the purification plating bath 1 avoids influencing the electroplating quality such as the copper powder copper slag of deposiing, and can adjust to suitable circulation volume and circulation frequency, reduces the maintenance degree of difficulty and cost.
In addition, the electroplating liquid 3 is immersed with an electroplating product cathode 9 and an insoluble copper plating anode 10, and the surface of the insoluble copper plating anode 10 is provided with a rare noble metal protective coating, preferably the rare noble metal protective coating is made of iridium oxide coating material, so that the situation that the anode drops copper powder and copper slag is reduced, the conductivity of the anode is improved, and the copper plating quality is improved.
Further, the insoluble copper plating anodes 10 are positioned on two sides of the cathode 9 of the electroplating product, the distance between the insoluble copper plating anodes 10 and the cathode 9 of the electroplating product is adjustable, the copper plating reaction speed is increased in an auxiliary mode by adjusting the distance between the anodes and the cathodes, and good copper plating compactness, thickness consistency, appearance flatness and glossiness are guaranteed by combining adjustment of circulation quantity and uniform distribution of the entering electroplating solution 3.
In summary, the above rapid metal ion supplementing device for high-speed copper plating has the following advantages:
(1) by establishing an auxiliary copper dissolving auxiliary tank outside the electroplating tank, copper ions are dissolved in advance for adding the copper ion content into electroplating liquid medicine;
(2) the automatic adding system effectively and accurately controls the adding amount of copper ions, conveniently and rapidly adjusts and supplements the copper ion concentration of electroplating liquid medicine, maintains the copper ion supply speed, and can effectively improve the copper plating rate;
(3) the copper dissolving material of the copper dissolving auxiliary tank can use copper material copper wire rim charge, high-purity clean copper powder or phosphor copper material rim charge to replace the original deep-processing phosphor copper ball, thereby saving the cost of copper plating raw materials and ensuring the electroplating quality;
(4) the insoluble anode with rare noble metal protective coating is used for replacing the conventional phosphorus copper anode, so that the conductivity and the conductivity rate are improved;
(5) the traditional fixed anode and copper plating products are changed into a spacing adjustable structure, so that different electroplating requirements are met, and the copper plating reaction speed is increased in an auxiliary manner;
(6) the filtering and circulating system can adjust the circulating amount of the liquid medicine and the liquid medicine exchange frequency in a variable frequency manner, so that the periodic cleaning and maintenance frequency is reduced, the maintenance difficulty and the personnel cost are reduced, and the productivity is effectively improved.
The above embodiments merely illustrate the basic principles and features of the present utility model, and the present utility model is not limited to the above embodiments, but can be variously changed and modified without departing from the spirit and scope of the present utility model, which is within the scope of the present utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (9)
1. The utility model provides a high-speed copper plating supplements metal ion equipment fast, its characterized in that includes plating bath and is located the copper auxiliary tank that dissolves of the outside of plating bath, it has electroplating liquid medicine to hold in the plating bath, it has allotment liquid medicine and dissolves copper material to dissolve copper auxiliary tank splendid attire, dissolve copper material with allotment liquid medicine reaction and dissolve release copper ion, form high concentration metal copper ion plating solution, dissolve copper auxiliary tank with communicate through the feed liquor pipeline between the plating bath, be provided with automatic interpolation system on the feed liquor pipeline, automatic interpolation system is used for with the metal copper ion plating solution pump in the copper auxiliary tank reaches in the plating bath, thereby change the copper ion content in the electroplating liquid medicine.
2. The rapid copper plating and metal ion supplementing device according to claim 1, wherein the automatic adding system comprises a liquid medicine adding pump, wherein a copper ion measuring instrument is arranged in the plating bath, and the copper ion measuring instrument is in signal connection with the liquid medicine adding pump.
3. The rapid copper plating and replenishment metal ion apparatus as recited in claim 1, wherein the copper-dissolving material in the copper-dissolving auxiliary tank comprises copper wire copper material rim, high purity clean copper powder, phosphor copper material rim or industry standard deep processed phosphor copper balls.
4. The rapid copper plating and replenishment metal ion apparatus as recited in claim 1, wherein a heater and a stirrer are provided in the copper dissolution sub-tank for assisting in the preparation of the metal copper ion plating solution.
5. The rapid copper plating and metal ion replenishing device according to claim 1, wherein a shut-off valve is provided on the liquid supply line.
6. The rapid replenishment metal ion plating equipment for high-speed copper plating as recited in claim 1, further comprising a circulating filtration system located outside the plating tank, wherein the circulating filtration system is communicated with the plating tank through a circulating pipeline for purifying the plating solution in the plating tank.
7. The rapid replenishment metal ion plating equipment for high-speed copper plating as recited in claim 1, wherein the plating solution is immersed with a plating product cathode and an insoluble copper plating anode, and the surface of the insoluble copper plating anode is provided with a rare noble metal protective coating.
8. The rapid replenishment metal ion plating device as recited in claim 7, wherein the insoluble copper plating anode is located on both sides of the cathode of the plating product, and wherein the distance between the insoluble copper plating anode and the cathode of the plating product is adjustable.
9. The rapid copper plating and replenishment metal ion apparatus as recited in claim 7, wherein the rare noble metal protective coating is an iridium oxide coating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321334276.4U CN219793163U (en) | 2023-05-29 | 2023-05-29 | High-speed copper plating equipment for quickly supplementing metal ions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321334276.4U CN219793163U (en) | 2023-05-29 | 2023-05-29 | High-speed copper plating equipment for quickly supplementing metal ions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219793163U true CN219793163U (en) | 2023-10-03 |
Family
ID=88177227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321334276.4U Active CN219793163U (en) | 2023-05-29 | 2023-05-29 | High-speed copper plating equipment for quickly supplementing metal ions |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219793163U (en) |
-
2023
- 2023-05-29 CN CN202321334276.4U patent/CN219793163U/en active Active
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