CN218998383U - Novel ceramic substrate structure - Google Patents
Novel ceramic substrate structure Download PDFInfo
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- CN218998383U CN218998383U CN202223150830.1U CN202223150830U CN218998383U CN 218998383 U CN218998383 U CN 218998383U CN 202223150830 U CN202223150830 U CN 202223150830U CN 218998383 U CN218998383 U CN 218998383U
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- adhesive layer
- ceramic inner
- inner layer
- ceramic
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- 239000000919 ceramic Substances 0.000 title claims abstract description 56
- 239000000758 substrate Substances 0.000 title claims abstract description 21
- 239000010410 layer Substances 0.000 claims abstract description 97
- 239000012790 adhesive layer Substances 0.000 claims abstract description 51
- 239000003292 glue Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- RCHKEJKUUXXBSM-UHFFFAOYSA-N n-benzyl-2-(3-formylindol-1-yl)acetamide Chemical compound C12=CC=CC=C2C(C=O)=CN1CC(=O)NCC1=CC=CC=C1 RCHKEJKUUXXBSM-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- -1 phenolic aldehyde Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model relates to the technical field of circuit boards, in particular to a novel ceramic substrate structure, which comprises a ceramic inner layer, a first adhesive layer, a second adhesive layer, a first PP layer and a second PP layer; the ceramic inner layer is provided with a hole structure; the first adhesive layer is arranged on the top side of the ceramic inner layer; the second adhesive layer is arranged at the bottom side of the ceramic inner layer; the first PP layer is arranged on one side of the first adhesive layer, which is away from the ceramic inner layer; the second PP layer is arranged on one side of the second adhesive layer, which is away from the ceramic inner layer, and the ceramic inner layer is simple in structure and reasonable in design.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a novel ceramic substrate structure.
Background
The base materials adopted by most of the current PCB boards are resin glass fibers, namely FR-4 or phenolic aldehyde resin FR-3, and part of phenolic aldehyde cotton paper FR-1, and the functionality of the boards cannot be ensured to be stable continuously in environments such as high-temperature resistance, high humidity resistance, little attenuation, corrosion resistance, small dielectric loss and the like which are required by high-power electronics, communication base stations, military industry and the like due to the characteristics of materials. Therefore, some electronic products use ceramic materials as the substrate, such as aluminum oxide, aluminum nitride, silicon nitride, etc., and the PCB board made of these materials is commonly called as a ceramic board.
Although the substrate made of ceramic perfectly avoids the performance problems, the manufacturing difficulty is greatly improved, holes are reserved in the manufacturing process to prevent the soft and hard plates from being exploded in the pressing and combining process, bubbles are reserved in the holes, the inner layer is filled with resin, printing ink, electroplated copper and other processes, the hole is plugged, the processing difficulty is high, and the production and manufacturing cost is high.
In view of this, it is necessary to propose a novel ceramic substrate structure to solve the problem of high manufacturing difficulty.
Disclosure of Invention
In order to solve the problems, the utility model provides a novel ceramic substrate structure which is simple in structure, reasonable in design, free of hole plugging and low in manufacturing cost.
The technical scheme adopted by the utility model is as follows:
a novel ceramic substrate structure comprises a ceramic inner layer, a first adhesive layer, a second adhesive layer, a first PP layer and a second PP layer;
the ceramic inner layer is provided with a hole structure;
the first adhesive layer is arranged on the top side of the ceramic inner layer;
the second adhesive layer is arranged at the bottom side of the ceramic inner layer;
the first PP layer is arranged on one side of the first adhesive layer, which is away from the ceramic inner layer;
the second PP layer is arranged on one side of the second adhesive layer, which is away from the ceramic inner layer.
Further, the ceramic inner layer is provided with a circuit structure.
Further, the circuit structure comprises a copper deposition layer and an electroplated layer.
Further, the first adhesive layer and the second adhesive layer are respectively set as AD adhesive layers.
Further, the thicknesses of the first adhesive layer and the second adhesive layer are respectively set to be 20-30um.
Further, the first PP layer and the second PP layer are made of 1080 model PP materials respectively.
Further, the thickness of the first PP layer and the second PP layer is respectively set to 75-80um.
The beneficial effects of the utility model are as follows:
the utility model comprises a ceramic inner layer, a first adhesive layer, a second adhesive layer, a first PP layer and a second PP layer; the ceramic inner layer is provided with a hole structure; the first adhesive layer is arranged on the top side of the ceramic inner layer; the second adhesive layer is arranged at the bottom side of the ceramic inner layer; the first PP layer is arranged on one side of the first adhesive layer, which is away from the ceramic inner layer; the second PP layer is arranged on one side of the second adhesive layer, which is away from the ceramic inner layer, and the ceramic inner layer is simple in structure and reasonable in design.
Drawings
FIG. 1 is a schematic diagram of the structure of some embodiments of the present application;
FIG. 2 is a schematic structural view of a ceramic inner layer in some embodiments of the present application;
reference numerals illustrate: the ceramic inner layer 1, the hole structure 11, the circuit structure 12, the first adhesive layer 2, the second adhesive layer 3, the first PP layer 4 and the second PP layer 5.
Detailed Description
The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "rear", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be mechanically coupled, directly coupled, or indirectly coupled via an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 to 2, the novel ceramic substrate structure in this embodiment includes a ceramic inner layer 1, a first adhesive layer 2, a second adhesive layer 3, a first PP layer 4 and a second PP layer 5;
the ceramic inner layer 1 is provided with a hole structure 11;
the first adhesive layer 2 is arranged on the top side of the ceramic inner layer 1;
the second adhesive layer 3 is arranged at the bottom side of the ceramic inner layer 1;
the first PP layer 4 is arranged on one side of the first adhesive layer 2, which is away from the ceramic inner layer 1;
the second PP layer 5 is arranged on one side of the second adhesive layer 3, which is away from the ceramic inner layer 1.
The embodiment has simple structure and reasonable design, the first adhesive layer 2 and the second adhesive layer 3 are additionally arranged on the two sides of the ceramic inner layer 1, the hole structures 11 can be filled in the adhesive layers on the two sides of the ceramic inner layer 1 in the pressing process, and then the hole structures are combined with the first PP layer 4 and the second PP layer 5 to form a substrate structure, so that a hole plugging process is not required to be independently carried out, the manufacturing difficulty is greatly simplified, and the manufacturing cost is effectively reduced.
Specifically, in the prior art, after the substrate is drilled and then deposited and electroplated, the hole plugging and grinding plate are used, the hole plugging process is complex, the used hole plugging and grinding plate devices are expensive, the operation time is long, the manufacturing difficulty is high, the manufacturing cost is high, in the embodiment, the adhesive layers are respectively arranged on two sides of the inner layer plate, the structure is changed, the pure adhesive layers are attached, and the adhesive layers are combined with the PP layer, so that the processing and the manufacturing are facilitated.
In some embodiments, the ceramic inner layer 1 is provided with a wiring structure 12.
Specifically, the circuit structure 12 includes a copper plating layer and a plating layer.
In this embodiment, the circuit structure 12 is formed by adopting the copper deposition layer and the electroplated layer, the copper deposition and electroplating of the circuit structure 12 can be completed at one time in the manufacturing process, then the pure glue layer is attached, and then the pure glue layer is combined with the PP layer, so that the manufacturing flow is simplified.
In some embodiments, the first glue layer 2 and the second glue layer 3 are respectively provided as AD glue layers.
Specifically, the thicknesses of the first adhesive layer 2 and the second adhesive layer 3 are respectively set to 20-30um.
In this embodiment, it is specifically shown that the first adhesive layer 2 and the second adhesive layer 3 are AD pure adhesive layers, preferably, the thicknesses of the first adhesive layer 2 and the second adhesive layer 3 may be set to 25um, and the rheological property of the AD pure adhesive layers is good, so as to realize a better hole structure 11 in the lamination process, further ensure the structural quality of the substrate, and have simple structure and strong practicability.
In some embodiments, the first PP layer 4 and the second PP layer 5 are made of 1080 model PP materials respectively.
Specifically, the thicknesses of the first PP layer 4 and the second PP layer 5 are set to 75-80um, respectively.
In this embodiment, specifically shown, the first PP layer 4 and the second PP layer 5 made of 1080 model PP material are preferably set to 80um in thickness, so as to ensure rigidity of the substrate structure.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (7)
1. The novel ceramic substrate structure is characterized by comprising a ceramic inner layer, a first adhesive layer, a second adhesive layer, a first PP layer and a second PP layer;
the ceramic inner layer is provided with a hole structure;
the first adhesive layer is arranged on the top side of the ceramic inner layer;
the second adhesive layer is arranged at the bottom side of the ceramic inner layer;
the first PP layer is arranged on one side of the first adhesive layer, which is away from the ceramic inner layer;
the second PP layer is arranged on one side of the second adhesive layer, which is away from the ceramic inner layer.
2. The novel ceramic substrate structure of claim 1, wherein the ceramic inner layer is provided with a wiring structure.
3. The novel ceramic substrate structure of claim 2, wherein the wiring structure comprises a copper deposition layer and a plating layer.
4. The novel ceramic substrate structure of claim 1, wherein the first and second glue layers are each provided as an AD glue layer.
5. The novel ceramic substrate structure of claim 4, wherein the thickness of the first and second glue layers is set to 20-30um, respectively.
6. The novel ceramic substrate structure of claim 1, wherein the first PP layer and the second PP layer are made of 1080 model PP material, respectively.
7. The novel ceramic substrate structure of claim 6, wherein the first PP layer and the second PP layer are each provided at a thickness of 75-80um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223150830.1U CN218998383U (en) | 2022-11-25 | 2022-11-25 | Novel ceramic substrate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223150830.1U CN218998383U (en) | 2022-11-25 | 2022-11-25 | Novel ceramic substrate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218998383U true CN218998383U (en) | 2023-05-09 |
Family
ID=86223070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223150830.1U Active CN218998383U (en) | 2022-11-25 | 2022-11-25 | Novel ceramic substrate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218998383U (en) |
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2022
- 2022-11-25 CN CN202223150830.1U patent/CN218998383U/en active Active
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