CN206611637U - The product structure of multi-layer precise circuit is made on ceramic substrate - Google Patents
The product structure of multi-layer precise circuit is made on ceramic substrate Download PDFInfo
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- CN206611637U CN206611637U CN201720388552.3U CN201720388552U CN206611637U CN 206611637 U CN206611637 U CN 206611637U CN 201720388552 U CN201720388552 U CN 201720388552U CN 206611637 U CN206611637 U CN 206611637U
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Abstract
A kind of product structure that multi-layer precise circuit is made on ceramic substrate, including separation layer, the rectangular wave structure of separation layer, it is the first metal layer between two square waves on the separation layer top, it is second metal layer under the single square wave of the separation layer bottom, the first metal layer rectangularity structure, the second metal layer squarely structure；It is insulating barrier positioned at the top of separation layer and the first metal layer, the top of the insulating barrier is protective layer, and the top of the protective layer is ceramic substrate；The separation layer is also arranged at intervals with extraction electrode on one side.Substrate is made using hyperfrequency ceramics, excellent properties of the high-frequency ceramic base electronic circuit board in terms of heat resistance, thermal diffusivity, resistance to cosmic ray, green environmental protection and high/low temperature circulate degradation are that traditional copper-clad plate is incomparable.
Description
Technical field
The utility model is related to ceramic substrate manufacturing technology field, and especially one kind makes multi-layer precise on ceramic substrate
The product structure of circuit.
Background technology
High-frequency ceramic electronic circuit board is a very important basic industry project, and can bring about changes China's high frequency
Substrate relies on the U.S., the history of state's import such as Japan, and project belongs to emerging strategic industries category, project construction meet country and
Local industries are planned and policy requirements.
High performance ceramic base electronic circuit board is a species of ceramic substrate, is microminiature plate resistor capacitor and inductor
And the carrier material of the element such as integrated circuit die I C, it is generally used for requiring in higher and frequency of use very high radio-circuit,
Connection and the fixed carrier of installation as element, are widely used in mobile communication, computer, household electrical appliance and automotive electronics etc.
Field.
Generally manufactured in the prior art using general circuit board substrate, be copperclad plate, the heat resistance of copperclad plate is resistance to
Penetrating property of width, thermal diffusivity is poor, and the circuit basic electro-conducting material made on copperclad plate is copper, the thickness of copper material be it is fixed, no
Easily change；The electronic circuit of multilayer needs that multilayer copperclad plate is overlapping, and thickness is thicker；General Mining mesoporous metals of the connection of sandwich circuit up and down
The simple connection such as change.Metal wire thickness width is typically up to grade.
General copperclad plate, the high frequency that the field such as microwave and millimeter wave transmission performance is unstable in the communications and loss is big is special
Property defect.
Utility model content
The shortcoming that the applicant is directed in above-mentioned existing production technology makes multi-layer precise there is provided one kind on ceramic substrate
The product structure of circuit, so as to solve the height that the field such as microwave in the communications and millimeter wave transmission performance is unstable, loss is big
Frequency characteristic defective.
The technical scheme that the utility model is used is as follows：
A kind of product structure that multi-layer precise circuit is made on ceramic substrate, including separation layer, the separation layer is into square
It is the first metal layer, the single rectangle of the separation layer bottom between shape wave structure, two square waves on the separation layer top
It is second metal layer, the first metal layer rectangularity structure, the second metal layer squarely structure under wave base；Positioned at every
The top of absciss layer and the first metal layer is insulating barrier, and the top of the insulating barrier is protective layer, and the top of the protective layer is pottery
Porcelain substrate；The separation layer is also arranged at intervals with extraction electrode on one side.
It is used as the further improvement of above-mentioned technical proposal：
The bottom of the separation layer, second metal layer and extraction electrode is respectively protective layer and ceramic substrate.
The first metal layer and second metal layer are formed by metal wire distribution.
The metal wire is interspersed, and the minimum feature of metal wire is 0.01mm, and minimum line is away from being 0.01mm.
The beneficial effects of the utility model are as follows：
The utility model compact conformation, rationally, operation with it is easily manufactured, do substrate, high-frequency ceramic using hyperfrequency ceramics
Base electronic circuit board is in terms of heat resistance, thermal diffusivity, resistance to cosmic ray, green environmental protection and high/low temperature circulation degradation
Excellent properties are that traditional copper-clad plate is incomparable.Due to ceramic material and the intrinsic advantage of processing mode, therefore have
The easily controllable high mechanical strength of dielectric constant, performance are stable, thermal conductivity is good, dielectric strength is high, anticorrosion, low-loss the features such as.
The utility model can on ceramic substrate plated with gold, silver, aluminium, copper, nickel, the various required metal materials such as molybdenum.
The utility model makes metallic diaphragm using vacuum coating scheme and makees multilayer wiring, controllable per a layer thickness, each
Layer also can various metals superposition.
The utility model is isolated using the intermembranous Mining of double layer of metal with organic gel, and the thickness of glued membrane is also controllable.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model (embodiment one).
Fig. 2 is structural representation of the present utility model (embodiment two).
Fig. 3 is the distribution map of the utility model metal wire.
Fig. 4 is making workflow diagram of the present utility model.
Wherein：1st, ceramic substrate；2nd, protective layer；3rd, insulating barrier；4th, the first metal layer；5th, separation layer；6th, second metal layer；
7th, extraction electrode；8th, metal wire.
Embodiment
Below in conjunction with the accompanying drawings, embodiment of the present utility model is illustrated.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, the product knot that multi-layer precise circuit is made on ceramic substrate of the present embodiment
It is the first metal layer 4 between structure, including separation layer 5, the rectangular wave structure of separation layer 5, two square waves on the top of separation layer 5,
It is second metal layer 6, the rectangularity structure of the first metal layer 4, second metal layer 6 under the single square wave of the bottom of separation layer 5
Squarely structure；It is insulating barrier 3 positioned at the top of separation layer 5 and the first metal layer 4, the top of insulating barrier 3 is protective layer 2, is protected
The top of sheath 2 is ceramic substrate 1；Separation layer 5 is also arranged at intervals with extraction electrode 7 on one side.
The bottom of separation layer 5, second metal layer 6 and extraction electrode 7 is respectively protective layer 2 and ceramic substrate 1.
The first metal layer 4 and second metal layer 6 are formed by the distribution of metal wire 8.
Metal wire 8 is interspersed, and the minimum feature of metal wire 8 is 0.01mm, and minimum line is away from being 0.01mm.
The utility model product structure is sandwich construction, and substrate is high-frequency ceramic piece.
Metallic diaphragm is plated by vacuum coating mode on potsherd.
Lines needed for metal level can also be made with figure using photoetching process.
The purity of metal, consistency comparative superiority, vacuum coating makes film layer and ceramic substrate have good adhesion.
The width of metal wire can arbitrarily make up to micron order, the shape of lines.
Isolation (isolation i.e. in the middle of metal multilayer film) between metal level uses organic photo glue, and the glue has good
Insulating properties, and high temperature resistant, the thickness of film layer can accomplish accurate control as needed, and between upper/lower layer metallic film
Connection, can also arbitrarily be made by photoetching process.
Compared with traditional multilayer copperclad plate, it has metal material optional, and thickness is controllable, high temperature resistant, is adapted to high frequency occasion,
It is easy to multi-stacked.
During actual fabrication, including following process route：
The first step：Prepare potsherd；
Second step：Potsherd is cut into small pieces；
3rd step：Small pieces are processed into external form；
4th step：Plane grinding and polishing is carried out to small pieces；
5th step：Cleaning；
6th step：Stopping off；
7th step：Vacuum metallizing the first metal layer；
8th step：Cleaning；
9th step：Apply photoresists --- exposure --- development --- removing photoresist --- needle drawing shape one；
Tenth step：Cleaning；
11st step：Apply separation layer glue；
12nd step：Aobvious isolation layer pattern；
13rd step：Vacuum metallizing second metal layer；
14th step：Cleaning；
15th step：Apply photoresists；
16th step：Exposure；
17th step：Development；
18th step：Remove photoresist；
19th step：Needle drawing shape two；
20th step：Extraction electrode；
21st step：Bonding；
22nd step：Examine；
23rd step：Storage.
In whole technical process, after high-frequency ceramic Jian Jin factories, then edge grind, grinds two sides, polishing.Use organic base
Cleaning fluid cleans surface, drying.Metal level, resist coating, development required for surface vacuum plating again, etches metal layer line bar,
Remove photoresist.Surface is cleaned with organic alkaline cleaner, the organic gel of isolation is applied, post bake carves isolation layer pattern, forms separation layer.
Multiple layer metal is such as needed, then is repeated above-mentioned technique, the metal wire and figure of multilayer isolation, upper/lower layer metallic is formed
Between connection, then photoetching hole or figure can be made on separation layer.
Because the processing technology possesses, flexibility is strong, and manufacturing process precision precision is high, is particularly suitable for highly difficult, multilayer
Secondary, complex figure wiring board is made.
Above description is explained of the present utility model, is not the restriction to utility model, what the utility model was limited
Scope is referring to claim, within protection domain of the present utility model, can make any type of modification.
Claims (4)
1. a kind of product structure that multi-layer precise circuit is made on ceramic substrate, it is characterised in that：Including separation layer (5), institute
It is the first metal layer (4) to state between separation layer (5) rectangular wave structure, two square waves on separation layer (5) top, described
It is second metal layer (6), the first metal layer (4) the rectangularity structure, institute under the single square wave of separation layer (5) bottom
State second metal layer (6) squarely structure；It is insulating barrier (3) positioned at the top of separation layer (5) and the first metal layer (4), it is described
The top of insulating barrier (3) is protective layer (2), and the top of the protective layer (2) is ceramic substrate (1)；The separation layer (5) is on one side
Also it is arranged at intervals with extraction electrode (7).
2. the product structure of multi-layer precise circuit is made on ceramic substrate as claimed in claim 1, it is characterised in that：It is described
The bottom of separation layer (5), second metal layer (6) and extraction electrode (7) is respectively protective layer (2) and ceramic substrate (1).
3. the product structure of multi-layer precise circuit is made on ceramic substrate as claimed in claim 1, it is characterised in that：It is described
The first metal layer (4) and second metal layer (6) are formed by metal wire (8) distribution.
4. the product structure of multi-layer precise circuit is made on ceramic substrate as claimed in claim 3, it is characterised in that：It is described
Metal wire (8) is interspersed, and the minimum feature of metal wire (8) is 0.01mm, and minimum line is away from being 0.01mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720388552.3U CN206611637U (en) | 2017-04-13 | 2017-04-13 | The product structure of multi-layer precise circuit is made on ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720388552.3U CN206611637U (en) | 2017-04-13 | 2017-04-13 | The product structure of multi-layer precise circuit is made on ceramic substrate |
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| Publication Number | Publication Date |
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| CN206611637U true CN206611637U (en) | 2017-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720388552.3U Active CN206611637U (en) | 2017-04-13 | 2017-04-13 | The product structure of multi-layer precise circuit is made on ceramic substrate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937478A (en) * | 2017-04-13 | 2017-07-07 | 戴永岗 | The product structure and its manufacture craft of multi-layer precise circuit are made on ceramic substrate |
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
-
2017
- 2017-04-13 CN CN201720388552.3U patent/CN206611637U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937478A (en) * | 2017-04-13 | 2017-07-07 | 戴永岗 | The product structure and its manufacture craft of multi-layer precise circuit are made on ceramic substrate |
| CN106937478B (en) * | 2017-04-13 | 2023-10-13 | 戴永岗 | Product structure for manufacturing multilayer precise circuit on ceramic substrate and manufacturing process thereof |
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
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| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20200721 Address after: Room 106-306, building 16, Jinlong Yihai community, Xinxing District, Donggang City, Dandong City, Liaoning Province Patentee after: Liaoning Shengshi BEICI Electronic Technology Co., Ltd Address before: 214000 Jiangsu city of Wuxi Province Rui Garden No. 23 room 1001 Co-patentee before: Zhou Weimin Patentee before: Dai Yonggang Co-patentee before: Yu Xiangrong |