CN218959396U - Bare chip packaging module of filter and radio frequency module - Google Patents
Bare chip packaging module of filter and radio frequency module Download PDFInfo
- Publication number
- CN218959396U CN218959396U CN202223609276.9U CN202223609276U CN218959396U CN 218959396 U CN218959396 U CN 218959396U CN 202223609276 U CN202223609276 U CN 202223609276U CN 218959396 U CN218959396 U CN 218959396U
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- substrate
- bare chip
- fixed
- circuit
- module
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 197
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229910052802 copper Inorganic materials 0.000 claims abstract description 56
- 239000010949 copper Substances 0.000 claims abstract description 56
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 33
- 230000000712 assembly Effects 0.000 claims abstract description 13
- 238000000429 assembly Methods 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 32
- 150000001875 compounds Chemical class 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/46—Filters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The utility model discloses a bare chip packaging module and a radio frequency module of a filter, wherein the bare chip packaging module of the filter comprises: a circuit substrate; the substrate is opposite to and supported on one surface of the circuit substrate at intervals; the interdigital transducer is fixed on one side of the substrate close to the circuit base plate; the substrate tin ball assembly comprises a plurality of tin ball assemblies which are fixed on one side of the substrate close to the circuit substrate at intervals; the copper column baffle is fixed on one side of the substrate close to the circuit substrate and is arranged at intervals with the circuit substrate; the cover plate layer is covered and fixed on the circuit substrate and completely covers the substrate; a substrate protection layer; the substrate protection layer is clamped between the cover plate layer and the substrate. The bare chip packaging module of the filter in the embodiment can prevent the overflow phenomenon of the cover plate layer to the cavity when the mold material of the cover plate layer is filled through the copper column baffle plate, so that the cleanness of the cavity and the normal operation of the interdigital transducer are ensured.
Description
[ field of technology ]
The utility model relates to the technical field of radio frequency, in particular to a bare chip packaging module of a filter and a radio frequency module.
[ background Art ]
The radio frequency module is a radio frequency chip containing one or more radio frequency components, and the radio frequency components comprise a filter, a low noise amplifier, a radio frequency switch, i.e. an amplifier, and the like. The radio frequency components are connected with a certain radio frequency microstrip line through a substrate and packaged, and then the radio frequency module chip can be formed.
In order to develop high integration and low cost, the conventional radio frequency module does not need to package the filter in advance, and can be packaged by a bare chip module packaging technology later; the unpackaged bare chip of the filter is directly attached to a substrate together with devices such as a switch and the like, then a layer of plastic organic film with the thickness of ten micrometers is sealed and attached to the whole module to serve as a substrate protection layer, so that the interdigital structure of the filter is protected to form a cavity, and finally the whole package can be completed through plastic package.
The filter is filtered by using mechanical vibration, so that a cavity which cannot contact the interdigital transducer of the filter is required to be generated in the package, and meanwhile, a layer of protection is formed around the filter through a substrate protection layer in the bare chip module package, so that the filter is prevented from being failed when the bottom of the filter is filled with the molding compound under the pressure of several megapascals.
The substrate protective layer generally needs to be made of an organic material and needs to have a low young's modulus in order to mold and cover the device. However, the curing pressure of the solid resin layer outside the substrate protection layer is generally relatively fixed, and in order to avoid the interdigital transducer of the filter contacting the circuit substrate, the height of the substrate solder ball is generally designed to be relatively higher so as to ensure the height of the cavity, and when the bare chip module is packaged by C4 (Controlled Collapse Chip Connection ), the molding compound forming the solid resin layer is easy to overflow into the cavity, thereby influencing the normal operation of the interdigital transducer.
[ utility model ]
The utility model aims to provide a bare chip packaging module of a filter, which solves the problem that when the bare chip packaging structure of the existing filter is used for C4 packaging, the molding material forming a solid resin layer is easy to overflow into a cavity, so that the normal operation of an interdigital transducer is affected.
In order to solve the above technical problem, in a first aspect, the present utility model provides a bare chip packaging module of a filter, which includes:
a circuit substrate;
the substrate is opposite to and supported on one surface of the circuit substrate at intervals;
the interdigital transducer is fixed on one side of the substrate close to the circuit substrate;
the substrate tin ball assembly comprises a plurality of tin ball assemblies which are fixed on one side of the substrate, close to the circuit substrate, at intervals; the substrate is fixedly supported on the circuit base plate through the substrate tin ball assembly and forms electric connection;
the copper column baffle is fixed on one side of the substrate, close to the circuit substrate, and is arranged at intervals with the circuit substrate, and the copper column baffle is arranged along the periphery of the substrate so as to encircle the interdigital transducer and the substrate tin ball assembly;
the cover plate layer is arranged on the circuit substrate in a covering manner and is used for completely covering the substrate; the method comprises the steps of,
and the substrate protection layer is clamped between the cover plate layer and the substrate and extends to the space between the cover plate layer and the circuit substrate.
Preferably, the cover sheet layer is a solid resin layer.
Preferably, the copper pillar baffle is one and annular.
Preferably, the copper pillar baffle includes a plurality of, and a plurality of copper pillar baffles are mutual interval setting and enclose jointly and establish and form annular structure.
Preferably, a plurality of the substrate tin ball assemblies are fixed at intervals at the position of the substrate close to the edge; the copper pillar baffle is closer to an edge of the substrate than the substrate solder balls.
Preferably, the distances between a plurality of the substrate tin ball assemblies and the edge of the substrate are the same.
Preferably, a plurality of the substrate tin ball assemblies on the same side of the substrate are uniformly fixed on the substrate.
Preferably, the substrate tin ball assembly comprises a copper pillar bump fixed on one side of the substrate close to the circuit substrate and a substrate tin ball fixed on one end of the copper pillar bump far away from the substrate; and the position of the substrate tin ball, which is far away from the copper pillar bump, is fixedly and electrically connected with the circuit substrate.
Preferably, the substrate tin ball is of a semicircular structure; the flat surface of the substrate tin ball is fixed at one end of the copper pillar bump, which is far away from the substrate, and the round end of the substrate tin ball is fixed at the circuit substrate.
In a second aspect, the present utility model provides a radio frequency module comprising a bare chip packaging module of a filter as described above.
Compared with the related art, the bare chip packaging module of the filter has the advantages that the copper column baffle plate which is spaced from the circuit substrate is arranged on one side, close to the circuit substrate, of the substrate, and the copper column baffle plate is arranged along the periphery of the substrate so as to surround the interdigital transducer and the substrate tin ball assembly, so that the phenomenon that the cover plate layer overflows to the cavity when the molding compound is filled in the cavity can be blocked by the copper column baffle plate, and the cleanness of the cavity and the normal operation of the interdigital transducer can be ensured.
[ description of the drawings ]
For a clearer description of the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the description below are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
fig. 1 is a schematic structural diagram of a bare chip packaging module of a filter according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of a preparation process of forming copper pillar bumps, substrate solder balls and copper pillar baffles on a filter substrate in a bare chip packaging module of a filter according to an embodiment of the present utility model.
The bare chip packaging module of the filter comprises a bare chip packaging module of the filter, a filter and a filter, wherein the bare chip packaging module; 1. a circuit substrate; 10. a cavity; 2. a substrate; 3. an interdigital transducer; 4. a substrate solder ball assembly; 41. copper pillar bumps; 42. a substrate solder ball; 5. a copper column baffle; 6. a substrate protection layer; 7. a cover sheet layer; 8. and (5) forming a solder ball.
[ detailed description ] of the utility model
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1, an embodiment of the present utility model provides a bare chip package module 100 of a filter, which includes a circuit substrate 1, a substrate 2 (filter substrate), an interdigital transducer 3, a substrate solder ball assembly 4, a copper pillar baffle 5, a substrate protection layer 6, and a solid resin layer 7.
Wherein, the substrate 2 is opposite to and supported on one surface of the circuit substrate 1 at intervals; the interdigital transducer 3 is fixed on one side of the substrate 2 close to the circuit substrate 1; the substrate tin ball assembly 4 comprises a plurality of tin ball assemblies and is fixed on one side of the substrate 2 close to the circuit base plate 1 at intervals; the substrate 2 is fixedly supported on the circuit base plate 1 through the substrate tin ball assembly 4 and forms electric connection; the copper column baffle 5 is fixed on one side of the substrate 2 close to the circuit substrate 1 and is arranged at intervals with the circuit substrate 1, and the copper column baffle 5 is arranged along the periphery of the substrate 2 to surround the interdigital transducer 3 and the substrate tin ball assembly 4; the cover plate layer 7 is fixedly covered on the circuit substrate 1 and completely covers the substrate 2; the substrate protection layer 6 is sandwiched between the cover plate layer 7 and the substrate 2, and extends between the cover plate layer 7 and the circuit substrate 1.
The substrate 2 is fixedly supported on the circuit substrate 1 through the substrate tin ball assembly 4 and forms electric connection, and a cavity 10 is formed at intervals with the circuit substrate 1, so that the interdigital transducer 3 and the circuit substrate 1 are arranged at intervals.
The copper pillar baffle 5 is spaced from the circuit substrate 1 to avoid electrical interference caused by contact between the copper pillar baffle 5 and the circuit substrate 1.
The cover plate layer 7 is a solid resin layer, that is, the cover plate layer 7 is filled on one side of the circuit substrate 1 close to the substrate 2 through solid resin (mold material) and is formed after solidification; the cover plate layer 7 completely covers the side of the substrate 2 away from the wiring substrate 1 and the peripheral side of the substrate 2, while covering other areas of the wiring substrate 1 close to the substrate 2 and not facing the substrate 2.
Specifically, the substrate solder ball assembly 4 includes a copper pillar bump 41 fixed to a side of the substrate 2 close to the wiring substrate 1, and a substrate solder ball 42 fixed to an end of the copper pillar bump 41 away from the substrate 2; the substrate solder balls 42 are fixedly and electrically connected with the circuit substrate 1 at positions far away from the copper pillar bumps 41.
Through setting up copper post lug 41 earlier, set up the substrate tin ball 42 at the terminal of copper post lug 41 again, can make the bare chip packaging module 100 of wave filter carry out C2 (Cu-Pillar with Solder Cap or take the copper post of solder cap) encapsulation like this to when guaranteeing different module products production, its cavity 10 height is always, and then promotes the yield.
In this embodiment, the substrate solder ball 42 has a semicircular structure; the flat surface of the substrate tin ball 42 is fixed at one end of the copper pillar bump 41 away from the substrate 2, and the rounded end of the substrate tin ball 42 is fixed at the circuit substrate 1.
By designing the substrate solder ball 42 in a semicircular structure, electrical interference caused by the substrate solder ball assembly 4 can be prevented.
Specifically, a plurality of substrate solder ball assemblies 4 are fixed at intervals at positions of the substrate 2 close to the edge; the copper pillar barrier 5 is closer to the edge of the substrate 2 than the substrate solder balls 42.
In this embodiment, the distances between the plurality of substrate solder ball assemblies 4 and the edge of the substrate 2 are the same; a plurality of substrate solder ball assemblies 4 on the same side of the substrate 2 are uniformly fixed to the substrate 2. This design allows the substrate solder ball assembly 4 to more stably support the substrate 2 on the wiring substrate 1.
In this embodiment, a plurality of module solder balls 8 are disposed on a surface of the circuit substrate 1 away from the substrate 2 at intervals.
As a first design method of the copper pillar baffle 5: the copper pillar baffle 5 includes a plurality of, and a plurality of copper pillar baffles 5 are mutual interval setting and enclose jointly and establish and form annular structure.
Preferably, the distances between the plurality of copper pillar baffles 5 and the edge of the substrate 2 are the same; a plurality of copper pillar baffles 5 on the same side of the substrate 2 are uniformly fixed on the substrate 2. This design can better block the phenomenon that the solid resin of the solid resin layer 7 overflows to the cavity 10 when filling (packaging) by the copper pillar baffle 5.
As a second design method of the copper pillar baffle 5: the copper pillar baffle 5 is one and annular. This design makes it possible to better block the overflow of the molding compound into the cavity 10 by the copper pillar baffle 5 when the molding compound of the cover plate layer 7 is filled.
Referring to fig. 2, the preparation process of the bare chip packaging module 100 of the filter in this embodiment is as follows: after the filter is ready, i.e. the interdigital transducer 3 has been mounted on the substrate 2; firstly, preparing a copper pillar bump 41 and a copper pillar baffle 5 on a substrate 2 through an electroplating process; then covering the substrate tin ball 42 on one end of the copper pillar bump 41 far away from the substrate 2; and finally, performing module packaging through the substrate protection layer 6 and the solid resin layer 7.
Compared with the related art, the bare chip packaging module 100 of the filter of the embodiment is provided with the copper pillar baffle 5 spaced from the circuit substrate 1 on one side of the substrate 2 close to the circuit substrate 1, and is arranged along the periphery of the substrate 2 so as to surround the interdigital transducer 3 and the substrate tin ball assembly 4, so that the phenomenon that the cavity 10 overflows when the molding compound of the cover plate layer 7 is filled can be blocked by the copper pillar baffle 5, and the cleanness of the cavity 10 and the normal operation of the interdigital transducer 3 are ensured.
The utility model also provides an embodiment of a radio frequency module, which comprises the bare chip packaging module 100 of the filter in the embodiment.
Since the rf module in this embodiment includes the bare chip packaging module 100 of the filter in the above embodiment, the technical effects achieved by the bare chip packaging module 100 of the filter in the above embodiment can be achieved, which is not described herein.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (10)
1. The bare chip packaging module of a kind of filter, characterized by, the bare chip packaging module of the said filter includes:
a circuit substrate;
the substrate is opposite to and supported on one surface of the circuit substrate at intervals;
the interdigital transducer is fixed on one side of the substrate close to the circuit substrate;
the substrate tin ball assembly comprises a plurality of tin ball assemblies which are fixed on one side of the substrate, close to the circuit substrate, at intervals; the substrate is fixedly supported on the circuit base plate through the substrate tin ball assembly and forms electric connection;
the copper column baffle is fixed on one side of the substrate, close to the circuit substrate, and is arranged at intervals with the circuit substrate, and the copper column baffle is arranged along the periphery of the substrate so as to encircle the interdigital transducer and the substrate tin ball assembly;
the cover plate layer is arranged on the circuit substrate in a covering manner and is used for completely covering the substrate; the method comprises the steps of,
and the substrate protection layer is clamped between the cover plate layer and the substrate and extends to the space between the cover plate layer and the circuit substrate.
2. The bare chip package module of claim 1, wherein the cover plate layer is a solid resin layer.
3. The bare chip packaging module of claim 1, wherein the copper pillar baffle is annular.
4. The bare chip packaging module of claim 1, wherein the copper pillar baffle comprises a plurality of copper pillar baffles which are mutually spaced and are commonly surrounded to form a ring structure.
5. The bare chip package module of claim 1 wherein a plurality of said substrate solder ball assemblies are spaced apart from each other at a location adjacent to an edge of said substrate; the copper pillar baffle is closer to an edge of the substrate than the substrate solder ball assembly.
6. The bare chip package module of claim 5 wherein a plurality of the substrate solder ball assemblies are all equidistant from an edge of the substrate.
7. The bare chip package module of claim 6, wherein a plurality of the substrate solder ball assemblies on the same side of the substrate are uniformly fixed to the substrate.
8. The bare chip package module of claim 1, wherein the substrate solder ball assembly comprises a copper pillar bump fixed to a side of the substrate close to the circuit substrate and a substrate solder ball fixed to an end of the copper pillar bump away from the substrate; and the position of the substrate tin ball, which is far away from the copper pillar bump, is fixedly and electrically connected with the circuit substrate.
9. The bare chip packaging module of the filter of claim 8, wherein the substrate solder balls are of semi-circular structure; the flat surface of the substrate tin ball is fixed at one end of the copper pillar bump, which is far away from the substrate, and the round end of the substrate tin ball is fixed at the circuit substrate.
10. A radio frequency module comprising a bare chip packaging module of a filter according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223609276.9U CN218959396U (en) | 2022-12-28 | 2022-12-28 | Bare chip packaging module of filter and radio frequency module |
| PCT/CN2023/138155 WO2024140168A1 (en) | 2022-12-28 | 2023-12-12 | Bare die packaging module of filter and radio frequency module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223609276.9U CN218959396U (en) | 2022-12-28 | 2022-12-28 | Bare chip packaging module of filter and radio frequency module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218959396U true CN218959396U (en) | 2023-05-02 |
Family
ID=86105279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223609276.9U Active CN218959396U (en) | 2022-12-28 | 2022-12-28 | Bare chip packaging module of filter and radio frequency module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN218959396U (en) |
| WO (1) | WO2024140168A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024140168A1 (en) * | 2022-12-28 | 2024-07-04 | 深圳飞骧科技股份有限公司 | Bare die packaging module of filter and radio frequency module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3915649B2 (en) * | 2002-10-04 | 2007-05-16 | エプソントヨコム株式会社 | Manufacturing method of surface mount type SAW device |
| JP2006229632A (en) * | 2005-02-17 | 2006-08-31 | Epson Toyocom Corp | Surface acoustic wave device |
| JP5177516B2 (en) * | 2008-06-02 | 2013-04-03 | 太陽誘電株式会社 | Electronic components |
| CN115000654B (en) * | 2022-08-05 | 2022-11-11 | 深圳飞骧科技股份有限公司 | Radio frequency module and packaging method thereof |
| CN218959396U (en) * | 2022-12-28 | 2023-05-02 | 深圳飞骧科技股份有限公司 | Bare chip packaging module of filter and radio frequency module |
-
2022
- 2022-12-28 CN CN202223609276.9U patent/CN218959396U/en active Active
-
2023
- 2023-12-12 WO PCT/CN2023/138155 patent/WO2024140168A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024140168A1 (en) * | 2022-12-28 | 2024-07-04 | 深圳飞骧科技股份有限公司 | Bare die packaging module of filter and radio frequency module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024140168A1 (en) | 2024-07-04 |
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