CN218883920U - Aluminum-based circuit board for LED illumination - Google Patents
Aluminum-based circuit board for LED illumination Download PDFInfo
- Publication number
- CN218883920U CN218883920U CN202222811569.9U CN202222811569U CN218883920U CN 218883920 U CN218883920 U CN 218883920U CN 202222811569 U CN202222811569 U CN 202222811569U CN 218883920 U CN218883920 U CN 218883920U
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- Prior art keywords
- heat dissipation
- plate
- heat
- substrate
- aluminum
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 238000005286 illumination Methods 0.000 title abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims abstract description 95
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 6
- 239000011324 bead Substances 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 239000004411 aluminium Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model discloses an aluminium base circuit board for LED illumination belongs to LED lamp base plate technical field. The method comprises the following steps: the heat dissipation structure comprises a substrate, a heat dissipation plate, a heat dissipation cover and a plurality of heat dissipation fins; a white solder resist ink layer is coated on the top surface of the substrate; the heat dissipation plate is arranged on the bottom surface of the substrate; the interior of the heat dissipation cover is hollow and is provided with an upward opening; the heat dissipation cover is connected to the bottom surface of the heat dissipation plate, and a heat dissipation space is formed between the heat dissipation cover and the heat dissipation plate; the radiating fins are arranged on the bottom surface of the radiating plate in an array mode and are located in the radiating space. In the utility model, the heat generated by the LED lamp beads is conducted to the heat dissipation plate through the substrate and then conducted to the heat dissipation plate, and the heat dissipation process is that heat is firstly transferred in the heat dissipation cover and then the heat is transferred to the outside through the heat dissipation holes; through the multistage heat dissipation of heating panel, fin and heat exchanger, improve the heat dissipation wholeness ability.
Description
Technical Field
The utility model belongs to the technical field of the LED lamp base plate, concretely relates to aluminium base circuit board for LED illumination.
Background
Aluminum substrates are widely used in LED lamps, and are metal-based copper-clad plates with good heat dissipation function. One side of an aluminum substrate in the LED lamp is coated with a white solder resist ink layer, and the side is used for welding LED pins.
The LED lamp can generate a large amount of heat in long-time use, so that the energy consumption of the lamp is increased, and safety hidden dangers can be brought. In the prior art, for example, a ceramic substrate is added at the bottom of an aluminum substrate, the heat dissipation effect is mainly realized by heat exchange between the ceramic substrate and the outside, and the heat dissipation effect is not good.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: in order to solve the problem, the utility model provides an aluminium base circuit board for LED illumination.
The technical scheme is as follows: an aluminum-based wiring board for LED lighting, comprising: the top surface of the substrate is coated with a white solder resist ink layer; a plurality of LED lamp beads are arranged on the top surface of the white solder resist ink layer;
the heat dissipation plate is arranged on the bottom surface of the substrate;
the heat dissipation cover is hollow and provided with an upward opening; the heat dissipation cover is connected to the bottom surface of the heat dissipation plate, and a heat dissipation space is formed between the heat dissipation cover and the heat dissipation plate;
and the radiating fins are arranged on the bottom surface of the radiating plate in an array manner and are positioned in the radiating space.
In a further embodiment, the fins are wave-shaped, and a gap is provided between adjacent fins.
By adopting the technical scheme, the heat dissipation area of the heat dissipation fin per unit length is increased, and a flowing space is provided for heat flow, so that the heat dissipation speed is improved.
In a further embodiment, the outer wall of the heat dissipation cover is provided with a plurality of heat dissipation holes communicated with the heat dissipation space.
Through adopting above-mentioned technical scheme, the louvre will dispel the heat and cover inside and external intercommunication, realize the heat exchange.
In a further embodiment, the bottom of the heat dissipation plate comprises a straight plate and arc plates connected to two ends of the straight plate; the straight plate is higher than the arc-shaped plate.
Through adopting above-mentioned technical scheme, the straight board is closer to the fin tip, realizes that the heat of fin tip can in time exchange with the external world through the louvre on the straight board.
In a further embodiment, the substrate is an aluminum substrate plate.
Through adopting above-mentioned technical scheme, realized good conduction radiating effect, can be in time with the heat that LED lamp pearl produced with the help of heating panel conduction to fin.
In a further embodiment, the louvers are honeycomb.
Through adopting above-mentioned technical scheme, increase in the heat exchanger unit area with the foundation area of air for the inside speed to the outside heat transfer of heat exchanger has been accelerated.
Has the advantages that: the heat generated by the LED lamp beads is conducted to the heat dissipation plate through the substrate and then conducted to the heat dissipation plate, and the heat dissipation process is that heat is firstly transferred in the heat dissipation cover and then the heat is transferred to the outside through the heat dissipation holes; through the multi-stage heat dissipation of the heat dissipation plate, the heat dissipation fins and the heat dissipation cover, the overall heat dissipation performance is improved; and the structure is simple, and the radiating cover protects the radiating fins and prevents foreign matters from adhering to the surfaces of the radiating fins.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a vertical cross-sectional view of the present invention.
Fig. 3 is an enlarged view at a.
Fig. 4 is a schematic structural view of the heat sink.
In fig. 1 to 4, each reference is: LED lamp pearl 10, base plate 20, white hinder welding ink layer 21, heating panel 30, radiator cap 40, straight board 41, arc 42, louvre 43, fin 50.
Detailed Description
Example 1
The embodiment provides an aluminum-based circuit board for LED illumination, including: a substrate 20, a heat dissipation plate 30, a heat dissipation cover 40 and a plurality of heat dissipation fins 50. The present embodiment is directed to improving the heat dissipation structure of the aluminum-based circuit board, and the electrical characteristics related to the aluminum-based circuit board are the prior art and are not described herein.
The top surface coating of base plate 20 has white resistance to weld printing ink layer 21, welds printing ink layer 21 top surface at white and sets up the station that a plurality of is used for installing LED lamp pearl 10, installs a plurality of LED lamp pearl 10 on this station.
The heat sink 30, the heat sink cover 40, and the heat sink 50 are made of a material having good thermal conductivity. The heat dissipation plate 30 is fixed to the bottom surface of the substrate 20. The size of heating panel 30 is the same or roughly the same with base plate 20 bottom surface to arbitrary LED lamp pearl 10 vertical projection point all falls on heating panel 30, realizes can be to base plate 20 bottom surface large tracts of land heat dissipation. The heat dissipation cover 40 is hollow and has an upward opening, and the opening of the heat dissipation cover 40 is fixed to the bottom surface of the heat dissipation plate 30. A heat radiation space is formed between the heat radiation plate 30 and the inside of the heat radiation cover 40. A plurality of heat dissipation fins 50 are fixed on the bottom surface of the heat dissipation plate 30 in an array and located in the heat dissipation space.
In order to reduce the overall weight of the product, the plurality of heat dissipation fins 50 are designed to be thin and have relatively small volume, so that in the using process, if foreign matters such as dust are attached to the heat dissipation fins 50, the heat dissipation effect of the heat dissipation fins 50 is affected, therefore, firstly, the heat dissipation cover 40 is arranged, a heat dissipation space is formed between the heat dissipation cover 40 and the heat dissipation plate 30, and the heat dissipation fins 50 are arranged in the heat dissipation space to prevent the foreign matters from being attached to the surfaces of the heat dissipation fins 50. The heat dissipation cover 40 not only protects the heat dissipation fins 50, but also performs heat exchange.
As shown in fig. 4, the heat sink 50 has a wave shape, and the wave-shaped heat sink 50 has a larger heat dissipation area than the straight heat sink 30 when the length of the heat sink 50 is constant, thereby improving heat dissipation efficiency. Gaps are provided between adjacent fins 50, and a heat flow space is provided between adjacent fins 50.
A plurality of heat dissipation holes 43 are formed on the outer wall of the heat dissipation cover 40. Only partial louvers 43 are shown in fig. 1. The heat dissipation holes 43 are communicated with the heat dissipation space. The heat radiation holes 43 are used for communicating the inside and the outside of the heat radiation cover 40, and heat exchange between the inside and the outside of the heat radiation cover 40 is realized.
The bottom of the heat dissipation cover 40 is formed by connecting at least a straight plate 41 and two arc plates 42. The two arc plates 42 are respectively arranged at two ends of the straight plate 41, and the two arc plates 42 are integrally formed with the straight plate 41. As shown in fig. 2, the straight plate 41 is higher than the arc-shaped plate 42, that is, the straight plate 41 is closer to the end of the heat sink 50. A space is reserved between the arc-shaped plate 42 and the side wall of the heat dissipation cover 40 close to the arc-shaped plate 42, so that outside cold air can be conveniently stored, cold and heat exchange can be carried out more quickly, and the temperature in the heat dissipation cover 40 is reduced. The bottom of the heat sink 30 is close to the straight plate 41, and flows out of the heat sink 40 through the heat dissipation holes 43 of the straight plate 41 quickly.
The substrate 20 is an aluminum substrate plate. Adopt aluminium base board 20 material can realize good conduction radiating effect, can in time conduct the heat that LED lamp pearl 10 produced to fin 50 with the help of heating panel 30.
The louvers 43 are formed in a honeycomb shape. The honeycomb hexagonal through hole structure is adopted, the base area of the heat dissipation cover 40 with air in unit area is increased, the heat transfer speed from the inside of the heat dissipation cover 40 to the outside is accelerated, and the integral heat dissipation performance is improved.
Claims (6)
1. An aluminum-based wiring board for LED lighting, comprising:
the top surface of the substrate is coated with a white solder resist ink layer; a plurality of LED lamp beads are arranged on the top surface of the white solder resist ink layer;
the heat dissipation plate is arranged on the bottom surface of the substrate;
the heat dissipation cover is hollow and provided with an upward opening; the heat dissipation cover is connected to the bottom surface of the heat dissipation plate, and a heat dissipation space is formed between the heat dissipation cover and the heat dissipation plate;
and the radiating fins are arranged on the bottom surface of the radiating plate in an array manner and are positioned in the radiating space.
2. The aluminum-based wiring board for LED lighting as defined in claim 1, wherein said fins are wave-shaped with a gap between adjacent fins.
3. The aluminum-based circuit board for LED lighting as defined in claim 1, wherein the heat dissipation cover has a plurality of heat dissipation holes on its outer wall, said heat dissipation holes being connected to the heat dissipation space.
4. The aluminum-based wiring board for LED lighting as defined in claim 1, wherein said heat dissipating plate bottom portion comprises a straight plate, and arc-shaped plates connected to both ends of said straight plate; the straight plate is higher than the arc-shaped plate.
5. The aluminum-based wiring board for LED lighting as claimed in claim 1, wherein said substrate is an aluminum-based substrate board.
6. The aluminum-based wiring board for LED lighting as defined in claim 3, wherein said heat dissipation holes are honeycomb-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222811569.9U CN218883920U (en) | 2022-10-25 | 2022-10-25 | Aluminum-based circuit board for LED illumination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222811569.9U CN218883920U (en) | 2022-10-25 | 2022-10-25 | Aluminum-based circuit board for LED illumination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218883920U true CN218883920U (en) | 2023-04-18 |
Family
ID=85949560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222811569.9U Active CN218883920U (en) | 2022-10-25 | 2022-10-25 | Aluminum-based circuit board for LED illumination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218883920U (en) |
-
2022
- 2022-10-25 CN CN202222811569.9U patent/CN218883920U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Kanglou Road, Industrial Concentration Zone, Dailou Town, Jinhu County, Huai'an City, Jiangsu Province, 211600 Patentee after: Jiangsu Shangfu Electronics Co.,Ltd. Address before: Kanglou Road, Industrial Concentration Zone, Dailou Town, Jinhu County, Huai'an City, Jiangsu Province, 211600 Patentee before: Jiangsu Shangfu Electronics Co.,Ltd. |