CN201297525Y - LED lamp with good heat dissipation structure - Google Patents
LED lamp with good heat dissipation structure Download PDFInfo
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- CN201297525Y CN201297525Y CNU2008201754256U CN200820175425U CN201297525Y CN 201297525 Y CN201297525 Y CN 201297525Y CN U2008201754256 U CNU2008201754256 U CN U2008201754256U CN 200820175425 U CN200820175425 U CN 200820175425U CN 201297525 Y CN201297525 Y CN 201297525Y
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 52
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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Abstract
本实用新型改良以往LED灯具的铝挤或压铸散热结构,特指一种采用通风孔电源座模块和通风孔灯罩组成一高散热效率的LED灯具,再配合以流线多数流线曲面散热片堆叠围绕成环形散热模块,更大幅提升其散热能力的功效。
The utility model improves the aluminum extrusion or die-casting heat dissipation structure of the previous LED lamps, and specifically refers to an LED lamp that uses a ventilation hole power socket module and a ventilation hole lampshade to form a high heat dissipation efficiency, and then uses a plurality of streamlined streamlined curved heat sinks stacked around a ring-shaped heat dissipation module to greatly improve its heat dissipation effect.
Description
技术领域 technical field
本实用新型涉及一种LED灯具,尤其涉及一种具有良好散热结构的LED灯具。The utility model relates to an LED lamp, in particular to an LED lamp with a good heat dissipation structure.
背景技术 Background technique
环保节能减碳是目前世界的趋势,LED固态照明诉求省电节能,由于目前广泛采用的高亮度LED,使用时会产生高温,因此必须配合适当的散热方式,以发散所述高亮度LED的热量,高亮度LED芯片模块的发热量愈来愈高,使得散热成为维持LED灯具照明系统正常运作的重要课题,通常会以散热片附于LED芯片模块发热元件表面,将热排除于LED灯具照明系统外,以防止LED芯片模块元件过热而光衰及延长元件使用寿命。Environmental protection, energy saving and carbon reduction is the current trend in the world. LED solid-state lighting demands power saving and energy saving. Due to the high-brightness LEDs widely used at present, high temperatures will be generated during use, so appropriate heat dissipation methods must be used to dissipate the heat of the high-brightness LEDs , the calorific value of high-brightness LED chip modules is getting higher and higher, making heat dissipation an important issue in maintaining the normal operation of the LED lighting system. Usually, a heat sink is attached to the surface of the heating element of the LED chip module to remove heat from the LED lighting system. In addition, to prevent the LED chip module components from overheating and light decay and prolong the service life of the components.
LED灯具照明系统的散热方法,主要靠自然对流将热带走,目前传统LED灯具照明散热缺点如下:The heat dissipation method of LED lamp lighting system mainly relies on natural convection to take away the heat. At present, the disadvantages of traditional LED lamp lighting heat dissipation are as follows:
(一)LED灯具电源座密不通风:传统电源座模块,仅用一外壳将电路板(pcb)包住,电源座外壳没有通风孔,密不通风散热差,因此电路板上高温零件常会过热而烧毁,灯具电源座寿命减短。(1) The power supply base of LED lamps is airtight and not ventilated: the traditional power supply module only uses a shell to cover the circuit board (pcb). And burnt, the life of lamps and lanterns power socket is shortened.
(二)LED灯具灯罩密不通风:(2) The lampshade of LED lamps is not airtight:
传统LED基板模块灯罩,仅用一外壳将LED基板模块包住,没有通风孔,密不通风且散热不良,LED上高温零件常会过热而光衰。The traditional LED substrate module lampshade only uses a shell to cover the LED substrate module. There are no ventilation holes, airtight and poor heat dissipation. The high temperature parts on the LED often overheat and cause light failure.
(三)LED灯具散热器表面积不足:(3) Insufficient surface area of LED lamp radiator:
一般LED灯具所用的散热器,按制造方法及型式可分为铝挤型(图1)、压铸型(图2)及平面鳍片堆叠型(图3)三种。铝挤型或压铸型散热片的制造,因受限于机械加工能力,厚度无法做得很薄,因此散热片组合起来的片数受到较大限制,使得密度(单位体积的总散热面积)较低,而堆叠型则可做得很薄,其密度因而较高,也就是其单位体积的总散热面积较大,因此有较大的散热能力。再者,堆叠型目前大都使用直片堆叠来制造散热片,目前LED灯具直片堆叠型的表面积仍嫌不足。The radiators used in general LED lamps can be divided into three types according to the manufacturing method and type: aluminum extrusion type (Figure 1), die-casting type (Figure 2) and planar fin stacked type (Figure 3). The manufacture of aluminum extruded or die-cast heat sinks cannot be made very thin due to limited machining capabilities. Therefore, the number of heat sinks combined is greatly limited, making the density (total heat dissipation area per unit volume) relatively low. Low, while the stacked type can be made very thin, so its density is higher, that is, the total heat dissipation area per unit volume is larger, so it has a greater heat dissipation capacity. Furthermore, the stacked type currently mostly uses straight sheet stacking to manufacture heat sinks, and the surface area of the straight sheet stacked type of LED lamps is still insufficient.
由上可知,上述的LED灯具结构,在散热效率上可加以改善。It can be known from the above that the above-mentioned structure of the LED lamp can be improved in terms of heat dissipation efficiency.
本实用新型人有感以上LED灯具散热效率的可改善方向,提出一种可增加散热效率的LED灯具结构设计。The inventors of the utility model feel that the heat dissipation efficiency of the above LED lamps can be improved, and propose a structural design of the LED lamps that can increase the heat dissipation efficiency.
发明内容 Contents of the invention
本实用新型的主要目的,在于改进传统LED灯具照明散热结构缺失,提供一种采用LED基板模块、通风孔电源座模块和通风孔灯罩,再结合由多数片流线曲面散热片堆叠围绕成环形散热模块,组成一高散热效率的LED灯具。The main purpose of this utility model is to improve the lack of heat dissipation structure of traditional LED lamps and lanterns, and provide a kind of LED substrate module, ventilation hole power base module and ventilation hole lampshade, combined with a plurality of streamline curved surface heat sinks stacked to form a ring heat dissipation modules to form an LED lamp with high heat dissipation efficiency.
由于所述散热片的形状设计为流线曲面,流线曲面可增加散热表面积,又可让流体流过时较平滑顺畅,因此可增加散热效率,又通风孔电源座模块和通风孔灯罩,可让流体对流更顺畅,因此LED灯具散热效率更高。Because the shape of the heat sink is designed as a streamlined curved surface, the streamlined curved surface can increase the heat dissipation surface area and allow the fluid to flow smoothly, so that the heat dissipation efficiency can be increased, and the air vent power base module and the air vent lampshade can allow the The fluid convection is smoother, so the heat dissipation efficiency of LED lamps is higher.
为了达到本实用新型的主要目的,提供一具有良好散热结构的LED灯具,LED灯具主要组成结构如下:In order to achieve the main purpose of this utility model, an LED lamp with good heat dissipation structure is provided. The main composition and structure of the LED lamp are as follows:
(一)通风孔灯罩(图10)、(二)通风孔电源座模块(图)、(三)流线曲面散热模块(图6)和(四)LED基板模块(图8),其中,(1) Air vent lampshade (Fig. 10), (2) Air vent power socket module (Fig.), (3) Streamline curved surface heat dissipation module (Fig. 6) and (4) LED substrate module (Fig. 8), among which,
(一)通风孔灯罩(1) Air vent lampshade
传统LED基板模块灯罩,仅用一外壳将LED基板模块包住,因密不通风而散热不良,使得LED上高温零件常会过热而光衰。The traditional LED substrate module lampshade only uses a shell to cover the LED substrate module. Due to the lack of ventilation and poor heat dissipation, the high-temperature parts on the LED often overheat and cause light failure.
本实用新型的通风孔灯罩采内、外双壳设计,LED基板模块放入所述内壳内,并可将所述内壳底部圆周整圈点胶粘着于LED基板模块的上面或散热模块顶面后,使LED基板模块被密闭于内壳中,可达防尘防水目的,而灯罩外壳设有通风孔,可让内壳与外壳间的流体对流更顺畅,增加散热效率。The ventilation hole lampshade of the utility model is designed with inner and outer double shells. The LED substrate module is placed in the inner shell, and the bottom of the inner shell can be glued to the top of the LED substrate module or the top of the heat dissipation module. After the surface, the LED substrate module is sealed in the inner shell, which can achieve the purpose of dustproof and waterproof, and the lampshade shell is provided with ventilation holes, which can make the fluid convection between the inner shell and the outer shell smoother and increase the heat dissipation efficiency.
(二)通风孔电源座模块(2) Air vent power socket module
传统电源座模块,仅用一外壳将电路板(pcb)包住,密不通风而散热不良,使得电路板上高温零件常会过热而烧毁。The traditional power base module only uses a shell to cover the circuit board (pcb), which is not airtight and has poor heat dissipation, so that high-temperature components on the circuit board often overheat and burn out.
本电源座模块采内、外双壳设计,电路板放入长方型内壳中,内壳中灌导热胶,可防尘防水,兼具导热功能,可将电路板上高温零件降温,电源座外壳设有通风孔,可让流体对流更顺畅,增加散热效率。The power base module is designed with inner and outer double shells. The circuit board is placed in the rectangular inner shell, and the inner shell is filled with heat-conducting glue, which can prevent dust and water, and has the function of heat conduction. The seat shell is provided with ventilation holes, which can make the fluid convection flow more smoothly and increase the heat dissipation efficiency.
(三)流线曲面散热模块:(3) Streamlined surface cooling module:
其由数个单一流线型曲面散热片接合所组成,每一单一散热片包括有一本体,其侧边连接有一扇形折边,此扇形的两端以同一圆心,但不同半径所形成的两段不同大小的圆弧,于本体中间位置冲设凹槽,将多数个单一线型曲面散热片利用靠合部紧密排列组合成一封闭环状,则每一散热片的凹槽也形成一封闭的环状,另设有与所述环形同等大小的环形扣具,置入凹槽内,可将散热片定位,防止散热片向散热器中心偏移,多数片散热片堆叠围绕扣合成环形,组成一流线曲面散热模块。It is composed of several single streamlined curved heat sink joints. Each single heat sink includes a body, and its side is connected with a fan-shaped folded edge. The two ends of the fan shape have the same center of circle, but two sections of different sizes formed by different radii The circular arc is punched with a groove in the middle of the body, and a plurality of single-line curved surface heat sinks are closely arranged and combined into a closed ring by using the abutment part, and the groove of each heat sink also forms a closed ring. In addition, there is a ring buckle with the same size as the ring, which can be placed in the groove to position the heat sink and prevent the heat sink from shifting to the center of the heat sink. Most heat sinks are stacked around the buckle to form a ring, forming a streamlined surface Cooling module.
(a)其散热片设计成流线型曲面:可让流体更平滑的通过,流量增大,热效率提高。(a) The heat sink is designed as a streamlined curved surface: it allows the fluid to pass through more smoothly, increases the flow rate, and improves the thermal efficiency.
流线型曲面设计可随流场做最佳化的曲面设计,可设计成各种流线曲面,例如复杂不规则的多曲面、双曲面、S型扭曲面、单曲面、圆弧曲面等。Streamlined surface design can be optimized according to the flow field, and can be designed into various streamlined surfaces, such as complex and irregular multi-curved surfaces, hyperboloids, S-shaped twisted surfaces, single curved surfaces, arc curved surfaces, etc.
(b)又散热片设计成折边可扣合,容易组装,多数片散热片由侧4e边褶边扣合成一串,堆叠围绕扣合成环形时,容易组装,不必一片一片分开组装。(b) The radiating fins are designed so that the hems can be snapped together, which is easy to assemble. Most of the radiating fins are buckled into a string by the frills on the side 4e.
(c)散热片底部扇形折边再向上折成型(c) The fan-shaped edge at the bottom of the heat sink is folded upwards to form type
(c1)扇形折边,可维持尺寸精确:此扇形折边散热片可堆叠成环形,则多数片扇形散热片底部扇形彼此紧靠连接成圆环形,避免有重叠现象。(c1) Scalloped edges can maintain accurate dimensions: the fan-shaped radiating fins can be stacked to form a ring, and the bottom scallops of most fan-shaped radiating fins are closely connected to each other to form a circular ring to avoid overlapping.
(c2)扇形折边再向上折成型(c2) Scalloped edges and then folded upwards type
一般扇形折边有R角,组装不良时,两片之间仍可能有一点点重叠,因此折边再向上折型,便完全不会有重叠现象。Generally, the fan-shaped hem has an R angle. When the assembly is poor, there may still be a little overlap between the two pieces, so the hem should be folded upwards. type, there will be no overlap at all.
(d)环形扣具:有两大功能:(d) Loop buckle: it has two functions:
(1)散热片定位:多数片散热片堆叠围绕扣合成环形时,散热片内侧部上设计有凹槽,凹槽也围绕形成环形,将形扣具放入槽,可将散热片定位,防止散热片向散热器中心偏移。(1) Heat sink positioning: When most heat sinks are stacked around the buckle to form a ring, the inner part of the heat sink is designed with a groove, and the groove is also formed around the ring. Put the shaped buckle into the groove to position the heat sink to prevent The cooling fins are offset towards the center of the heat sink.
(2)固定电源座:有2种方式:环形扣具上设计有攻牙螺丝孔,电源塑胶底座设计有螺丝通过孔,利用螺丝将电源座锁付在环形扣具上。(2) Fixing the power base: There are two ways: the ring buckle is designed with tapping screw holes, and the plastic base of the power supply is designed with screw holes, and the power base is locked on the ring buckle with screws.
(四)LED基板模块(4) LED substrate module
LED基板选用高导热系数的金属材质基板。The LED substrate uses a metal substrate with high thermal conductivity.
与现有技术相比,本实用新型所述的LED灯具,由于所述散热片的形状设计为流线曲面,流线曲面可增加散热表面积,又可让流体流过时较平滑顺畅,因此可增加散热效率,又通风孔电源座模块和通风孔灯罩,可让流体对流更顺畅,因此LED灯具散热效率更高。Compared with the prior art, the LED lamp described in the utility model, because the shape of the heat sink is designed as a streamlined curved surface, the streamlined curved surface can increase the heat dissipation surface area, and can make the fluid flow smoother, so it can increase Heat dissipation efficiency, and the ventilation hole power base module and the ventilation hole lampshade can make the fluid convection smoother, so the heat dissipation efficiency of the LED lamp is higher.
附图说明 Description of drawings
图1是现有压铸型散热结构的LED灯具立体图;Fig. 1 is a perspective view of an LED lamp with an existing die-cast heat dissipation structure;
图2是现有铝挤型散热结构的LED灯具立体图;Fig. 2 is a perspective view of an LED lamp with an existing aluminum extruded heat dissipation structure;
图3是现有平面鳍片堆叠型结构的LED灯具立体图;Fig. 3 is a perspective view of an existing LED lamp with a stacked planar fin structure;
图4是本实用新型流线型曲面散热结构的LED灯具立体图;Fig. 4 is a perspective view of an LED lamp with a streamlined curved surface heat dissipation structure of the present invention;
图5是本实用新型流线型曲面散热结构的LED灯具组合图;Fig. 5 is a combination diagram of an LED lamp with a streamlined curved surface heat dissipation structure of the present invention;
图6是本实用新型流线型曲面散热模块组合图;Fig. 6 is a combination diagram of the streamlined curved surface cooling module of the utility model;
图7A、图7B、图7C、图7D是本实用新型单片流线型曲面散热片的立体图;Fig. 7A, Fig. 7B, Fig. 7C and Fig. 7D are perspective views of the single-chip streamlined curved surface heat sink of the utility model;
图8A、图8B、图8C是本实用新型流线型曲面散热结构的LED灯具立体图;Fig. 8A, Fig. 8B, and Fig. 8C are three-dimensional views of LED lamps with a streamlined curved surface heat dissipation structure of the present invention;
图9是本实用新型环型扣具的立体图;Fig. 9 is a perspective view of the utility model ring buckle;
图10A、图10B、图10C、图10D是本实用新型通风孔灯罩立体图;Fig. 10A, Fig. 10B, Fig. 10C, and Fig. 10D are three-dimensional views of the vent lampshade of the present invention;
图11A、图11B、图11C、图11D是本实用新型通风孔电源座模块立体图。Fig. 11A, Fig. 11B, Fig. 11C and Fig. 11D are three-dimensional views of the ventilation hole power base module of the utility model.
附图标记说明:1a-压铸散热结构的LED灯具;1aa-压铸散热片模块;1ab-密闭灯罩;1ac-密闭电源座;1ad-LED基板模块;1b-铝挤散热结构的LED灯具;1ba-铝挤散热片模块;1bb-密闭灯罩;1bc-密闭电源座;1c-平面堆叠散热片结构的LED灯具;1ca-铝挤散热片模块;1cb-密闭灯罩;1cc-密闭电源座;1-流线曲面散热结构的LED灯具;11-散热模块;111-单一流线型曲面散热片;111a-流线型曲面本体;111b-扇形折边;111c-扣合处;111d-型折边;12-环型扣具;12a-扣具本体;12b-螺丝孔;13-通风孔灯罩;13a-灯罩外壳;13b-通风孔;13c-灯罩内壳;14-LED基板模块;14a-LED单元;14b-热传基板;15-通风孔电源座模块;15a-电源座本体外壳;15b-通风孔;15c-电源PCB板;15d-PCB板连接LED基板的电线;15e-长方型内壳。Explanation of reference signs: 1a-LED lamp with die-casting heat dissipation structure; 1aa-die-casting heat sink module; 1ab-airtight lampshade; 1ac-airtight power socket; 1ad-LED substrate module; Aluminum extruded heat sink module; 1bb-airtight lampshade; 1bc-airtight power base; 1c-LED lamp with plane stacked heat sink structure; 1ca-aluminum extruded heat sink module; 1cb-airtight lampshade; LED lamps with linear curved surface heat dissipation structure; 11-heat dissipation module; 111-single streamlined curved surface heat sink; 111a-streamlined curved surface body; 111b-fan-shaped folding edge; 12-ring buckle; 12a-buckle body; 12b-screw hole; 13-air vent lampshade; 13a-lampshade shell; 13b-ventilation hole; 13c-lampshade inner shell; 14-LED substrate module; 14a-LED unit; 14b-heat transfer substrate; 15-ventilation hole power base module; 15a-power base body shell; 15b-ventilation hole; 15c-power PCB board; Square inner shell.
具体实施方式 Detailed ways
以下结合附图,对本实用新型上述的和另外的技术特征和优点作更详细的说明。The above-mentioned and other technical features and advantages of the present utility model will be described in more detail below in conjunction with the accompanying drawings.
请参阅图4至图11,本实用新型提供一种LED灯具的散热改良结构1,其主要组成结构如下:Please refer to Fig. 4 to Fig. 11. The utility model provides an improved heat dissipation structure 1 of an LED lamp, and its main composition and structure are as follows:
(一)通风孔灯罩13(图4至图5及图10)(1) Air vent lampshade 13 (Fig. 4 to Fig. 5 and Fig. 10)
传统LED基板模块灯罩1a(图1),仅用一外壳1ab将LED基板模块1ad包住,因密不通风而散热不良,LED基板模块上的高温零件常会过热而光衰。The traditional LED substrate module lampshade 1a (Fig. 1) only uses a shell 1ab to enclose the LED substrate module 1ad. Due to the airtightness, the heat dissipation is poor, and the high-temperature parts on the LED substrate module often overheat and cause light decay.
本实用新型的通风孔灯罩13采内、外双壳(13C、13a)设计,由LED单元14a和所述LED单元14a所接合的热传基板14b所构成的LED基板模块14是被放入内壳13c(图10)之中,将内壳13c底缘131C(图5及图10)整圈点胶粘合于所述LED基板模块14之上或散热模块11的顶部后,同时外壳13a底缘和所述散热模块11(图5及图6)的顶部也加以黏合,以形成一密闭空间,使所述LED基板模块14密闭于内壳13C中,可达防尘防水目的,而灯罩外壳13a设有通风孔13b,可让流体对流更顺畅,增加散热效率。The
(二)通风孔电源座模块15(图5及图11)(2) Air vent power base module 15 (Fig. 5 and Fig. 11)
传统电源座模块,仅用一外壳1ac(图1)将电路板(pcb)包住,因密不通风而散热不良,电路板上高温零件常会过热而烧毁。The traditional power supply module only uses a shell 1ac (Fig. 1) to enclose the circuit board (pcb). Due to the lack of ventilation, the heat dissipation is poor, and the high-temperature parts on the circuit board are often overheated and burned.
本电源座模块采内、外双壳设计,电路板(pcb)15c(图11B)放入长方型内壳15e中,内壳中灌注导热胶,即可防尘防水,兼具导热功能,可将电路板上高温零件降温,电源座外壳15a(图11B)设有通风孔15b(图11B),可让流体对流更顺畅,增加散热效率。The power base module is designed with inner and outer double shells, and the circuit board (pcb) 15c (Fig. 11B) is placed in the rectangular
(三)散热模块11(图6):(3) Heat dissipation module 11 (FIG. 6):
(a)所述散热片设计成流线型曲面111a(图7B):可让流体更平滑的通过,流量增大,热效率提高。(a) The heat sink is designed as a streamlined
流线型曲面设计可随流场做最佳化的曲面设计,可设计成各种流线曲面,例如不规则多曲面、双曲面、S型扭曲面、单曲面或圆弧曲面等。Streamlined surface design can be optimized according to the flow field, and can be designed into various streamlined surfaces, such as irregular multi-curved surfaces, hyperboloids, S-shaped twisted surfaces, single-curved surfaces or arc-shaped surfaces, etc.
(b)又散热片设计成扇形折边111b(图7B)可扣合,容易组装,多数片散热片由褶边扣合成一串,堆叠围绕扣合成环形时,容易组装,不必一片一片分开组装。(b) The heat sinks are designed as fan-shaped
(c)散热片底部扇形折边再向上折成型111d(图7D)(c) The fan-shaped edge at the bottom of the heat sink is folded upwards to form Type 111d (Fig. 7D)
(c1)扇形折边111b(图7B),可维持尺寸精确:此扇形折边散热片可堆叠成环形,则多数片扇形散热片底部扇形彼此紧靠连接成圆环形,避免有重叠现象。(c1)
(c2)扇形折边再向上折成型111d(图7D)(c2) Scalloped edges and then folded upwards Type 111d (Fig. 7D)
一般扇形折边有R角,组装不良时,两片之间仍可能有一点点重叠,因此折边再向上折型,便完全不会有重叠现象。Generally, the fan-shaped hem has an R angle. When the assembly is poor, there may still be a little overlap between the two pieces, so the hem should be folded upwards. type, there will be no overlap at all.
(d)环形扣具12(图9):有两大功能:(d) ring fastener 12 (Fig. 9): there are two major functions:
(1)散热片定位:(1) Heat sink positioning:
多数片散热片堆叠围绕扣合成环形时,散热片内侧部折边上设计有凹槽111e(图7C),凹槽也围绕形成环形,将环形扣具放入槽内,可将散热片定位,防止散热片向散热器中心偏移。When most heat sinks are stacked and buckled around to form a ring, a
(2)固定电源座12(图1):有2种方式:(2) Fixing the power base 12 (Fig. 1): There are 2 ways:
环形扣具上设计有攻牙螺丝孔15(图11B),电源塑胶底座设计有螺穿过孔,利用螺丝将电源座锁付在环形扣具上。Tapping screw holes 15 are designed on the ring buckle (Fig. 11B), and the plastic base of the power supply is designed with screw holes, and the power base is locked on the ring buckle by screws.
(四)LED基板模块(4) LED substrate module
LED基板选用高导热系数的金属材质基板。The LED substrate uses a metal substrate with high thermal conductivity.
以上说明对本实用新型而言只是说明性的,而非限制性的,本领域普通技术人员理解,在不脱离以下所附权利要求所限定的精神和范围的情况下,可做出许多修改,变化,或等效,但都将落入本实用新型的保护范围内。The above description is only illustrative of the present utility model, rather than restrictive. Those of ordinary skill in the art understand that many modifications and changes can be made without departing from the spirit and scope defined by the following appended claims. , or equivalent, but all will fall within the protection scope of the present utility model.
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CNU2008201754256U CN201297525Y (en) | 2008-10-30 | 2008-10-30 | LED lamp with good heat dissipation structure |
DE202009011849U DE202009011849U1 (en) | 2008-10-30 | 2009-09-01 | Cooling device for light-emitting diode lamp |
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