CN218827039U

CN218827039U - Small-size chip fixing device

Info

Publication number: CN218827039U
Application number: CN202223214165.8U
Authority: CN
Inventors: 周敏
Original assignee: Wuhan Guangqiyuan Technology Co ltd
Current assignee: Wuhan Guangqiyuan Technology Co ltd
Priority date: 2022-11-28
Filing date: 2022-11-28
Publication date: 2023-04-07
Anticipated expiration: 2032-11-28

Abstract

The utility model discloses a small chip fixing device, which belongs to the technical field of chip processing and testing and comprises a clamp plate with a chip fixing hole and a fixing glue layer attached to the end surface of one side of the clamp plate, wherein the small chip to be fixed can be embedded into the chip fixing hole and is bonded and fixed by the fixing glue layer; simultaneously, fixed glue film is the degradable glued membrane for small-size chip corresponds the test or processes the back in the completion, and the corresponding degradation of accessible is handled and is made the adhesive force of fixed glue film inefficacy, then realizes taking out fast of chip. The utility model discloses a small-size chip fixing device, its simple structure, it is convenient to use, can realize the reliable fixed of small-size chip, avoids traditional chip fixing method to the pollution and the damage of chip, guarantees the location accuracy in chip test or the course of working, provides the condition for automatic identification, the search of the corresponding equipment after the chip is fixed, and then has promoted the yield and the efficiency of the relevant rear end operation of small-size chip, has better practical value and application prospect.

Description

Small-sized chip fixing device

Technical Field

The utility model belongs to the technical field of chip processing and test, concretely relates to small-size chip fixing device.

Background

In the field of optical communication, the application of chips is very wide, and the demand for chips is increasing. In the production and application process of chips, the chips are often required to be fixed at corresponding positions so as to complete corresponding testing and processing operations. However, as miniaturization of chips progresses, the overall size (< 10 mm) and thickness of the chips are becoming smaller, making it difficult to fix the chips as the size becomes smaller.

For fixing the chip, the conventional methods mainly include clamp clamping, vacuum adsorption, briquetting fixing and the like, but the above methods are often not applicable to small chips with small overall sizes. Because the chip is made of fragile materials, if the chip is clamped and fixed by common clamping, the edge of the chip is easily damaged and scratched; moreover, the chip size is too small, so that the fixing strength of the conventional vacuum adsorption fixing mode is not enough, and the fixed chip is easy to move, thereby affecting the operation precision. It is also due to the above-mentioned defects that the fixing of the small chip becomes a problem that the industry focuses on and needs to solve.

SUMMERY OF THE UTILITY MODEL

To the above defect of prior art or improve in the demand one or more, the utility model provides a microchip fixing device can realize microchip's reliable fixed, guarantees the accuracy of microchip test, processing, promotes microchip's test and machining precision.

In order to achieve the above object, the present invention provides a small chip fixing device, which comprises a clamp plate and a fixing glue layer;

the clamp plate is of a thin plate structure, and a plurality of chip fixing holes penetrating through two end faces are formed in a plate body of the clamp plate;

the fixing adhesive layer is adhered to one side end face of the clamp plate, so that a chip to be fixed can be fixed by the fixing adhesive layer after being embedded into the chip fixing hole; and is

The fixing adhesive layer is a degradable adhesive film which can have adhesive capacity in an initial state and can be degraded and lose efficacy after corresponding degradation treatment.

As a further improvement of the utility model, the degradable adhesive film is a photodegradable adhesive film, and the corresponding degradation treatment mode is the photodegradable treatment mode.

As a further improvement, the photodegradable adhesive film is a UV adhesive film which can be degummed by degradation under the irradiation of ultraviolet light.

As a further improvement, the degradable adhesive film is a thermal degradation adhesive film, and the corresponding degradation treatment mode is a temperature control degradation treatment mode.

As a further improvement of the utility model, the degumming failure temperature of the thermal degradation glue film is 60-150 ℃.

As a further improvement, the length and width of the chip fixing hole is larger than the length and width of the chip to be fixed, and the length and width of the chip to be fixed are respectively increased by 0.5 mm-2 mm.

As a further improvement, the chip fixing holes are a plurality of arranged in an array or arranged along the circumferential interval.

As a further improvement of the utility model, the thickness dimension of the chip fixing hole is 0.9 to 1.5 times of the thickness dimension of the chip to be fixed.

As a further improvement of the utility model, the utility model also comprises a bearing plate;

the bearing plate and the clamp plate are bonded through the fixing glue layer.

As a further improvement of the utility model, the thickness of the clamp plate is not less than 2mm.

The above-described improved technical features may be combined with each other as long as they do not conflict with each other.

Generally, through the utility model above technical scheme who conceives compares with prior art, the beneficial effect who has includes:

(1) The utility model discloses a small chip fixing device, which comprises a clamp plate and a fixed glue layer, and the small chip to be fixed can be fixed by the fixed glue layer after being embedded into the chip fixing hole by utilizing the chip fixing hole on the clamp plate and the sticking of the fixed glue layer on one side end surface of the clamp plate; meanwhile, the small chip is subjected to corresponding test or processing by preferably selecting the fixing adhesive layer as a degradable adhesive film, so that the adhesive capacity of the fixing adhesive layer is disabled through corresponding degradation treatment, and then the chip is quickly taken out; through above-mentioned fixing device's setting, can realize quick, the accurate fixed of microchip, avoid damage chip, pollution chip, fixed defects such as not firm that traditional chip fixed mode probably exists, promote the fixed accuracy and the reliability of microchip, promote the yield and the efficiency of the relevant operation of chip.

(2) The utility model discloses a small-size chip fixing device, it is through the type that corresponds preferred degradable glued membrane for chip fixing device can satisfy the operation demand under the different operation environment, and then realizes the reliable fixed of small-size chip under the multiple scene, avoids leading to the fact not good influence to the chip because of the introduction of degradation processing condition, also fully laminates the operation condition (temperature condition or illumination condition etc.) under the different operation environment, and then promotes small-size chip fixing device's compatibility and use convenience.

(3) The utility model discloses a small-size chip fixing device, its length and width size through preferred thickness size of setting up anchor clamps plate and chip fixed orifices can guarantee the fixed accuracy of chip location when realizing that small-size chip is reliably fixed, further promotes the fixed efficiency and the precision of small-size chip.

(4) The utility model discloses a small-size chip fixing device, its simple structure, it is convenient to use, can realize the reliable fixed of small-size chip, avoids traditional chip fixing method to the pollution and the damage of chip, guarantees the location accuracy in chip test or the course of working, provides the condition for automatic identification, the search of the corresponding equipment after the chip is fixed, and then has promoted the yield and the efficiency of the relevant rear end operation of small-size chip, has better practical value and application prospect.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic perspective view of a small chip fixing device according to an embodiment of the present invention;

FIG. 2 is a side view of a small chip holder according to an embodiment of the present invention;

in all the figures, the same reference numerals denote the same features, in particular:

1. a clamp plate; 101. a chip fixing hole; 2. fixing the adhesive layer; 3. a carrier plate; 4. and (5) fixing the chip.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention. Furthermore, the technical features mentioned in the embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and for simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Example (b):

referring to fig. 1 to 2, a small chip fixing device according to a preferred embodiment of the present invention includes a clamp plate 1 having a sheet structure or a thin plate structure, wherein the clamp plate 1 is adhered to a carrier plate 3 through a fixing adhesive layer 2 having a certain thickness.

Wherein, the clamp plate 1 is provided with a plurality of through holes which penetrate through two end faces, namely chip fixing holes 101. In practice, the die attach wells 101 are preferably arranged in an array, such as that shown in FIG. 1. Of course, the arrangement may be changed correspondingly according to actual needs, for example, the arrangement is provided as a plurality arranged at intervals along the circumferential direction.

It is understood that, in actual arrangement, the opening size of the chip fixing hole 101 corresponds to the size (length-width size, thickness size) of the chip 4 to be fixed.

Specifically, the chip fixing hole 101 has a length and width dimension larger than that of the chip 4 to be fixed, and the length and width dimension of the chip fixing hole 101 is preferably a dimension obtained by increasing the length and width dimension of each of the chips 4 to be fixed by 0.5 to 2mm.

The selection of the above dimensions is a result of comprehensively considering the difficulty of taking and placing the chip 4 to be fixed and the positioning accuracy. If the increment of the length and the width is less than 0.5mm, the difficulty of putting in and taking out the chip 4 to be fixed is increased, and the risk of damaging the edge of the chip and damaging the chip exists; if the increment of the length and the width is larger than 2mm, the position offset of the chip may be too large after the chip 4 is fixed, which affects the identification and operation precision of subsequent operation equipment.

Meanwhile, as for the depth of the chip fixing hole 101, it corresponds to the thickness of the jig plate 1, and at the time of actual setting, the thickness value also preferably corresponds to the thickness value of the chip 4 to be fixed, and further preferably 0.9 to 1.5 times the thickness of the chip 4 to be fixed.

However, in actual arrangement, in order to avoid deformation of the plate body due to the clamp plate 1 being too thin, the thickness of the clamp plate 1 is not less than 2mm in the preferred embodiment, that is, the depth of the chip fixing hole 101 is not less than 2mm.

Further, the fixture plate 1 in the preferred embodiment is preferably connected to the corresponding carrier plate 3 by a layer of fixing glue, and at this time, the two sides of the fixing glue layer 2 have adhesive ability, i.e. are "double-sided glue". In practical applications, the carrier plate 3 may be a top plate of a transfer mechanism, a workbench of a testing mechanism (probe device) or a processing mechanism (e.g., gold wire bonding device), or a carrier for applying glue. In actual installation, the carrier plate 3 may be of a hard structure or a soft structure as long as it can be used as an installation medium for the fixing glue.

In the preferred embodiment, the carrier plate 3 is a rigid plate structure with a certain thickness and a certain strength, and is connected to the bottom surface of the clamp plate 1 through a fixing glue.

Certainly, in actual setting, the bearing plate 3 may not be provided according to the change of the setting requirement, at this time, only one layer of the fixing adhesive layer 2 needs to be adhered on the bottom surface of the clamp plate 1, at this time, the fixing adhesive layer 2 may have an adhesive capacity on one side, that is, "single-sided adhesive", which is equivalent to the fixing adhesive layer 2 serving as the bottom pocket of the clamp plate 1 to form the supporting bottom surface of the chip fixing hole 101; after that, the chips 4 to be fixed are embedded and bonded in the corresponding chip fixing holes 101.

In actual operation, the chip 4 to be fixed can be taken and placed preferably by a material transferring machine, and after the chip is placed and fixed, the clamp plate 1 provided with the chip is preferably fixed by vacuum adsorption or pressing and holding by a pressing block through equipment to be operated.

In more detail, in a preferred embodiment, the fixing glue layer 2 for bonding and fixing the chip 4 to be fixed is a degradable glue film, which has a glue force during initial bonding and can be degraded and failed after a corresponding degradation treatment (light treatment or temperature control treatment), so that the glue force is lost and the adhesive connection between corresponding bonding objects is released.

During actual setting, the fixture plate 1 and the bearing plate 3 are reliably bonded through the degradable adhesive film, so that the chip 4 to be fixed can be bonded on the surface of the degradable adhesive film after being placed into the chip fixing hole 101, and then the chip 4 to be fixed is fixed on the fixture plate 1.

In more detail, the degradable adhesive film in the preferred embodiment may be a thermally degradable adhesive film, or may be a photodegradable adhesive film.

For the thermal degradation adhesive film, the thermal degradation adhesive film is preferably insensitive to light, is not degraded or failed under the illumination condition, can meet the requirements of electrifying and optical coupling in the corresponding chip detection process, and can realize the degradation failure of the adhesive film in a temperature control mode after the test is finished. During actual setting, if the temperature of the temperature control treatment is too low, the adhesive film may decompose and lose efficacy under the condition that the temperature is slightly higher than the room temperature, so that the chip is not firmly fixed, and the accuracy of the chip test is affected; if the temperature of control by temperature change processing is too high, the degree of difficulty of operation may be increased to there is the risk that operating personnel scald, moreover, there is the chip risk of damaging for a long time high temperature.

Therefore, in a preferred embodiment, the degumming failure temperature of the thermal degradation adhesive film is preferably 60 ℃ to 150 ℃.

For the photodegradable adhesive film, the photodegradable adhesive film is preferably insensitive to temperature, does not degrade or melt under corresponding temperature conditions, and can be suitable for scenes needing heating treatment of the chip, such as a ball mounting operation process of the chip. At present, ball bonding is mostly carried out in a thermosonic mode aiming at the ball planting of a chip, the operation process is completed under a heating condition, at the moment, the tolerance temperature of fixing glue is preferably not less than 250 ℃, and after the operation process is completed, the degradation failure of a glue film can be correspondingly realized through the illumination effect of a specific wavelength, so that the taking-out operation of the chip is realized.

In one embodiment, the photodegradable adhesive film is further preferably a UV (Ultraviolet) adhesive film, which can be degummed by degradation under the irradiation of Ultraviolet light, and then the removal of the chip is completed.

The utility model provides a small-size chip fixing device, its simple structure, it is convenient to use, can realize the reliable fixed of small-size chip, avoids traditional chip fixing method to the pollution and the damage of chip, guarantees the location accuracy in chip test or the course of working, provides the condition for automatic identification, the search of the corresponding equipment after the chip is fixed, and then has promoted the yield and the efficiency of the relevant rear end operation of small-size chip, has better practical value and application prospect.

It will be understood by those skilled in the art that the foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

Claims

1. A small chip fixing device is characterized by comprising a clamp plate and a fixing glue layer;

the fixing glue layer is glued on one side end face of the clamp plate, and a chip to be fixed can be fixed by the fixing glue layer after being embedded into the chip fixing hole; and is

The fixed glue layer is a degradable glue film, can have the gluing capacity in an initial state, and is degraded and failed after corresponding degradation treatment.

2. The small chip holder according to claim 1, wherein the degradable adhesive film is a photodegradable adhesive film, and the corresponding degradation process is a photodegradable process.

3. The small chip mounting apparatus as claimed in claim 2, wherein the photo-degradable adhesive film is a UV adhesive film that can be degummed by degradation under the irradiation of UV light.

4. The small chip fixing device as claimed in claim 1, wherein the degradable adhesive film is a thermal degradable adhesive film, and the corresponding degradation process is a temperature-controlled degradation process.

5. The small chip fixing device according to claim 4, wherein the thermal degradation adhesive film has a degumming failure temperature of 60 ℃ to 150 ℃.

6. The small chip holder according to any one of claims 1 to 5, wherein the chip holding hole has a length and width dimension larger than that of the chip to be held, and is increased by 0.5mm to 2mm in each of the length and width dimensions of the chip to be held.

7. The microchip holder of claim 6, wherein the chip holding holes are arranged in an array or are circumferentially spaced.

8. The die attach apparatus according to any one of claims 1 to 5 and 7, wherein the die attach hole has a thickness dimension of 0.9 to 1.5 times the thickness dimension of the die to be attached.

9. The small chip holder according to any one of claims 1 to 5 and 7, further comprising a carrier plate;

the bearing plate and the clamp plate are bonded through the fixing glue layer.

10. The small chip holder according to any one of claims 1 to 5 and 7, wherein the jig plate has a thickness of not less than 2mm.