CN218352832U - Plasma etching device and double-cavity structure thereof - Google Patents

Abstract

The utility model discloses a plasma etching device and a double-cavity structure thereof, which comprises an outer cavity shell, two groups of pneumatic door body mechanisms, an upper cooling component, an upper electrode, a lower cooling component, a lower electrode and a longitudinal and transverse guide mechanism, wherein a feed port and a discharge port are respectively arranged at two opposite sides of the outer cavity shell, and the two groups of pneumatic door body mechanisms are respectively arranged at the feed port and the discharge port of the outer cavity shell; the upper cooling assembly and the upper electrode are arranged on the top side of the outer cavity shell, and the lower cooling assembly and the lower electrode are arranged on the bottom side of the outer cavity shell; the longitudinal and transverse guide mechanism is positioned between the upper electrode and the lower electrode, and is used for sliding guiding the plate frame clamp horizontally fed along the conveying direction and the PCB on the plate frame clamp and performing longitudinal and transverse limiting; and the duplex outer cavity shell layout with the upper layer and the lower layer superposed is adopted, the PCB loaded on the plate frame clamp is subjected to automatic plasma etching, the assembly and the positioning of double-station PCB batch feeding are realized, and the production efficiency and the processing precision are effectively improved.

Description

Plasma etching device and double-cavity structure thereof

[ technical field ] A

The utility model relates to an etching technique of PCB board especially relates to a plasma etching device and two-chamber structure thereof.

[ background ] A method for producing a semiconductor device

The plasma etching or plasma cleaning is an environment-friendly etching process, the purpose of the plasma etching is to etch the unprotected non-conductor part copper on the circuit board with patterns made in the previous process to form a circuit, or to generate plasma under strict conditions to clean the materials left in the drilled holes on the PCB, namely to remove the glue residues in the drilled holes in the PCB, and the plasma PCB removal glue residue technology can also provide better etching quality and through hole pollutant removal effect.

Plasma etching equipment generally consists of four main components: a vacuum chamber, two electrodes for generating radio frequency, a vacuum pump and an RF power supply. When the gas enters the system, a radio frequency is applied to ionize the gas particles and produce a high-velocity plasma pulse to etch. Plasma etching is also used, among other things, to clean the lead frame within the chip package, since the lead frame carries the electrical signals to the outside of the package and all organics must be removed before incorporation into the package.

However, most of the existing plasma etching equipment adopts an integrated structure, the internal structure is not adjustable, a loading clamp or a tray positioning mechanism aiming at a PCB is lacked, and the loading clamp or the tray is not convenient to adjust and place; moreover, during the use, load anchor clamps or tray and directly place when the top of station, easily receive the effect of external force and produce sideslip and rock, stability is relatively poor, can not effectively guarantee the quality of processing product.

[ Utility model ] content

The embodiment of the utility model provides a plasma etching device and two-chamber structure thereof adopts three complex guide rolls of group vertically and horizontally, effectively fixes a position and business turn over material control to the PCB board and plate frame anchor clamps complex etching assembly body, and the circulation of being convenient for is carried out the PCB board etching in batches, effectively improves processingquality and machining efficiency.

The utility model discloses the technical scheme that at least one embodiment adopted is:

in a first aspect, the embodiment provides a plasma etching apparatus for automatic plasma etching of a PCB board loaded on a board frame fixture, including:

the outer cavity shell is a square frame shell, an etching processed sealed cavity is formed inside the outer cavity shell, a feeding hole and a discharging hole are respectively formed in two opposite sides of the square frame shell, and a vacuum air exhaust interface and an air inlet and exhaust interface are respectively formed in the other two sides of the square frame shell with the feeding hole and the discharging hole being different;

the two groups of pneumatic door mechanisms are respectively arranged at the feed inlet and the discharge outlet of the outer cavity shell and are used for sealing the feed inlet and the discharge outlet during etching processing;

the upper cooling assembly is used for cooling and refrigerating the upper electrode;

the lower electrode is arranged at the bottom side of the outer cavity shell and used for generating high-speed plasma pulse to etch the lower surface of the PCB, and the lower cooling component cools and refrigerates the lower electrode;

and the longitudinal and transverse guide mechanism is positioned between the upper electrode and the lower electrode, is installed and fixed on the inner walls of two sides of the outer cavity shell, and is used for sliding guiding the plate frame clamp horizontally fed along the conveying direction and the PCB on the plate frame clamp and performing longitudinal and transverse limiting.

Preferably, each set of pneumatic door body mechanism comprises a material port sealing plate, long round waist holes vertically arranged at two sides of a material inlet or a material outlet on the outer cavity shell and used for slidably guiding two ends of the material port sealing plate, two sets of sliding rail frames sliding along the long round waist holes and two sets of pneumatic driving assemblies;

the lower end of the long round waist hole extends towards the direction close to the feed inlet or the discharge outlet on the outer cavity shell in an inclined way;

two ends of the material port sealing plate are respectively fixed on the sliding rail frame, and a piston rod of the pneumatic driving assembly is hinged on the sliding rail frame;

and the pneumatic driving assembly drives the slide rail frame and the connected material port sealing plate to move downwards along the long round waist hole to seal the material inlet or the material outlet of the sealing cover.

Preferably, the longitudinal and transverse guide mechanism comprises two groups of U-shaped guide strips, a plurality of groups of top side limiting pinch rollers, a plurality of groups of bottom side limiting supporting wheels and a plurality of groups of side limiting wheels, and the two groups of U-shaped guide strips are respectively installed and fixed on the inner walls of the two sides of the outer cavity shell between the upper electrode and the lower electrode;

the top side limiting pressing wheel and the bottom side limiting bearing wheel are respectively positioned at the upper side and the lower side of the frame of the plate frame clamp, and the side limiting wheels are abutted against the outer edge of the plate frame clamp;

the multiple groups of top side limiting pressing wheels, the multiple groups of bottom side limiting supporting wheels and the multiple groups of side limiting wheels are divided into two corresponding parts which are respectively and evenly arranged on each group of U-shaped guide strip plates at the inner walls of the two sides of the outer cavity shell at intervals, and the longitudinal and transverse limiting fixing is carried out while the plate frame clamp and a PCB on the plate frame clamp are guided in a sliding mode.

In a second aspect, another embodiment provides a dual chamber structure of a plasma etching apparatus, which employs a dual-station layout of the above plasma etching apparatus in which upper and lower layers are stacked, and support pillars for supporting and connecting the upper and lower layers are disposed at four corners between outer chamber shells of the upper and lower layers of the plasma etching apparatus.

Preferably, a standby placing mechanism for standby placing of the vacant plate frame clamp after the upper layer or the lower layer plasma etching device discharges is further arranged between the outer cavity shells of the upper layer and the lower layer plasma etching device, the standby placing mechanism comprises two groups of U-shaped guide strip plates, a plurality of groups of top side limiting pinch rollers, a plurality of groups of bottom side limiting supporting wheels and a plurality of groups of side limiting wheels, and the two groups of U-shaped guide strip plates are respectively installed and fixed on the supporting columns between the upper layer plasma etching device and the lower layer plasma etching device;

the top side limiting pressing wheel and the bottom side limiting bearing wheel are respectively positioned on the upper side and the lower side of the frame of the plate frame clamp, and the side limiting wheels are rotatably arranged between the U-shaped groove bodies of the U-shaped guide strip plates and abut against the outer edges of the plate frame clamp;

the multiple groups of top side limiting pressing wheels, the multiple groups of bottom side limiting bearing wheels and the multiple groups of side limiting wheels are respectively and uniformly arranged on each group of U-shaped guide strip plates at intervals, and are used for longitudinally and transversely limiting and fixing the plate frame clamp while sliding and guiding.

The beneficial effects of the utility model are that:

the utility model discloses in, in single layer construction's plasma etching device, adopt group's complex guide roller of moving about freely and quickly between upper electrode and the bottom electrode, effectively fix a position and business turn over material control to PCB board and sheet frame anchor clamps complex etching assembly body, be convenient for circulate in batches carry out the PCB board etching, effectively improve processingquality and machining efficiency.

When the plasma etching device adopting the double-layer structure is adopted, due to the adoption of the double-cavity layout of the double stations of the upper layer and the lower layer, the PCB is etched by the effective cooperation of the plate frame clamp and the PCB in order replacement and circulation in the process of feeding and discharging through the two etching cavities, a standby placing mechanism is further arranged between the outer cavity shells of the plasma etching device of the upper layer and the lower layer, the vacant plate frame clamp after the discharge of the plasma etching device of the upper layer or the lower layer is convenient to place for standby through the standby placing mechanism, the feeding and discharging efficiency of the PCB during the feeding and discharging is further improved, and the processing efficiency of the PCB is reasonably planned through the double stations.

[ description of the drawings ]

FIG. 1 is a schematic left side view of a single-layer plasma etching apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic diagram illustrating a right side view of a single-layer plasma etching apparatus according to an embodiment of the present invention;

FIG. 3 is a schematic left side view of a single-layer plasma etching apparatus according to an embodiment of the present invention to remove a portion of the housing;

FIG. 4 is a schematic side view of a single-layer plasma etching apparatus according to an embodiment of the present invention for removing a portion of the outer shell;

FIG. 5 is a schematic left-view structural diagram of a double-layer plasma etching apparatus according to a second embodiment of the present invention;

FIG. 6 is a schematic diagram of a second embodiment of the present invention showing a right side view of a dual-layer plasma etching apparatus;

fig. 7 is a schematic side view of a double-layered plasma etching apparatus according to a second embodiment of the present invention;

FIG. 8 is a schematic perspective view of a double-layered plasma etching apparatus according to a second embodiment of the present invention;

fig. 9 is a schematic perspective view of a second embodiment of the present invention, illustrating a top plasma etching apparatus and a spare placement mechanism for removing a portion of a frame.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Example one

The plasma etching device provided by the embodiment is used for automatic plasma etching of a PCB (not shown) loaded on a plate frame clamp 1, and as shown in fig. 1 to 4, the plasma etching device comprises an outer cavity shell 2, two groups of pneumatic door mechanisms 3, an upper cooling component 4, an upper electrode 5, a lower cooling component 6, a lower electrode 7 and a longitudinal and transverse guide mechanism 8, wherein the outer cavity shell 2 is a square frame shell, and a sealed cavity for etching processing is formed inside the outer cavity shell, strip-shaped feed inlets 9 and strip-shaped discharge outlets 10 are respectively arranged on two opposite sides of the square frame shell, vacuum air exhaust interfaces 11 and air inlet and outlet interfaces 12 are respectively arranged on the other two sides of the square frame shell with the feed inlets 9 and the discharge outlets 10 different from the feed inlets 10, and the two groups of pneumatic door mechanisms 3 are respectively installed at the feed inlets 9 and the discharge outlets 10 of the outer cavity shell 2 and are used for sealing the air inlet and outlet during etching processing.

As shown in fig. 3 and 4, the upper electrode 5 is mounted on the top side of the cavity housing 2 and used for generating high-speed plasma pulses to etch the upper surface of the PCB, and the upper cooling assembly 4 cools and refrigerates the upper electrode 5; the lower electrode 7 is arranged at the bottom side of the outer cavity shell 2 and used for generating high-speed plasma pulses to etch the lower surface of the PCB, and the lower cooling component 6 cools and refrigerates the lower electrode 7; the longitudinal and transverse guide mechanism 8 is positioned between the upper electrode 5 and the lower electrode 7, is installed and fixed on the inner walls of two sides of the outer cavity shell 2, and is used for limiting the plate frame clamp 1 which horizontally feeds along the conveying direction and the PCB on the plate frame clamp longitudinally and transversely while guiding in a sliding manner.

As shown in fig. 1 and 2, each set of pneumatic door mechanism 3 includes a material inlet sealing plate 30, long circular holes 31 vertically disposed on both sides of the material inlet 9 or the material outlet 10 on the outer cavity housing 2 for slidably guiding both ends of the material inlet sealing plate 30, two sets of slide rail frames 32 sliding along the long circular holes 31, and two sets of pneumatic driving assemblies 33, wherein the lower ends of the long circular holes 31 extend obliquely toward a direction close to the material inlet 9 or the material outlet 10 on the outer cavity housing 2; the two ends of the material opening sealing plate 30 are respectively fixed on the slide rail frame 32, and a piston rod of the pneumatic driving assembly 33 is hinged on the slide rail frame 32; the pneumatic driving assembly 33 drives the slide rail frame 32 and the connected material opening sealing plate 30 to move downwards along the long circular hole 31, and the material inlet 9 or the material outlet 10 is automatically sealed and covered through the guiding of the long circular hole 31.

As shown in fig. 3 and 4, the longitudinal and transverse guiding mechanism 8 includes two sets of U-shaped guiding strips 80, multiple sets of top-side limiting pressing wheels 81, multiple sets of bottom-side limiting supporting wheels 82 and multiple sets of side limiting wheels 83, wherein the two sets of U-shaped guiding strips 80 are respectively installed and fixed on the inner walls of the two sides of the outer cavity shell 2 between the upper electrode 5 and the lower electrode 7; the top side limiting pressure wheel 81 and the bottom side limiting bearing wheel 82 are respectively positioned at the upper side and the lower side of the frame of the plate frame clamp 1, and the side limiting wheels 83 are rotatably installed between the U-shaped groove bodies 800 of the U-shaped guide laths 80 and abut against the outer edges of the plate frame clamp 1. During assembly, the multiple sets of top side limiting pressing wheels 81, the multiple sets of bottom side limiting supporting wheels 82 and the multiple sets of side limiting wheels 83 are respectively and uniformly arranged on each set of U-shaped guide strip plates 80 at the inner walls of the two sides of the outer cavity shell 2 at intervals, and longitudinally and transversely limit and fix the plate frame clamp 1 and the PCB on the plate frame clamp while guiding in a sliding manner.

In this embodiment, go up the unloading in-process, the PCB board passes through 1 location bearing of sheet frame anchor clamps, and move about freely and quickly guiding mechanism 8 and be located between upper electrode 5 and lower electrode 7, can be to when sheet frame anchor clamps 1 that follow the direction of transfer horizontal feed and PCB board sliding guide on it, and vertically and transversely spacing, realize PCB board automated positioning and fixed, automatic feeding and automatic positioning in the etching processing of effectively being convenient for, realize the batch processing operation, effectively avoid the collision of PCB board in the production process, effectively improve production efficiency and machining precision.

Example two

As shown in fig. 5 to 9, the dual-chamber structure of the plasma etching apparatus in this embodiment is different from the first embodiment in that a dual-station layout in which the plasma etching apparatus is stacked in an upper layer and a lower layer is adopted, support columns 13 for supporting and connecting each other are disposed at four corners between the outer chamber shells 2 of the upper and lower layer plasma etching apparatuses, a spare placement mechanism 14 for placing the empty plate frame fixture 1 after the discharge of the upper or lower layer plasma etching apparatus is disposed between the outer chamber shells 2 of the upper and lower layer plasma etching apparatuses, and the spare placement mechanism 14 is the same as the vertical and horizontal guide mechanism 8 between the upper electrode 5 and the lower electrode 7, which is not described herein again; only the spare placement mechanism 14 is installed and fixed on the supporting column 13 between the upper plasma etching device and the lower plasma etching device, and the guide wheel 140 for guiding the blank plate frame clamp 1 is arranged at the feed/discharge port 10 of the spare placement mechanism in an extending manner.

In this embodiment, realize going up the unloading in-process through two etching chambeies and replace the endless PCB board etching of carrying on in order to and the vacant sheet frame anchor clamps 1 that are convenient for after the upper strata or the ejection of compact of lower floor's plasma etching device is reserved to be placed through reserve placement machine structure, the business turn over material efficiency of PCB board when further improving and unloading.

When the double-layer double-station plasma etching device works, in a feeding area, an automatic feeding control device of a PCB (printed Circuit Board) lifts a plate frame clamp 1 which clamps the PCB, then the plate frame clamp is horizontally transferred into an etching cavity of an upper layer plasma etching device, then the automatic feeding control device exits from the etching cavity of the upper layer, the upper layer plasma etching device seals a feeding and discharging port 10 through a pneumatic door mechanism 3, and then the steps of vacuumizing, adding cleaning gas and ionizing are sequentially carried out to finish etching.

Then, in a discharging area, the automatic blanking control device of the PCB takes out the etched PCB and the plate frame fixture 1 from the etching cavity of the upper plasma etching device, removes the PCB from the plate frame fixture 1 and transfers the plate frame fixture 1 to a next station, at this time, a vacant plate frame fixture 1 is formed, and the automatic blanking control device transfers the vacant plate frame fixture 1 to a plate frame idle area between the upper plasma etching device and the lower plasma etching device.

Further, automatic feeding controlling means obtains vacant sheet frame anchor clamps 1 in the idle district of sheet frame to shift the PCB board of coming on the production line behind the elevating movement, translate again to material loading station on vacant sheet frame anchor clamps 1, the processing of single PCB board and sheet frame anchor clamps 1 recovery are accomplished in the circulation.

And finishing the flow of processing the single PCB and recovering the plate frame clamp 1, moving the plate frame clamp 1 with the PCB to an etching cavity of the lower-layer plasma etching device after the plate frame clamp 1 with the PCB is lifted and translated by the automatic feeding control device for the second loading, and repeating the steps of the upper-layer plasma etching device to finish the processing of the single PCB in the lower-layer plasma etching device and the recovery of the plate frame clamp 1.

The upper plasma etching device and the lower plasma etching device alternately work in a reciprocating mode in sequence, and therefore continuous etching processing of the PCB can be achieved.

In the description of the present invention, it should be noted that the terms "top", "bottom", "upper", "lower", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the utility model is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

The above-mentioned embodiment is only the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent changes made by the shape, structure and principle of the present invention should be covered in the protection scope of the present invention.

Claims (5)

1. Plasma etching device for the automatic plasma etching of PCB board of loading on plate frame anchor clamps, its characterized in that includes:

the outer cavity shell is a square frame shell, an etching processed sealed cavity is formed inside the outer cavity shell, a feeding hole and a discharging hole are respectively formed in two opposite sides of the square frame shell, and a vacuum air exhaust interface and an air intake and exhaust interface are respectively formed in the other two sides of the square frame shell with the feeding hole and the discharging hole being different;

the two groups of pneumatic door mechanisms are respectively arranged at the feed inlet and the discharge outlet of the outer cavity shell and are used for sealing the feed inlet and the discharge outlet during etching processing;

the upper cooling assembly is used for cooling and refrigerating the upper electrode;

the lower electrode is arranged at the bottom side of the outer cavity shell and used for generating high-speed plasma pulses to etch the lower surface of the PCB, and the lower cooling component cools and refrigerates the lower electrode;

and the longitudinal and transverse guide mechanism is positioned between the upper electrode and the lower electrode, is installed and fixed on the inner walls of two sides of the outer cavity shell, and is used for sliding guiding the plate frame clamp horizontally fed along the conveying direction and the PCB on the plate frame clamp and performing longitudinal and transverse limiting.

2. The plasma etching device according to claim I, wherein each set of pneumatic door mechanisms comprises a material port sealing plate, a long round waist hole vertically arranged on the outer cavity shell and used for slidably guiding two ends of the material port sealing plate at two sides of a material inlet or a material outlet, two sets of slide rail frames sliding along the long round waist hole, and two sets of pneumatic driving components;

the lower end of the long round waist hole extends towards the direction close to the feed inlet or the discharge outlet on the outer cavity shell in an inclined way;

two ends of the material port sealing plate are respectively fixed on the sliding rail frame, and a piston rod of the pneumatic driving assembly is hinged on the sliding rail frame;

and the pneumatic driving assembly drives the slide rail frame and the connected material port sealing plate to move downwards along the long round waist hole to seal the material inlet or the material outlet of the sealing cover.

3. The plasma etching apparatus of claim 1, wherein the vertical and horizontal guide mechanism comprises two sets of U-shaped guide strips, a plurality of sets of top-side limiting pinch rollers, a plurality of sets of bottom-side limiting support rollers and a plurality of sets of side limiting rollers, the two sets of U-shaped guide strips are respectively installed and fixed at the inner walls of the two sides of the outer chamber between the upper electrode and the lower electrode;

the top side limiting pressing wheel and the bottom side limiting bearing wheel are respectively positioned at the upper side and the lower side of the frame of the plate frame clamp, and the side limiting wheels are abutted against the outer edge of the plate frame clamp;

the multiple groups of top side limiting pressing wheels, the multiple groups of bottom side limiting supporting wheels and the multiple groups of side limiting wheels are divided into two corresponding parts which are respectively and evenly arranged on each group of U-shaped guide strip plates at the inner walls of the two sides of the outer cavity shell at intervals, and the longitudinal and transverse limiting fixing is carried out while the plate frame clamp and a PCB on the plate frame clamp are guided in a sliding mode.

4. The double-chamber structure of the plasma etching device is characterized in that the double-station layout of the plasma etching device according to any one of claims l to 3, wherein the upper layer and the lower layer are overlapped in a layered manner, and supporting columns for supporting and connecting with each other are arranged at four corners between outer chamber shells of the upper layer and the lower layer of the plasma etching device.

5. The plasma etching apparatus of claim 4, wherein a standby placement mechanism for placing a vacant plate frame clamp after the discharge of the upper or lower plasma etching apparatus is further disposed between the outer chamber shells of the upper and lower plasma etching apparatuses, the standby placement mechanism comprises two sets of U-shaped guide slats, multiple sets of top-side limiting pinch rollers, multiple sets of bottom-side limiting supporting wheels and multiple sets of side limiting wheels, and the two sets of U-shaped guide slats are respectively mounted and fixed on the supporting columns between the upper plasma etching apparatus and the lower plasma etching apparatus;

the top side limiting pressing wheel and the bottom side limiting bearing wheel are respectively positioned on the upper side and the lower side of the frame of the plate frame clamp, and the side limiting wheels are rotatably arranged between the U-shaped groove bodies of the U-shaped guide strip plates and abut against the outer edges of the plate frame clamp;

the multiple groups of top side limiting pressing wheels, the multiple groups of bottom side limiting bearing wheels and the multiple groups of side limiting wheels are respectively and uniformly arranged on each group of U-shaped guide strip plates at intervals, and are used for longitudinally and transversely limiting and fixing the plate frame clamp while sliding and guiding.

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