CN217037774U - Communication equipment with heat radiation structure - Google Patents
Communication equipment with heat radiation structure Download PDFInfo
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- CN217037774U CN217037774U CN202220219198.2U CN202220219198U CN217037774U CN 217037774 U CN217037774 U CN 217037774U CN 202220219198 U CN202220219198 U CN 202220219198U CN 217037774 U CN217037774 U CN 217037774U
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- heat
- heat pipe
- heat dissipation
- receiving groove
- shell
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Abstract
A communication device having a heat dissipation structure, comprising: the heat dissipation device comprises a shell, wherein heat dissipation fins are arranged on the surface of the outer side of the shell; the heat pipe is attached to the inner side surface of the shell; the mainboard sets up inside the casing, working element has on the mainboard, working element with the heat pipe meets. By last, the heat pipe is attached on the casing inside surface to can make and form great area of contact between heat pipe and the casing, the different positions of casing can be transmitted with the heat fast to working element from this through the heat pipe, then dispel the heat by the heat dissipation wing that sets up on the casing, thereby can improve the radiating efficiency to working element. Meanwhile, the heat dissipation fins and the heat pipes are arranged on the shell, so that the heat dissipation fins, the shell and the heat pipes can be integrally installed and separated with the main board, and the main board can be conveniently disassembled and installed.
Description
Technical Field
The present invention relates to the field of communications devices, and in particular, to a communications device with a heat dissipation structure.
Background
With the development of communication technology, communication devices are becoming more and more powerful. At the same time, the volume of the communication device is getting smaller. Since working elements such as a CPU in a communication device generate a large amount of heat during operation, if the heat is not dissipated in time, the temperature of the CPU increases. The over-high temperature can affect the normal work of the CPU and even cause irreparable damage to the CPU. Meanwhile, due to the limitation of the volume, the installation among the elements in the communication equipment is very compact, and in order to dissipate heat of working elements such as a CPU, the connection and fixation between the heat dissipation assembly and the main board is generally complicated. Therefore, when the communication device is detached and mounted, it is very difficult to detach and mount the main board and the heat dissipation assembly. Therefore, a communication device with a heat dissipation structure is needed to improve the heat dissipation efficiency and facilitate the detachment and installation of the motherboard.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a communication device with a heat dissipation structure, which can improve the heat dissipation efficiency and facilitate the detachment and installation of a motherboard.
The present invention provides a communication device having a heat dissipation structure, including: the heat dissipation device comprises a shell, wherein heat dissipation fins are arranged on the surface of the outer side of the shell; the heat pipe is attached to the inner side surface of the shell; the mainboard sets up inside the casing, the last working element that has of mainboard, working element with the heat pipe meets.
By last, the heat pipe is attached on the casing inboard surface to can make and form great area of contact between heat pipe and the casing, the different positions of casing can be transmitted with the heat through the heat pipe fast to the working element from this, then dispel the heat by the fin that dispels the heat that sets up on the casing, thereby can improve the radiating efficiency to the working element. Meanwhile, the heat dissipation fins and the heat pipes are arranged on the shell, so that the heat dissipation fins, the shell and the heat pipes can be integrally installed and separated with the main board, and the main board can be conveniently detached and installed.
In some embodiments, the heat pipe is provided in plurality.
Therefore, the contact area between the heat pipe and the inner surface of the shell can be increased, and the contact area between the heat pipe and the working element can be increased, so that the heat dissipation efficiency is improved, and the heat dissipation effect is improved.
In some embodiments, the heat pipe further comprises a heat conduction block, the heat conduction block is located at a position corresponding to the working element and fixedly connected with the shell, and the heat pipe is located between the heat conduction block and the inner side surface of the shell.
Therefore, the heat pipe can be fixed on the inner side surface of the shell through the heat conduction block, and the contact area between the heat pipe and the working element can be increased through the heat conduction block, so that the heat dissipation efficiency is improved.
In some embodiments, the heat conducting block is provided with a first accommodating groove at a position corresponding to the heat pipe.
By the above, the heat pipe can be located in the first accommodating groove, so that the contact area between the heat pipe and the heat conducting block can be increased, and the heat dissipation efficiency is improved.
In some embodiments, a convex connecting portion is disposed on an inner side surface of the housing at a position opposite to the heat conducting block, and a second accommodating groove is disposed on the connecting portion at a position corresponding to the heat pipe.
From above, can lie in the corresponding position of heat conduction piece through setting up connecting portion to make things convenient for the fixed connection of heat conduction piece and shell. The connecting part is provided with the second accommodating groove, so that the contact area of the connecting part and the heat pipe can be increased, and the heat dissipation efficiency is improved.
In some embodiments, the cross-sectional shapes of the first receiving groove and the second receiving groove are adapted to the heat pipe.
Therefore, when the heat pipe is located in the first accommodating groove and the second accommodating groove, the outer surface of the heat pipe can be attached to the first accommodating groove and the second accommodating groove, so that the contact area is increased, and the heat dissipation efficiency is improved.
In some embodiments, the main plate is fixed to the heat-conducting block by bolts.
By last, fix the mainboard on the heat conduction piece through the bolt, can make the connection between working element and the heat conduction piece inseparabler to can improve the heat conduction effect. Meanwhile, the mainboard can be conveniently mounted and dismounted.
In some embodiments, a third receiving groove is formed in an inner surface of the housing, and the heat pipe is disposed in the third receiving groove.
Therefore, the contact area between the heat pipe and the shell can be increased, and the heat dissipation effect is improved.
In some embodiments, the heat pipe fixing device further includes a fixing block, the fixing block is fixedly connected to the housing, is disposed at a notch position of the third receiving groove, and fixes the heat pipe in the third receiving groove.
By last, can fix the heat pipe in the third storage tank through the fixed block to make the connection between heat pipe and the shell inseparabler, thereby improved the radiating effect.
In some embodiments, the fixing block is provided with a fourth accommodating groove at a position corresponding to the heat pipe.
Therefore, the contact area between the heat pipe and the fixed block can be increased, and the heat dissipation effect is improved.
Drawings
Fig. 1 is a schematic structural diagram of a communication device in an embodiment of the present application;
fig. 2 is a first exploded view of the communication device of fig. 1;
fig. 3 is a second exploded schematic view of the communication device in fig. 1;
FIG. 4 is a front projection view of the heat dissipation structure of FIG. 2;
FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4;
fig. 6 is a sectional view taken along the line B-B in fig. 4.
Description of the reference numerals
100 of a shell; 110 heat dissipation fins; 120 a connecting part; 121 a second accommodating groove; 130 a third accommodating groove; 200 heat pipes; 300 a main board; 310 a working element; 400 heat conducting blocks; 410 a first receiving groove; 500, fixing blocks; 510 fourth receiving groove.
Detailed Description
Next, the specific structure of the communication device in the embodiment of the present application is described in detail with reference to the drawings.
Fig. 1 is a schematic structural diagram of a communication device in an embodiment of the present application; fig. 2 is a first exploded view of the communication device of fig. 1; fig. 3 is a second exploded schematic view of the communication device in fig. 1. As shown in fig. 1, fig. 2, and fig. 3, the communication device in the embodiment of the present application includes: housing 100, heat pipe 200, and motherboard 300. The heat dissipation fins 110 are disposed on the outer surface of the casing 100, the heat pipe 200 is attached to the inner surface of the casing 100, the main board 300 is disposed inside the casing 100, the main board 300 has a CPU or other working elements 310 that generate heat during operation, and the working elements 310 are connected to the heat pipe 200.
From above, the heat pipe 200 is attached to the inner side surface of the case 100, so that a large contact area can be formed between the heat pipe 200 and the case 100, and thus the working element 310 can rapidly transfer heat to different positions of the case 100 through the heat pipe 200 and then dissipate the heat by the heat dissipation fins 110 provided on the case 100, so that the heat dissipation efficiency of the working element 310 can be improved. Meanwhile, because the heat dissipation fins 110 and the heat pipes 200 are both disposed on the housing 100, the heat dissipation fins 110, the housing 100, and the heat pipes 200 can be integrally mounted on and separated from the motherboard 300, so that the motherboard 300 can be conveniently dismounted and mounted.
The housing 100 is a shell-shaped member having an installation space therein, and specifically, may be, for example, a rectangular parallelepiped formed by combining a plurality of plate-shaped members as shown in fig. 1 to 3, some of six surfaces of the housing 100, for example, left, right, and upper portions, may be integrally formed by sheet metal, casting, or other means, and the front, rear, and lower portions may be fixed by bolts or the like, thereby forming the sealed housing 100. The case 100 is provided with heat dissipation fins 110 on a plurality of surfaces, for example, outer side surfaces of left, right, and upper side portions, thereby increasing a heat dissipation area and improving heat dissipation efficiency.
The heat pipe 200 is attached to the inner side surface of the case 100, and in particular, as shown in fig. 2, the heat pipe 200 may be provided in plurality, and the heat pipe 200 may be attached to the inner surface of the left, right, and upper portions of the case 100. The heat pipe 200 has a capillary structure inside and is filled with a cooling liquid, and the cooling liquid can transfer heat from one end of the heat pipe 200 to the other end of the heat pipe 200 by evaporation-condensation in the heat pipe 200. Therefore, heat can be rapidly transferred to different positions of the left, right and upper parts of the casing 100 through the heat pipe 200, so that the heat can be rapidly conducted and dispersed, and finally dissipated by the heat dissipation fins 110 arranged on the casing 100, thereby improving the heat dissipation efficiency and the heat dissipation effect.
As shown in fig. 2 and 3, the communication device in the embodiment of the present application further includes a heat conduction block 400, the heat conduction block 400 is located at a position corresponding to the working element 310, and the shape of the heat conduction block 400 may be configured to match the shape of the working element 310, so as to increase the contact area between the heat conduction block 400 and the working element 310, and further increase the heat conduction effect.
The inner side surface of the housing 100 is provided with the connection portion 120, and specifically, as shown in fig. 2, for example, the inner side surface of the upper portion of the housing 100 is provided with the connection portion 120. The connecting portion 120 is convex, the shape of the connecting portion 120 may be configured to be matched with the heat conducting block 400, and the heat conducting block 400 may be fixedly connected with the connecting portion 120 by a bolt. The heat pipe 200 is disposed between the heat conduction block 400 and the connection portion 120, so that the heat pipe 200 is fixed.
As shown in fig. 2, the main board 300 may be fixed on the heat conducting block 400 by bolts, and the working element 310 on the main board 300 is attached to the heat conducting block 400 after the fixing, so that the heat generated by the working element 310 may be transferred to the heat pipe 200 by the heat conducting block 400, thereby implementing the heat dissipation of the working element 310.
As shown in fig. 2 and 3, the communication device in the embodiment of the present application further includes a fixing block 500, the fixing block 500 may be provided in plurality, and the fixing block 500 and the inner side surface of the housing 100 may be fixedly connected by bolts. Heat pipe 200 is located between fixing block 500 and the inner surface of casing 100, so that heat pipe 200 can be fixed and heat pipe 200 can be attached to the inner surface of casing 100.
Fig. 4 is a front projection view of the heat dissipation structure of fig. 2. As shown in fig. 2 to 4, the housing 100, the heat dissipation fins 110, the heat pipe 200, and the heat conduction block 400 in the communication device according to the embodiment of the present application may form an integrated heat dissipation structure after the installation. Meanwhile, since heat pipe 200 is attached to the inner surface of case 100, it does not hinder the installation of main board 300 and other devices. Therefore, when the communication device is mounted and dismounted, the main board 300 can be directly mounted and dismounted, so that the working element 310 and the heat dissipation structure can be conveniently connected and separated.
Fig. 5 is a sectional view taken along the line a-a in fig. 4. As shown in fig. 3 and 5, the heat conducting block 400 is provided with a first receiving groove 410 at a position corresponding to the heat pipe 200, and the connecting portion 120 is provided with a second receiving groove 121 at a position corresponding to the heat pipe 200. After the heat conducting block 400 is fixed on the connecting portion 120, the first receiving groove 410 is connected to the notch of the second receiving groove 121, and the heat pipe 200 is located inside the first receiving groove 410 and the second receiving groove 121. The cross sections of the first receiving groove 410 and the second receiving groove 121 are matched with the cross section of the heat pipe 200, so that the outer surface of the heat pipe 200 is attached to the first receiving groove 410 and the second receiving groove 121. Accordingly, the contact area between heat pipe 200 and heat conducting block 400 and connecting portion 120 can be increased, and the heat dissipation efficiency can be improved.
Fig. 6 is a sectional view taken along the line B-B in fig. 4. As shown in fig. 2, 3 and 6, a third receiving groove 130 is formed on the inner surface of the casing 100 at a position corresponding to the heat pipe 200. Specifically, the third receiving grooves 130 may be disposed on the inner side surfaces of the left and right sides of the casing 100, and arranged along the positions where the heat pipes 200 are attached to the inner side surface of the casing 100. The fixing block 500 is disposed at a notch position of the third receiving groove 130, so as to fix the heat pipe 200. A fourth receiving groove 510 is further disposed at a position of the fixing block 500 corresponding to the heat pipe 200, after the fixing block 500 is mounted, the third receiving groove 130 is connected to a notch of the fourth receiving groove 510, and the heat pipe 200 is disposed inside the third receiving groove 130 and the fourth receiving groove 510. The cross sections of the third receiving groove 130 and the fourth receiving groove 510 are matched with the cross section of the heat pipe 200, so that the outer surface of the heat pipe 200 is attached to the third receiving groove 130 and the fourth receiving groove 510. Therefore, the contact area between the heat pipe 200 and the housing and the fixing block 500 can be increased, and the heat dissipation efficiency can be further improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the present invention, which is intended to cover any modifications, equivalents, improvements, etc. within the spirit and scope of the present invention.
Claims (10)
1. A communication apparatus having a heat dissipation structure, comprising:
the heat dissipation device comprises a shell, wherein heat dissipation fins are arranged on the surface of the outer side of the shell;
the heat pipe is attached to the inner side surface of the shell;
the mainboard sets up inside the casing, working element has on the mainboard, working element with the heat pipe meets.
2. The communication apparatus having a heat dissipation structure according to claim 1, wherein the heat pipe is provided in plurality.
3. The communication apparatus having a heat dissipation structure according to claim 1, further comprising a heat conduction block located at a position corresponding to the working element and fixedly connected to the housing, wherein the heat pipe is located between the heat conduction block and an inner surface of the housing.
4. The communication device with the heat dissipation structure as recited in claim 3, wherein the heat conduction block is provided with a first receiving groove at a position corresponding to the heat pipe.
5. The communication apparatus having a heat dissipating structure according to claim 4, wherein the case inside surface is provided with a convex connecting portion at a position opposite to the heat conducting block, and the connecting portion is provided with a second receiving groove at a position corresponding to the heat pipe.
6. The communication device with the heat dissipation structure as recited in claim 5, wherein the cross-sectional shapes of the first receiving groove and the second receiving groove are adapted to the heat pipe.
7. The communication device with the heat dissipation structure as set forth in claim 3, wherein the main board is fixed to the heat conduction block by a bolt.
8. The communication device with the heat dissipation structure as recited in claim 1, wherein a third receiving groove is disposed on an inner surface of the housing, and the heat pipe is disposed in the third receiving groove.
9. The communication device with the heat dissipation structure as recited in claim 8, further comprising a fixing block fixedly connected to the housing and disposed at a notch of the third receiving groove to fix the heat pipe in the third receiving groove.
10. The communication device with the heat dissipation structure as recited in claim 9, wherein the fixing block is provided with a fourth receiving groove at a position corresponding to the heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220219198.2U CN217037774U (en) | 2022-01-25 | 2022-01-25 | Communication equipment with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220219198.2U CN217037774U (en) | 2022-01-25 | 2022-01-25 | Communication equipment with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217037774U true CN217037774U (en) | 2022-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220219198.2U Active CN217037774U (en) | 2022-01-25 | 2022-01-25 | Communication equipment with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217037774U (en) |
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2022
- 2022-01-25 CN CN202220219198.2U patent/CN217037774U/en active Active
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