CN222154316U - Laser processing equipment - Google Patents
Laser processing equipment Download PDFInfo
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- CN222154316U CN222154316U CN202420160197.4U CN202420160197U CN222154316U CN 222154316 U CN222154316 U CN 222154316U CN 202420160197 U CN202420160197 U CN 202420160197U CN 222154316 U CN222154316 U CN 222154316U
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- laser
- partition
- circuit board
- fin group
- heat dissipation
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Abstract
The application relates to the field of laser equipment, in particular to a laser processing device which comprises a shell, a laser, a circuit board and a cooling fan. The shell is provided with an inner cavity. The baffle is connected with the casing to be located the inner chamber, with the inner chamber separation for installation cavity and connecting chamber, radiator fan and laser set up in the installation cavity, the circuit board sets up in the connecting chamber, and circuit board and baffle contact. The radiating fin group is arranged on the partition plate and is positioned in the mounting cavity, and the radiating fin group is configured to correspond to the position of the radiating fan so that the air flow generated by the radiating fan passes through the radiating fin group. The cooling fan cools the circuit board. That is, the heat dissipation fan dissipates heat of the laser and dissipates heat of the circuit board, so that the circuit board and the laser can be kept at a proper temperature without additionally arranging two fans, which is beneficial to reducing parts and the volume of the laser processing device, and the laser processing device is lighter.
Description
Technical Field
The application relates to the field of laser equipment, in particular to a laser processing device shell and a laser processing device.
Background
The laser can be widely applied to various fields, such as industry, medical treatment, business, scientific research, information, military and the like. The laser processing device generally needs to be provided with a heat dissipation fan and other structures to dissipate heat generated by the laser in the laser processing device, however, in the actual use process, besides the heat generated by the laser, the circuit board also needs to dissipate heat so as to ensure the stable operation of the laser processing device. Accordingly, in the related art, a heat radiation fan is separately provided at the circuit board, which may cause an excessively large volume of the laser processing apparatus.
Disclosure of utility model
In view of the above, it is necessary to provide a laser processing apparatus capable of reducing the volume.
In a first aspect, the present application provides a laser processing apparatus, including a housing, a laser, a circuit board, and a heat dissipating fan, wherein the housing includes a casing, a partition, and a heat dissipating fin set. The shell is provided with an inner cavity. The baffle with the casing is connected, and is located the inner chamber, with the inner chamber is separated into installation cavity and connecting chamber, radiator fan with the laser instrument set up in the installation cavity, the circuit board set up in the connecting chamber, just the circuit board with the baffle contacts. The radiating fin group is arranged on the partition plate and is positioned in the mounting cavity, and the radiating fin group is configured to correspond to the position of the radiating fan so that air flow generated by the radiating fan passes through the radiating fin group.
In the laser processing device, the cooling fan and the laser are both positioned in the mounting cavity, the cooling fan can be used for radiating the laser, in addition, the circuit board is in contact with the partition board, heat of the circuit board can be transferred to the partition board, the partition board transfers the heat to the cooling fin group, and air flow generated by the cooling fan can pass through the cooling fin group, so that the cooling of the circuit board by the cooling fan is realized. That is, the heat dissipation fan dissipates heat of the laser and dissipates heat of the circuit board, so that the circuit board and the laser can be kept at a proper temperature without additionally arranging two fans, which is beneficial to reducing parts and the volume of the laser processing device, and the laser processing device is lighter.
In one possible implementation, the housing includes a main body and a connection housing, the main body or the partition is detachably connected with the connection housing, the main body and the partition form the installation cavity, and the partition and the connection housing form the connection cavity.
In one possible implementation, the fin group includes a plurality of fins, and the plurality of fins are equidistantly spaced.
In one possible implementation manner, the laser processing device further includes a heat dissipation structure, the heat dissipation structure is connected with the housing and located in the mounting cavity, the laser is connected with the heat dissipation structure, and the air flow generated by the heat dissipation fan passes through the heat dissipation fin group and the heat dissipation structure.
In one possible implementation manner, the heat dissipation structure includes a first fin set and a second fin set, the first fin set and the second fin set are arranged at intervals, the laser and the heat dissipation fin set are located between the first fin set and the second fin set, and an air flow generated by the heat dissipation fan passes through the first fin set, the second fin set and the heat dissipation fin set.
In one possible implementation manner, the first fin group includes a plurality of first fins arranged at intervals, the second fin group includes a plurality of second fins arranged at intervals, the fin group includes a plurality of fins arranged at intervals, and the length directions of the first fins, the second fins and the fins are parallel.
In one possible implementation, a heat dissipating silicone grease is disposed in the connection cavity, and the heat dissipating silicone grease contacts the circuit board and the connection housing.
In one possible implementation, the projection of the circuit board at least partially coincides with the projection of the heat sink group in a direction perpendicular to the partition.
In one possible implementation, the body includes a cover plate, a first side plate, a second side plate, a first end plate, and a second end plate. The cover plate is arranged opposite to the partition plate. One side of the first side plate is connected with the cover plate, and the other side of the first side plate is in contact with the connecting shell. The second side plate is arranged opposite to the first side plate, one side of the second side plate is connected with the cover plate, the other side of the second side plate is in contact with the connecting shell, and the partition plate is arranged between the first side plate and the second side plate. The first end plate is arranged at one end of the partition plate, the first end plate is provided with a heat dissipation groove, and the heat dissipation fan is connected with the first end plate. The second end plate is arranged at the other end of the partition board, a laser hole is formed in the second end plate, and laser output by the laser passes through the laser hole.
In one possible implementation manner, the heat dissipation structure further includes a wind deflector, where the wind deflector is disposed between the first fin group and the second fin group and is disposed at intervals with the partition board, the wind deflector is opposite to the heat dissipation fan, the first fin group, the second fin group, the wind deflector and the partition board enclose to form an installation space, and the heat dissipation fin group is located in the installation space.
In the laser processing device, the laser and the circuit board are separated through the partition board, and the circuit board is contacted with the partition board so as to conduct heat generated by the circuit board to the radiating fins, and the radiating fan radiates heat through the radiating fins so as to radiate the circuit board. In addition, the radiating fan can radiate the laser through the radiating structure, and the radiating fan can radiate the radiating fin group and the radiating structure at the same time, so that the radiating effect is improved.
Drawings
Fig. 1 is a perspective view of a laser processing apparatus.
Fig. 2 is an exploded view of the laser processing apparatus of fig. 1.
Fig. 3 is a perspective view of a part of the laser processing apparatus of fig. 1.
Fig. 4 is a side view of a portion of the housing and circuit board of fig. 1.
Fig. 5 is an exploded view of a portion of the housing and circuit board of fig. 1.
Fig. 6 is a perspective view of the laser and heat dissipation structure of fig. 1
Description of main reference numerals:
100. A laser processing device;
10. The shell, 11, the shell, 110, the inner cavity, 111, the main body, 1111, the cover plate, 1112, the first side plate, 1113, the second side plate, 1114, the first end plate, 11141, the radiating groove, 1115, the second end plate, 11151, the laser hole, 1110, the installation cavity, 112, the connecting shell, 1121, the connecting plate, 1122, the baffle, 1123, the clamping block, 1120, the connecting cavity, 12, the baffle, 121, the plate body, 122, the locating strip, 13, the radiating fin group, 131 and the radiating fin;
20. 30 parts of a laser, a circuit board, 40 parts of a cooling fan;
50. Heat radiation structure, 51, first fin group, 511, first fin, 52, second fin group, 521, second fin, 53, heat pipe, 54, wind shield;
S, installing space.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments, and all other embodiments obtained by persons of ordinary skill in the art without making any inventive effort based on the embodiments of the present application are within the scope of protection of the present application.
It should be understood that the term "vertical" is used in the present solution to describe the ideal situation between two components, taking into account the factors of the actual tolerances. In the actual production or use state, there may be an approximately vertical state between the two components. The two components described as "perpendicular" may be considered "straight" or "planar" as they are considered "straight" or "planar" in that they are not strictly straight or planar, but may be substantially straight or planar in that they extend in a macroscopic manner.
Referring to fig. 1, the present embodiment provides a laser processing apparatus 100, and the laser processing apparatus 100 includes, but is not limited to, a laser cutting machine, a laser welding machine, a laser engraving machine, a laser marking machine, etc., and the laser processing apparatus 100 of the present application will be exemplified as the laser engraving machine.
Referring to fig. 1 and 2, the laser processing apparatus 100 includes a housing 10, a laser 20, a circuit board 30, and a heat dissipation fan 40, wherein the laser 20, the circuit board 30, and the heat dissipation fan 40 are disposed in the housing 10, and the heat dissipation fan 40 is used for dissipating heat from the laser 20 and the circuit board 30. The heat dissipation of the laser 20 and the circuit board 30 is performed by one heat dissipation fan 40, which is beneficial to cost reduction, volume reduction and light weight of the laser processing device 100.
Referring to fig. 2 and 3, the housing 10 includes a shell 11, a partition 12, and a fin group 13. The housing 11 is provided with an inner cavity 110, the partition board 12 is connected with the housing 11 and is located in the inner cavity 110 to divide the inner cavity 110 into a mounting cavity 1110 and a connecting cavity 1120, the heat dissipation fan 40 and the laser 20 are arranged in the mounting cavity 1110, the circuit board 30 is arranged in the connecting cavity 1120, and the circuit board 30 is in contact with the partition board 12. The fin group 13 is disposed on the partition 12 and is located in the installation cavity 1110, and the fin group 13 is configured to correspond to the position of the cooling fan 40, so that the air flow generated by the cooling fan 40 passes through the fin group 13.
The cooling fan 40 and the laser 20 are both located in the mounting cavity 1110, the cooling fan 40 can be used for cooling the laser 20, in addition, the circuit board 30 is in contact with the partition board 12, heat of the circuit board 30 can be transferred to the partition board 12, the partition board 12 transfers the heat to the cooling fin set 13, and air flow generated by the cooling fan 40 can pass through the cooling fin set 13, so that cooling of the circuit board 30 by the cooling fan 40 is achieved. That is, the heat dissipation fan 40 dissipates heat to the laser 20 and dissipates heat to the circuit board 30, so that the circuit board 30 and the laser 20 can be kept at a proper temperature without additionally arranging two fans, which is beneficial to reducing parts, reducing the volume of the laser processing device 100 and enabling the laser processing device 100 to be lighter.
Further, by separating the laser 20 from the circuit board 30 using the spacer 12, heat generated by the laser 20 can be blocked from flowing to the circuit board 30, and the occurrence of excessive temperature of the circuit board 30 can be reduced.
Referring to fig. 3, 4 and 5, in some embodiments, the circuit board 30 is mounted on a side of the partition 12 away from the mounting cavity 1110, and the partition 12 can separate the laser 20 from the circuit board 30 and provide a location for mounting the circuit board 30, which is beneficial for further lightening the laser processing apparatus 100. Further, the circuit board 30 is mounted on the partition board 12, and the contact area between the circuit board 30 and the partition board 12 is large, so that heat generated by the circuit board 30 can be transferred to the partition board 12.
In some embodiments, the housing 11 includes a main body 111 and a connection housing 112, where the main body 111 or the partition 12 is detachably connected to the connection housing 112, and an inner cavity 110 is defined between the main body 111 and the connection housing 112. The main body 111 is connected with the partition board 12, and the main body 111 encloses with the partition board 12 to form a mounting cavity 1110, and the partition board 12 encloses with the connection housing 112 to form a connection cavity 1120. Alternatively, the body 111 is integrally coupled with the partition plate 12, and the partition plate 12 is detachably coupled with the coupling case 112 by bolts.
When the main body 111 or the partition 12 is detachably connected with the connection housing 112 and the main body 111 or the partition 12 is separated from the connection housing 112, the partition 12 is exposed at a side far away from the mounting cavity 1110, so that the circuit board 30 is mounted on the partition 12, which is beneficial to improving the assembly efficiency of the laser processing device 100.
Alternatively, the body 111 and the partition 12 are connected to form a substantially rectangular shape, and the mounting cavity 1110 is also substantially rectangular in shape. The overall shape of the housing 11 and the shape of the connection cavity 1120 are also substantially rectangular, and since the size of the laser 20 is larger than that of the circuit board 30 and the mounting cavity 1110 is also required to mount the heat radiation fan 40, the volume of the mounting cavity 1110 is larger than that of the connection cavity 1120.
In some embodiments, the body 111 includes a cover plate 1111, a first side plate 1112, a second side plate 1113, a first end plate 1114, and a second end plate 1115. The cover plate 1111 is disposed opposite to the partition plate 12, and one side of the first side plate 1112 is connected to the cover plate 1111 and the other side is in contact with the connection housing 112. The second side plate 1113 is disposed opposite to the first side plate 1112, one side of the second side plate 1113 is connected to the cover plate 1111, the other side is in contact with the connection housing 112, and the partition 12 is disposed between the first side plate 1112 and the second side plate 1113. The first end plate 1114 is disposed at one end of the cover plate 1111, the first end plate 1114 is provided with a heat dissipation groove 11141, and the heat dissipation fan 40 is connected to the first end plate 1114. The second end plate 1115 is disposed at the other end of the cover plate 1111, and the second end plate 1115 is provided with a laser hole 11151, and laser light outputted from the laser 20 passes through the laser hole 11151.
The first side plate 1112, the second side plate 1113, the cover plate 1111, and the partition plate 12 may be integrally formed, and the first end plate 1114 and the second end plate 1115 may be connected to the first side plate 1112, the second side plate 1113, the cover plate 1111, and the connection case 112 at corresponding positions by bolts.
Referring to fig. 2, 3 and 4, the heat dissipation fan 40 is connected to the first end plate 1114, and the heat dissipation groove 11141 is provided to communicate the mounting cavity 1110 with the outside, so that the heat dissipation fan 40 can generate an air flow to dissipate heat from the laser 20 and the circuit board 30.
Referring to fig. 4 and 5, in some embodiments, the partition 12 includes a plate body 121 and two positioning strips 122, the plate body 121 is disposed on the inner sides of the first side plate 1112 and the second side plate 1113, and the plate body 121 is adjacent to the edges of the first side plate 1112 and the second side plate 1113 on the side far from the cover plate 1111. The heat sink group 13 is disposed on one side of the board 121, and the circuit board 30 is disposed on the other side of the board 121. The two positioning strips 122 are arranged at intervals on one side of the plate body 121 far away from the radiating fin group 13, and the circuit board 30 is positioned between the two positioning strips 122. The positioning strips 122 extend out of the housing 11 from a side remote from the cover plate 1111, and one positioning strip 122 is adjacent to the first side plate 1112 and the other is adjacent to the second side plate 1113.
The first side plate 1112 and the corresponding positioning strip 122, and the second side plate 1113 and the other positioning strip 122 respectively form a step structure. The connection housing 112 cooperates with the stepped structure to position the connection housing 112 to promote stability of the housing 10.
The connection shell 112 includes a connection plate 1121 and two baffles 1122, the connection plate 1121 is disposed opposite to the plate body 121, and the two baffles 1122 are disposed at two opposite sides of the connection plate 1121 at intervals. When the connection housing 112 is connected to the partition 12, the barrier 1122 is engaged with the stepped structure, and in particular, one side of the barrier 1122 close to the other barrier 1122 is in contact with one side of the corresponding positioning bar 122 away from the other positioning bar 122, and the first side plate 1112 and the second side plate 1113 are in contact with the corresponding barrier 1122, thereby positioning the connection housing 112.
In some embodiments, the connection housing 112 further includes a clamping block 1123, where the clamping block 1123 is disposed on a side of the plate 121 away from the connection cavity 1120, and the clamping block 1123 is used for being connected to a driving device, and the driving device is used for driving the laser processing device 100 to move, so that the laser processing device 100 can process different positions of the workpiece.
In some embodiments, a heat dissipating silicone grease is disposed within the connection cavity 1120, the heat dissipating silicone grease being in contact with the circuit board 30 and the connection housing 112. The heat generated by the circuit board 30 can be conducted to the connection housing 112 through the heat dissipation silicone grease in addition to the partition board 12, so as to further enhance the heat dissipation effect of the circuit board 30.
In some embodiments, along the direction perpendicular to the plate body 121 of the partition 12, the projection of the circuit board 30 at least partially coincides with the projection of the heat sink 13, so that the heat of the circuit board 30 is more easily conducted into the heat sink 13, which is beneficial to improving the heat dissipation effect of the heat sink 13. Optionally, the central axis of the circuit board 30 coincides with the projection of the central axis of the heat sink group 13.
In some embodiments, the fin group 13 includes a plurality of fins 131, the plurality of fins 131 are equidistantly spaced apart, and the direction of arrangement is parallel to the direction of spacing of the first side plate 1112 from the second side plate 1113. The heat dissipation fins 131 are parallel to the first side plate 1112, and the air flow generated by the heat dissipation fan 40 can pass through between two adjacent heat dissipation fins 131, so as to dissipate heat of the heat dissipation fins 131.
In some embodiments, the laser processing device 100 further includes a heat dissipating structure 50, where the heat dissipating structure 50 is connected to the housing 11 and located in the mounting cavity 1110, and the laser 20 is connected to the heat dissipating structure 50, and the air flow generated by the heat dissipating fan 40 passes through the heat dissipating fin set 13 and the heat dissipating structure 50.
The heat generated by the laser 20 can be conducted to the heat dissipating structure 50, and the air flow generated by the heat dissipating fan 40 can pass through the heat dissipating fin set 13 and the heat dissipating structure 50, so as to dissipate heat of the laser 20 and the circuit board 30. The heat dissipation effect of the laser 20 is advantageously improved by providing the heat dissipation structure 50.
Referring to fig. 2, 3 and 6, in some embodiments, the heat dissipation structure 50 includes a first fin set 51 and a second fin set 52, the first fin set 51 and the second fin set 52 are disposed at intervals, the laser 20 and the heat dissipation fin set 13 are located between the first fin set 51 and the second fin set 52, and the air flow generated by the heat dissipation fan 40 passes through the first fin set 51, the second fin set 52 and the heat dissipation fin set 13.
The heat dissipation effect on the laser 20 can be improved by providing the first fin group 51 and the second fin group 52, and in some embodiments, the first fin group 51 and the second fin group 52 are both in contact with the laser 20, so as to dissipate heat from two opposite sides of the laser 20.
In other embodiments, the first fin group 51 is in contact with the bottom of the laser 20. A heat pipe 53 is disposed between the first fin group 51 and the second fin group 52, and the heat absorbed by the first fin group 51 is transferred to the second fin group 52 through the heat pipe 53. Since the laser chip of the laser 20 is located at the bottom, the first fin group 51 contacts the bottom of the laser 20, which is advantageous in transferring heat generated from the laser chip to the first fin 511. The heat of the first fins 511 is transferred to the second fins 521 through the heat pipes 53, so as to enhance the heat dissipation effect of the heat dissipation structure 50.
In some embodiments, the first fin group 51 includes a plurality of first fins 511 arranged at intervals, and the second fin group 52 includes a plurality of second fins 521 arranged at intervals, and the length directions of the first fins 511, the second fins 521, and the heat sinks 131 are parallel.
The first fins 511, the second fins 521, and the heat sink 131 have the same longitudinal direction, and the airflow generated by the heat radiation fan 40 can flow through the first fins 511, the second fins 521, and the heat sink 131, respectively, and the heat radiation fan 40 can radiate heat from a plurality of structures.
Optionally, the length direction of the first fin 511, the second fin 521, and the heat sink 131, the length direction of the laser 20, and the length direction of the first side plate 1112 and the second side plate 1113 are all the same to maintain the uniformity of the appearance.
In some embodiments, the heat dissipation structure 50 further includes a wind deflector 54, where the wind deflector 54 is disposed between the first fin group 51 and the second fin group 52 and is spaced from the partition 12, the wind deflector 54 faces the heat dissipation fan 40, the first fin group 51, the second fin group 52, the wind deflector 54 and the partition 12 enclose a mounting space S, and the heat dissipation fin group 13 is located in the mounting space S. The wind shield 54 can guide the air flow to pass through the first fin group 51, the second fin group 52 and the heat dissipation fin group 13, so that the air flow generated by the heat dissipation fan 40 is reduced to directly pass through the laser 20, and the occurrence of the condition that the air flow passes through the first fin group 51, the second fin group 52 and the heat dissipation fin group 13 is reduced, thereby being beneficial to improving the heat dissipation effect.
In summary, in the laser processing apparatus 100 according to the embodiment of the application, the partition 12 separates the laser 20 and the circuit board 30, and the circuit board 30 contacts with the partition 12, so as to conduct the heat generated by the circuit board 30 to the heat sink 131, and the heat dissipation fan 40 dissipates the heat of the heat sink 131, so as to dissipate the heat of the circuit board 30. In addition, the heat dissipation fan 40 can also dissipate heat to the laser 20 through the heat dissipation structure 50, and the heat dissipation fan 40 can dissipate heat to the heat dissipation fin group 13 and the heat dissipation structure 50 at the same time, which is beneficial to improving the heat dissipation effect.
In this document, terms such as front, rear, upper, lower, etc. are defined with respect to the positions of the components in the drawings and with respect to each other, for clarity and convenience in expressing the technical solution. It should be understood that the use of such orientation terms should not limit the scope of the claimed application.
It is apparent that the above-described embodiments are only some embodiments of the present application, but not all embodiments, and the present application is not limited to the details of the above-described embodiments, and any appropriate changes or modifications made by those skilled in the art will be deemed to be within the scope of the present application.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420160197.4U CN222154316U (en) | 2024-01-22 | 2024-01-22 | Laser processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420160197.4U CN222154316U (en) | 2024-01-22 | 2024-01-22 | Laser processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222154316U true CN222154316U (en) | 2024-12-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420160197.4U Active CN222154316U (en) | 2024-01-22 | 2024-01-22 | Laser processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222154316U (en) |
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- 2024-01-22 CN CN202420160197.4U patent/CN222154316U/en active Active
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