CN216437892U

CN216437892U - Die bonder

Info

Publication number: CN216437892U
Application number: CN202122924840.5U
Authority: CN
Inventors: 何文胜; 秦世通
Original assignee: Shenzhen Jingyuan Intelligent Technology Co ltd
Current assignee: Shenzhen Jingyuan Intelligent Technology Co ltd
Priority date: 2021-11-25
Filing date: 2021-11-25
Publication date: 2022-05-03
Anticipated expiration: 2031-11-25

Abstract

The utility model discloses a die bonder, which comprises a machine body, wherein a die bonder station is arranged on the machine body; the conveying mechanism is used for conveying the PCB; the die bonding station is positioned on the conveying track of the conveying mechanism; the wafer picking and placing mechanism comprises a picking and placing frame, a picking and placing suction nozzle, a glue dispensing piece and a picking and placing frame driving piece, wherein the picking and placing frame driving piece is used for driving the picking and placing frame to move along the X-axis direction, and the picking and placing frame driving piece is used for driving the picking and placing frame to move along the Y-axis direction; the picking and placing suction nozzle is arranged on the picking and placing frame and used for clamping the wafer; the glue dispensing part is arranged on the taking and placing frame and is used for dispensing glue on the PCB; the die bonding station is positioned on the motion track of the pick-and-place frame. The utility model discloses a solid brilliant device, it can realize gluing and the wafer is fixed to the automation of PCB board, improves PCB production efficiency.

Description

Die bonder

Technical Field

The utility model relates to a PCB board production facility technical field especially relates to a solid brilliant device.

Background

At present, in the production process of a chip, operations such as die bonding and binding need to be performed on the chip, die bonding refers to welding a wafer on the chip, and binding refers to a routing manner of the chip in the production process, and the routing manner is generally used for connecting a circuit inside the chip with a gold wire or an aluminum wire and a packaging pin or a circuit board gold-plated copper foil before packaging. In the process of die bonding, the wafer is usually placed on the die by a pick-and-place device and then fixed. However, the automation degree of the die bonder is low, which results in low production efficiency.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a solid brilliant device, it can realize gluing the automation of PCB board and the wafer is fixed, improves PCB production efficiency.

The purpose of the utility model is realized by adopting the following technical scheme:

a die bonding apparatus comprises a die bonding unit including,

the die bonder comprises a machine body, wherein a die bonding station is arranged on the machine body;

the conveying mechanism is used for conveying the PCB; the die bonding station is positioned on the conveying track of the conveying mechanism;

the wafer picking and placing mechanism comprises a picking and placing frame, a picking and placing suction nozzle, a glue dispensing piece and a picking and placing frame driving piece, wherein the picking and placing frame driving piece is used for driving the picking and placing frame to move along the X-axis direction, and the picking and placing frame driving piece is used for driving the picking and placing frame to move along the Y-axis direction; the picking and placing suction nozzle is arranged on the picking and placing frame and used for clamping the wafer; the glue dispensing part is arranged on the taking and placing frame and is used for dispensing glue on the PCB; the die bonding station is positioned on the motion track of the pick-and-place frame.

Furthermore, the machine body is also provided with a feeding table, and the feeding table is used for placing a material tray for storing a plurality of wafers.

Furthermore, a wafer detection piece is arranged on the feeding table.

Further, the taking and placing frame driving part comprises a first motor, a first screw rod, a first nut, a first guiding piece, a second motor, a second screw rod, a second nut and a second guiding piece,

the first motor is arranged on the machine body, and the first screw rod extends along the Y-axis direction; the first nut is sleeved outside the first screw rod in a threaded manner; the first guide piece is used for guiding the first nut to move along the Y-axis direction when the first screw rod rotates; the first nut is provided with a mounting seat;

the second motor is arranged on the mounting seat, the second screw rod is connected with a rotating shaft of the second motor, the second nut is sleeved outside the second screw rod in a threaded manner, and the second guide piece is used for guiding the second nut to move along the X-axis direction when the second screw rod rotates; the taking and placing frame is connected with the second nut.

Furthermore, a first driving part and a second driving part are arranged on the pick-and-place frame, the first driving part comprises a third motor, a transmission belt and two transmission wheels, and the third motor is arranged on the pick-and-place frame; the two driving wheels are rotatably arranged on the taking and placing frame and are arranged at intervals in the height direction of the taking and placing frame; two ends of the transmission belt are respectively wound outside the two transmission wheels; the part of the transmission belt between the two transmission wheels forms two transmission sections distributed on two sides of the transmission wheels; mounting plates are arranged on the two transmission sections; elastic components are connected between the mounting plate and the taking and placing frame; the mounting plates are provided with the pick-and-place suction nozzle and a second driving piece; the second driving piece is used for driving the pick-and-place suction nozzle to rotate.

Furthermore, the conveying mechanism comprises a belt conveying assembly, two conveying frames and a conveying frame driving part, and the two conveying frames are arranged on the machine body at intervals; the two conveying frames are provided with the belt conveying assemblies; the belt conveying components on the two conveying frames are used for supporting the workpiece; the conveying frame driving part is used for driving the two conveying frames to be close to each other or be far away from each other.

Furthermore, a jacking mechanism is arranged between the two conveying frames and arranged at the die bonding station; the jacking mechanism comprises a jacking plate and a jacking plate driving part, and the jacking plate driving part is used for driving the jacking plate to move along the Z-axis direction.

Furthermore, at least two workpiece pressing blocks are arranged on the conveying frame and distributed at intervals in the conveying direction of the belt conveying assembly; the workpiece pressing block is arranged above the jacking plate.

Compared with the prior art, the beneficial effects of the utility model reside in that: when wafers and PCBs are fixed, the PCBs can be conveyed to the die bonding mechanism through the conveying mechanism, then the pick-and-place frame driving piece can drive the pick-and-place frame to move back and forth and move left and right, so that glue dispensing pieces on the pick-and-place frame and pick-and-place suction nozzles are aligned to die bonding positions of the PCBs, glue dispensing and wafer gluing are carried out, after die bonding is completed, the conveying mechanism continues to convey the processed PCBs to the discharging positions, the automation degree is high, and the production efficiency is improved.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is a schematic view of a partial structure of the wafer pick-and-place mechanism of the present invention;

fig. 3 is a schematic structural diagram of the conveying mechanism and the jacking mechanism of the present invention.

In the figure: 10. a body; 11. a feeding table; 12. a wafer detection member; 20. a conveying mechanism; 21. a carriage; 211. pressing the workpiece into a block; 22. a belt transport assembly; 231. a synchronous belt; 232. a synchronizing wheel; 233. a third screw rod; 31. a taking and placing frame; 311. a driving wheel; 312. mounting a plate; 313. an elastic member; 32. taking and placing the suction nozzle; 321. a second driving member; 33. a first motor; 34. a first lead screw; 35. a mounting base; 36. a second motor; 37. a second lead screw; 38. dispensing a glue piece; 40. a jacking mechanism; 41. and (4) jacking the plate.

Detailed Description

The invention will be further described with reference to the accompanying drawings and specific embodiments:

as shown in fig. 1, 2 and 3, the die bonder includes a machine body 10, a conveying mechanism 20 and a wafer pick-and-place mechanism, specifically, the machine body 10 is provided with a die bonder station, the die bonder station is located on a conveying track of the conveying mechanism 20, and the conveying mechanism 20 is used for conveying a PCB;

in addition, the above-mentioned chip pick and place mechanism includes the pick-and-place frame 31, the pick-and-place nozzle 32, the glue dispensing device 38 and the pick-and-place frame driving device, specifically, the pick-and-place frame driving device can be used for driving the pick-and-place frame 31 to move along the X-axis direction, the pick-and-place frame driving device can also be used for driving the pick-and-place frame 31 to move along the Y-axis direction, the above-mentioned die bonding station is located on the motion trail of the pick-and-place frame 31, and the pick-and-place nozzle 32 is installed on the pick-and-place frame 31 and used for clamping the chip, and the glue dispensing device 38 is installed on the pick-and-place frame 31 and used for dispensing on the PCB board.

On the basis of the structure, use the utility model discloses a during solid brilliant device, when carrying out solid brilliant operation, conveying mechanism 20 carries solid brilliant station department with the PCB board along conveying mechanism 20's transport orbit, has practiced thrift the time cost, has improved solid brilliant efficiency.

In addition, when the PCB is conveyed to the die bonding station, the wafer picking and placing mechanism starts to work, specifically, the picking and placing frame driving member drives the picking and placing frame 31 to move along the X-axis and Y-axis directions for driving and matching, and the die bonding station is located on the movement track of the picking and placing frame 31, so that the picking and placing frame driving member can drive the picking and placing frame 31 to the die bonding station, then the wafer is clamped onto the PCB through the picking and placing suction nozzle 32 installed on the picking and placing frame 31, and then the wafer on the PCB is subjected to the dispensing operation through the dispensing member 38 installed on the picking and placing frame 31, thereby achieving the purpose of die bonding.

Further, a feeding table 11 may be further disposed on the machine body 10, the feeding table 11 is used for placing trays for storing a plurality of wafers, that is, the trays for storing a plurality of wafers may be placed on the feeding table 11, the pick-and-place frame driving member may drive the pick-and-place frame 31 to move to the position of the feeding table 11, and the pick-and-place nozzle 32 directly clamps the wafers and then moves to the die bonding station for die bonding.

In the present embodiment, the loading platform 11 and the wafer pick-and-place mechanism are respectively disposed on two sides of the conveying mechanism 20, and the pick-and-place suction nozzle 32 of the wafer pick-and-place mechanism only needs to pick and place the wafer to reciprocate between the conveying mechanism 20 and the loading platform 11, so as to save the movement stroke of the wafer pick-and-place mechanism.

Further, be equipped with wafer detection spare 12 on material loading platform 11, this wafer detection spare 12 can choose for use to realize for the CCD camera among the prior art, gets on putting frame 31 promptly and puts suction nozzle 32 and carry out the wafer clamp and get the time, and the CCD camera can shoot the location to getting the wafer on putting suction nozzle 32, and the image signal who shoots can transmit for the system, and the motion of control is got and is put the frame driving piece, realizes getting of accuracy of wafer and puts.

Further, referring to fig. 1, the rack driving unit may include a first motor 33, a first lead screw 34, a first nut, a first guide, a second motor 36, a second lead screw 37, a second nut, and a second guide, specifically, the first motor 33 may be mounted on the body 10, the first lead screw 34 may extend in the Y-axis direction, the first nut may be threadedly mounted outside the first lead screw 34, and the first guide may be configured to guide the first nut to move in the Y-axis direction when the first lead screw 34 rotates.

In addition, a mounting seat 35 is arranged on the first screw nut, the second motor 36 is mounted on the mounting seat 35, the second screw rod 37 is connected with a rotating shaft of the second motor 36, the second screw nut is sleeved outside the second screw rod 37 in a threaded manner, the second guide piece is used for guiding the second screw nut to move along the X-axis direction when the second screw rod 37 rotates, and the taking and placing frame 31 is connected with the second screw nut.

So set up, can drive first lead screw through first motor and rotate, first lead screw rotates and to drive the first nut of screw-thread fit with it and rotate, the rotation of first nut can be turned into along the motion of Y axle direction by the guide of first guide, and then order about the mount pad and move along Y axle direction, and the second motor rotates and to drive the second lead screw and rotate, the second lead screw rotates and to drive screw-thread fit's second nut and rotate with it, the rotary motion of second nut can be turned into the motion along the X axle direction under the guide of second guide, so, get and put the frame alright move to appointed solid brilliant station, thereby carry out corresponding solid brilliant operation.

Further, referring to fig. 2, the pick-and-place frame 31 is provided with a first driving member and a second driving member 321, specifically, the first driving member includes a third motor, a belt and two driving wheels 311, the third motor is mounted on the rack 31, and both the two driving wheels 311 are rotatably mounted on the rack 31, and the two driving wheels 311 are arranged at intervals in the height direction of the rack 31, and both ends of the driving belt are respectively wound outside the two driving wheels 311, thus, the part of the transmission belt between the two transmission wheels 311 forms two transmission sections distributed at two sides of the transmission wheels 311, and the two transmission sections are both provided with mounting plates 312, the elastic component 313 is connected between the mounting plate 312 and the pick-and-place frame 31, and the pick-and-place nozzle 32 and the second driving component 321 are disposed on the mounting plate 312, and the second driving component 321 is used for driving the pick-and-place nozzle 32 to rotate.

So set up for two transmission sections that the drive belt formed between two drive wheels 311 are at the third motor around same direction rotation in-process, two transmission sections are one on the other, and then drive two mounting panels 312 that are connected with two transmission sections one on the other, two are installed on mounting panel 312 and are put suction nozzle 32 one on the other promptly, carry out the wafer clamp in turn and get, both can improve the wafer and get efficiency of getting, can avoid two to get simultaneously to get of getting suction nozzle 32 and press from both sides and cause the interference again.

In addition, during the up-and-down movement of the mounting plate 312, the elastic component 313 can stretch and retract, so as to buffer the up-and-down movement speed of the pick-and-place nozzle 32 and avoid the damage of the wafer caused by the hard contact between the pick-and-place nozzle 32 and the wafer.

Further, referring to fig. 3, the conveying mechanism 20 includes a belt conveying assembly 22, two conveying frames 21 and a conveying frame 21 driving member, specifically, the two conveying frames 21 are disposed on the machine body 10 at intervals, the belt conveying assemblies 22 are disposed on the two conveying frames 21, the belt conveying assemblies 22 on the two conveying frames 21 are used for supporting the workpiece, and the conveying frame 21 driving member is used for driving the two conveying frames 21 to approach to or move away from each other, so that the interval between the belt conveying assemblies 22 on the two conveying frames 21 can be reduced or increased, and thus the conveying mechanism can be adjusted according to the size of the workpiece and is suitable for conveying workpieces with different sizes.

Further, the driving member of the transportation frame 21 comprises a fourth motor, a synchronous belt 231, a synchronous wheel 232 and two third screw rods 233, the fourth motor is mounted on the machine body 10, a rotating shaft of the fourth motor is connected with one of the synchronous wheels 232, the synchronous belt 231 is synchronously wound outside the two synchronous wheels 232, the two third screw rods 233 are connected with the two synchronous wheels 232, third nuts are sleeved outside the third screw rods 233 and are connected with the bottom ends of the conveying frames 21, thus, can drive one of the synchronous wheels 232 to rotate by the rotation of the fourth motor, the rotation of the synchronous wheel 232 can be driven by the synchronous belt 231, that is, the other synchronizing wheel 232 can rotate synchronously, so that the two third lead screws 233 rotate simultaneously, so that the third nut connected with the third screw rod moves along the third screw rod 233 to drive the conveying frame 21 connected with the third screw rod to approach or separate from the other conveying frame 21.

It should be noted that the bottom end of the conveying frame 21 is provided with a sliding block, the machine body 10 is provided with a sliding rail, and the two conveying frames 21 can be guided to approach or move away from each other by sliding fit between the house opening and the sliding rail.

Further, a jacking mechanism 40 is arranged between the two conveying frames 21, specifically, the jacking mechanism 40 is arranged at the die bonding station, the jacking mechanism 40 comprises a jacking plate 41 and a jacking plate 41 driving part, the jacking plate 41 driving part is used for driving the jacking plate 41 to move along the Z-axis direction, the arrangement is such that when a workpiece is conveyed to the jacking plate 41, the jacking plate 41 can move upwards under the driving of the jacking plate 41 driving part, the workpiece is jacked away from the belt conveying assembly 22, after positioning processing is carried out, the jacking plate 41 descends again under the action of the jacking plate 41 driving part, the workpiece can be conveyed by the belt conveying assembly 22 again, the workpiece can be separated from the belt conveying assembly 22 without a manipulator, positioning processing is carried out, and the equipment cost is reduced.

Further, be equipped with two at least work piece briquetting 211 on carriage 21, two at least work piece briquetting 211 are at the direction of delivery of belt conveyor component 22 on interval distribution, and work piece briquetting 211 locates the top of jacking board 41, so set up for when the work piece was upwards jacked by jacking board 41, the border upper end of work piece alright be compressed tightly on jacking board 41 by a plurality of work piece briquetting 211, the work piece is compressed tightly by jacking board 41 and work piece briquetting 211 promptly, be convenient for seal the glue, bind or die bonding operation etc. to the work piece.

Various other modifications and changes can be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes should fall within the scope of the claims.

Claims

1. A die bonding device is characterized by comprising,

the machine body is provided with a die bonding station;

2. The die bonding apparatus according to claim 1, wherein a loading platform is further disposed on the body, and the loading platform is used for placing a tray for storing a plurality of wafers.

3. The die bonding apparatus according to claim 2, wherein a wafer detecting member is provided on the loading table.

4. The die bonding apparatus according to claim 1, wherein the pick-and-place frame driving member comprises a first motor, a first lead screw, a first nut, a first guiding member, a second motor, a second lead screw, a second nut, and a second guiding member,

5. The die bonding apparatus according to claim 4, wherein the pick-and-place frame is provided with a first driving member and a second driving member, the first driving member comprises a third motor, a transmission belt and two transmission wheels, and the third motor is mounted on the pick-and-place frame; the two driving wheels are rotatably arranged on the taking and placing frame and are arranged at intervals in the height direction of the taking and placing frame; two ends of the transmission belt are respectively wound outside the two transmission wheels; the part of the transmission belt between the two transmission wheels forms two transmission sections distributed on two sides of the transmission wheels; mounting plates are arranged on the two transmission sections; elastic components are connected between the mounting plate and the taking and placing frame; the mounting plates are provided with the pick-and-place suction nozzle and a second driving piece; the second driving piece is used for driving the pick-and-place suction nozzle to rotate.

6. The die bonding device according to any one of claims 1 to 4, wherein the conveying mechanism comprises a belt conveying assembly, two conveying frames and a conveying frame driving member, and the two conveying frames are arranged on the machine body at intervals; the two conveying frames are provided with the belt conveying assemblies; the belt conveying components on the two conveying frames are used for supporting the workpiece; the conveying frame driving part is used for driving the two conveying frames to be close to each other or be far away from each other.

7. The die bonding device according to claim 6, wherein a jacking mechanism is arranged between the two conveying frames, and the jacking mechanism is arranged at the die bonding station; the jacking mechanism comprises a jacking plate and a jacking plate driving part, and the jacking plate driving part is used for driving the jacking plate to move along the Z-axis direction.

8. The die bonding apparatus according to claim 7, wherein said carriage is provided with at least two workpiece pressing blocks, and said at least two workpiece pressing blocks are spaced apart from each other in a conveying direction of said belt conveying assembly; the workpiece pressing block is arranged above the jacking plate.