CN216248810U - Board-level MCU data interaction storage system, controller and electrical equipment - Google Patents

Abstract

The utility model relates to a board-level MCU data interaction storage system, a controller and electrical equipment, wherein the board-level MCU data interaction storage system comprises: the external storage chip, the read-write interlocking transmission assembly and the single chip microcomputer pair are arranged; the single chip microcomputer pair comprises two MCUs; the two MCUs are connected through the read-write interlocking transmission assembly, and the interlocking relation of the two MCUs is achieved. One MCU sends external storage use information and external storage read-write requirements to the other MCU; and the MCU for receiving the communication transmission data controls the read-write interlocking transmission assembly to unlock according to the external storage use information and the external storage read-write requirement, so that the MCU for sending the communication transmission data performs read-write operation on the external storage chip. According to the scheme, the storage capacity is expanded through the external storage chip, the storage efficiency is improved, interactive unlocking when the MCU accesses the external storage chip is realized through the interlocking relation of the two MCUs, and the storage confidentiality and the storage safety are improved.

Description

Board-level MCU data interactive storage system, controller and electrical equipment

technical field

The utility model relates to the technical field of data interactive storage, in particular to a board-level MCU data interactive storage system, a controller and electrical equipment.

Background technique

The controller is the core part of the control system of various electrical equipment, and is responsible for controlling the functional operation of each component of the electrical equipment. For example, the air conditioner controller is responsible for controlling the functions of refrigeration, dehumidification, heating, automatic, air supply, switching, and self-checking of various components of the air conditioner. Today, with the prevalence of artificial intelligence and the Internet of Things, with the deepening of the intelligence of various electrical equipment, the controller's demand for embedded computing resources has further increased. It is more and more common for multiple MCUs on a single board to work together, and at the same time, a single MCU has an increasing demand for running memory.

In the prior art, the memory for data interactive storage among the MCUs in the control board of the controller of the electrical equipment is small and there is no security measure, which affects the data storage efficiency and storage security.

Therefore, how to improve the storage efficiency and storage security of data interactive storage among the MCUs at the board level is a technical problem that needs to be solved urgently by those skilled in the art.

Utility model content

In view of this, the purpose of this utility model is to provide a board-level MCU data interactive storage system, controller and electrical equipment, so as to solve the problem of data interactive storage between each MCU in the control board of the controller in the prior art. The memory is small and there are no security measures, which affects the data storage efficiency and storage security.

To achieve the above purpose, the utility model adopts the following technical solutions:

A board-level MCU data interactive storage system, comprising: an external memory chip, at least one group of read-write interlocking transmission components and at least one group of single-chip microcomputer pairs; the read-write interlocking transmission components and the single-chip microcomputer pairs are in one-to-one correspondence; The single-chip pair includes two MCUs;

Each of the MCUs is connected to the external memory chip through the read-write interlock transmission component;

The two MCUs are connected through the read-write interlocking transmission component, so as to realize the interlocking relationship between the two MCUs;

The read-write interlock transmission component is used to control the communication conduction or communication disconnection between the two MCUs and the external memory chip;

Two described MCUs are connected, and one described MCU sends communication transmission data to the other described MCU; the communication transmission data includes external storage usage information and external storage reading and writing requirements;

The MCU receiving the communication transmission data controls the read-write interlocking transmission component to unlock according to the external storage usage information and the external storage read and write requirements, so that the MCU that sends the communication transmission data and the external storage chip can communicate with each other. communication between the

The MCU that sends the communication transmission data performs read and write operations on the external storage chip through the read-write interlock transmission component according to the external storage usage information and the external storage read and write requirements.

Further, in the above board-level MCU data exchange storage system, the communication transmission data further includes: work interaction information;

The MCU that receives the communication transmission data updates the pre-stored historical communication transmission data according to the communication transmission data sent by the MCU that sends the communication transmission data, and works according to the work interaction information.

Further, in the above board-level MCU data interactive storage system, the MCU that sends the communication transmission data uses the read-write interlocking transmission component to transfer the data to the external storage according to the external storage usage information and the external storage read and write requirements. The external memory chip performs read and write operations, including:

If the read-write request of the external storage indicates a write request, the MCU sending the communication transmission data writes the work interaction information into the external memory chip through the read-write interlock transmission component, and according to the The write address of the work interaction information updates the external storage usage information;

If the read-write request of the external storage indicates a read request, the MCU that sends the communication transmission data reads from the external memory chip through the read-write interlock transmission component according to the use information of the external storage The external storage stores target information corresponding to read and write requirements.

Further, in the above board-level MCU data interactive storage system, each group of the read-write interlocking transmission components includes: a storage communication component, a transmission circuit and two sets of interlocking circuits;

The interlock circuit is in one-to-one correspondence with the MCU;

the interlock circuit is connected to the MCU corresponding to the interlock circuit;

Each group of the interlocking circuits is connected with the transmission circuit through the storage communication assembly;

the transmission circuit is connected to the external memory chip;

The MCU that receives the communication transmission data sends a high-level signal to the interlock circuit corresponding to the MCU that sends the communication transmission data according to the external storage usage information and the external storage reading and writing requirements;

After the interlock circuit corresponding to the MCU that sends the communication and transmission data receives the high-level signal, the communication between the storage communication component and the transmission circuit is turned on, so that the MCU that sends the communication and transmission data is turned on. The external memory chip is read and written through the interlock circuit corresponding to the MCU that sends the communication and transmission data, the storage communication component and the transmission circuit.

Further, the above board-level MCU data interactive storage system further includes: a hardware protection component;

The hardware protection component is connected to the external storage chip, and is used for performing hardware protection on the external storage chip.

Further, in the above board-level MCU data interactive storage system, the interlock circuit corresponding to the MCU that sends the communication transmission data includes: a first transistor, a first resistor and a second resistor;

The interlock circuit corresponding to the MCU receiving the communication transmission data includes: a second transistor, a third resistor and a fourth resistor;

The transmission circuit includes: a fifth resistor;

The first pin of the MCU that sends the communication transmission data is connected to the base of the first transistor through the first resistor;

The collector of the first triode is connected to the second pin of the MCU that receives the communication and transmission data;

The emitter of the first triode is grounded through the second resistor;

The first pin of the MCU that receives the communication and transmission data is connected to the base of the second transistor through the third resistor;

The collector of the second triode is connected with the second pin of the MCU that transmits communication and transmits data;

The emitter of the second triode is grounded through the fourth resistor;

Both the emitter of the first triode and the emitter of the second triode are connected to the fifth resistor through the storage communication component;

the fifth resistor is connected to the external memory chip;

After the MCU that receives the communication transmission data receives the external storage usage information and the external storage read and write requirements, the second pin of the MCU that receives the communication transmission data sends the information to the first transistor. The collector sends a high-level signal, so that the emitter of the first transistor outputs a high-level signal, so as to realize the communication conduction between the MCU that sends the communication transmission data and the external memory chip;

The MCU that sends the communication transmission data can perform read and write operations on the external memory chip through the emitter of the first transistor, the storage communication component and the fifth resistor.

Further, in the above board-level MCU data interactive storage system, the hardware protection component includes: a sixth resistor, a seventh resistor, a third transistor and a fourth transistor;

The collector of the third triode is connected to the power supply;

The second pin of the MCU that sends the communication transmission data is connected to the base of the third triode through the sixth resistor;

The emitter of the third triode is connected to the collector of the fourth triode;

The second pin of the MCU that receives the communication and transmission data is connected to the base of the fourth transistor through the seventh resistor;

The emitter of the fourth triode is connected to the external memory chip.

Further, the above board-level MCU data interactive storage system further includes: an inter-board communication component;

The two MCUs are connected through the inter-board communication component.

Further, in the above board-level MCU data interactive storage system, the inter-board communication component includes a UART communication component; the storage communication component includes an I2C bus.

Further, in the above board-level MCU data interaction storage system, the two MCUs include: an external interaction MCU and a special task MCU.

Further, in the above board-level MCU data interaction storage system, if the MCU that sends the communication transmission data is an external interaction MCU, and the MCU that receives the communication transmission data is a special task MCU, the work interaction information includes: the The unit information data corresponding to the external interactive MCU, the current unit operation data and the first program operation intermediate data;

If the MCU that sends the communication and transmission data is a special task MCU, and the MCU that receives the communication and transmission data is an external interaction MCU, the work interaction information includes: the special task running result and the second program corresponding to the special task MCU Run intermediate data.

The utility model also provides a controller, comprising: a control single board and the above board-level MCU data interactive storage system;

The board-level MCU data exchange storage system is arranged on the control board.

The utility model also provides an electrical equipment, including the above-mentioned controller.

A board-level MCU data interactive storage system, a controller and electrical equipment, the board-level MCU data interactive storage system comprises: an external storage chip, at least one group of read-write interlock transmission components and at least one group of single-chip pairs; read-write interlock One-to-one correspondence between transmission components and MCU pairs; MCU pairs include two MCUs; each MCU is connected to an external memory chip through a read-write interlock transmission component; the two MCUs are connected through a read-write interlock transmission component to achieve The interlocking relationship between two MCUs; the read-write interlocking transmission component is used to control the communication conduction or communication disconnection between the two MCUs and the external memory chip. One MCU sends communication transmission data to another MCU; the communication transmission data includes the external storage usage information and the external storage read and write requirements; the MCU receiving the communication transmission data controls the read and write according to the external storage usage information and the external storage read and write requirements The interlocking transmission component is unlocked, so that the communication between the MCU sending the communication transmission data and the external memory chip is conducted; the MCU sending the communication transmission data passes the read-write interlock according to the use information of the external storage and the reading and writing requirements of the external storage The transmission component performs read and write operations on the external memory chip. By adopting the technical scheme of the utility model, the storage capacity is expanded by arranging the external storage chip, the storage efficiency is improved, and the interlocking relationship between the two MCUs in the single board is controlled, so that the MCU can access the external storage chip. Interactive unlocking improves storage confidentiality and security.

It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not limiting of the invention.

Description of drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

1 is a circuit block diagram provided by an embodiment of a board-level MCU data interactive storage system of the present invention;

2 is a circuit connection diagram of a read-write interlock transmission component and a hardware protection component in the board-level MCU data interactive storage system of the present invention;

3 is a flowchart provided by an embodiment of a method for interactive storage of board-level MCU data of the present invention;

FIG. 4 is a structural block diagram provided by an embodiment of the controller of the present invention.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention more clear, the technical solutions of the present invention will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other implementations obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present invention.

FIG. 1 is a circuit block diagram provided by an embodiment of the board-level MCU data interactive storage system of the present invention. As shown in FIG. 1 , the board-level MCU data interactive storage system of this embodiment includes: an external memory chip 13, at least one A group of read-write interlock transmission components 12 and at least one group of single-chip pairs 11 , wherein the read-write interlock transmission components 12 correspond to the single-chip pairs 11 one-to-one, that is, a group of single-chip pairs 11 corresponds to a group of read-write interlock transmission components 12 . Each set of microcontroller pairs 11 includes two MCUs, such as an external interaction MCU111 and a special task MCU112 in FIG. 1 . Each MCU is connected to the external memory chip 13 through the read-write interlock transmission component 12; the two MCUs are connected through the read-write interlock transmission component 12, so that the interlock relationship between the two MCUs can be realized.

The read-write interlock transmission component 12 can control the communication between the two MCUs and the external memory chip 13 to be turned on or off. When two MCUs are connected, one MCU sends communication transmission data to the other MCU, wherein the communication transmission data includes external storage usage information and external storage reading and writing requirements. The MCU receiving the communication transmission data can control the read-write interlocking transmission component 12 to unlock according to the external storage usage information and the external storage read and write requirements, so that the communication between the MCU sending the communication transmission data and the external storage chip is conducted. In this way, the MCU sending the communication transmission data can perform read and write operations on the external memory chip through the read-write interlocking transmission component 12 according to the external memory usage information and the read and write requirements of the external memory. By adopting the technical solution of this embodiment, the storage capacity is expanded by setting the external storage chip 13, the storage efficiency is improved, and the MCU access to the external storage chip 13 is realized by controlling the interlocking relationship between the two MCUs in the single board. The interactive unlocking at the same time improves the storage confidentiality and security.

Further, the board-level MCU data interactive storage system in this embodiment further includes an inter-board communication component 14 , and the two MCUs are connected through the inter-board communication component 14 . One MCU can send communication transmission data to another MCU through the inter-board communication component 14 . The inter-board communication component 121 preferably adopts a UART communication component.

Further, the communication transmission data also includes work interaction information, the MCU receiving the communication transmission data can update the pre-stored historical communication transmission data according to the received communication transmission data, and the MCU receiving the communication transmission data can also update the historical communication transmission data according to the received communication transmission data. work interaction information.

Further, when the external storage read/write request sent by the MCU that sends the communication and transmission data indicates a writing request, the MCU that receives the communication and transmission data controls the read-write interlocking transmission component 12 to unlock, and the MCU that sends the communication and transmission data will work interactively. The information is written into the external storage chip 13 through the read-write interlock transmission component 12, and the external storage usage information is updated to the write address of the working interaction information; When the writing demand indicates the reading demand, the MCU receiving the communication and transmission data controls the read-write interlocking transmission component 12 to unlock, and the MCU that sends the communication and transmission data uses the information from the external storage to store the data from the external storage through the read-write interlocking transmission component 12. The chip 13 reads the target information corresponding to the read and write requirements of the external storage.

Specifically, the two MCUs include: an external interaction MCU111 and a special task MCU112. The external interaction MCU 111 can be used for external interaction, logic operation, load driving, etc.; the special task MCU 112 can be used for special task operation, model operation, and the like.

When the external interaction MCU111 is used as the MCU for sending communication transmission data, and the special task MCU112 is used as the MCU for receiving communication transmission data:

First, the external interaction MCU111 controls the operation of the air conditioner, and the special task MCU112 waits for the external interaction MCU111 to transmit data.

Second, the external interaction MCU111 and the special task MCU112 conduct data interaction through the inter-board communication component 14, and the external interaction MCU111 sends communication transmission data to the special task MCU112, wherein the communication transmission data includes: work interaction information, external storage usage information and External storage read and write requirements. The work interaction information sent by the external interaction MCU111 includes: unit information data such as the model of the unit and the cooling capacity of the unit, and current unit operation data (for example, indoor ambient temperature, outdoor ambient temperature, air conditioner switch status, user set temperature, user set Air-conditioning mode, etc.) and the intermediate data of the first program operation; the external storage usage information includes: storage data address, storage data type and group number.

The special task MCU112 stores the historical communication transmission data sent by the external interaction MCU111. When the special task MCU112 receives the communication transmission data sent by the external interaction MCU111 again, it will compare the pre-stored historical communication data according to the newly received communication transmission data. to update. In addition, when the patent task MCU is working, it may be applied to the work interaction information sent by the external interaction MCU 111 . Therefore, the patent task MCU can also work according to the work interaction information.

Third, the special task MCU112 controls the read-write interlock transmission component 12 to unlock according to the external storage usage information and external storage read/write requirements, so that the communication between the external interaction MCU111 and the external storage chip 13 is conducted.

Fourth, if the external storage read and write demand indicates a write demand, the external interaction MCU 111 writes the unit information data, the first program running intermediate data and the work interaction information into the external storage chip 13 through the read-write interlock transmission component 12 For example, multiple sets of current unit operation data are periodically written to the external storage chip 13 (for example, recorded once per minute). The external interaction MCU 111 may only write data that cannot be stored in the external interaction MCU 111's own space to the external memory chip 13 . The external interaction MCU 111 also needs to update the external storage usage information according to the write address of each data, so that when the external interaction MCU 111 needs to read data, it can search for the storage address of the data according to the external storage usage information.

If the external storage read/write request indicates a read request, the external interaction MCU 111 reads the external storage read/write request from the external storage chip 13 through the read/write interlock transmission component 12 according to the address corresponding to the external storage usage information. target information.

When the special task MCU112 is used as the MCU for sending communication transmission data, and the external interaction MCU111 is used as the MCU for receiving communication transmission data:

First, the external interaction MCU111 and the special task MCU112 conduct data interaction through the inter-board communication component 14, and the special task MCU112 sends communication transmission data to the external interaction MCU111, wherein the communication transmission data includes: work interaction information, external storage usage information and External storage read and write requirements. The work interaction information sent by the special task MCU112 includes: the running results of the special task corresponding to the special task MCU112 (for example, the status of the Internet of Things, the cloud setting on and off, etc.) and the intermediate data of the second program operation; the external storage usage information includes: storage Data address, storage data type and number of groups.

The external interaction MCU111 stores the historical communication transmission data sent by the previous special task MCU112. When the external interaction MCU111 receives the communication transmission data sent by the special task MCU112 again, it will compare the pre-stored historical communication data according to the newly received communication transmission data. to update. In addition, when the external interaction MCU 111 performs work, it may be applied to the work interaction information sent by the special task MCU 112 , and therefore, the external interaction MCU 111 can also perform work according to the work interaction information.

Second, the external interaction MCU 111 controls the read-write interlock transmission component 12 to unlock according to the external storage usage information and external storage read/write requirements, so that the communication between the special task MCU 112 and the external storage chip 13 is conducted.

Third, if the read and write requirements of the external storage indicate the writing requirements, the special task MCU 112 writes the second program running intermediate data and work interaction information into the external storage chip 13 through the read and write interlock transmission component 12, wherein the special task The task MCU 112 can only write the data that cannot be stored in the space of the special task MCU 112 to the external memory chip 13 . The special task MCU 112 also needs to update the external storage usage information according to the write address of each data, so that when the special task MCU 112 needs to read data, it can search for the storage address of the data according to the external storage usage information.

If the read/write requirement of the external storage indicates a read requirement, the special task MCU 112 reads the corresponding address of the read/write requirement of the external storage from the external storage chip 13 through the read/write interlock transmission component 12 according to the address corresponding to the use information of the external storage. target information.

Further, in this embodiment, each group of read-write interlocking transmission components 12 includes: a storage communication component 122 , a transmission circuit 123 and two sets of interlocking circuits 121 . The interlock circuits 121 are in one-to-one correspondence with the MCUs, that is, each MCU is provided with a set of interlock circuits 121 correspondingly, and each MCU is connected to its corresponding interlock circuit 121 . Each group of interlock circuits 121 is connected to the transmission circuit 123 through the storage communication component 122 , and the transmission circuit 123 is connected to the external memory chip 13 . Wherein, the storage communication component 122 includes an I2C bus.

The MCU receiving the communication transmission data sends a high-level signal to the interlock circuit 121 corresponding to the MCU sending the communication transmission data according to the external storage usage information and the reading and writing requirements of the external storage; the interlock circuit corresponding to the MCU sending the communication transmission data After 121 receives the high-level signal, the communication between the storage communication component 122 and the transmission circuit 123 is turned on, so that the MCU that sends the communication transmission data passes the corresponding interlock circuit 121, the storage communication component 122 and the transmission circuit 123 to the outside world. The memory chip 13 is set to perform read and write operations.

In this embodiment, the inter-board communication component 14 and the storage communication component 122 are provided. The multi-channel communication method can improve the confidentiality of the external memory chip 13, and the multi-channel communication and the two MCUs share the external storage, and two Three modes of interaction between MCUs (communication interaction between two MCUs, read-write interaction between the MCU and the external memory chip 13 , and read-write interlock interaction of the external storage) can improve the data acquisition speed, thereby reducing the computing pressure of the MCU.

Further, the board-level MCU data interactive storage system in this embodiment further includes: a hardware protection component. The hardware protection component is connected to the external storage chip 13 and is used for hardware protection of the external storage chip 13 .

Specifically, Fig. 2 is a circuit connection diagram of a read-write interlock transmission component and a hardware protection component in the board-level MCU data interactive storage system of the present invention, as shown in Fig. 2, MCU-A is the MCU that sends the communication transmission data, MCU-B is the MCU that receives the communication transmission data. The interlock circuit 121 corresponding to the MCU that sends the communication transmission data in this embodiment includes: a first transistor Q1 , a first resistor R1 and a second resistor R2 . The interlock circuit corresponding to the MCU receiving the communication transmission data includes: a second transistor Q2, a third resistor R3 and a fourth resistor R4. The transmission circuit includes: a fifth resistor R5. The first pin of MCU-A is connected to the base of the first transistor Q1 through the first resistor R1; the collector of the first transistor Q1 is connected to the second pin of MCU-B; the first transistor Q1 is connected to the second pin of MCU-B; The emitter of Q1 is grounded through the second resistor R2; the first pin of MCU-B is connected to the base of the second transistor Q2 through the third resistor R3; the collector of the second transistor Q2 is connected to the MCU-A The second pin is connected; the emitter of the second transistor Q2 is grounded through the fourth resistor R4; the emitter of the first transistor Q1 and the emitter of the second transistor Q2 are connected to the fifth through the storage communication component 122 The resistor R5 is connected; the fifth resistor R5 is connected to the pin SDA of the external memory chip 13 .

After MCU-B receives the external storage usage information and external storage reading and writing requirements, the second pin of MCU-B sends a high-level signal MCU-A-LOCK to the collector of the first transistor Q1, and the first The transistor Q1 has a switching function. When the collector of the first transistor Q1 is at a low level, the signal I2C_SDA of the emitter of the first transistor Q1 cannot be pulled high, so that the MCU-A and the external memory chip cannot be turned on. Therefore, only when the high-level signal MCU-A-LOCK makes the first transistor Q1 turn on, can the signal I2C_SDA output by the emitter of the first transistor Q1 be at a high level, thereby realizing The communication between the MCU-A and the external memory chip 13 is turned on, and the MCU-A can communicate with the fifth resistor R5 through the storage communication component 122 through the emitter of the first transistor Q1, so that the MCU-A can be connected to the external memory chip 13. The memory chip 13 performs read and write operations.

Specifically, as shown in FIG. 2, the hardware protection component includes: a sixth resistor R6, a seventh resistor R7, a third transistor Q3 and a fourth transistor Q4; the collector of the third transistor Q3 and the power supply VDD Connected; the second pin of MCU-A is connected with the base of the third transistor Q3 through the sixth resistor R6; the emitter of the third transistor Q3 is connected with the collector of the fourth transistor Q4; MCU- The second pin of B is connected to the base of the fourth transistor Q4 through the seventh resistor R7 ; the emitter of the fourth transistor Q4 is connected to the pin WP of the external memory chip 13 .

Specifically, the fifth pin of the MCU-A is connected to the eighth resistor R8 through the storage communication component 122 , and the eighth resistor R8 is connected to the pin SCL of the external memory chip 13 . The third pin of MCU-A is connected to the third pin of MCU-B through the RX line in the UART communication component; the fourth pin of MCU-A is connected to the fourth pin of MCU-B through the TX line in the UART communication component. pins are connected. The emitter of the third transistor Q3 is grounded through the ninth resistor R9 and the first capacitor C1 respectively; the pins A0, A1, A2 and GND of the external memory chip 13 are all grounded; A1, A2, and GND are all connected to the power supply VDD through the second capacitor C2. The pin SCL of the external memory chip 13 is connected to the power supply VDD through the tenth resistor R10; the pin SDA of the external memory chip 13 is connected to the power supply VDD through the eleventh resistor R11.

In order to be more comprehensive, corresponding to the board-level MCU data interactive storage system provided by the embodiment of the present invention, the present application also provides a board-level MCU data interactive storage method.

FIG. 3 is a flowchart provided by an embodiment of the method for interactive storage of board-level MCU data of the present invention. As shown in FIG. 3 , the method for interactive storage of board-level MCU data in this embodiment is applied to the board-level MCU described in the above embodiment. The MCU data interactive storage system, and the board-level MCU data interactive storage method specifically includes the following steps:

S101. One MCU sends communication transmission data to another MCU. Communication transmission data includes external storage usage information and external storage read and write requirements.

S102, the MCU receiving the communication transmission data controls the read-write interlocking transmission component 12 to unlock according to the external storage usage information and the reading and writing requirements of the external storage included in the communication transmission data, so that the MCU sending the communication transmission data and the external storage chip The communication of 13 is turned on.

S103 , the MCU sending the communication transmission data performs read and write operations on the external storage chip 13 through the read-write interlocking transmission component 12 according to the external storage usage information and the read and write requirements of the external storage.

By adopting the technical solution of this embodiment, the storage capacity is expanded by setting the external storage chip 13, the storage efficiency is improved, and the MCU access to the external storage chip 13 is realized by controlling the interlocking relationship between the two MCUs in the single board. The interactive unlocking at the same time improves the storage confidentiality and security.

Further, in the method for interactive storage of board-level MCU data in this embodiment, the communication and transmission data further includes: work interaction information. The board-level MCU data interactive storage method also includes:

The MCU that receives the communication transmission data updates the pre-stored historical communication transmission data according to the communication transmission data sent by the MCU that sends the communication transmission data, and works according to the work interaction information.

Further, in the method for interactive storage of board-level MCU data in this embodiment, step S103 specifically includes the following steps:

First, if the read and write requirements of the external storage indicate the write requirements, the MCU that sends the communication transmission data writes the working interaction information into the external storage chip 13 through the read-write interlocking transmission component 12, and writes the working interaction information according to the writing of the working interaction information. The incoming address updates the external storage usage information;

Second, if the read and write requirements of the external storage indicate the read requirements, the MCU sending the communication transmission data reads the external storage read and write from the external storage chip 13 through the read-write interlock transmission component 12 according to the use information of the external storage. The target information corresponding to the requirement.

Regarding the methods in the foregoing embodiments, the specific manners of performing operations in each step have been described in detail in the embodiments of the board-level MCU data interactive storage system, and will not be described in detail here.

FIG. 4 is a structural block diagram provided by an embodiment of the controller of the present invention. As shown in FIG. 4 , the controller of this embodiment includes: a control board 21 and the board-level MCU data exchange storage system described in the above embodiment twenty two. The board-level MCU data exchange storage system 22 is arranged on the control board 21 . By adopting the technical solution of this embodiment, the board-level MCU data interactive storage system 22 expands the storage capacity by setting the external storage chip 13, improves the storage efficiency, and controls the interlocking relationship between the two MCUs in the single board 21, The interactive unlocking when the MCU accesses the external storage chip 13 is realized, and the storage confidentiality and security are improved.

The present invention also provides an electrical device, the electrical device includes the controller described in the above embodiments, so that the electrical device of this embodiment can expand the storage capacity by setting the external memory chip 13 in the controller, and improve the storage capacity. The storage efficiency is improved, and through the interlocking relationship between the two MCUs in the controller, the interactive unlocking when the MCU accesses the external storage chip 13 is realized, and the storage confidentiality and security are improved.

It can be understood that, the same or similar parts in the above embodiments may refer to each other, and the content not described in detail in some embodiments may refer to the same or similar content in other embodiments.

It should be noted that, in the description of the present invention, the terms "first", "second" and the like are only used for the purpose of description, and cannot be understood as indicating or implying relative importance. Furthermore, in the description of the present invention, unless otherwise specified, the meaning of "plurality" means at least two.

In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limitations of the present invention, and those of ordinary skill in the art are within the scope of the present invention Variations, modifications, substitutions and variations can be made to the above-described embodiments.

Claims (13)

1. A board-level MCU data interaction storage system is characterized by comprising: the device comprises an external storage chip, at least one group of read-write interlocking transmission components and at least one group of singlechip pairs; the read-write interlocking transmission assemblies correspond to the single chip microcomputer in a one-to-one manner; the single chip microcomputer pair comprises two MCUs;

each MCU is connected with the external storage chip through the read-write interlocking transmission assembly;

the two MCUs are connected through the read-write interlocking transmission assembly to achieve the interlocking relationship between the two MCUs;

the read-write interlocking transmission assembly is used for controlling the communication connection or disconnection between the two MCUs and the external storage chip;

the two MCUs are connected, and one MCU sends communication transmission data to the other MCU; the communication transmission data comprises external storage use information and external storage read-write requirements;

the MCU receiving the communication transmission data controls the read-write interlocking transmission assembly to unlock according to the external storage use information and the external storage read-write requirement so as to enable the communication between the MCU sending the communication transmission data and the external storage chip to be conducted;

and the MCU for sending communication transmission data carries out read-write operation on the external storage chip through the read-write interlocking transmission assembly according to the external storage use information and the external storage read-write requirement.

2. The board-level MCU data interaction storage system of claim 1, wherein the communicating and transmitting data further comprises: work interaction information;

and the MCU receiving the communication transmission data updates pre-stored historical communication transmission data according to the communication transmission data sent by the MCU sending the communication transmission data, and works according to the work interaction information.

3. The board-level MCU data interaction storage system of claim 2, wherein the MCU sending communication transmission data performs read-write operation on the external storage chip through the read-write interlock transmission component according to the external storage use information and the external storage read-write requirement, and comprises:

if the external storage read-write requirement represents a write-in requirement, the MCU sending the communication transmission data writes the working interaction information into the external storage chip through the read-write interlocking transmission assembly, and updates the external storage use information according to a write-in address of the working interaction information;

and if the external storage read-write requirement represents a read requirement, the MCU sending the communication transmission data reads the target information corresponding to the external storage read-write requirement from the external storage chip through the read-write interlocking transmission assembly according to the external storage use information.

4. The board-level MCU data interaction storage system of claim 1, wherein each set of the read-write interlock transmission components comprises: the device comprises a storage communication component, a transmission circuit and two groups of interlocking circuits;

the interlocking circuits correspond to the MCUs one by one;

the interlocking circuit is connected with the MCU corresponding to the interlocking circuit;

each group of the interlocking circuits is connected with the transmission circuit through the storage communication assembly;

the transmission circuit is connected with the external storage chip;

the MCU receiving the communication transmission data sends a high-level signal to an interlocking circuit corresponding to the MCU sending the communication transmission data according to the external storage use information and the external storage read-write requirement;

and after the interlocking circuit corresponding to the MCU for sending the communication transmission data receives the high-level signal, the communication between the storage communication assembly and the transmission circuit is conducted, so that the MCU for sending the communication transmission data performs read-write operation on the external storage chip through the interlocking circuit corresponding to the MCU for sending the communication transmission data, the storage communication assembly and the transmission circuit.

5. The board-level MCU data interaction storage system of claim 4, further comprising: a hardware protection component;

the hardware protection component is connected with the external storage chip and used for performing hardware protection on the external storage chip.

6. The board-level MCU data interaction storage system of claim 5, wherein the interlock circuit corresponding to the MCU transmitting the communication transmission data comprises: the circuit comprises a first triode, a first resistor and a second resistor;

the interlocking circuit that MCU that the receipt communication transmitted data corresponds includes: the second triode, the third resistor and the fourth resistor;

the transmission circuit includes: a fifth resistor;

a first pin of the MCU for sending communication transmission data is connected with a base electrode of the first triode through the first resistor;

the collector of the first triode is connected with the second pin of the MCU for receiving the communication transmission data;

the emitter of the first triode is grounded through the second resistor;

the first pin of the MCU for receiving communication transmission data is connected with the base electrode of the second triode through the third resistor;

the collector of the second triode is connected with the second pin of the MCU for transmitting the communication transmission data;

the emitter of the second triode is grounded through the fourth resistor;

the emitting electrode of the first triode and the emitting electrode of the second triode are connected with the fifth resistor through the storage communication component;

the fifth resistor is connected with the external memory chip;

after the MCU receiving the communication transmission data receives the external storage use information and the external storage read-write requirement, a second pin of the MCU receiving the communication transmission data sends a high level signal to a collector of the first triode so that an emitter of the first triode outputs the high level signal, and therefore communication conduction between the MCU sending the communication transmission data and the external storage chip is achieved;

the MCU for sending communication transmission data can perform read-write operation on the external memory chip through the emitter of the first triode, the memory communication component and the fifth resistor.

7. The board-level MCU data interaction storage system of claim 6, wherein the hardware protection component comprises: the third triode is connected with the fourth resistor;

the collector of the third triode is connected with a power supply;

a second pin of the MCU for sending communication transmission data is connected with a base electrode of the third triode through the sixth resistor;

the emitter of the third triode is connected with the collector of the fourth triode;

the second pin of the MCU for receiving the communication transmission data is connected with the base electrode of the fourth triode through the seventh resistor;

and the emitter of the fourth triode is connected with the external memory chip.

8. The board-level MCU data interaction storage system of claim 4, further comprising: an inter-board communication component;

and the two MCUs are connected through the inter-board communication assembly.

9. The board-level MCU data interaction storage system of claim 8, wherein the inter-board communication component comprises a UART communication component; the storage communication assembly comprises: I2C bus.

10. The board-level MCU data interaction storage system of claim 2, wherein the two MCUs comprise: and the MCU and the special task MCU are interacted outside.

11. The board-level MCU data interaction storage system of claim 10, wherein if the MCU transmitting the communication transmission data is an external interaction MCU and the MCU receiving the communication transmission data is a dedicated task MCU, the work interaction information comprises: the unit information data, the current unit operation data and the first program operation intermediate data corresponding to the external interaction MCU;

if the MCU for sending the communication transmission data is a special task MCU and the MCU for receiving the communication transmission data is an external interaction MCU, the work interaction information comprises: and the special task operation result corresponding to the special task MCU and the second program operation intermediate data.

12. A controller, comprising: a control single board and the board-level MCU data interaction storage system according to any one of claims 1-11;

the board-level MCU data interaction storage system is arranged on the control single board.

13. An electrical device, comprising: the controller of claim 12.

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