CN215680680U - Chip module and mainboard - Google Patents

Abstract

The application provides a chip module and a mainboard. The chip module includes: the chip comprises a chip main body and a chip module, wherein the chip main body is provided with a mounting surface, and the vertex angles of the mounting surface are provided with first bonding pads; the first bonding pad is used for fixing the chip main body on the PCB before the chip main body and the PCB are subjected to high temperature furnace passing; wherein the melting point of the first bonding pad is larger than the highest temperature in the process of high-temperature furnace passing. Through the improvement on the mounting surface, the problem of module warping can be effectively solved, and further the mechanical reliability of a follow-up PCB connected with the PCB can be ensured without thickening.

Description

Chip module and mainboard

Technical Field

The application relates to the technical field of chip processing, in particular to a chip module and a mainboard.

Background

In the field of hardware circuit boards, mechanical reliability and power reliability are conflicting variables. A Printed Circuit Board (PCB) Board needs to be thick enough to ensure mechanical reliability (the module is not deformed during the secondary soldering), but the power stability of the PCB Board is degraded due to the excessive thickness of the PCB Board. With the rapid development of hardware, the processing capability is stronger and more complex, and the dependence of the system on the power supply is high, so the PCB has to be thinned. Therefore, people in the industry need to solve the problem of how to make the PCB thin while ensuring that the modules on the PCB are not changed during the secondary soldering.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a chip module and a main board, so that the PCB is thinned, and simultaneously, the module on the PCB is ensured not to deform during secondary welding, and further, the mechanical reliability and the power reliability of the PCB are improved.

In a first aspect, an embodiment of the present application provides a chip module, including: the chip comprises a chip main body and a chip module, wherein the chip main body is provided with a mounting surface, and the vertex angles of the mounting surface are provided with first bonding pads; the first bonding pad is used for fixing the chip main body on the PCB before the chip main body and the PCB are subjected to high temperature furnace passing; wherein the melting point of the first bonding pad is larger than the highest temperature in the process of high-temperature furnace passing.

In the embodiment of the application, the vertex angles of the mounting surface of the chip main body are provided with the first bonding pads, so that the vertex angles of the mounting surface can be welded with a PCB firstly. Because the melting point of the first bonding pad at the vertex angle is larger than the highest temperature in the high-temperature furnace passing process, the first bonding pad can not be melted in the subsequent high-temperature furnace passing process, and further the distortion and deformation between the chip module and the PCB board caused by the thermal expansion coefficient can be effectively inhibited under the action of the pulling force of the vertex angle of the chip module. Through the improvement on the mounting surface, the problem of module warping can be effectively solved, and further the mechanical reliability of a follow-up PCB connected with the PCB can be ensured without thickening.

With reference to the technical solution provided by the first aspect, in some possible implementation manners, the mounting surface is quadrilateral and has a first side and a second side that are oppositely arranged, and the first side and the second side are respectively provided with a second pad; the second bonding pad is used for fixing the chip main body on the PCB before the chip main body and the PCB are subjected to high temperature furnace passing; wherein the melting point of the second bonding pad is larger than the highest temperature in the process of high-temperature furnace passing.

In this application embodiment, all be provided with the second pad at the first side and the second side of installation face for the first side and the second side of installation face can weld with the PCB board earlier. Because the melting point of the second bonding pad is greater than the highest temperature in the high-temperature furnace passing process, the second bonding pad can not be melted in the subsequent high-temperature furnace passing process, and the side warping condition of the chip module can be further effectively inhibited under the action of the tension of the first side and the second side of the mounting surface.

With reference to the technical solution provided by the first aspect, in some possible implementation manners, the second pads are respectively disposed in the middle of the first side and the second side.

In this application embodiment, set up the second pad respectively at first side and the respective middle part of second side, can make things convenient for the welding to have also improved first side and second side welded stability simultaneously.

With reference to the technical solution provided by the first aspect, in some possible implementation manners, the mounting surface further has a third side and a fourth side that are arranged oppositely, two opposite ends of the third side and the fourth side are respectively connected to the first side and the second side, and the third side and the fourth side are respectively provided with a third pad; the third bonding pad is used for fixing the chip main body on the PCB before the chip main body and the PCB are subjected to high temperature furnace passing; wherein the melting point of the third bonding pad is larger than the highest temperature in the process of high-temperature furnace passing.

In the embodiment of the application, the third bonding pads are arranged on the third side edge and the fourth side edge of the mounting surface, so that the third side edge and the fourth side edge of the mounting surface can be welded with the PCB firstly. Because the melting point of the third bonding pad is larger than the highest temperature in the high-temperature furnace passing process, the third bonding pad can not be melted in the subsequent high-temperature furnace passing process, and the situation that the side edge of the chip module is warped can be further effectively inhibited under the action of the tension of the third side edge and the fourth side edge of the mounting surface.

With reference to the technical solution provided by the first aspect, in some possible implementation manners, the third pad is disposed in the middle of each of the third side and the fourth side.

In the embodiment of the application, the third pads are respectively arranged in the respective middle parts of the third side and the fourth side, so that welding can be facilitated, and meanwhile, the welding stability of the third side and the fourth side is also improved.

With reference to the technical solution provided by the first aspect, in some possible implementation manners, a fourth pad is further disposed in the middle of the mounting surface; and the fourth bonding pad is used for fixedly connecting the chip main body with the PCB after the chip main body and the PCB are subjected to high-temperature furnace passing.

In the embodiment of the application, the fourth bonding pad is arranged in the middle of the mounting surface, so that the connection between the mounting surface and the inner part of the PCB is more stable after the chip module passes through the furnace at high temperature.

In combination with the technical solution provided by the first aspect, in some possible implementations, the fourth pads are disposed in an axisymmetrical structure with respect to a center line of a pair of opposite sides of the mounting surface.

In the embodiment of the application, the fourth bonding pads are arranged in an axisymmetrical structure relative to the center line of a pair of opposite sides of the mounting surface, so that the stability of connection between the mounting surface and the inside of the PCB after the chip module passes through a furnace at high temperature is further improved.

With reference to the technical solution provided by the first aspect, in some possible implementation manners, the cross section of the fourth pad is circular.

In the embodiment of the present application, the cross section of the fourth pad is circular to facilitate faster fusion and connection during the high temperature furnace process.

With reference to the technical solution provided by the first aspect, in some possible implementation manners, the chip module is a communication module.

In a second aspect, an embodiment of the present application provides a motherboard, including: a PCB and a chip module connected to the PCB and provided in the above first aspect embodiment and/or in combination with some possible implementations of the above first aspect embodiment.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a chip module provided in an embodiment of the present application at different viewing angles; wherein, (a) is a structural schematic diagram of the chip module under a first viewing angle; (b) a schematic diagram of the chip module in the second viewing angle is shown.

Fig. 2 is a schematic view of a mounting surface of a first chip module according to an embodiment of the present disclosure.

Fig. 3 is a schematic view of a mounting surface of a second chip main body according to an embodiment of the present disclosure.

Fig. 4 is a schematic view of a mounting surface of a third chip body according to an embodiment of the present disclosure.

Fig. 5 is a schematic view of a mounting surface of a fourth chip body according to an embodiment of the present disclosure.

Fig. 6 is a schematic view of a mounting surface of a fifth chip main body according to an embodiment of the present disclosure.

Fig. 7 is a schematic view of a mounting surface of a sixth chip main body according to an embodiment of the present disclosure.

Fig. 8 is a schematic view of a mounting surface of a seventh chip main body according to an embodiment of the present disclosure.

Fig. 9 is a schematic view of a mounting surface of an eighth chip body according to an embodiment of the present application.

Fig. 10 is a schematic structural diagram of a main board according to an embodiment of the present application.

Icon: 100-chip module; 10-a chip body; 11-a mounting surface; 12-a display surface; 20-a first pad; 30-a second pad; 40-a third pad; 50-a fourth pad; 200-a main board; 300-PCB board.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

In the description of the present application, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, and are only used for convenience in describing the present application and simplifying the description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," "fourth," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

It should also be noted that, unless expressly stated or limited otherwise, the terms "disposed" and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1, an embodiment of the present application provides a chip module 100 including a chip body 10. The chip body 10 is provided with a mounting surface 11 and a display surface 12 facing each other.

The mounting surface 11 is mainly used for connecting with a PCB. The mounting surface 11 is provided with pin pads and pads in advance according to the type of the chip module (the black area in fig. 1(a) is a configuration of the pin pads and pads). The pin pads and lands on the mounting face 11 are used for communication connections with the PCB board. The pin pads and the pads on the mounting surface 11 are soldered to the PCB by passing through a high temperature furnace. Since this welding method is well known in the art, it will not be described in detail in this application.

The display surface 12 includes information such as the model and manufacturer of the chip module 100 (the characters in fig. 1(b) represent the relevant information of the chip module 100). The display surface 12 is primarily used to present the above information.

In order to ensure that the chip body 10 is not deformed when being soldered to a PCB main board, in the embodiment of the present application, the mounting surface 11 of the chip body 10 is modified. Referring to fig. 2, first pads 20 are disposed at the top corners of the mounting surface 11 of the chip body 10. The chip body 10 is generally quadrangular in shape, and the first pads 20 are provided at the four corners of the mounting surface 11.

The first pads 20 are used to fix the chip body 10 on the PCB before the chip body 10 and the PCB are subjected to high temperature through the furnace. The first pads 20 are not used for communication connection of the two.

It should be noted that the melting point of the first pad 20 is greater than the highest temperature during the high temperature furnace. That is, the melting point of the first bonding pad 20 needs to be greater than the melting points of the pre-formulated pin pad and bonding pad (which can be achieved with different compositions of solder). When the temperature is high, the melting of the pin welding points and the welding pads prepared in advance on the mounting surface is ensured, and the first welding pads 20 are not melted.

In a specific implementation process, the four top corners of the mounting surface 11 need to be welded with the PCB in advance, and since the melting point of the first bonding pads 20 at the four top corners is greater than the highest temperature in the high-temperature furnace passing process, the first bonding pads 20 are not melted in the subsequent high-temperature furnace passing process, and further, the distortion and deformation between the chip module 100 and the PCB, which are caused by the thermal expansion coefficient, can be effectively inhibited under the action of the tensile force at the four top corners of the chip module 100.

It can be seen that, by improving the mounting surface 11 of the chip main body 10, the problem of module warpage can be effectively improved, and further, the mechanical reliability of a PCB board connected with the chip main body can be ensured without thickening the PCB board.

In other embodiments, when the chip body 10 has other shapes, the first pads 20 may be disposed at each corner, for example, when the chip body 10 has a triangular shape, the first pads 20 are disposed at three corners of the chip module 100. Of course, when the chip body 10 has an oval shape, the first pads 20 may be provided at four vertices of the oval shape, but the present application is not limited thereto.

In the embodiment of the present application, the chip module 100 is a communication module, such as a bluetooth module or a Wi-Fi module.

Of course, in other embodiments, the chip module 100 may be an integrated circuit chip having signal processing capabilities. The chip module 100 may also be a general-purpose Processor, for example, a Central Processing Unit (CPU), a Digital Signal Processor (DSP), a discrete gate or transistor logic device, a discrete hardware component, etc., and the present application is not limited thereto.

In the following embodiments, the shape of the chip body 10 is a quadrangle. That is, the mounting surface 11 has a quadrangular shape. The mounting surface 11 has a first side and a second side which are oppositely arranged; the mounting surface 11 also has third and fourth oppositely disposed sides. The opposite ends of the third side and the fourth side are respectively connected with the first side and the second side.

Referring to fig. 3, as an alternative embodiment, the first side and the second side are further provided with a second pad 30.

It should be noted that the second pads 30 are offset from the pre-configured pin pads and pads.

The second bonding pads 30 are used to fix the chip body 10 on the PCB before the chip body 10 and the PCB are subjected to high temperature through the furnace. Specifically, the second pads 30 are used to fix the first side and the second side of the mounting surface 11 of the chip body 10 on the PCB before the chip body 10 and the PCB are heated in the furnace. The second pads 30 are not used for communication connection of the two.

It should be noted that the melting point of the second bonding pad 30 is greater than the highest temperature during the high temperature furnace. That is, the melting point of the second bonding pad 30 needs to be greater than the melting point of the pre-formulated pin pad and bonding pad. When the temperature is high, the melting of the pin welding points and the bonding pads prepared in advance on the mounting surface 11 is ensured, and the second bonding pads 30 are not melted.

In a specific implementation process, the second pad 30 on the mounting surface 11 needs to be welded with the PCB in advance, and a melting point of the second pad 30 is greater than a highest temperature in a high-temperature furnace passing process, so that the second pad 30 is not melted in the high-temperature furnace passing process, and further, distortion and deformation caused by thermal expansion coefficients between the first side and the second side of the mounting surface 11 and the PCB can be effectively inhibited under the action of tensile force of the first side and the second side of the mounting surface 11.

As a way of improving the stability of the soldering, as shown in fig. 3, the second pads 30 on the first side may be disposed at a position close to the third side, and the second pads 30 on the second side may be disposed at a position close to the fourth side, and the linear distance from the second pads 30 on the first side to the third side is equal to the linear distance from the second pads 30 on the second side to the fourth side.

In order to facilitate the welding and improve the stability of the subsequent welding of the first side and the second side, referring to fig. 4, the second pads 30 may also be respectively disposed in the middle of the first side and the second side.

Of course, the second pads 30 may also be disposed at any position on the first side and the second side, and the number of the corresponding second pads may also be set according to actual requirements, for example, the number of the second pads 30 may also be 4, 6, 8, and the like, which is not limited in this application.

Referring to fig. 5, as an alternative embodiment, a third pad 40 is further disposed on the third side and the fourth side.

It should be noted that the third pad 40 is offset from the pre-configured pin pad and pad.

The third bonding pads 40 are used to fix the chip body 10 on the PCB before the chip body 10 and the PCB are subjected to high temperature through the furnace. Specifically, the third pads 40 are used to fix the third side and the fourth side of the mounting surface 11 of the chip main body 10 on the PCB before the chip main body 10 and the PCB are subjected to high temperature in the furnace. The third pad 40 is not used for communication connection of the two.

It should be noted that the melting point of the third bonding pad 40 is greater than the highest temperature during the high temperature furnace. That is, the melting point of the third pad 40 needs to be greater than the melting points of the pre-formulated pin pad and pad. When the temperature is high, the melting of the pin soldering points and the soldering pads prepared in advance on the mounting surface 11 is ensured, and the third soldering pad 40 is not melted.

In a specific implementation process, the third pad 40 of the mounting surface 11 needs to be soldered to the PCB in advance, and a melting point of the third pad 40 is greater than a highest temperature in a high-temperature furnace passing process, so that the third pad 40 is not melted in the high-temperature furnace passing process, and further, distortion and deformation caused by thermal expansion coefficients between the third side and the fourth side of the mounting surface 11 and the PCB can be effectively inhibited under the action of tensile forces of the third side and the fourth side of the mounting surface 11.

As a way of improving the stability of the welding, as shown in fig. 5, the third pad 40 on the third side may be disposed at a position close to the first side, and the third pad 40 on the fourth side may be disposed at a position close to the second side, and the straight distance of the third pad 40 on the third side from the first side is equal to the straight distance of the third pad 40 on the fourth side from the second side.

In order to facilitate the soldering and improve the stability of the subsequent soldering of the third side and the fourth side, referring to fig. 6, the third pads 40 may be further disposed at the respective middle portions of the third side and the fourth side, respectively.

Of course, the third pads 40 may also be disposed at any position on the third side and the fourth side, and the number of the corresponding third pads 40 may also be set according to actual requirements, for example, the number of the third pads 40 may also be 4, 6, 8, and the like, which is not limited in this application.

Of course, the second pads 30 and the third pads 40 may be provided on the mounting surface 11 at the same time (as shown in fig. 7). By arranging the second pads 30 on the first side and the second side of the mounting surface 11, the third pads 40 on the third side and the fourth side of the mounting surface 11 can effectively prevent the chip body 10 from warping at the four sides after passing through the furnace at a high temperature.

Referring to fig. 8, optionally, a fourth pad 50 is further disposed in the middle of the mounting surface 11. The fourth bonding pad 50 is used for fixedly connecting the chip body 10 and the PCB after the chip body 10 and the PCB are heated at a high temperature.

The fourth pad 50 may be made of the same solder as the pre-prepared pin pad and pad. The fourth pad 50 is mainly used for fixing after passing through a furnace at a high temperature, so as to ensure the stability of the connection between the chip body 10 and the PCB.

Optionally, the fourth pads 50 are arranged in an axisymmetrical configuration with respect to a center line of a pair of opposite sides of the mounting surface. Referring to fig. 9, the number of the fourth pads 50 is 4, and the 4 fourth pads 50 are disposed in an axisymmetrical structure with respect to a center line of the first side and the second side.

Of course, in other embodiments, the middle line of the third side and the fourth side can also be used as the symmetry axis, and the application is not limited.

Through the fourth bonding pad 50 arranged in the axisymmetrical structure, the stability of the connection between the mounting surface 11 and the inside of the PCB after the chip module 100 passes through the furnace at a high temperature is further improved.

Of course, in other implementations, the number of the fourth pads 50 may also be determined according to actual situations, for example, the number of the fourth pads 50 may also be 6 or 8. Similarly, the plurality of fourth pads 50 may be disposed at any position in the middle of the mounting surface 11, and the present application is not limited thereto.

With continued reference to fig. 9, optionally, the fourth pad 50 is circular in cross-section. That is, the fourth pad 50 is shaped in a pie shape to facilitate faster fusion and connection during the high temperature annealing process.

In other embodiments, the cross section of the fourth pad 50 may be rectangular, which is not limited in the present application.

Referring to fig. 10, based on the same concept, an embodiment of the present application further provides a main board 200, including: a PCB board 300 and the chip module 100 of the above embodiment connected to the PCB board 300.

In the embodiment of the present application, before the PCB 300 and the chip module 100 are heated in the furnace, the four corners of the mounting surface of the chip body are fixed on the PCB by the first bonding pads. After the four corners of the mounting surface are fixed on the PCB 300, the pre-prepared pin pads and pads for communication are connected to the PCB 300 by means of high temperature furnace.

It can be understood that, when the second bonding pad and the third bonding pad are further disposed on the mounting surface, before the PCB 300 and the chip module 100 are subjected to high temperature in the furnace, the four sides are further fixed on the PCB 300 by the second bonding pad and the third bonding pad. After the four sides of the mounting surface are also fixed on the PCB 300, the pre-prepared pin pads and pads for communication are connected to the PCB 300 by means of a high temperature furnace.

The first pad, the second pad, and the third pad may be welded by spot welding. For example, electric soldering iron is used for spot welding, and the application is not limited.

Of course, in other embodiments, high-temperature-resistant glue can be used for fixing the four top corners of the mounting surface. The four top corners of the mounting surface are fixed by the high-temperature-resistant glue, so that when the PCB 300 and the chip module 100 are subjected to high-temperature furnace passing, the four top corners generate tensile force to effectively inhibit the distortion between the chip module 100 and the PCB 300 caused by the thermal expansion coefficient.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A chip module, comprising:

the chip comprises a chip main body and a chip module, wherein the chip main body is provided with a mounting surface, and the vertex angles of the mounting surface are provided with first bonding pads; the first bonding pad is used for fixing the chip main body on the PCB before the chip main body and the PCB are subjected to high temperature furnace passing; wherein the melting point of the first bonding pad is larger than the highest temperature in the process of high-temperature furnace passing.

2. The chip module according to claim 1, wherein the mounting surface is quadrilateral and has a first side and a second side opposite to each other, and the first side and the second side are respectively provided with a second pad;

the second bonding pad is used for fixing the chip main body on the PCB before the chip main body and the PCB are subjected to high temperature furnace passing; wherein the melting point of the second bonding pad is larger than the highest temperature in the process of high-temperature furnace passing.

3. The chip module according to claim 2, wherein the second pads are respectively disposed at respective middle portions of the first side and the second side.

4. The chip module according to claim 2, wherein the mounting surface further has a third side and a fourth side which are oppositely arranged, opposite ends of the third side and the fourth side are respectively connected with the first side and the second side, and the third side and the fourth side are respectively provided with a third pad;

the third bonding pad is used for fixing the chip main body on the PCB before the chip main body and the PCB are subjected to high temperature furnace passing; wherein the melting point of the third bonding pad is larger than the highest temperature in the process of high-temperature furnace passing.

5. The chip module of claim 4, wherein the third pads are disposed in a middle portion of each of the third side and the fourth side.

6. The chip module according to claim 1, wherein a fourth pad is further provided in the middle of the mounting surface;

and the fourth bonding pad is used for fixedly connecting the chip main body with the PCB after the chip main body and the PCB are subjected to high-temperature furnace passing.

7. The chip module of claim 6, wherein the fourth pads are disposed in an axisymmetric configuration with respect to a centerline of a pair of opposing sides of the mounting surface.

8. The chip module of claim 7, wherein the fourth pad has a circular cross-section.

9. The chip module according to claim 1, wherein the chip module is a communication module.

10. A motherboard, comprising:

a PCB board and a chip module according to any of claims 1-9 connected to the PCB board.

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