JP4844260B2 - Electronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component and a method for manufacturing the same, and particularly includes an electronic component main body in which a mounting component is mounted on a mounting surface of a substrate and a metal case provided in the electronic component main body so as to cover the mounting surface of the substrate. The present invention relates to an electronic component used for a radio communication high-frequency electronic component mounted on a radio communication device such as a mobile phone and a manufacturing method thereof.

  FIG. 7 is a perspective view showing an example of a conventional electronic component, and FIG. 8 is an illustrative view showing an electronic component body used for the electronic component. An electronic component 1 shown in FIG. 7 includes an electronic component main body 2 shown in FIG. 8, and the electronic component main body 2 includes a rectangular plate-like substrate 3, for example. A mounting component 4 is mounted on one main surface of the substrate 3. The electronic component body 2 is provided with a metal case 5 so as to cover the mounting region on one main surface of the substrate 3 in order to protect the mounting component 4. In this case, bonding electrodes 6 are formed at the four corners on the substrate 3, ball-shaped solder paste is printed on the bonding electrodes 6, and the leg portions at the four corners of the metal case 5 are formed on the bonding electrodes 6. 7 and the joining electrodes 6 at the four corners of the substrate 3 and the leg portions 7 at the four corners of the metal case 5 are joined by soldering by reflow. Thus, when the metal case 5 is joined to the substrate 3 by reflow, it is necessary to position the metal case 5 with respect to the substrate 3. In this electronic component 1, fitting recesses 8 are formed on opposite side surfaces of the substrate 3, and claw portions 9 that fit into the fitting recesses 8 are formed on both sides of the metal case 5. The metal case 5 is positioned with respect to the board | substrate 3 by fitting those nail | claw parts 9 in 8 (for example, refer patent document 1).

JP 2002-57234 A

However, in recent wireless communication devices such as mobile phones on which the electronic component 1 is mounted, the thickness of the electronic component main body 2 or the substrate 3 of the electronic component 1 has been reduced. In the electronic component 1 described above, the metal case 5 is usually placed on a ball-shaped solder paste printed on the bonding electrode 6 on the substrate 3 and passed through a heating dome for reflow. In the case where the thickness of the main body 2 or the substrate 3 is thin, the length of the portion where the fitting recess 8 of the substrate 3 and the claw portion 9 of the metal case 5 are fitted becomes very short. For this reason, the problem of the position shift of the metal case 5 with respect to the substrate 3 occurs that the claw portion 9 of the metal case 5 comes off the fitting recess 8 of the substrate 3 and rides on the main surface of the substrate 3 with a slight impact. End up.
Further, if the length of the claw portion 9 is formed long in order to prevent such a problem of misalignment, the ball-shaped solder paste melts and the metal case 5 sinks after reflow. The problem that the nail | claw part 9 of the metal case 5 will protrude will arise.

  Therefore, the main object of the present invention is to provide an electronic device having a structure capable of preventing the displacement of the metal case with respect to the substrate during manufacturing and making it difficult for the claw portion of the metal case to protrude from the lower surface of the substrate. It is to provide a component and a manufacturing method thereof.

The present invention includes a substrate having at least one main surface as a mounting surface, and a mounting component mounted on the mounting surface of the substrate, and a fitting recess having an electrode non-forming portion on the side surface of the substrate, and one main surface of the substrate The electronic component main body having the bonding electrode formed thereon and the top plate portion provided at a predetermined interval from the mounting surface of the substrate so as to cover at least a part of the mounting surface of the substrate, and bent from the top plate portion And a metal case provided with a leg portion formed to be bent from the top plate portion and joined to the joining electrode. In the electronic component main body, an auxiliary land is formed on the mounting surface of the board and inside the concave portion for fitting, and the claw portion of the metal case is separated from the concave portion for fitting on the auxiliary land. Auxiliary to prevent getting on the surface I's mass is formed, which is an electronic component.
In the electronic component according to the present invention, the gap between the fitting recess and the auxiliary land in the substrate is preferably equal to or less than the thickness of the metal plate that is the material of the metal case.
An electronic component manufacturing method according to the present invention is an electronic component manufacturing method for manufacturing an electronic component according to the present invention, wherein a mounting land and an auxiliary land are formed on a substrate for an electronic component main body. A step of forming a mounting solder pattern and an auxiliary solder lump on the mounting land and the auxiliary land, and a step of mounting a mounting component on the predetermined mounting land on which the mounting solder pattern is formed Mounting the metal case on the other of the mounting lands on which the mounting solder pattern is formed so that the claw portion of the metal case is fitted into the fitting concave portion of the board, and mounting components and And a step of bonding a metal case to a mounting land.

In the electronic component according to the present invention, an auxiliary land is formed on the mounting surface of the substrate in the electronic component main body and inside the concave portion for fitting, and the claw portion of the metal case is detached from the concave portion for fitting on the auxiliary land. Since the auxiliary solder lump for preventing the board from climbing on the main surface of the board is formed, the relative height of the part where the claw part of the metal case tries to climb is set to the auxiliary land and the auxiliary solder lump. Increased by. Therefore, even when the metal case is lifted after the metal case is mounted so that the claw portion of the metal case is fitted in the fitting recess of the substrate when the electronic component according to the present invention is manufactured, It is possible to prevent the claw portion from climbing onto the substrate, that is, the displacement of the metal case with respect to the substrate.
Furthermore, in the electronic component according to the present invention, the relative height of the portion where the claw portion of the metal case tries to climb is increased by the auxiliary land and the auxiliary solder lump, so that the metal case is prevented from being displaced relative to the substrate. Does not require a long claw portion that protrudes from the lower surface of the substrate, and can prevent the claw portion of the metal case from protruding from the lower surface of the substrate.
As described above, the electronic component according to the present invention can solve the problems without deteriorating the coplanarity (flatness) of the substrate and the risk of poor mounting of the metal case.
In the electronic component according to the present invention, since the gap between the fitting recess and the auxiliary land on the board is equal to or less than the thickness of the metal plate that is the material of the metal case, the claw portion of the metal case gets on the gap. It can be prevented from going up.
Furthermore, in the electronic component manufacturing method according to the present invention, the electronic component according to the present invention can be manufactured.

  According to the present invention, an electronic component having a structure capable of preventing the displacement of the metal case with respect to the substrate during manufacture and making it difficult for the claw portion of the metal case to protrude from the lower surface of the substrate and the manufacture thereof. A method is obtained.

  The above-mentioned object, other objects, features, and advantages of the present invention will become more apparent from the following description of the best mode for carrying out the invention with reference to the drawings.

  FIG. 1 is a perspective view showing an example of an electronic component according to the present invention, and FIG. 2 is an illustrative view showing an electronic component main body used in the electronic component shown in FIG. An electronic component 10 shown in FIG. 1 includes an electronic component main body 12 shown in FIG. The electronic component body 12 includes a substrate 14 made of, for example, a rectangular double-sided printed circuit board. The substrate 14 has a large number of electrode recesses 16 formed on, for example, semicircular cutouts on four side surfaces, and two fitting recesses 18 formed on, for example, rectangular cutouts on two side surfaces opposed in the longitudinal direction. It is formed. The electrode recess 16 is a recess for forming a terminal electrode, and the fitting recess 18 is a recess for fitting a claw portion 38 of a metal case 32 described later.

  One side of the substrate 14 is used as a mounting surface for mounting a mounting component or the like. Therefore, a large number of electrode patterns (not shown) having mounting lands at portions other than the four corners are formed on one main surface of the substrate 14, and four bonding lands as further mounting lands are formed at the four corners. Electrode 20 is formed. Predetermined ones of these electrode patterns are formed extending over a large number of terminal electrodes (not shown) formed in a large number of electrode recesses 16 of the substrate 14 and connected to these terminal electrodes. . Further, four through holes 22 are formed in a portion of the substrate 14 where the four bonding electrodes 20 are formed, and the four bonding electrodes 20 are connected to the other main surface of the substrate 14 through the through holes 22. Are connected to a ground electrode (not shown). When a multilayer substrate is used as the substrate 14, the ground electrode connected to the bonding electrode 20 may be formed inside the substrate 14.

  A mounting solder pattern (not shown) is formed on the mounting land of the electrode pattern formed on the substrate 14. Similarly, a mounting solder pattern 24 is formed on the bonding electrode 20 as a further mounting land.

  Furthermore, two auxiliary electrodes 26 having, for example, a rectangular shape are formed as auxiliary lands on one main surface of the substrate 14 inside the two fitting recesses 18. These auxiliary electrodes 26 are formed along the side surfaces of the substrate 14 where the fitting recesses 18 are formed. In this case, the gap between the fitting recess 18 and the auxiliary electrode 26 in the substrate 14 is “0” in plan view. On these auxiliary electrodes 26, for example, thick plate-shaped auxiliary solder lump 28 is formed. The auxiliary solder lump 28 serves to play a role of a so-called bank for preventing a claw portion 38 of the metal case 32 described later from coming off the fitting recess 18 and riding on the main surface of the substrate 14.

  A large number of mounting components 30 are joined to mounting lands of a large number of electrode patterns formed on one main surface of the substrate 14 by a mounting solder pattern thereon.

  Furthermore, the metal case 32 is joined to the four joining electrodes 20 formed on the one main surface of the substrate 14 by the mounting solder pattern 24 thereon. The metal case 32 includes, for example, a rectangular top plate portion 34 having a main surface slightly smaller than one main surface of the substrate 14. The top plate portion 34 is spaced a predetermined distance from the mounting surface of the substrate 14 so as to cover the mounting surface of the substrate 14 in order to protect the mounting component 30 mounted on one main surface (mounting surface) of the substrate 14. It is provided. Therefore, two leg portions 36 each having a trapezoidal plate shape, for example, are formed at the four corners of the top plate portion 34 so as to be bent downward from the top plate portion 34. In this case, at each corner of the top plate portion 34, the two leg portions 36 are formed so as to approach each other and their main surfaces are orthogonal to each other. The lower portions of the leg portions 36 are joined to the joining electrode 20 by the mounting solder pattern 24. Further, for example, two plate-like claw portions 38 are formed at both ends in the longitudinal direction of the top plate portion 34 so as to be bent downward from the top plate portion 34. Each of these claw portions 38 includes, for example, a rectangular intermediate portion 40, and a triangular tip portion 42 is formed at a lower portion in the center of the intermediate portion 40. These claw portions 38 are used for positioning the metal case 32 with respect to the substrate 14, and the tip portion 42 is fitted into the fitting recess 18 of the substrate 14, and the intermediate portion 40 is on the substrate 14. Placed in.

  Next, an example of a method for manufacturing the electronic component 10 will be described.

  First, as shown in the manufacturing process of the electronic component 10 in FIG. 3, a parent substrate having a size in which a plurality of substrates 14 are arranged in a row and in a row is prepared. Each substrate 14 of the parent substrate is formed with an electrode recess 16, a fitting recess 18 and a through hole 22.

  An electrode pattern having mounting lands, a bonding electrode 20 as a further mounting land, and an auxiliary electrode 26 as an auxiliary land are placed at predetermined positions on one main surface of each substrate 14 of the parent substrate. Formed simultaneously. A ground electrode is formed on the other main surface of each substrate 14 of the parent substrate. The ground electrode may be formed before or after the electrode pattern, the bonding electrode 20 and the auxiliary electrode 26 are formed on the parent substrate. When a multilayer substrate is used as the parent substrate, the ground electrode may be formed inside the parent substrate when the parent substrate is formed.

  Then, a solder paste for printing, a further mounting solder pattern 24, and an auxiliary solder lump 28 are formed on the mounting lands of the electrode pattern, the bonding electrode 20, and the auxiliary electrode 26 by printing a solder paste. Formed simultaneously.

  Then, the mounting component 30 is mounted on the mounting land on which the mounting solder pattern is formed.

  Furthermore, a metal case 32 is mounted on the four bonding electrodes 20 on which the mounting solder patterns 24 are formed. In this case, the eight leg portions 36 at the four corners of the metal case 32 are placed on the four joining electrodes 20 on which the soldering flux 24 for mounting is formed with solder flux applied to the lower surfaces thereof. Further, the tip end portion 42 of the claw portion 38 of the metal case 32 is fitted into the fitting recess 18 of the substrate 14. Further, the intermediate portion 40 of the claw portion 38 of the metal case 32 is disposed on the substrate 14.

  Then, by reflow, the mounting component 30 is bonded to the mounting land of the electrode pattern by the mounting solder pattern, and the leg portion 36 of the metal case 32 is bonded to the bonding electrode 20 by the mounting solder pattern 24. In this case, the claw portion 38 of the metal case 32 may or may not be joined to the auxiliary electrode 26 by the auxiliary solder lump 28.

  Then, each electronic component 10 is manufactured by cutting the parent substrate into each substrate 14.

  In the electronic component 10, an auxiliary electrode 26 is formed on the mounting surface of the substrate 14 in the electronic component main body 12 and inside the fitting recess 18, and an auxiliary solder lump 28 is formed on the auxiliary electrode 26. Therefore, the relative height of the portion where the tip end portion 42 of the claw portion 38 of the metal case 32 is about to climb is increased by the auxiliary electrode 26 and the auxiliary solder lump 28. Therefore, when the electronic component 10 is manufactured, the claw portion 38 of the metal case 32 is mounted after the metal case 32 is mounted so that the tip 42 of the claw portion 38 of the metal case 32 fits into the fitting recess 18 of the substrate 14. Even if the metal plate 32 is lifted, it is possible to prevent the tip portion 42 of the claw portion 38 of the metal case 32 from climbing onto the substrate 14 in the longitudinal direction of the substrate 14 and to prevent the metal case 32 from being displaced relative to the substrate 14. can do.

  Further, in this electronic component 10, the relative height of the portion where the tip 42 of the claw portion 38 of the metal case 32 is about to climb is increased by the auxiliary electrode 26 and the auxiliary solder lump 28, so that the metal case with respect to the substrate 14. In order to prevent the displacement of the position 32, a long claw portion that protrudes from the lower surface of the substrate 14 is unnecessary, and the front end portion 42 of the claw portion 38 of the metal case 32 is prevented from protruding from the lower surface of the substrate 14. be able to.

  Further, in this electronic component 10, the gap between the fitting recess 18 and the auxiliary electrode 26 in the substrate 14 is “0” which is equal to or less than the thickness of the metal plate that is the material of the metal case 32. It is possible to prevent the tip portion 42 of the 32 claw portions 38 from climbing up. Thus, the gap between the fitting recess 18 and the auxiliary electrode 26 in the substrate 14 is preferably equal to or less than the thickness of the metal plate that is the material of the metal case 32.

  As described above, in this electronic component 10, the auxiliary solder lump 28 serves as a bank, and the length of the claw portion 38 is substantially fitted without forming the claw portion 38 of the metal case 32 long. Can be secured. Further, the auxiliary electrode 26 can be formed in the same manner as the mounting land, and the auxiliary solder block 28 can be formed in the same manner as the mounting solder pattern. Without applying, the displacement of the metal case 32 relative to the substrate 14 can be prevented.

  In addition, since this electronic component 10 has a large number of terminal electrodes in a large number of electrode recesses 16, it can cope with the increase in the number of terminals. Further, in this electronic component 10, since the two leg portions 36 of the metal case 32 are bonded to each bonding electrode 20, the bonding strength between the substrate 14 and the metal case 32 is high. Furthermore, in this electronic component 10, since the metal case 32 is connected to the ground electrode via the bonding electrode 20 or the like, the shielding effect by the metal case 32 can be enhanced. Further, since the bonding electrode 20 is connected to the ground electrode through the through hole 22, the bonding electrode 20 is hardly peeled off from the substrate 14. In addition, in this electronic component 10, since the two leg portions 36 of the metal case 32 are arranged so that their main surfaces are orthogonal, the metal case 32 is deformed with respect to the force received from any direction. Hard to bend.

  FIG. 4 is a main part illustrative view showing another example of an electronic component main body used in the electronic component according to the present invention. In the electronic component 10 shown in FIG. 1, the auxiliary electrode 26 and the auxiliary solder lump 28 are formed in a rectangular shape, but the auxiliary electrode 26 and the auxiliary solder lump 28 are for fitting as shown in FIG. It may be formed in a U shape so as to surround the recess 18. If the auxiliary electrode 26 and the auxiliary solder lump 28 are formed in a U shape in this way, the tip of the claw portion 38 of the metal case 32 is not only in the longitudinal direction of the substrate 14 but also in the width direction of the substrate 14. 42 can be prevented from climbing onto the substrate 14, and displacement of the metal case 32 relative to the substrate 14 can be prevented.

  FIG. 5 is a perspective view showing another example of the electronic component according to the present invention, and FIG. 6 is an illustrative view showing an electronic component main body used for the electronic component shown in FIG. In the electronic component 10 shown in FIG. 5, compared to the electronic component 10 shown in FIG. 1, three additional sets of fitting recesses 18, auxiliary electrodes 26, and two side surfaces opposed in the width direction of the substrate 14 and the inside thereof are provided. Auxiliary solder masses 28 are formed, and correspondingly, three further claw portions 38 are formed at both ends in the width direction of the metal case 32.

  The electronic component 10 shown in FIG. 5 can be manufactured by the same method as the above-described method for manufacturing the electronic component 10 shown in FIG.

  In the electronic component 10 shown in FIG. 5, compared to the electronic component 10 shown in FIG. 1, the tip portion 42 of the claw portion 38 of the metal case 32 is prevented from climbing onto the substrate 14 in the width direction of the substrate 14. This also has the effect of preventing the displacement of the metal case 32 relative to the substrate 14.

  In each electronic component 10 described above, a double-sided printed board is used as the board 14, but in the present invention, a single-sided printed board may be used as the board, or a ceramic board may be used. .

  Further, in each of the electronic components 10 described above, the fitting recess 18 is formed in a rectangular shape, but in the present invention, the fitting recess 18 may be formed in another shape such as a semicircular shape. In this way, when the fitting recess 18 is formed in a semicircular shape, the auxiliary electrode 26 and the auxiliary solder lump 28 may be formed in a C shape so as to surround the fitting recess 18.

  Further, in each of the electronic components 10 described above, the leg portion 36 of the metal case 32 is formed in a trapezoidal plate shape, but the leg portion 36 of the metal case 32 may be formed in another plate shape such as a rectangular plate shape or in FIG. It may be formed in other shapes such as an L-shaped cross section like the leg 7 shown, and the shape is not limited.

  Moreover, in the manufacturing method of the electronic component 10 described above, the mounting component 30 and the metal case 32 are simultaneously bonded to the substrate 14 by reflow. However, the mounting component 30 is first bonded to the substrate 14 and the metal case 32 is It may be bonded to the substrate 14 later.

  The electronic component according to the present invention is used for a radio communication high frequency electronic component mounted on a radio communication device such as a mobile phone.

It is a perspective view which shows an example of the electronic component concerning this invention. It is an illustration figure which shows the electronic component main body used for the electronic component shown in FIG. It is a flowchart which shows the manufacturing process of the manufacturing method of the electronic component shown in FIG. It is a principal part solution figure which shows the other example of the electronic component main body used for the electronic component concerning this invention. It is a perspective view which shows the other example of the electronic component concerning this invention. It is an illustration figure which shows the electronic component main body used for the electronic component shown in FIG. It is a perspective view which shows an example of the conventional electronic component. It is an illustration figure which shows the electronic component main body used for the electronic component shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electronic component 12 Electronic component main body 14 Substrate 16 Electrode recessed part 18 Fitting recessed part 20 Joining electrode 22 Through hole 24 Solder pattern for mounting 26 Auxiliary electrode 28 Auxiliary solder lump 30 Mounting part 32 Metal case 34 Top plate part 36 Leg Part 38 Claw part 40 Middle part 42 Tip part

Claims (3)

A substrate having at least one main surface as a mounting surface; and a mounting component mounted on the mounting surface of the substrate; and a fitting recess having an electrode non-forming portion on a side surface of the substrate; and the one main surface of the substrate An electronic component main body formed with a bonding electrode ;
The mounting surface top plate portion provided at a predetermined distance from said mounting surface of said substrate so as to cover at least a portion of said substrate, is formed so as to be bent from the front SL top plate portion, formed on the substrate A claw part that fits into the fitting concave part , and a metal case that is formed to be bent from the top plate part and includes a leg part joined to the joining electrode ,
An auxiliary land is formed on the mounting surface of the substrate in the electronic component main body and inside the recess for fitting,
An electronic component in which an auxiliary solder lump is formed on the auxiliary land to prevent the claw portion of the metal case from coming off the fitting recess and riding on the main surface of the substrate.   2. The electronic component according to claim 1, wherein a gap between the fitting recess and the auxiliary land in the substrate is equal to or less than a thickness of a metal plate that is a material of the metal case. An electronic component manufacturing method for manufacturing the electronic component according to claim 1 or 2,
Forming a mounting land and an auxiliary land on a substrate for an electronic component body;
Forming a mounting solder pattern and an auxiliary solder lump on the mounting land and the auxiliary land,
Mounting a mounting component on a predetermined one of the mounting lands on which the mounting solder pattern is formed;
A step of mounting the metal case on the other of the mounting lands on which the solder pattern for mounting is formed so that the claw portion of the metal case fits into the recess for fitting of the substrate, and the mounting component by reflow And a method of manufacturing an electronic component, comprising joining the metal case to the mounting land.

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