CN215582442U - Heat radiator applied to high-power amplifier - Google Patents
Heat radiator applied to high-power amplifier Download PDFInfo
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- CN215582442U CN215582442U CN202121887879.8U CN202121887879U CN215582442U CN 215582442 U CN215582442 U CN 215582442U CN 202121887879 U CN202121887879 U CN 202121887879U CN 215582442 U CN215582442 U CN 215582442U
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- heat dissipation
- heat
- power amplifier
- heat conduction
- teeth
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 101
- 239000000463 material Substances 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000002791 soaking Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat dissipation device applied to a high-power amplifier, which comprises a heat dissipation body, a heat conduction layer, a wind scooper and a fan, wherein the heat dissipation body is formed by combining a plurality of sectional material heat dissipation teeth; the utility model is respectively provided with three heat dissipation measures of a heat dissipation body, a heat conduction layer and an air guide cover, wherein the heat dissipation body is a section heat dissipation tooth, and the first layer of heat dissipation is carried out through the heat dissipation tooth; the heat conduction layer is embedded with a plurality of heat conduction pipes, the heat conduction pipes can effectively improve the temperature uniformity of the surface of the heat dissipation teeth, and heat can be quickly conducted; the fan work in the wind scooper can restrain the flow direction of the air channel and prevent hot air from forming backflow in the heat dissipation device.
Description
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device applied to a high-power amplifier.
Background
With the development of electronic technology, the scale of integrated circuits is getting larger and larger, and the functions are getting more powerful, and along with the higher heat consumption of devices, the higher the demand for system heat dissipation is. The product also faces the strict requirement of miniaturization while increasing the heat consumption. Increasing the amount of heat dissipated means that a larger heat dissipation area, a shorter heat dissipation path, and a better heat conduction material are required in the system. The large number of devices need to be arranged in a restricted space, so that the design of a heat dissipation system which occupies a small space and has large heat dissipation capacity has a wider and wider application prospect.
At present, the heat dissipation design aiming at the high-power amplifier mainly has two solving routes: 1. adopt the high and stable liquid cooling radiator of radiating efficiency, liquid cooling heat dissipation principle: the cooling medium in the liquid cooling plate absorbs heat through heat exchange, and then is transmitted to the radiating fins through the driving of the water pump for concentrated radiation; 2. adopt the big heat dissipation tooth of heat radiating area to carry out the forced air cooling heat dissipation, the forced air cooling principle of dispelling the heat: the heat is transferred to the radiator through heat conduction, convection heat exchange is carried out on the surface of the radiator, a convection air channel is formed under the action of the fan, and the heat is transferred to the outside of the system.
The existing liquid cooling heat dissipation system has a complex integral structure and high cost, the failure rate is higher than that of an air cooling heat dissipation system, the space required by the traditional air cooling heat dissipation system is large, the temperature equalization performance is not good, and the miniaturization requirement cannot be met. Therefore, the utility model provides a heat dissipation device applied to a high-power amplifier, which has small occupied space and high heat dissipation efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heat dissipation device applied to a high-power amplifier, which has the advantages of small occupied space, various heat dissipation structure designs and effective improvement of heat dissipation efficiency.
The embodiment of the utility model is realized by the following technical scheme:
a heat dissipation device applied to a high-power amplifier comprises a heat dissipation body, a heat conduction layer, an air guide cover and a fan, wherein the heat conduction layer is installed on the surface of the heat dissipation body, and the air guide cover is installed at one end of the heat dissipation body; the heat dissipation body is formed by combining a plurality of sectional material heat dissipation teeth, the air guide cover is provided with a plurality of fan mounting openings, and the fans are mounted in the air guide cover through the fan mounting openings.
Preferably, the section bar heat dissipation teeth comprise a heat dissipation plate and heat dissipation teeth, the heat dissipation plate is provided with the heat dissipation teeth, and the heat dissipation teeth of the section bar heat dissipation teeth are oppositely arranged.
Preferably, both sides of the heat dissipation teeth are provided with raised grains.
Preferably, the heat conduction layer includes the heat conduction bottom plate, the heat conduction bottom plate install in the surface of heating panel, evenly be equipped with a plurality of heat conduction recesses on the heat conduction bottom plate, the heat conduction is embedded to be equipped with the heat pipe in the heat conduction recess.
Preferably, the heat conduction pipe is a heat conduction copper pipe.
Preferably, the heat conductive layer is provided integrally with the heat dissipation plate.
Preferably, the heat conducting layer is a soaking plate.
The technical scheme of the embodiment of the utility model at least has the following advantages and beneficial effects:
1. the utility model adopts the combined installation of a plurality of sectional material heat dissipation teeth, so that the area of the heat dissipation plate is increased, more amplifier functional modules can be installed, and the volume occupied by the functional modules is smaller;
2. the utility model adopts three radiating structures for radiating, thereby effectively improving the radiating efficiency; in the second aspect, a plurality of heat conduction pipes are uniformly embedded in the heat conduction layer, the heat conduction pipes can effectively improve the temperature uniformity of the surfaces of the heat dissipation teeth, and heat can be quickly conducted; in the third aspect, the fan in the wind scooper works to restrict the flow direction of the air duct and prevent hot air from forming backflow in the heat dissipation device;
the utility model has reasonable design, simple structure and strong practicability.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device provided in embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation device provided in embodiment 1 of the present invention;
fig. 3 is a schematic structural view of a profile heat dissipation tooth provided in embodiment 1 of the present invention;
icon: 1-a wind scooper, 2-a fan, 3-a fan mounting port, 4-a heat dissipation plate, 5-a heat dissipation tooth, 6-a heat conduction bottom plate, 7-a heat conduction groove, 8-a heat conduction pipe and 9-a functional module.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Example 1
As shown in fig. 1-3, a heat dissipation device applied to a high power amplifier includes a heat dissipation body, a heat conduction layer, an air guiding cover 1 and a fan 2, wherein the heat conduction layer is installed on the surface of the heat dissipation body, and the air guiding cover 1 is installed at one end of the heat dissipation body; the heat dissipation body is formed by combining a plurality of sectional material heat dissipation teeth, the wind scooper 1 is provided with a plurality of fan mounting openings 3, and the fan 2 is mounted in the wind scooper 1 through the fan mounting openings 3. A plurality of functional modules 9 of the high-power amplifier are respectively arranged on the surface of the heat conducting layer; the sectional material radiating teeth are assembled, so that the area of the functional module 9 of the high-power amplifier installed on the radiating device is increased; specifically, a plurality of sectional material heat dissipation teeth are assembled and installed into a cuboid. The one end that the wind scooper 1 was kept away from to the heat dissipation body is the air inlet end, and wind scooper 1 is used for retraining the wind channel flow direction, and at fan 2 during operation, all air inlets are carrying out the heat convection through section bar heat dissipation tooth and section bar heat dissipation tooth, then directly discharge through wind scooper 1, can prevent effectively that hot-blast formation backward flow in the system from worsening the radiating effect. The fan mounting port 3 and the fan 2 can be arranged according to actual requirements.
The section bar heat dissipation tooth comprises a heat dissipation plate 4 and heat dissipation teeth 5, wherein the heat dissipation plate 4 is provided with the heat dissipation teeth 5, and the heat dissipation teeth 5 of the section bar heat dissipation teeth are oppositely arranged. The section heat dissipation teeth are combined according to actual requirements.
Wave grains are arranged on two sides of the heat dissipation teeth 5. The raised grains further increase the area of the heat dissipation teeth 5, so that the heat dissipation area of the heat dissipation body is increased, and the heat dissipation effect is further enhanced.
The heat conduction layer comprises a heat conduction bottom plate 6, the heat conduction bottom plate 6 is installed on the surface of the heat dissipation plate 4, a plurality of heat conduction grooves 7 are evenly formed in the heat conduction bottom plate 6, and heat conduction pipes 8 are embedded in the heat conduction grooves 7. The effect of quick heat conduction is played on the one hand to heat pipe 8, and many heat pipes 8 evenly set up for the temperature on heat dissipation plate 4 surface is even, and the radiating effect is even, prevents that local high temperature's the condition from appearing in the heat-conducting layer, causes the functional module 9 of installing on the heat-conducting layer to become invalid, influences high power amplifier's stability.
The heat conduction pipe 8 is a heat conduction copper pipe. The heat conductivity coefficient of the heat conduction copper pipe is 3000-10000W/(m.K), which is 20-50 times of that of the common aluminum profile, and the heat conduction efficiency can be effectively improved.
The heat conductive layer is provided integrally with the heat dissipation plate 4. Specifically, the heat conducting bottom plate 6 and the heat dissipation plate 4 can be the same plate, so that the size of the heat dissipation device can be further reduced, and the heat conducting of the heat conducting pipe 8 on the heat dissipation plate 4 is facilitated.
The heat conduction layer is a soaking plate. The inner wall of the soaking plate is provided with a vacuum cavity with a fine structure, and the soaking plate is made of copper, so that the heat conducting effect on the heat dissipation plate 4 can be achieved, and the surface temperature of the heat dissipation plate 4 can be balanced.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The heat dissipation device applied to the high-power amplifier is characterized by comprising a heat dissipation body, a heat conduction layer, an air guide cover (1) and a fan (2), wherein the heat conduction layer is installed on the surface of the heat dissipation body, and the air guide cover (1) is installed at one end of the heat dissipation body; the heat dissipation body is formed by combining a plurality of sectional material heat dissipation teeth, the air guide cover (1) is provided with a plurality of fan mounting openings (3), and the fan (2) is mounted in the air guide cover (1) through the fan mounting openings (3).
2. The heat sink applied to high power amplifier as recited in claim 1, wherein the profile heat dissipation teeth comprise a heat dissipation plate (4) and heat dissipation teeth (5), the heat dissipation teeth (5) are disposed on the heat dissipation plate (4), and the heat dissipation teeth (5) of the plurality of profile heat dissipation teeth are oppositely disposed.
3. The heat sink applied to high power amplifier according to claim 2, wherein the heat sink teeth (5) are provided with raised grains on both sides.
4. The heat dissipation device applied to the high power amplifier according to claim 2, wherein the heat conduction layer comprises a heat conduction bottom plate (6), the heat conduction bottom plate (6) is mounted on the surface of the heat dissipation plate (4), a plurality of heat conduction grooves (7) are uniformly formed in the heat conduction bottom plate (6), and heat conduction pipes (8) are embedded in the heat conduction grooves (7).
5. The heat sink applied to high power amplifier as recited in claim 4, wherein the heat conducting pipe (8) is a copper pipe.
6. The heat sink applied to a high power amplifier according to claim 2, wherein the heat conducting layer is integrally provided with the heat dissipating plate (4).
7. The heat sink applied to a high power amplifier according to claim 1, wherein the heat conducting layer is a heat spreader.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121887879.8U CN215582442U (en) | 2021-08-12 | 2021-08-12 | Heat radiator applied to high-power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121887879.8U CN215582442U (en) | 2021-08-12 | 2021-08-12 | Heat radiator applied to high-power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215582442U true CN215582442U (en) | 2022-01-18 |
Family
ID=79835168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121887879.8U Active CN215582442U (en) | 2021-08-12 | 2021-08-12 | Heat radiator applied to high-power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215582442U (en) |
-
2021
- 2021-08-12 CN CN202121887879.8U patent/CN215582442U/en active Active
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