CN113593616A - Heat dissipation device for memory - Google Patents
Heat dissipation device for memory Download PDFInfo
- Publication number
- CN113593616A CN113593616A CN202110639118.9A CN202110639118A CN113593616A CN 113593616 A CN113593616 A CN 113593616A CN 202110639118 A CN202110639118 A CN 202110639118A CN 113593616 A CN113593616 A CN 113593616A
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- CN
- China
- Prior art keywords
- heat dissipation
- water
- storage box
- memory
- storage
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 70
- 230000015654 memory Effects 0.000 title claims abstract description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 91
- 238000003860 storage Methods 0.000 claims abstract description 60
- 238000005192 partition Methods 0.000 claims abstract description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 7
- 239000000498 cooling water Substances 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 abstract description 26
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1413—Reducing the influence of the temperature by fluid cooling
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1413—Reducing the influence of the temperature by fluid cooling
- G11B33/142—Reducing the influence of the temperature by fluid cooling by air cooling
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation device for a memory, which comprises a storage box, wherein a partition plate is arranged in the middle of the storage box, the storage box is divided into a heat dissipation cabin and a water storage cabin through the partition plate, a drain pipe is arranged on the right side of a water tank, a water inlet pipe is arranged on the left side of the water tank, a water pump is arranged in the middle of the water inlet pipe, a plurality of groups of heat dissipation blocks are fixedly arranged in the heat dissipation cabin at equal intervals, a plurality of groups of memories are fixedly arranged in the middle of the heat dissipation blocks, and heat dissipation water pipes are arranged in the middle of the heat dissipation blocks. According to the invention, heat generated by the storage is taken away by the aluminum alloy through water flow in the heat dissipation water pipe, and then is dissipated through the gap in the heat dissipation fin, the heat dissipation capacity of the storage is further improved by integrating the upper water cooling device, the air cooling mode, the water cooling mode and the combination of air cooling and water cooling are controlled on the device according to the heat dissipation requirement, and the corresponding selection is selected according to the requirement on the cooling capacity of the storage, so that the heat dissipation is ensured, and the energy-saving and environment-friendly effects are achieved.
Description
Technical Field
The invention relates to the field of heat dissipation of memories, in particular to a heat dissipation device for a memory.
Background
The memory cell is actually one type of sequential logic circuit. The functions of the memory can be divided into a Read Only Memory (ROM) and a Random Access Memory (RAM) according to the use types of the memory, and the functions of the memory are greatly different, so that the description is different. The memory is generally installed in the storage box in a concentrated manner, the memory can generate heat in the operation process, the service life of the memory can be shortened due to long-time high temperature, and the memory needs to be cooled.
However, the existing air-out heat dissipation device simply dissipates heat by a fan, cannot dissipate heat between memories, and is low in heat dissipation efficiency, and therefore, a heat dissipation device for memories is provided to solve the problems.
Disclosure of Invention
The present invention is directed to a heat sink for a memory, which can effectively solve the problems of the related art.
In order to achieve the purpose, the invention adopts the technical scheme that:
a heat sink for a memory, comprising: the storage box, the middle part is provided with the baffle in the storage box, cuts apart into heat dissipation cabin and water storage tank through the baffle with the storage box, be provided with the water tank in the water storage tank, the water tank right side is provided with the drain pipe, the water tank left side is provided with the inlet tube, the inlet tube middle part is provided with the water pump, provides pressure to the rivers of inlet tube through the water pump, for the circulation flow of cooling water provides water pressure, equidistance fixed mounting has a plurality of groups radiating block in the heat dissipation tank, radiating block middle part fixed mounting has a plurality of groups of storages, the radiating block middle part is provided with the heat dissipation water pipe, and drain pipe and the inlet tube through both sides communicate the heat dissipation water pipe, and rivers realize cooling down to the storage of radiating block internal fixation through the heat dissipation water pipe, take away the heat that the storage produced through rivers, dispel the heat.
Preferably, the radiating block outside is provided with a plurality of groups of fin, the fin adopts the aluminum alloy sheet metal, takes away some through the rivers in the heat dissipation water pipe with the heat that the memory produced through the aluminum alloy, and the gap in the rethread fin dispels the heat, synthesizes the heat-sinking capability that the top water cooling plant further promoted to the memory.
Preferably, the left side of the storage box is provided with a switch, the water pump and the air pump are controlled through the switch, the air cooling mode, the water cooling mode and the air cooling and water cooling combination are controlled on the device according to the heat dissipation requirement, the corresponding selection is selected according to the requirement on the cooling capacity of the storage, and better energy conservation can be realized while the heat dissipation is ensured.
Preferably, the air pump is arranged below the left side of the storage box, the air pipe is arranged above the air pump, the air inlet block is arranged below the heat dissipation cabin of the storage box, the left side of the air inlet block is communicated with the air pipe, the upper surface of the air inlet block is provided with an air inlet, and external air is pumped into the air outlet through the surface of the air inlet block through the air pump.
Preferably, an air inlet frame is arranged above the top of the storage box and used for filtering air entering the storage box, and dust is prevented from entering the storage box and being attached to the surface of the heat dissipation block and the surface of the storage to influence subsequent heat dissipation.
Preferably, the storage box is a stainless steel structure frame and is used for protecting internal storage equipment.
Compared with the prior art, the invention has the following beneficial effects:
1. the drain pipe and the inlet tube through both sides communicate the heat dissipation water pipe, and rivers realize cooling off the memory of heat dissipation block internal fixation through the heat dissipation water pipe, take away the heat that the memory produced through rivers, dispel the heat, there is the switch in storage box left side, controls the water pump through the switch, realizes the water-cooled control to the memory, and this structure passes through water tank, drain pipe, inlet tube and water pump realization to the used circulation of cooling water, and is energy-concerving and environment-protective.
2. The heat that produces the memory through the aluminum alloy takes away partly through the rivers in the heat dissipation water pipe, and the gap in the rethread fin dispels the heat, synthesizes top water cooling plant and further promotes the heat-sinking capability to the memory, there is the switch in the storage box left side, controls water pump and air pump through the switch, comes to carry out the control of forced air cooling mode, water-cooling mode and air cooling and water-cooling combination to the device according to radiating requirement, selects to correspond the selection according to the demand to the memory cooling capacity, when guaranteeing the heat dissipation, more energy-concerving and environment-protective.
Drawings
Fig. 1 is an overall structural view of a heat dissipation device for a memory according to embodiment 1 of the present invention;
fig. 2 is a structural diagram of a heat dissipation device for a memory according to embodiment 2 of the present invention;
fig. 3 is a structural diagram of a heat dissipation block in a heat dissipation device for a memory according to embodiment 2 of the present invention.
In the figure: 1. a storage box; 2. a water tank; 3. a drain pipe; 4. a water inlet pipe; 5. a water pump; 6. a heat dissipating block; 7. a heat dissipation water pipe; 8. a memory; 9. a switch; 10. an air intake frame; 11. an air pump; 12. an air tube; 13. an air inlet block; 14. and a heat sink.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "bottom" and "top," "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Example 1
Referring to fig. 1, a heat sink for a memory includes: the storage box 1 is a stainless steel structure frame and used for protecting internal storage equipment, a partition plate is arranged in the middle of the storage box 1, the storage box 1 is divided into a heat dissipation cabin and a water storage cabin through the partition plate, a water tank 2 is arranged in the water storage cabin, a drain pipe 3 is arranged on the right side of the water tank 2, a water inlet pipe 4 is arranged on the left side of the water tank 2, a water pump 5 is arranged in the middle of the water inlet pipe 4, pressure is provided for water flow of the water inlet pipe 4 through the water pump 5, water pressure is provided for circulating flow of cooling water, a plurality of groups of heat dissipation blocks 6 are fixedly arranged in the heat dissipation cabin at equal intervals, a plurality of groups of memories 8 are fixedly arranged in the middle of the heat dissipation blocks 6, a heat dissipation water pipe 7 is arranged in the middle of each heat dissipation block 6, the heat dissipation water pipes 7 are communicated through the drain pipes 3 and the water inlet pipes 4 on two sides, and the water flow cools the memories 8 fixed in the heat dissipation blocks 6 through the heat dissipation water pipes 7, take away the heat that 8 storers produced through rivers, dispel the heat, there is switch 9 on the left of the storage box 1, controls water pump 5 through switch 9, realizes the control to the 8 water-cooled of storers, and this structure passes through water tank 2, drain pipe 3, inlet tube 4 and water pump 5 and realizes energy-concerving and environment-protective to the recycling of cooling water.
Example 2
Referring to fig. 2, a heat sink for a memory includes: the storage box 1 is a stainless steel structure frame and used for protecting internal storage equipment, a partition plate is arranged in the middle of the storage box 1, the storage box 1 is divided into a heat dissipation cabin and a water storage cabin through the partition plate, a water tank 2 is arranged in the water storage cabin, a drain pipe 3 is arranged on the right side of the water tank 2, a water inlet pipe 4 is arranged on the left side of the water tank 2, a water pump 5 is arranged in the middle of the water inlet pipe 4, pressure is provided for water flow of the water inlet pipe 4 through the water pump 5, water pressure is provided for circulating flow of cooling water, a plurality of groups of heat dissipation blocks 6 are fixedly arranged in the heat dissipation cabin at equal intervals, a plurality of groups of memories 8 are fixedly arranged in the middle of the heat dissipation blocks 6, a heat dissipation water pipe 7 is arranged in the middle of each heat dissipation block 6, the heat dissipation water pipes 7 are communicated through the drain pipes 3 and the water inlet pipes 4 on two sides, and the water flow cools the memories 8 fixed in the heat dissipation blocks 6 through the heat dissipation water pipes 7, the heat generated by the memory 8 is taken away by the water flow to dissipate the heat,
an air pump 11 is arranged below the left side of the storage box 1, an air pipe 12 is arranged above the air pump 11, an air inlet block 13 is arranged below a heat dissipation cabin of the storage box 1, the left side of the air inlet block 13 is communicated with the air pipe 12, an air inlet is arranged on the upper surface of the air inlet block 13, external air is pumped into an air outlet passing through the surface of the air inlet block 13 through the air pump 11, an air inlet frame 10 is arranged above the top of the storage box 1 and used for filtering air entering the storage box 1, and dust is prevented from entering the storage box 1 and attaching to the surfaces of the heat dissipation block 6 and the storage 8 to influence subsequent heat dissipation,
synthesize fig. 3 and show, the radiating block 6 outside is provided with a plurality of groups of fin 14, fin 14 adopts the aluminum alloy sheet metal, and the heat that produces memory 8 through the aluminum alloy takes away some through the rivers in the heat dissipation water pipe 7, and the gap in the rethread fin 14 dispels the heat, synthesizes top water cooling plant and further promotes the heat-sinking capability to the memory, there is switch 9 storage box 1 left side, controls water pump 5 and air pump 11 through switch 9, comes to carry out the control of forced air cooling mode, water-cooling mode and air-cooling and water-cooling combination to the device according to radiating requirement, selects to correspond the selection according to the demand to memory 8 cooling capacity, can also carry out better energy-conservation when guaranteeing the heat dissipation.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A heat sink for memory, comprising a storage box (1), characterized in that: the improved water-cooling water tank is characterized in that a partition plate is arranged in the middle of the storage box (1), the storage box (1) is divided into a heat dissipation cabin and a water storage cabin through the partition plate, a water tank (2) is arranged in the water storage cabin, a drain pipe (3) is arranged on the right side of the water tank (2), a water inlet pipe (4) is arranged on the left side of the water tank (2), a water pump (5) is arranged in the middle of the water inlet pipe (4), a plurality of groups of heat dissipation blocks (6) are fixedly arranged in the heat dissipation cabin at equal intervals, a plurality of groups of storage devices (8) are fixedly arranged in the middle of the heat dissipation blocks (6), and heat dissipation water pipes (7) are arranged in the middle of the heat dissipation blocks (6).
2. The heat sink for memory as claimed in claim 1, wherein: a plurality of groups of radiating fins (14) are arranged on the outer side of the radiating block (6), and the radiating fins (14) are made of aluminum alloy sheets.
3. The heat sink for memory as claimed in claim 2, wherein: the air pump (11) is arranged below the left side of the storage box (1), an air pipe (12) is arranged above the air pump (11), an air inlet block (13) is arranged below a heat dissipation cabin of the storage box (1), the left side of the air inlet block (13) is communicated with the air pipe (12), and an air inlet is formed in the upper surface of the air inlet block (13).
4. The heat sink for memory as set forth in claim 3, wherein: a switch (9) is arranged on the left side of the storage box (1), and the water pump (5) and the air pump (11) are controlled through the switch (9).
5. The heat sink for memory as set forth in claim 4, wherein: an air inlet frame (10) is arranged above the top of the storage box (1).
6. The heat sink for memory as claimed in claim 1, wherein: the storage box (1) is a stainless steel structure frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110639118.9A CN113593616A (en) | 2021-06-08 | 2021-06-08 | Heat dissipation device for memory |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110639118.9A CN113593616A (en) | 2021-06-08 | 2021-06-08 | Heat dissipation device for memory |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113593616A true CN113593616A (en) | 2021-11-02 |
Family
ID=78243565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110639118.9A Pending CN113593616A (en) | 2021-06-08 | 2021-06-08 | Heat dissipation device for memory |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113593616A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115138872A (en) * | 2022-06-30 | 2022-10-04 | 安徽省春谷3D打印智能装备产业技术研究院有限公司 | Laser 3D prints and uses platform stabilising arrangement |
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| CN208338178U (en) * | 2018-06-28 | 2019-01-04 | 济南汇智电力科技有限公司 | A kind of radiator of new-energy automobile charging module |
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| CN211828129U (en) * | 2020-02-28 | 2020-10-30 | 兰州学博电子新技术有限责任公司 | A network storage device for security monitoring |
| CN212690274U (en) * | 2020-07-28 | 2021-03-12 | 杜伟 | Double-effect cooling device of compressor of natural gas long-distance pipeline gas station |
| CN112512276A (en) * | 2020-12-10 | 2021-03-16 | 苏州蓝讯电气设备有限公司 | Dustproof computer network equipment box of high-efficient heat dissipation |
-
2021
- 2021-06-08 CN CN202110639118.9A patent/CN113593616A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001153490A (en) * | 1999-11-30 | 2001-06-08 | Hitachi Constr Mach Co Ltd | Radiator equipment for construction machinery |
| WO2016124077A1 (en) * | 2015-02-03 | 2016-08-11 | 徐思 | Water-cooled radiating case |
| CN107196207A (en) * | 2017-07-28 | 2017-09-22 | 江苏新汇源电气科技有限公司 | A kind of temperature control device of AC low voltage power switch box |
| CN207185063U (en) * | 2017-08-28 | 2018-04-03 | 云南邦纳科技有限公司 | A kind of cold electronic heat sink of charging pile liquid |
| CN208338178U (en) * | 2018-06-28 | 2019-01-04 | 济南汇智电力科技有限公司 | A kind of radiator of new-energy automobile charging module |
| CN109375720A (en) * | 2018-10-26 | 2019-02-22 | 天津海壹网络科技有限公司 | Computer heat dissipation tank |
| CN210900152U (en) * | 2019-11-13 | 2020-06-30 | 河北海贝斯科技有限公司 | Industrial automation control heat abstractor |
| CN211828129U (en) * | 2020-02-28 | 2020-10-30 | 兰州学博电子新技术有限责任公司 | A network storage device for security monitoring |
| CN212690274U (en) * | 2020-07-28 | 2021-03-12 | 杜伟 | Double-effect cooling device of compressor of natural gas long-distance pipeline gas station |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115138872A (en) * | 2022-06-30 | 2022-10-04 | 安徽省春谷3D打印智能装备产业技术研究院有限公司 | Laser 3D prints and uses platform stabilising arrangement |
| CN115138872B (en) * | 2022-06-30 | 2024-01-26 | 安徽省春谷3D打印智能装备产业技术研究院有限公司 | A platform stabilizing device for laser 3D printing |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211102 |
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| RJ01 | Rejection of invention patent application after publication |