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CN215340496U - Optical element drive mechanism - Google Patents

Optical element drive mechanism Download PDF

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Publication number
CN215340496U
CN215340496U CN202120622538.1U CN202120622538U CN215340496U CN 215340496 U CN215340496 U CN 215340496U CN 202120622538 U CN202120622538 U CN 202120622538U CN 215340496 U CN215340496 U CN 215340496U
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bonding surface
bonding
driving mechanism
modulus
main axis
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林湘琴
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TDK Taiwan Corp
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TDK Taiwan Corp
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Abstract

本实用新型提供一种光学元件驱动机构,包括一活动部和一第一接着元件。活动部包括一第一元件和一第二元件,其中第一元件经由第一接着元件连接第二元件。

Figure 202120622538

The utility model provides an optical element driving mechanism, which comprises a movable part and a first connecting element. The movable part includes a first element and a second element, wherein the first element is connected to the second element via the first connecting element.

Figure 202120622538

Description

Optical element driving mechanism
Technical Field
The present invention relates to an optical element driving mechanism. More particularly, the present invention relates to an optical element driving mechanism that drives an optical element to move.
Background
With the development of technology, many electronic devices (such as tablet computers or smart phones) are equipped with a lens module to have a function of taking pictures or recording videos. The use of these electronic devices is becoming more common and the design direction of these electronic devices is being developed to be more convenient and thinner to provide more choices for users.
However, when the lens module is assembled, a gap may be formed due to assembly errors or tolerance, so that foreign objects may intrude, thereby causing abrasion of the lens or other internal components, and possibly causing the lens driving module to be unusable. Therefore, how to solve the above problems becomes an important issue.
SUMMERY OF THE UTILITY MODEL
In order to solve the above-mentioned conventional problems, the present invention provides an optical element driving mechanism, which includes a movable portion and a first engaging element. The movable part comprises a first element and a second element, wherein the first element is connected with the second element through a first connecting element.
In some embodiments of the present invention, the first element includes a bonding reinforcement structure for improving bonding strength between the first element and the second element, and the bonding reinforcement structure includes a first bonding surface, a first receiving space, a second bonding surface, a third bonding surface, a first protrusion structure, a fourth bonding surface, a fifth bonding surface, a second receiving space, a sixth bonding surface, a seventh bonding surface, a second protrusion structure, an eighth bonding surface, and a ninth bonding surface. The first bonding surface directly contacts the first bonding element, wherein the first bonding surface is perpendicular to a main axis. The first accommodating space is formed on the first bonding surface and is provided with a concave structure recessed from the first bonding surface. The second adhering surface is located in the first containing space and is adjacent to the first adhering surface, wherein the first adhering surface and the second adhering surface are not parallel, and the second adhering surface and the main shaft are not parallel. The third adhering surface is located in the first containing space and is adjacent to the second adhering surface, wherein the second adhering surface and the third adhering surface are not parallel, and the first adhering surface is parallel to the third adhering surface. The first protrusion structure protrudes from the third adhesion surface, wherein the first accommodation space surrounds the first protrusion structure when viewed in the main axis direction. A fourth bonding surface is on the first protrusion structure and adjacent to the third bonding surface, wherein the third bonding surface and the fourth bonding surface are not parallel, and the fourth bonding surface and the major axis are not parallel. The fifth bonding surface is located on the first protrusion structure and adjacent to the fourth bonding surface, wherein the fourth bonding surface and the fifth bonding surface are not parallel, and the third bonding surface is parallel to the fifth bonding surface. The second accommodating space is formed on the fifth bonding surface and is provided with a concave structure which is recessed from the fifth bonding surface. The sixth adhering surface is located in the second containing space and is adjacent to the fifth adhering surface, wherein the fifth adhering surface and the sixth adhering surface are not parallel, and the sixth adhering surface and the main shaft are not parallel. The seventh adhering surface is located in the second accommodating space and is adjacent to the sixth adhering surface, wherein the sixth adhering surface and the seventh adhering surface are not parallel, and the fifth adhering surface is parallel to the seventh adhering surface. The second projection structure is projected from the seventh abutment surface, wherein the second accommodation space surrounds the second projection structure as viewed in the main axis direction. The eighth bonding surface is on the second protrusion structure and adjacent to the seventh bonding surface, wherein the seventh bonding surface and the eighth bonding surface are not parallel, and the eighth bonding surface and the major axis are not parallel. The ninth bonding surface is located on the second protrusion structure and adjacent to the eighth bonding surface, wherein the eighth bonding surface and the ninth bonding surface are not parallel, and the fifth bonding surface is parallel to the ninth bonding surface. The second bonding surface, the third bonding surface, and the fourth bonding surface form a U-shaped structure when viewed in a direction perpendicular to the major axis. The sixth bonding surface, the seventh bonding surface, and the eighth bonding surface form a U-shaped structure when viewed in a direction perpendicular to the major axis. An angle between the second attaching surface and the third attaching surface is different from an angle between the sixth attaching surface and the seventh attaching surface. The angle between the second adhesion surface and the third adhesion surface is smaller than the angle between the sixth adhesion surface and the seventh adhesion surface. The angle between the third and fourth bonding surfaces is different from the angle between the seventh and eighth bonding surfaces. The angle between the third and fourth bonding surfaces is smaller than the angle between the seventh and eighth bonding surfaces. The shortest distance between the second adhesion surface and the fourth adhesion surface is different from the shortest distance between the sixth adhesion surface and the eighth adhesion surface when viewed in a direction perpendicular to the major axis. The shortest distance between the second adhesion surface and the fourth adhesion surface is larger than the shortest distance between the sixth adhesion surface and the eighth adhesion surface when viewed in a direction perpendicular to the major axis. The first attachment surface and the fifth attachment surface are not coplanar. The fifth attachment surface and the ninth attachment surface are not coplanar. The first attachment surface and the fifth attachment surface are not coplanar. The first and fifth landing surfaces face in the same direction. The fifth following surface and the ninth following surface face in the same direction. The ninth adhesion surface is located between the first adhesion surface and the fifth adhesion surface in the direction of the principal axis when viewed in the direction perpendicular to the principal axis. The first bonding element directly contacts the first bonding surface, the second bonding surface, the third bonding surface, the fourth bonding surface, the fifth bonding surface, the sixth bonding surface, the seventh bonding surface, the eighth bonding surface, and the ninth bonding surface.
In some embodiments of the present invention, the first element further includes a connection portion, and the first element is connected to the second element via the connection portion. The connecting part comprises a protruding section, and the protruding section protrudes from the first attachment surface. The second element is provided with a plate-shaped structure, and the plate-shaped structure is perpendicular to the main shaft. The second element comprises an opening corresponding to the connecting part. The connecting part comprises a positioning section for limiting the position of the second element on the main shaft relative to the first element. The protruding section is located between the positioning section and the first abutment surface as viewed in a direction perpendicular to the main axis. The maximum dimension of the positioning section is larger than the maximum dimension of the protruding section in a direction perpendicular to the main axis when viewed in the direction of the main axis. The positioning section and the protruding section are integrally formed. The positioning section and the protruding section are made of the same material. The positioning section and the protruding section are not connected by glue.
In some embodiments of the present invention, the optical element driving mechanism further includes a reinforcing attachment element directly contacting the positioning section. The reinforcing bonding element and the positioning section are made of different materials. The connecting portion contacts the reinforcing member. The first bonding element and the reinforcing bonding element are integrally formed. The first bonding element and the reinforcing bonding element are made of the same material. The first following element directly contacts the positioning section.
In some embodiments of the present invention, the movable portion is used to connect an optical element. The first element is a bearing seat for connecting the optical element. The second element is a first elastic element. The movable part also comprises a frame, and the bearing seat is movably connected with the frame through a first elastic element. The optical element driving mechanism further comprises a first driving component for driving the bearing seat to move relative to the frame. The optical element driving mechanism further comprises a second bonding element, and the first elastic element is connected with the frame through the second bonding element. The cured Young's modulus of the second adhesive element is the same as that of the first adhesive element. The first elastic element has a plate-like structure. The first elastic element is perpendicular to the main shaft. The first elastic element is made of metal material.
In some embodiments of the present invention, the movable portion further includes a second elastic element, and the supporting base is movably connected to the frame through the second elastic element. The optical element driving mechanism further comprises a third connecting element, and the second elastic element is connected with the bearing seat through the third connecting element. The cured Young's modulus of the third bonding element is the same as that of the second bonding element. The optical element driving mechanism further comprises a fourth connecting element, and the second elastic element is connected with the frame through the fourth connecting element. The cured Young's modulus of the fourth bonding element is the same as that of the third bonding element. The fourth following element directly contacts the first driving component. The first driving assembly comprises a magnetic element, and the fourth follow-up element directly contacts the magnetic element.
In some embodiments of the present invention, the optical element driving mechanism further includes a fifth connecting element electrically connected to the first driving assembly. The fifth bonding element comprises a conductive section and a bonding section after being cured. The following section is made of resin material. The conductive section is made of metal. The resistivity of the segments is then greater than the resistivity of the conductive segments. The conductivity of the conductive section is different from that of the first bonding element after being cured. The conductivity of the conductive section is greater than the conductivity of the first bonding element after curing. The young's modulus of the following section is different from the young's modulus of the first following element after curing. The young's modulus of the adhesive section is greater than the young's modulus of the first adhesive element after curing. The bearing seat is fixedly connected with the first elastic element through the fifth connecting element. The first driving assembly comprises a driving coil, and the first elastic element is electrically connected with the driving coil through the fifth connecting element.
In some embodiments of the present invention, the optical element driving mechanism further includes a fixing portion, a second driving assembly, a third elastic element, a sixth bonding element, a first gap, a seventh bonding element, and a second gap. The movable part can move relative to the fixed part. The fixing part comprises an outer frame and a base. The outer frame comprises a top wall and a side wall, the top wall is of a plate-shaped structure and is perpendicular to the main shaft, the side wall is of a plate-shaped structure and extends from the edge of the top wall, and the side wall is not perpendicular to the main shaft. The base is connected with the outer frame. The second driving component is used for driving the movable part to move relative to the fixed part. The movable part is movably connected with the fixed part through a third elastic element, wherein the third elastic element has a strip-shaped structure and extends along the direction vertical to the first elastic element. The outer frame is fixedly connected with the base through a sixth connecting element. The first gap is formed between the outer frame and the base to accommodate the sixth bonding element. The outer frame is fixedly connected with the base through a seventh connecting element. The second gap is formed between the outer frame and the base to accommodate the seventh bonding element. The first gap surrounds the base when viewed in the direction of the major axis. The first gap surrounds the base continuously and uninterruptedly as viewed in the direction of the main axis. The cured Young's modulus of the seventh bonding element is different from that of the sixth bonding element. The cured Young's modulus of the seventh bonding element is smaller than that of the sixth bonding element. The shortest distance between the outer frame and the base in the first gap is different from the shortest distance between the outer frame and the base in the second gap. The shortest distance between the outer frame and the base in the first gap is smaller than the shortest distance between the outer frame and the base in the second gap. The first gap is connected with the second gap. The first element and the second element form an accommodating space for accommodating the movable part. The shortest distance between the first gap and the accommodating space is different from the shortest distance between the second gap and the accommodating space. The shortest distance between the first gap and the accommodating space is smaller than the shortest distance between the second gap and the accommodating space. The viscosity of the sixth bonding element is different from the viscosity of the seventh bonding element. The viscosity of the sixth adhesion element is lower than that of the seventh adhesion element when the sixth adhesion element is not cured.
In some embodiments of the present invention, the third elastic element passes through the base. The optical element driving mechanism further comprises an eighth following element which directly contacts the third elastic element. The eighth following element and the seventh following element are integrally formed. The cured Young's modulus of the eighth subsequent member is the same as that of the seventh subsequent member. At least part of the third elastic element is arranged in the second gap.
In some embodiments of the present invention, the optical element driving mechanism further includes a position sensing device, a ninth following element, and a tenth following element. The position sensing assembly is used for sensing the movement of the movable part or the bearing seat relative to the fixed part. The ninth adhesive element directly contacts an electrical contact, wherein the second driving element is electrically connected to a circuit element through the electrical contact, and the cured Young's modulus of the ninth adhesive element is the same as that of the seventh adhesive element. The tenth bonding element directly contacts the position sensing assembly, wherein the cured Young's modulus of the tenth bonding element is the same as the cured Young's modulus of the seventh bonding element. When viewed from the outside of the optical element driving mechanism, at least a portion of the seventh following element, at least a portion of the eighth following element, at least a portion of the ninth following element, and at least a portion of the tenth following element are exposed from the base. The seventh bonding device, the eighth bonding device, the ninth bonding device, and the tenth bonding device are cured by irradiation.
Drawings
Fig. 1 is a schematic diagram of an electronic device according to an embodiment of the utility model.
Fig. 2 is a schematic diagram of an optical element driving mechanism according to an embodiment of the present invention.
Fig. 3 shows an exploded view of an optical element driving mechanism according to an embodiment of the present invention.
Fig. 4 shows a cross-sectional view in the direction 13-a-13-a in fig. 2.
FIG. 5 is a schematic diagram of a bonding reinforcement structure according to an embodiment of the utility model.
Fig. 6 is a schematic diagram of a winding portion, a driving coil, a first elastic element and a fifth adhesion element according to an embodiment of the utility model.
Fig. 7 is a cross-sectional view of the winding portion, the driving coil, the first elastic element, and the fifth adhesion element according to the embodiment of the present invention.
Fig. 8 shows a cross-sectional view along the direction 13-B-13-B in fig. 2.
Fig. 9 shows a bottom view of the optical element driving mechanism according to the embodiment of the present invention.
Fig. 10 shows a partial schematic view of an optical element driving mechanism in another embodiment of the present invention.
The reference numerals are explained below:
13-10 optical element driving mechanism
13-20 electronic device
13-30 optical element
13-100 parts of movable part
13-110 bearing seat
13-111 bonding reinforcement structure
13-112 connecting part
13-112A, a convex section
13-112B positioning section
13-113 winding part
13-120 first elastic element
13-121, connecting segment
13-122 connecting segment
13-123 string segment
13-124 opening
13-130 second elastic element
13-131 connecting segment
13-132 connecting segment
13-133 string section
13-140 frame
13-200 first drive assembly
13-210 drive coil
13-220 magnetic element
13-300 fixed part
13-310 outer frame
13-311 top wall
13-312 side wall
13-320 of base
13-321 surface
13-322 surface
13-400 of lifting ring wire
13-500 second drive assembly
13-510 circuit board
13-600 position sensing assembly
13-AX1 main shaft
13-G1 first gap
13-G2 second gap
13-P1 first attachment element
13-P2 second coupling element
13-P3 third coupling element
13-P4 fourth coupling element
13-P5 fifth coupling element
13-P51 conductive region
13-P52 following region
13-P6 sixth engaging element
13-P7 seventh coupling element
13-P8 eighth coupling element
13-P9 ninth engaging element
13-P10 tenth coupling element
13-P11 Reinforcement attachment element
13-R accommodating space
13-R1 first accommodation space
13-R2 second accommodation space
13-S1 first attachment surface
13-S2 second adhesion surface
13-S3 third attachment surface
13-S4 fourth attachment surface
13-S5 fifth adhesion surface
13-S6 sixth adhesion surface
13-S7 seventh attachment surface
13-S8 eighth adhesion surface
13-S9 ninth adhesion surface
13-T1 first projection Structure
13-T2 second projection Structure
13-W circuit assembly
13-W1 electric contact
Detailed Description
The optical element driving mechanism of the present invention is explained below. It should be readily appreciated, however, that the present invention provides many suitable authoring concepts that can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of specific ways to make and use the utility model, and do not delimit the scope of the utility model.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Referring to fig. 1, an optical element driving mechanism 13-10 according to an embodiment of the present invention can be installed in an electronic device 13-20 to carry and drive an optical element 13-30, so that the optical element 13-30 can move relative to a photosensitive element (not shown) in the electronic device 13-20, thereby achieving the purpose of focusing and/or zooming. The electronic device 13-20 may be a smart phone, a tablet computer, or a digital camera, and the optical element 13-30 may be a lens.
Fig. 2 and 3 show a schematic view and an exploded view of the aforementioned optical element driving mechanism 13-10, and fig. 4 shows a sectional view in the direction 13-a-13-a in fig. 2. As shown in fig. 2 to 4, the optical element driving mechanism 13-10 mainly includes a movable portion 13-100, a first driving component 13-200, a fixed portion 13-300, a plurality of suspension loop wires 13-400, a second driving component 13-500, and at least one position sensing component 13-600.
The movable portion 13-100 may include a supporting base 13-110, a first elastic element 13-120, a second elastic element 13-130, and a frame 13-140. In the present embodiment, the carrier 13-110 can be referred to as a first element, and the first elastic element 13-120 can be referred to as a second element.
The optical element 13-30 can be fixed on the carrier 13-110, and the carrier 13-110 can be disposed between the first elastic element 13-120 and the second elastic element 13-130, and movably connected to the frame 13-140 by the first elastic element 13-120 and the second elastic element 13-130.
The first elastic element 13-120 may be, for example, a metal reed having a plate-like structure, which may be perpendicular to the main axis 13-AX1 of the optical element driving mechanism 13-10 and may be divided into at least one connecting section 13-121, at least one connecting section 13-122, and at least one string section 13-123. The connecting segments 13-121 can be secured to the carrier platform 13-110 by a first attachment element 13-P1, the connecting segments 13-122 can be secured to the frame 13-140 by a second attachment element 13-P2, and the string segments 13-123 connect the two between the connecting segments 13-121 and 13-122.
Specifically, as shown in fig. 4 and 5, in the present embodiment, the supporting base 13-110 may have an adhesion reinforcing structure 13-111, and the first adhesion element 13-P1 is adhered to the connecting section 13-121 of the first elastic element 13-120 and the adhesion reinforcing structure 13-111 to connect the first elastic element 13-120 and the supporting base 13-110. In detail, the bonding reinforcement structures 13-111 include a first bonding surface 13-S1, a second bonding surface 13-S2, a third bonding surface 13-S3, a fourth bonding surface 13-S4, a fifth bonding surface 13-S5, a sixth bonding surface 13-S6, a seventh bonding surface 13-S7, an eighth bonding surface 13-S8, a ninth bonding surface 13-S9, a first receiving space 13-R1, a second receiving space 13-R2, a first protrusion structure 13-T1, and a second protrusion structure 13-T2.
The first attachment surface 13-S1 is the top surface of the carrier 13-110 that is generally perpendicular to the major axis 13-AX1 of the optical element drive mechanism 13-10. The first receiving space 13-R1 is formed on the first bonding surface 13-S1 and has a concave structure recessed by the first bonding surface 13-S1.
The second attaching surface 13-S2 and the third attaching surface 13-S3 are located in the first receiving space 13-R1, and the second attaching surface 13-S2 constitutes a side surface of the concave structure of the first receiving space 13-R1, and the third attaching surface 13-S3 constitutes a bottom surface of the concave structure of the first receiving space 13-R1. In other words, the second adhesion surface 13-S2 abuts the first adhesion surface 13-S1, and the third adhesion surface 13-S3 abuts the second adhesion surface 13-S2. In the present embodiment, the first bonding surface 13-S1 is parallel to the third bonding surface 13-S3, and the second bonding surface 13-S2 is not parallel to the third bonding surface 13-S3 and the main axis 13-AX 1.
The first projection structure 13-T1 projects from the third abutment surface 13-S3, and the first accommodation space 13-R1 surrounds the first projection structure 13-T1 as viewed in the direction of the main axis 13-AX 1. The fourth attachment surface 13-S4 and the fifth attachment surface 13-S5 are located on the first bump structure 13-T1, wherein the fourth attachment surface 13-S4 abuts the third attachment surface 13-S3, the fifth attachment surface 13-S5 abuts the fourth attachment surface 13-S4, and the first attachment surface 13-S1 and the fifth attachment surface 13-S5 face in the same direction. In the present embodiment, the fourth landing surface 13-S4 is not parallel to the third landing surface 13-S3, the fifth landing surface 13-S5, and the major axis 13-AX1, and the fifth landing surface 13-S5 is parallel to the third landing surface 13-S3.
The second receiving space 13-R2 is formed on the fifth bonding surface 13-S5 and has a concave structure recessed by the fifth bonding surface 13-S5. The sixth adhesion surface 13-S6 and the seventh adhesion surface 13-S7 are located in the second receiving space 13-R2, and the sixth adhesion surface 13-S6 constitutes a side surface of the concave structure of the second receiving space 13-R2, and the seventh adhesion surface 13-S7 constitutes a bottom surface of the concave structure of the second receiving space 13-R2. In other words, the sixth bonding surface 13-S6 abuts the fifth bonding surface 13-S5, and the seventh bonding surface 13-S7 abuts the sixth bonding surface 13-S6. In the present embodiment, the sixth bonding surface 13-S6 is not parallel to the fifth bonding surface 13-S5, the seventh bonding surface 13-S7 and the main axis 13-AX1, and the seventh bonding surface 13-S7 is parallel to the fifth bonding surface 13-S5.
The second projection structure 13-T2 projects from the seventh abutment surface 13-S7, and the second accommodation space 13-R2 surrounds the second projection structure 13-T2 as viewed in the direction of the main axis 13-AX 1. The eighth attaching surface 13-S8 and the ninth attaching surface 13-S9 are located on the second protrusion structure 13-T2, wherein the eighth attaching surface 13-S8 abuts the seventh attaching surface 13-S7, the ninth attaching surface 13-S9 abuts the eighth attaching surface 13-S8, and the ninth attaching surface 13-S9 and the fifth attaching surface 13-S5 face in the same direction. In the present embodiment, the eighth bonding surface 13-S8 is not parallel to the seventh bonding surface 13-S7, the ninth bonding surface 13-S9 and the main axis 13-AX1, and the ninth bonding surface 13-S9 is parallel to the fifth bonding surface 13-S5.
The second adhesion surface 13-S2, the third adhesion surface 13-S3, and the fourth adhesion surface 13-S4 may form a U-shaped structure between the first adhesion surface 13-S1 and the fifth adhesion surface 13-S5, and the sixth adhesion surface 13-S6, the seventh adhesion surface 13-S7, and the eighth adhesion surface 13-S8 may form a U-shaped structure between the fifth adhesion surface 13-S5 and the ninth adhesion surface 13-S9, when viewed in a direction perpendicular to the main axis 13-AX 1.
In this embodiment, the third attachment surface 13-S3 and the seventh attachment surface 13-S7 are coplanar. Since the heights of the first and second bump structures 13-T1 and 13-T2 are smaller than the depth of the first receiving space 13-R1 and the height of the first bump structure 13-T1 is smaller than the height of the second bump structure 13-T2, the aforementioned first adhesion surface 13-S1, fifth adhesion surface 13-S5, and ninth adhesion surface 13-S9 are not coplanar with each other. The ninth abutment surface 13-S9 is located between the first abutment surface 13-S1 and the fifth abutment surface 13-S5 in the direction of the main axis 13-AX1 as viewed in the direction perpendicular to the main axis 13-AX 1.
In addition, in the present embodiment, the width of the seventh bonding surface 13-S7 is smaller than the width of the third bonding surface 13-S3, that is, the shortest distance between the sixth bonding surface 13-S6 and the eighth bonding surface 13-S8 is smaller than the shortest distance between the second bonding surface 13-S2 and the fourth bonding surface 13-S4 when viewed in the direction perpendicular to the main axis 13-AX 1. Therefore, in order that the first actuating member 13-P1 can smoothly fill the first receiving space 13-R1 and the second receiving space 13-R2, the angle between the sixth actuating surface 13-S6 and the seventh actuating surface 13-S7 can be greater than the angle between the second actuating surface 13-S2 and the third actuating surface 13-S3, and the angle between the seventh actuating surface 13-S7 and the eighth actuating surface 13-S8 can be greater than the angle between the third actuating surface 13-S3 and the fourth actuating surface 13-S4.
With the above-mentioned structure, when a user adheres the connecting segments 13-121 of the first elastic members 13-120 and the reinforcing structures 13-111 by using the first adhesion member 13-P1, the first adhesion member 13-P1 can smoothly enter the first receiving space 13-R1 and the second receiving space 13-R2 and directly contact the first adhesion surface 13-S1, the second adhesion surface 13-S2, the third adhesion surface 13-S3, the fourth adhesion surface 13-S4, the fifth adhesion surface 13-S5, the sixth adhesion surface 13-S6, the seventh adhesion surface 13-S7, the eighth adhesion surface 13-S8 and the ninth adhesion surface 13-S9. Thus, the contact area can be greatly increased, and the adhesion strength between the supporting base 13-110 and the first elastic element 13-120 can be effectively increased.
In the present embodiment, the first engaging element 13-P1 and the second engaging element 13-P2 may comprise the same material. Thus, the cured Young's modulus of the first adhesion element 13-P1 will be substantially the same as the cured Young's modulus of the second adhesion element 13-P2. For example, the first adhesive element 13-P1 and the second adhesive element 13-P2 can be photo-curable adhesives, i.e., the first adhesive element 13-P1 and the second adhesive element 13-P2 are cured by irradiation.
Referring back to fig. 2 to 4, similar to the first elastic element 13-120, the second elastic element 13-130 may also be a metal spring with a plate-like structure, and may be perpendicular to the main axis 13-AX1 and may be divided into at least one connecting segment 13-131, at least one connecting segment 13-132, and at least one string segment 13-133. The connecting section 13-131 can be fixed to the carrier seat 13-110 by a third follower element 13-P3, the connecting section 13-132 can be fixed to the frame 13-140 by a fourth follower element 13-P4, and the string section 13-133 connects the two between the connecting section 13-131 and the second movable section connecting section 13-132.
In the present embodiment, the material of the third following element 13-P3 and the fourth following element 13-P4 can be the same as the material of the second following element 13-P2. Thus, the cured Young's modulus of the second subsequent element 13-P2 will be substantially the same as the cured Young's modulus of the third subsequent element 13-P3 and the cured Young's modulus of the fourth subsequent element 13-P4.
The first driving assembly 13-200 includes a driving coil 13-210 and at least one magnetic element 13-220, wherein the driving coil 13-210 is disposed on the carrying seat 13-110, and the magnetic element 13-220 is fixed on the frame 13-140. When current flows through the driving coils 13 to 210, an electromagnetic effect is generated between the driving coils 13 to 210 and the magnetic elements 13 to 220, so as to apply a driving force to move the bearing seats 13 to 110 and the optical elements 13 to 30 arranged thereon relative to the frames 13 to 140.
As shown in fig. 6 and 7, the ends of the driving coils 13-210 can be wound around a winding portion 13-113 of the supporting base 13-110, and can be connected to the connecting sections 13-121 of the first elastic elements 13-120 by a fifth connecting element 13-P5. The fifth bonding element 13-P5 can be, for example, a conductive adhesive, and can include a conductive segment 13-P51 and a bonding region 13-P52 after being cured. Conductive region 13-P51 contacts drive coils 13-210 and connecting segments 13-121, and region 13-P52 encapsulates conductive region 13-P51. Since the conductive regions 13-P51 and the subsequent regions 13-P52 are made of metal and resin, respectively, the resistivity of the conductive regions 13-P51 is smaller than that of the subsequent regions 13-P52, and the conductive regions 13-P51 can turn on the driving coils 13-210 and the first elastic elements 13-120.
In the present embodiment, the conductivity of the conductive segment 13-P51 is greater than that of the first bonding element 13-P1 after curing, and the Young's modulus of the bonding region 13-P52 is greater than that of the first bonding element 13-P1 after curing.
In addition, as shown in FIG. 4, in the present embodiment, the fourth engaging element 13-P4 also directly contacts the magnetic element 13-220, so that the connecting segment 13-132 can be fixed to the magnetic element 13-220.
Fig. 8 shows a cross-sectional view along the direction 13-B-13-B in fig. 2. Referring to fig. 3 and 8, the fixing portion 13-300 includes an outer frame 13-310 and a base 13-320, which are fixedly connected to form a receiving space 13-R therebetween. The movable portion 13-100 can be accommodated in the accommodating space 13-R.
The outer frame 13-310 includes a top wall 13-311 and at least one side wall 13-312. The top wall 13-311 has a plate-like configuration and is perpendicular to the main axis 13-AX 1. The side walls 13-312 likewise have a plate-like configuration, and the side walls 13-312 are connected to the edges of the top wall 13-311 and extend from the aforementioned edges toward the base 13-320. Thus, side walls 13-312 will not be perpendicular to major axis 13-AX 1.
The side of the base 13-320 facing the side wall 13-312 has a stepped configuration and thus may include surfaces 13-321 and surfaces 13-322. A first gap 13-G1 may be formed between surface 13-321 and sidewall 13-312, a second gap 13-G2 may be formed between surface 13-322 and sidewall 13-312, and first gap 12-G1 and second gap 12-G2 communicate with each other. Since the surface 13-321 is closer to the sidewall 13-312 than the surface 13-322, the shortest distance between the outer frame 13-310 and the base 13-320 in the first gap 12-G1 will be smaller than the shortest distance between the outer frame 13-310 and the base 13-320 in the second gap 12-G2.
In this embodiment, the user can attach the outer frame 13-310 and the base 13-320 via a sixth attachment element 13-P6 and a seventh attachment element 13-P7. First, the user can fill the first gap 13-G1 with the sixth following element 13-P6, and then fill the second gap 13-G2 with the seventh following element 13-P7 after the sixth following element 13-P6 is cured. Since the surface 13-322 is closer to the outside of the optical element driving mechanism 13-10 than the surface 13-321 is to the assembled outer frame 13-310 and base 13-320, the shortest distance between the first gap 13-G1 and the accommodating space 13-R will be smaller than the shortest distance between the second gap 13-G2 and the accommodating space 13-R. Thus, when the outer frame 13-310 and the base 13-320 are fixed to each other via the sixth following element 13-P6 and the seventh following element 13-P7, the seventh following element 13-P7 is exposed from the base 13-320, and the sixth following element 13-P6 is not exposed.
It should be noted that the sixth connecting element 13-P6 and the seventh connecting element 13-P7 are made of different adhesive materials. For example, the sixth following element 13-P6 can be a thermosetting adhesive, and the seventh following element 13-P7 can be a photo-curing adhesive. That is, the sixth following element 13-P6 is cured by heating, and the seventh following element 13-P7 is cured by irradiation. The viscosity of the sixth following element 13-P6 is lower than that of the seventh following element 13-P7, and the Young's modulus of the sixth following element 13-P6 is higher than that of the seventh following element 13-P7. The sixth following element 13-P6 and the seventh following element 13-P7 may be respectively formed of a suitable resin material.
In addition, the first gap 13-G1 continuously and uninterruptedly surrounds the base 13-320 when viewed along the direction of the main axis 13-AX1, so that the sixth following element 13-P6 filled in the first gap 13-G1 also continuously and uninterruptedly surrounds the base 13-320, thereby completely closing the gap between the outer frame 13-310 and the base 13-320 and preventing fluid or foreign matters from invading the accommodating space 13-R.
The suspension loop wire 13-400 has a long bar type structure and extends in a direction perpendicular to the first elastic member 13-120 and passes through the base 13-320. Both ends of the suspension loop wire 13-400 are fixed to the first elastic element 13-120 and the base 13-320 by the eighth engaging element 13-P8, respectively, to limit the movable range of the movable portion 13-100 relative to the fixed portion 13-300. In detail, the eighth attaching member 13-P8 at one end of the bail line 13-400 may contact the bail line 13-400 and the first elastic member 13-120 to fix one end of the bail line 13-400 to the first elastic member 13-120, and the eighth attaching member 13-P8 at the other end of the bail line 13-400 may contact the bail line 13-400 and the seventh attaching member 13-P7 to fix the other end of the bail line 13-400 to the base 13-320.
In this embodiment, the suspension ring wire 13-400 extends to the second gap 13-G2, such that at least a portion of the suspension ring wire 13-400 is received in the second gap 13-G2. The material of the eighth subsequent element 13-P8 may be the same as that of the seventh subsequent element 13-P7, so that the cured Young's modulus of the eighth subsequent element 13-P8 will be substantially the same as that of the seventh subsequent element 13-P7. In some embodiments, the seventh following element 13-P7 and the eighth following element 13-P8 are integrally formed. In this embodiment, the aforementioned suspension loop wires 13-400 can be referred to as a third elastic element.
The second driving assembly 13-500 may include, for example, a circuit board 13-510 disposed on the base 13-320 and received in the receiving space 13-R. When current flows through the circuit on the circuit board 13-510, an electromagnetic effect is generated between the circuit and the magnetic element 13-220, and a driving force is applied to move the whole movable portion 13-100 relative to the fixed portion 13-300.
As shown in fig. 4, the circuit board 13-510 may be electrically connected to a circuit component 13-W (e.g., a wire) embedded in the base 13-320 at an electrical contact 13-W1. The optical element driving mechanism 13-10 of the present embodiment can use the ninth engaging element 13-P9 to contact and cover the electrical contact 13-W1.
As shown in FIGS. 3 and 9, the position sensing assembly 13-600 can be disposed on the base 13-320 for detecting the movement of the movable portion 13-100 and/or the carrying seat 13-110 relative to the fixed portion 13-300. For example, the position sensing elements 13-600 may be Hall Effect sensors (Hall sensors), magnetoresistive Effect sensors (MR sensors), Giant magnetoresistive Effect sensors (GMR sensors), Tunneling magnetoresistive Effect sensors (TMR sensors), or flux sensors (Fluxgate).
The position sensing device 13-600 can be adhered to the base 13-320 by the tenth adhering element 13-P10. The ninth adhesive element 13-P9 and the tenth adhesive element 13-P10 may comprise the same material as the seventh adhesive element 13-P7, so the ninth adhesive element 13-P9 and the tenth adhesive element 13-P10 may also be a light-cured adhesive, and the cured Young's modulus of the seventh adhesive element 13-P7 is approximately equal to the cured Young's modulus of the ninth adhesive element 13-P9 and the cured Young's modulus of the tenth adhesive element 13-P10. In addition, in the present embodiment, the eighth following element 13-P8, the ninth following element 13-P9 and the tenth following element 13-P10 are all exposed from the base 13-320 when viewed from the outside of the optical element driving mechanism 13-10.
Referring to fig. 10, in another embodiment of the present invention, in order to fix the first elastic elements 13 to 120 to the carrier 13 to 110 more firmly, the carrier 13 to 110 may further include a connecting portion 13 to 112 disposed beside the bonding reinforcement structure 13 to 111. The connecting portion 13-112 includes a protruding portion 13-112A and a positioning portion 13-112B, wherein the protruding portion 13-112A protrudes from the first attaching surface 13-S1 and passes through an opening 13-124 of the first elastic element 13-120, and the positioning portion 13-112B is connected to the protruding portion 13-112A. The convex section 13-112A is located between the positioning section 13-112B and the first abutment surface 13-S1 as viewed in a direction perpendicular to the main axis 13-AX 1. The maximum dimension of the positioning section 13-112B is larger than the maximum dimension of the protruding section 13-112A in a direction perpendicular to the main axis 13-AX1, as seen in the direction of the main axis 13-AX1, so that the positioning section 13-112B can be used to limit the position of the first spring element 13-120 in the direction of the main axis 13-AX1 relative to the carrier seat 13-110. In the present embodiment, the protruding sections 13-112A and the positioning sections 13-112B may comprise the same material and may be integrally formed, and the positioning sections 13-112B may be formed by riveting, so that the protruding sections 13-112A and the positioning sections 13-112B are not connected by other glue.
In addition, in this embodiment, a reinforcing attachment member 13-P11 may be further disposed on the positioning section 13-112B to directly contact the positioning section 13-112B, so that the first elastic member 13-120 is more firmly fixed to the carrier 13-110. The material of the reinforcement engaging member 13-P11 may be the same as the material of the first engaging member 13-P1, and thus different from the material of the positioning section 13-112B. In some embodiments, the reinforcement attachment member 13-P11 and the first attachment member 13-P1 may be connected to each other and may be integrally formed.
In summary, the present invention provides an optical element driving mechanism, which includes a movable portion and a first engaging element. The movable part comprises a first element and a second element, wherein the first element is connected with the second element through a first connecting element.
Although embodiments of the present invention and their advantages have been described above, it should be understood that various changes, substitutions and alterations can be made herein by those skilled in the art without departing from the spirit and scope of the utility model. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but it is to be understood that any process, machine, manufacture, composition of matter, means, method and steps, presently existing or later to be developed, that will become apparent to those skilled in the art from this disclosure, may be utilized according to the present invention, and that all the same functions or advantages of the disclosed embodiments may be accomplished by the present invention. Accordingly, the scope of the present application includes the processes, machines, manufacture, compositions of matter, means, methods, and steps described in the specification. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes combinations of the respective claims and embodiments.
Although the present invention has been described with reference to the above preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the present invention should be determined by the appended claims. Furthermore, each claim constitutes a separate embodiment, and combinations of various claims and embodiments are within the scope of the utility model.

Claims (10)

1.一种光学元件驱动机构,其特征在于,包括:1. an optical element drive mechanism, is characterized in that, comprises: 一活动部,包括:1 Department of Activities, including: 一第一元件;以及a first element; and 一第二元件,连接该第一元件;以及a second element connected to the first element; and 一第一接着元件,其中该第一元件经由该第一接着元件连接该第二元件。A first connecting element, wherein the first element is connected to the second element through the first connecting element. 2.如权利要求1所述的光学元件驱动机构,其中该第一元件包括一接着强化结构,用以提升该第一元件和该第二元件之间的接着强度,且该接着强化结构包括:2. The optical element driving mechanism as claimed in claim 1, wherein the first element comprises an adhesive strengthening structure for enhancing the adhesive strength between the first element and the second element, and the adhesive strengthening structure comprises: 一第一接着表面,直接接触该第一接着元件,其中该第一接着表面垂直于一主轴;a first bonding surface that directly contacts the first bonding element, wherein the first bonding surface is perpendicular to a major axis; 一第一容纳空间,形成于该第一接着表面上,且具有由该第一接着表面凹陷的内凹结构;a first accommodating space formed on the first bonding surface and having a concave structure recessed by the first bonding surface; 一第二接着表面,位于该第一容纳空间中,且邻接该第一接着表面,其中该第一接着表面和该第二接着表面不平行,且该第二接着表面和该主轴不平行;a second bonding surface, located in the first accommodating space and adjacent to the first bonding surface, wherein the first bonding surface and the second bonding surface are not parallel, and the second bonding surface and the main axis are not parallel; 一第三接着表面,位于该第一容纳空间中,且邻接该第二接着表面,其中该第二接着表面和该第三接着表面不平行,且该第一接着表面平行于该第三接着表面;a third bonding surface, located in the first accommodating space and adjacent to the second bonding surface, wherein the second bonding surface and the third bonding surface are not parallel, and the first bonding surface is parallel to the third bonding surface ; 一第一突起结构,由该第三接着表面凸出,其中沿着该主轴方向观察时,该第一容纳空间围绕该第一突起结构;a first protruding structure protruding from the third bonding surface, wherein when viewed along the main axis direction, the first accommodating space surrounds the first protruding structure; 一第四接着表面,位于该第一突起结构上,且邻接该第三接着表面,其中该第三接着表面和该第四接着表面不平行,且该第四接着表面和该主轴不平行;a fourth bonding surface located on the first protruding structure and adjacent to the third bonding surface, wherein the third bonding surface and the fourth bonding surface are not parallel, and the fourth bonding surface and the main axis are not parallel; 一第五接着表面,位于该第一突起结构上,且邻接该第四接着表面,其中该第四接着表面和该第五接着表面不平行,且该第三接着表面平行于该第五接着表面;A fifth bonding surface is located on the first protruding structure and adjacent to the fourth bonding surface, wherein the fourth bonding surface and the fifth bonding surface are not parallel, and the third bonding surface is parallel to the fifth bonding surface ; 一第二容纳空间,形成于该第五接着表面上,且具有由该第五接着表面凹陷的内凹结构;a second accommodating space formed on the fifth bonding surface and having a concave structure recessed by the fifth bonding surface; 一第六接着表面,位于该第二容纳空间中,且邻接该第五接着表面,其中该第五接着表面和该第六接着表面不平行,且该第六接着表面和该主轴不平行;a sixth bonding surface, located in the second accommodating space and adjacent to the fifth bonding surface, wherein the fifth bonding surface and the sixth bonding surface are not parallel, and the sixth bonding surface and the main axis are not parallel; 一第七接着表面,位于该第二容纳空间中,且邻接该第六接着表面,其中该第六接着表面和该第七接着表面不平行,且该第五接着表面平行于该第七接着表面;a seventh bonding surface, located in the second accommodating space and adjacent to the sixth bonding surface, wherein the sixth bonding surface and the seventh bonding surface are not parallel, and the fifth bonding surface is parallel to the seventh bonding surface ; 一第二突起结构,由该第七接着表面凸出,其中沿着该主轴方向观察时,该第二容纳空间围绕该第二突起结构;a second protruding structure protruding from the seventh connecting surface, wherein when viewed along the main axis direction, the second accommodating space surrounds the second protruding structure; 一第八接着表面,位于该第二突起结构上,且邻接该第七接着表面,其中该第七接着表面和该第八接着表面不平行,且该第八接着表面和该主轴不平行;以及an eighth bonding surface on the second protruding structure and adjacent to the seventh bonding surface, wherein the seventh bonding surface and the eighth bonding surface are not parallel, and the eighth bonding surface and the main axis are not parallel; and 一第九接着表面,位于该第二突起结构上,且邻接该第八接着表面,其中该第八接着表面和该第九接着表面不平行,且该第五接着表面平行于该第九接着表面;a ninth bonding surface on the second protruding structure and adjacent to the eighth bonding surface, wherein the eighth bonding surface and the ninth bonding surface are not parallel, and the fifth bonding surface is parallel to the ninth bonding surface ; 沿着垂直于该主轴的方向观察时,该第二接着表面、该第三接着表面、以及该第四接着表面形成U字形结构;When viewed along the direction perpendicular to the main axis, the second bonding surface, the third bonding surface, and the fourth bonding surface form a U-shaped structure; 沿着垂直于该主轴的方向观察时,该第六接着表面、该第七接着表面、以及该第八接着表面形成U字形结构;When viewed along the direction perpendicular to the main axis, the sixth bonding surface, the seventh bonding surface, and the eighth bonding surface form a U-shaped structure; 该第二接着表面和该第三接着表面之间的夹角相异于该第六接着表面和该第七接着表面之间的夹角;The included angle between the second bonding surface and the third bonding surface is different from the included angle between the sixth bonding surface and the seventh bonding surface; 该第二接着表面和该第三接着表面之间的夹角小于该第六接着表面和该第七接着表面之间的夹角;The included angle between the second bonding surface and the third bonding surface is smaller than the included angle between the sixth bonding surface and the seventh bonding surface; 该第三接着表面和该第四接着表面之间的夹角相异于该第七接着表面和该第八接着表面之间的夹角;The included angle between the third bonding surface and the fourth bonding surface is different from the included angle between the seventh bonding surface and the eighth bonding surface; 该第三接着表面和该第四接着表面之间的夹角小于该第七接着表面和该第八接着表面之间的夹角;The included angle between the third bonding surface and the fourth bonding surface is smaller than the included angle between the seventh bonding surface and the eighth bonding surface; 沿着垂直于该主轴的方向观察时,该第二接着表面和该第四接着表面之间的最短距离相异于该第六接着表面和该第八接着表面之间的最短距离;When viewed along the direction perpendicular to the main axis, the shortest distance between the second bonding surface and the fourth bonding surface is different from the shortest distance between the sixth bonding surface and the eighth bonding surface; 沿着垂直于该主轴的方向观察时,该第二接着表面和该第四接着表面之间的最短距离大于该第六接着表面和该第八接着表面之间的最短距离;When viewed along the direction perpendicular to the main axis, the shortest distance between the second bonding surface and the fourth bonding surface is greater than the shortest distance between the sixth bonding surface and the eighth bonding surface; 该第一接着表面和该第五接着表面不共面;the first bonding surface and the fifth bonding surface are not coplanar; 该第五接着表面和该第九接着表面不共面;The fifth bonding surface and the ninth bonding surface are not coplanar; 该第一接着表面和该第九接着表面不共面;The first bonding surface and the ninth bonding surface are not coplanar; 该第一接着表面和该第五接着表面面朝相同方向;the first bonding surface and the fifth bonding surface face the same direction; 该第五接着表面和该第九接着表面面朝相同方向;the fifth bonding surface and the ninth bonding surface face the same direction; 沿着垂直于该主轴的方向观察时,在该主轴方向上,该第九接着表面位于该第一接着表面和该第五接着表面之间;When viewed along a direction perpendicular to the main axis, in the main axis direction, the ninth bonding surface is located between the first bonding surface and the fifth bonding surface; 该第一接着元件直接接触第一接着表面;the first bonding element directly contacts the first bonding surface; 该第一接着元件直接接触第二接着表面;the first bonding element directly contacts the second bonding surface; 该第一接着元件直接接触第三接着表面;the first bonding element directly contacts the third bonding surface; 该第一接着元件直接接触第四接着表面;the first bonding element directly contacts the fourth bonding surface; 该第一接着元件直接接触第五接着表面;the first bonding element directly contacts the fifth bonding surface; 该第一接着元件直接接触第六接着表面;the first bonding element directly contacts the sixth bonding surface; 该第一接着元件直接接触第七接着表面;the first bonding element directly contacts the seventh bonding surface; 该第一接着元件直接接触第八接着表面;the first bonding element directly contacts the eighth bonding surface; 该第一接着元件直接接触第九接着表面。The first bonding element directly contacts the ninth bonding surface. 3.如权利要求2所述的光学元件驱动机构,其中该第一元件还包括一连接部,该第一元件经由该连接部连接该第二元件;3. The optical element driving mechanism of claim 2, wherein the first element further comprises a connecting portion, and the first element is connected to the second element via the connecting portion; 该连接部包括一凸出区段,且该凸出区段由该第一接着表面凸出;The connecting portion includes a protruding section, and the protruding section protrudes from the first bonding surface; 该第二元件具有板状结构,且该板状结构垂直于该主轴;the second element has a plate-like structure, and the plate-like structure is perpendicular to the main axis; 该第二元件包括一开口,对应该连接部;the second element includes an opening corresponding to the connecting portion; 该连接部包括一定位区段,用以限制该第二元件在该主轴上相对于该第一元件的位置;The connecting portion includes a positioning section for limiting the position of the second element relative to the first element on the main shaft; 沿着垂直该主轴的方向观察时,该凸出区段位于定位区段和该第一接着表面之间;When viewed along a direction perpendicular to the main axis, the protruding section is located between the positioning section and the first bonding surface; 沿着该主轴方向观察时,在垂直该主轴的方向上,该定位区段的最大尺寸大于该凸出区段的最大尺寸;When viewed along the main axis, in the direction perpendicular to the main axis, the largest dimension of the positioning section is greater than the largest dimension of the protruding section; 该定位区段和该凸出区段为一体成型;The positioning section and the protruding section are integrally formed; 该定位区段和该凸出区段具有相同材质;The positioning section and the protruding section have the same material; 该定位区段和该凸出区段之间未经由胶水连接。The positioning section and the protruding section are not connected by glue. 4.如权利要求3所述的光学元件驱动机构,其中该光学元件驱动机构还包括一补强接着元件,直接接触该定位区段;4. The optical element driving mechanism as claimed in claim 3, wherein the optical element driving mechanism further comprises a reinforcing connecting element directly contacting the positioning section; 该补强接着元件和该定位区段具有不同材质;The reinforcing connecting element and the positioning section have different materials; 该连接部接触该接着强化元件;the connecting portion contacts the adhering reinforcing element; 该第一接着元件和该补强接着元件为一体成型;The first bonding element and the reinforcing bonding element are integrally formed; 该第一接着元件和该补强接着元件具有相同材质;The first bonding element and the reinforcing bonding element have the same material; 该第一接着元件直接接触该定位区段。The first contact element directly contacts the positioning section. 5.如权利要求2所述的光学元件驱动机构,其中该活动部用以连接一光学元件;5. The optical element driving mechanism as claimed in claim 2, wherein the movable portion is used for connecting an optical element; 该第一元件为一承载座,用以连接该光学元件;The first element is a carrier for connecting the optical element; 该第二元件为一第一弹性元件;the second element is a first elastic element; 该活动部还包括一框架,该承载座经由该第一弹性元件活动地连接该框架;The movable part further includes a frame, and the bearing base is movably connected to the frame via the first elastic element; 该光学元件驱动机构还包括一第一驱动组件,用以驱动该承载座相对于该框架运动;The optical element driving mechanism further includes a first driving component for driving the bearing base to move relative to the frame; 该光学元件驱动机构还包括一第二接着元件,该第一弹性元件经由该第二接着元件连接该框架;The optical element driving mechanism further includes a second connecting element, and the first elastic element is connected to the frame via the second connecting element; 该第二接着元件固化后的杨氏模数相同于该第一接着元件固化后的杨氏模数;The cured Young's modulus of the second bonding element is the same as the cured Young's modulus of the first bonding element; 该第一弹性元件具有板状结构;the first elastic element has a plate-like structure; 该第一弹性元件垂直于该主轴;the first elastic element is perpendicular to the main axis; 该第一弹性元件具有金属材质。The first elastic element is made of metal material. 6.如权利要求5所述的光学元件驱动机构,其中该活动部还包括一第二弹性元件,该承载座经由该第二弹性元件活动地连接该框架;6. The optical element driving mechanism according to claim 5, wherein the movable portion further comprises a second elastic element, and the bearing base is movably connected to the frame via the second elastic element; 该光学元件驱动机构还包括一第三接着元件,该第二弹性元件经由该第三接着元件连接该承载座;The optical element driving mechanism further includes a third connecting element, and the second elastic element is connected to the bearing base via the third connecting element; 该第三接着元件固化后的杨氏模数相同于该第二接着元件固化后的杨氏模数;The cured Young's modulus of the third bonding element is the same as the cured Young's modulus of the second bonding element; 该光学元件驱动机构还包括一第四接着元件,该第二弹性元件经由该第四接着元件连接该框架;The optical element driving mechanism further includes a fourth connecting element, and the second elastic element is connected to the frame via the fourth connecting element; 该第四接着元件固化后的杨氏模数相同于该第三接着元件固化后的杨氏模数;The cured Young's modulus of the fourth adhesive element is the same as the cured Young's modulus of the third adhesive element; 该第四接着元件直接接触该第一驱动组件;the fourth connecting element directly contacts the first driving component; 该第一驱动组件包括一磁性元件,该第四接着元件直接接触该磁性元件。The first driving component includes a magnetic element, and the fourth connecting element directly contacts the magnetic element. 7.如权利要求5所述的光学元件驱动机构,其中该光学元件驱动机构还包括一第五接着元件,用以电性连接该第一驱动组件;7. The optical element driving mechanism as claimed in claim 5, wherein the optical element driving mechanism further comprises a fifth connecting element for electrically connecting the first driving element; 该第五接着元件固化后包括一导电区段和一接着区段;The fifth bonding element includes a conductive section and a bonding section after curing; 该接着区段具有树脂材质;the connecting section has resin material; 该导电区段具有金属材质;the conductive section has metal material; 该接着区段的电阻率大于该导电区段的电阻率;The resistivity of the following section is greater than the resistivity of the conductive section; 该导电区段的电导率相异于该第一接着元件固化后的电导率;The conductivity of the conductive section is different from the conductivity of the first bonding element after curing; 该导电区段的电导率大于该第一接着元件固化后的电导率;The conductivity of the conductive section is greater than the conductivity of the first bonding element after curing; 该接着区段的杨氏模数相异于该第一接着元件固化后的杨氏模数;The Young's modulus of the bonding section is different from the Young's modulus of the first bonding element after curing; 该接着区段的杨氏模数大于该第一接着元件固化后的杨氏模数;The Young's modulus of the bonding section is greater than the Young's modulus of the first bonding element after curing; 该承载座经由该第五接着元件固定地连接该第一弹性元件;The bearing seat is fixedly connected to the first elastic element via the fifth connecting element; 该第一驱动组件包括一驱动线圈,该第一弹性元件经由该第五接着元件电性连接该驱动线圈。The first driving component includes a driving coil, and the first elastic element is electrically connected to the driving coil through the fifth connecting element. 8.如权利要求5所述的光学元件驱动机构,其中该光学元件驱动机构还包括:8. The optical element driving mechanism of claim 5, wherein the optical element driving mechanism further comprises: 一固定部,该活动部可相对于该固定部运动,包括:A fixed part, the movable part can move relative to the fixed part, including: 一外框,包括一顶壁和一侧壁,该顶壁具有板状结构且垂直于该主轴,该侧壁具有板状结构且由该顶壁的边缘延伸,且该侧壁和该主轴不垂直;以及An outer frame includes a top wall and a side wall, the top wall has a plate-like structure and is perpendicular to the main axis, the side wall has a plate-like structure and extends from the edge of the top wall, and the side wall and the main axis are not vertical; and 一底座,连接该外框;a base, connected to the outer frame; 一第二驱动组件,用以驱动该活动部相对于该固定部运动;a second driving component for driving the movable part to move relative to the fixed part; 一第三弹性元件,该活动部经由该第三弹性元件活动地连接该固定部,其中该第三弹性元件具有长条形结构,并沿着垂直该第一弹性元件的方向延伸;a third elastic element, the movable portion is movably connected to the fixed portion via the third elastic element, wherein the third elastic element has an elongated structure and extends along a direction perpendicular to the first elastic element; 一第六接着元件,其中该外框经由该第六接着元件固定地连接该底座;a sixth connecting element, wherein the outer frame is fixedly connected to the base via the sixth connecting element; 一第一间隙,形成于该外框和该底座之间,用以容纳该第六接着元件;a first gap is formed between the outer frame and the base for accommodating the sixth connecting element; 一第七接着元件,其中该外框经由该第七接着元件固定地连接该底座;以及a seventh connecting element, wherein the outer frame is fixedly connected to the base via the seventh connecting element; and 一第二间隙,形成于该外框和该底座之间,用以容纳该第七接着元件;a second gap is formed between the outer frame and the base for accommodating the seventh connecting element; 沿着该主轴方向观察时,该第一间隙围绕该底座;When viewed along the main axis direction, the first gap surrounds the base; 沿着该主轴方向观察时,该第一间隙连续且不间断地围绕该底座;When viewed along the main axis direction, the first gap continuously and uninterruptedly surrounds the base; 该第七接着元件固化后的杨氏模数相异于该第六接着元件固化后的杨氏模数;The cured Young's modulus of the seventh bonding element is different from the cured Young's modulus of the sixth bonding element; 该第七接着元件固化后的杨氏模数小于该第六接着元件固化后的杨氏模数;The cured Young's modulus of the seventh bonding element is smaller than the cured Young's modulus of the sixth bonding element; 该外框和该底座在该第一间隙中的最短距离相异于该外框和该底座在该第二间隙中的最短距离;The shortest distance between the outer frame and the base in the first gap is different from the shortest distance between the outer frame and the base in the second gap; 该外框和该底座在该第一间隙中的最短距离小于该外框和该底座在该第二间隙中的最短距离;The shortest distance between the outer frame and the base in the first gap is less than the shortest distance between the outer frame and the base in the second gap; 该第一间隙与该第二间隙相连;The first gap is connected to the second gap; 该第一元件和该第二元件形成一容纳空间,用以容纳该活动部;The first element and the second element form an accommodating space for accommodating the movable part; 该第一间隙与该容纳空间之间的最短距离相异于该第二间隙与该容纳空间之间的最短距离;The shortest distance between the first gap and the accommodating space is different from the shortest distance between the second gap and the accommodating space; 该第一间隙与该容纳空间之间的最短距离小于该第二间隙与该容纳空间之间的最短距离;The shortest distance between the first gap and the accommodating space is smaller than the shortest distance between the second gap and the accommodating space; 该第六接着元件未固化时的黏度相异于该第七接着元件未固化时的黏度;The uncured viscosity of the sixth bonding element is different from the uncured viscosity of the seventh bonding element; 该第六接着元件未固化时的黏度小于该第七接着元件未固化时的黏度。The uncured viscosity of the sixth adhesive element is lower than the uncured viscosity of the seventh adhesive element. 9.如权利要求8所述的光学元件驱动机构,其中该第三弹性元件穿过该底座;9. The optical element driving mechanism of claim 8, wherein the third elastic element passes through the base; 该光学元件驱动机构还包括一第八接着元件,该第八接着元件直接接触该第三弹性元件;The optical element driving mechanism further includes an eighth connecting element, the eighth connecting element directly contacts the third elastic element; 该第八接着元件和该第七接着元件一体成型;The eighth connecting element and the seventh connecting element are integrally formed; 该第八接着元件固化后的杨氏模数相同于该第七接着元件固化后的杨氏模数;The cured Young's modulus of the eighth bonding element is the same as the cured Young's modulus of the seventh bonding element; 该第三弹性元件的至少部分设置于该第二间隙中。At least part of the third elastic element is disposed in the second gap. 10.如权利要求9所述的光学元件驱动机构,其中该光学元件驱动机构还包括:10. The optical element driving mechanism of claim 9, wherein the optical element driving mechanism further comprises: 一位置感测组件,用以感测该活动部或该承载座相对于该固定部的运动;a position sensing component for sensing the movement of the movable part or the bearing base relative to the fixed part; 一第九接着元件,直接接触一电性接点,其中该第二驱动组件经由该电性接点与一电路组件电性连接,且该第九接着元件固化后的杨氏模数相同于该第七接着元件固化后的杨氏模数;以及A ninth connecting element directly contacts an electrical contact, wherein the second driving element is electrically connected to a circuit element via the electrical contact, and the cured Young's modulus of the ninth connecting element is the same as that of the seventh connecting element the Young's modulus of the subsequent component after curing; and 一第十接着元件,直接接触该位置感测组件,其中该第十接着元件固化后的杨氏模数相同于该第七接着元件固化后的杨氏模数;A tenth bonding element directly contacts the position sensing element, wherein the cured Young's modulus of the tenth bonding element is the same as the cured Young's modulus of the seventh bonding element; 由该光学元件驱动机构的外部观察时,该第七接着元件的至少部分显露于该底座;When viewed from the outside of the optical element driving mechanism, at least part of the seventh connecting element is exposed on the base; 由该光学元件驱动机构的外部观察时,该第八接着元件的至少部分显露于该底座;When viewed from the outside of the optical element driving mechanism, at least part of the eighth connecting element is exposed on the base; 由该光学元件驱动机构的外部观察时,该第九接着元件的至少部分显露于该底座;When viewed from the outside of the optical element driving mechanism, at least part of the ninth connecting element is exposed on the base; 由该光学元件驱动机构的外部观察时,该第十接着元件的至少部分显露于该底座;When viewed from the outside of the optical element driving mechanism, at least part of the tenth connecting element is exposed on the base; 该第七接着元件以照光方式进行固化;the seventh bonding element is cured by illumination; 该第八接着元件以照光方式进行固化;the eighth bonding element is cured by illumination; 该第九接着元件以照光方式进行固化;the ninth bonding element is cured by illumination; 该第十接着元件以照光方式进行固化。The tenth adhesive element is cured by illumination.
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