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CN207867110U - Optical Component Driver Module - Google Patents

Optical Component Driver Module Download PDF

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Publication number
CN207867110U
CN207867110U CN201721304982.9U CN201721304982U CN207867110U CN 207867110 U CN207867110 U CN 207867110U CN 201721304982 U CN201721304982 U CN 201721304982U CN 207867110 U CN207867110 U CN 207867110U
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CN
China
Prior art keywords
optical element
base
driving module
circuit
element driving
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Withdrawn - After Issue
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CN201721304982.9U
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Chinese (zh)
Inventor
游证凯
陈怡和
胡朝彰
宋欣忠
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TDK Taiwan Corp
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TDK Taiwan Corp
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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G02B7/09Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00Adjustment of optical system relative to image or object surface other than for focusing
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/68Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682Vibration or motion blur correction
    • H04N23/685Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adjustment Of Camera Lenses (AREA)
  • Lens Barrels (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

The utility model provides an optical element drive module, including a moving mechanism, a base, a rings line and be used for driving an electromagnetic drive mechanism that the moving mechanism removed for the base. The movable mechanism comprises an optical element bearing seat, the base comprises a first surface, a second surface and an opening, wherein the second surface faces the optical element bearing seat and is opposite to the first surface, and the opening extends from the first surface to the second surface. The suspension loop wire passes through the opening, and two ends of the suspension loop wire are respectively fixed on the first surface and the movable mechanism.

Description

光学元件驱动模块Optical Component Driver Module

技术领域technical field

本实用新型涉及一种光学元件驱动模块。更具体地来说,本实用新型涉及一种具有吊环线的光学元件驱动模块。The utility model relates to an optical element driving module. More specifically, the utility model relates to an optical element driving module with a ring wire.

背景技术Background technique

随着科技的发展,现今许多电子装置(例如智能手机或数码相机)皆具有照相或录影的功能。这些电子装置的使用越来越普遍,并朝着便利和轻薄化的设计方向进行发展,以提供使用者更多的选择。With the development of technology, many electronic devices (such as smart phones or digital cameras) now have the function of taking photos or recording videos. The use of these electronic devices is becoming more and more common, and they are developing towards the direction of convenience and thinner design, so as to provide users with more choices.

前述具有照相或录影功能的电子装置通常设有一镜头驱动模块,以驱动一镜头沿着一光轴进行移动,进而达到自动对焦(autofocus)且/或变焦(zoom)的功能。光线可穿过前述镜头在一感光模块上成像。The aforementioned electronic device with a camera or video recording function is usually provided with a lens driving module to drive a lens to move along an optical axis, thereby achieving autofocus and/or zoom functions. The light can pass through the aforementioned lens and form an image on a photosensitive module.

此外,部分电子装置还包含例如吊环线等元件,以达到晃动补偿的目的。然而,为了使电子装置轻薄化而使其厚度降低时,前述吊环线的长度将会缩减,进而产生较大的拉力而难以达成前述晃动补偿的功能。由于现今吊环线的线径已难以缩小,因此,如何解决前述问题始成一重要的课题。In addition, some electronic devices also include components such as ring wires to achieve the purpose of shake compensation. However, when the thickness of the electronic device is reduced in order to make it lighter and thinner, the length of the aforementioned suspension ring wire will be reduced, thereby generating a relatively large pulling force, making it difficult to achieve the aforementioned shake compensation function. Since it is difficult to reduce the wire diameter of the current suspension ring wire, how to solve the aforementioned problems has become an important issue.

实用新型内容Utility model content

本实用新型的主要目的在于提供一种光学元件驱动模块,以解决上述技术问题。The main purpose of the utility model is to provide an optical element driving module to solve the above technical problems.

为了解决上述现有的问题点,本实用新型提供一种光学元件驱动模块,包括一活动机构、一底座、一吊环线以及用以驱动活动机构相对于底座移动的一电磁驱动机构。活动机构包括一光学元件承载座,且底座包括一第一表面、一第二表面和一开口,其中第二表面朝向光学元件承载座并相反于第一表面,且开口由第一表面延伸至第二表面。吊环线穿过前述开口,且其两端分别固定于第一表面和活动机构。In order to solve the above existing problems, the utility model provides an optical element driving module, which includes a movable mechanism, a base, a lifting ring wire and an electromagnetic driving mechanism for driving the movable mechanism to move relative to the base. The movable mechanism includes an optical element bearing seat, and the base includes a first surface, a second surface and an opening, wherein the second surface faces the optical element bearing seat and is opposite to the first surface, and the opening extends from the first surface to the second surface. Two surfaces. The suspension ring wire passes through the aforementioned opening, and its two ends are respectively fixed on the first surface and the movable mechanism.

本实用新型一实施例中,前述吊环线与开口的内壁之间具有一间隙。In an embodiment of the present invention, there is a gap between the aforementioned suspension ring wire and the inner wall of the opening.

本实用新型一实施例中,前述底座具有一凹陷部,且凹陷部的一底面与第二表面之间的距离小于第一表面与第二表面之间的距离。In an embodiment of the present invention, the aforementioned base has a concave portion, and the distance between a bottom surface of the concave portion and the second surface is smaller than the distance between the first surface and the second surface.

本实用新型一实施例中,前述光学元件驱动模块设置于一感光模块上,且感光模块的至少一部分容置于凹陷部中。In an embodiment of the present invention, the aforementioned optical element driving module is disposed on a photosensitive module, and at least a part of the photosensitive module is accommodated in the concave portion.

本实用新型一实施例中,前述底座具有一凸起,凸出于第一表面。In an embodiment of the present invention, the aforementioned base has a protrusion protruding from the first surface.

本实用新型一实施例中,前述凸起设置于吊环线周围。In an embodiment of the present invention, the aforementioned protrusions are arranged around the ring wire.

本实用新型一实施例中,前述底座具有一侧面,连接第一表面和第二表面,且吊环线的一端位于侧面和凸起之间。In an embodiment of the present invention, the aforementioned base has a side surface connecting the first surface and the second surface, and one end of the suspension ring wire is located between the side surface and the protrusion.

本实用新型一实施例中,前述底座还包括一第一线路,设置于第一表面。In an embodiment of the present invention, the aforementioned base further includes a first circuit disposed on the first surface.

本实用新型一实施例中,前述底座还包括一内线路,埋设于本体中,并与第一线路电性连接。In an embodiment of the present invention, the aforementioned base further includes an inner circuit buried in the body and electrically connected to the first circuit.

本实用新型一实施例中,前述第一线路和内线路利用嵌入成形的方式形成于本体上。In an embodiment of the present invention, the first circuit and the inner circuit are formed on the body by insert molding.

本实用新型一实施例中,前述第一线路利用模塑互联物件或镀膜的方式形成于本体上。In an embodiment of the present invention, the aforementioned first circuit is formed on the body by molding interconnected objects or coating.

本实用新型一实施例中,前述第一线路通过连接本体的一金属片形成。In an embodiment of the present invention, the aforementioned first circuit is formed by connecting a metal sheet of the body.

本实用新型一实施例中,前述驱动模块还包括一第二线路,设置于第二表面,并与电磁驱动机构电性连接。In an embodiment of the present invention, the aforementioned driving module further includes a second circuit disposed on the second surface and electrically connected to the electromagnetic driving mechanism.

本实用新型还提供一种光学元件驱动模块,包括一活动机构、一底座以及用以驱动活动机构相对于底座移动的一电磁驱动机构。底座包括一本体和一第一绝缘层,其中本体包括彼此分离的多个金属框架,且第一绝缘层的厚度小于本体的厚度的一半。The utility model also provides an optical element driving module, which includes a movable mechanism, a base and an electromagnetic driving mechanism for driving the movable mechanism to move relative to the base. The base includes a body and a first insulating layer, wherein the body includes a plurality of metal frames separated from each other, and the thickness of the first insulating layer is less than half of the thickness of the body.

本实用新型一实施例中,前述第一绝缘层的厚度小于本体的厚度的四分之一。In an embodiment of the present invention, the thickness of the first insulating layer is less than a quarter of the thickness of the main body.

本实用新型一实施例中,前述本体还包括一延伸部,朝向远离活动机构的方向延伸,且光学元件驱动模块还包括一吊环线,穿过延伸部并连接活动机构和底座。In an embodiment of the present invention, the aforementioned body further includes an extension part extending away from the movable mechanism, and the optical element driving module further includes a ring wire passing through the extension part and connecting the movable mechanism and the base.

本实用新型一实施例中,前述底座还包括一第一隔离元件,围绕延伸部。In an embodiment of the present invention, the aforementioned base further includes a first isolation element surrounding the extension portion.

本实用新型一实施例中,前述第一隔离元件具有一中空结构,且底座还包括一阻尼元件,设置于中空结构中。In an embodiment of the present invention, the aforementioned first isolation element has a hollow structure, and the base further includes a damping element disposed in the hollow structure.

本实用新型一实施例中,前述光学元件驱动模块还包括一位置检测元件,连接本体的部分金属框架。In an embodiment of the present invention, the aforementioned optical element driving module further includes a position detection element connected to a part of the metal frame of the body.

本实用新型一实施例中,前述底座还包括一第二隔离元件,围绕位置检测元件和本体的连接处。In an embodiment of the present invention, the aforementioned base further includes a second isolation element surrounding the joint between the position detection element and the body.

本实用新型一实施例中,前述底座还包括一第三隔离元件,围绕前述本体。In an embodiment of the present invention, the aforementioned base further includes a third isolation element surrounding the aforementioned body.

本实用新型一实施例中,前述本体还包括一延伸部,朝向活动机构延伸,且活动机构连接延伸部。In an embodiment of the present invention, the aforementioned body further includes an extension portion extending toward the movable mechanism, and the movable mechanism is connected to the extension portion.

本实用新型一实施例中,前述底座还包括一线圈组件,且本体设置于线圈组件和第一绝缘层之间。In an embodiment of the present invention, the aforementioned base further includes a coil component, and the body is disposed between the coil component and the first insulating layer.

本实用新型一实施例中,前述底座还包括一第二绝缘层,且第二绝缘层设置于线圈组件和本体之间。In an embodiment of the present invention, the aforementioned base further includes a second insulating layer, and the second insulating layer is disposed between the coil component and the main body.

本实用新型一实施例中,前述底座还包括一金属基板,且第一绝缘层设置于本体和金属基板之间。In an embodiment of the present invention, the aforementioned base further includes a metal substrate, and the first insulating layer is disposed between the body and the metal substrate.

本实用新型提供的光学元件驱动模块的优点和有益效果在于:通过光学元件驱动模块的吊环线延伸穿过底座,可使吊环线在光学元件驱动模块具有较低厚度的状态下仍具有适当的拉力。此外,通过光学元件驱动模块中的底座包括多个金属框架,更可使底座的厚度降低,进而达成减少光学元件驱动模块厚度的功效。The advantages and beneficial effects of the optical element driving module provided by the utility model are: the suspension ring line of the optical element driving module extends through the base, so that the suspension ring line can still have a proper tension when the optical element driving module has a relatively low thickness . In addition, the base in the optical element driving module includes a plurality of metal frames, so that the thickness of the base can be reduced, thereby achieving the effect of reducing the thickness of the optical element driving module.

附图说明Description of drawings

图1A为本实用新型一实施例的电子装置示意图。FIG. 1A is a schematic diagram of an electronic device according to an embodiment of the present invention.

图1B为本实用新型一实施例中的镜头驱动模块、光学元件和感光模块的示意图。FIG. 1B is a schematic diagram of a lens driving module, an optical element and a photosensitive module in an embodiment of the present invention.

图2为本实用新型一实施例的镜头驱动模块的爆炸图。FIG. 2 is an exploded view of a lens driving module according to an embodiment of the present invention.

图3为本实用新型一实施例的镜头驱动模块的剖视图。FIG. 3 is a cross-sectional view of a lens driving module according to an embodiment of the present invention.

图4A为本实用新型另一实施例的镜头驱动模块的示意图。FIG. 4A is a schematic diagram of a lens driving module according to another embodiment of the present invention.

图4B为图4A所示的镜头驱动模块与感光模块结合的示意图。FIG. 4B is a schematic diagram of the combination of the lens driving module and the photosensitive module shown in FIG. 4A .

图5为本实用新型另一实施例的镜头驱动模块的示意图。FIG. 5 is a schematic diagram of a lens driving module according to another embodiment of the present invention.

图6为本实用新型另一实施例的镜头驱动模块的示意图。FIG. 6 is a schematic diagram of a lens driving module according to another embodiment of the present invention.

图7A、图7B为本实用新型另一实施例的镜头驱动模块的示意图。7A and 7B are schematic diagrams of a lens driving module according to another embodiment of the present invention.

图7C为本实用新型另一实施例的镜头驱动模块的示意图。FIG. 7C is a schematic diagram of a lens driving module according to another embodiment of the present invention.

图8A为本实用新型另一实施例的底座的示意图。FIG. 8A is a schematic diagram of a base according to another embodiment of the present invention.

图8B为本实用新型另一实施例的底座的爆炸图。Fig. 8B is an exploded view of the base of another embodiment of the present invention.

图8C为本实用新型另一实施例中,第一隔离元件围绕吊环线的示意图。Fig. 8C is a schematic diagram of the first isolation element surrounding the ring wire in another embodiment of the present invention.

图8D为本实用新型另一实施例中,第二隔离元件围绕位置检测器和底座的连接处的示意图。Fig. 8D is a schematic diagram of the connection between the position detector and the base surrounded by the second isolation element in another embodiment of the present invention.

图9A为本实用新型另一实施例的底座的示意图。FIG. 9A is a schematic diagram of a base of another embodiment of the present invention.

图9B为第三隔离元件与壳体连接的示意图。Fig. 9B is a schematic diagram of the connection between the third isolation element and the housing.

图10为本实用新型另一实施例中,底座与第二弹性元件连接的示意图。Fig. 10 is a schematic diagram of the connection between the base and the second elastic element in another embodiment of the present invention.

附图标记说明:Explanation of reference signs:

10 光学元件驱动模块10 Optics driver module

20 电子装置20 electronics

30 光学元件30 optics

100 壳体100 shell

210 光学元件承载座210 Optics Carrier

211 容置空间211 storage space

212 内凹结构212 concave structure

220 框体220 frame

221 收容部221 Containment

222 凹槽222 grooves

230 第一电磁驱动组件230 The first electromagnetic drive assembly

240 第二电磁驱动组件240 Second electromagnetic drive assembly

250 第一弹性元件250 first elastic element

251 内圈段251 inner ring segment

252 外圈段252 outer ring segment

260 第二弹性元件260 second elastic element

261 内圈段261 inner ring segment

262 外圈段262 outer ring segment

300 吊环线300 ring line

400 底座400 base

410 本体410 Ontology

411 第一表面411 First Surface

412 第二表面412 Second Surface

413 开口413 opening

414 凹陷部414 Depression

414a 底面414a Bottom

415 金属框架415 metal frame

416 凸起416 raised

417 侧面417 side

418 延伸部418 extension

419 引脚419 pins

420 第一线路420 First Line

430 第二线路430 Second Line

440 线圈组件440 coil assembly

450 内线路450 inner line

460 第一绝缘层460 First insulating layer

461 开口461 opening

470 第二绝缘层470 Second insulating layer

471 开口471 openings

480 金属基板480 metal substrate

500 位置检测器500 position detector

B1 第一隔离元件B1 first isolation element

B2 第二隔离元件B2 Second isolation element

B3 第三隔离元件B3 third isolation element

O1 光学孔O1 optical hole

O2 光学孔O2 optical hole

D 阻尼元件D damping element

G 焊锡或粘胶G Solder or glue

R 焊锡R Solder

S 感光模块S photosensitive module

具体实施方式Detailed ways

以下说明本实用新型实施例的光学元件驱动模块。然而,可轻易了解本实用新型实施例提供许多合适的实用新型概念而可实施于广泛的各种特定背景。所公开的特定实施例仅仅用于说明以特定方法使用本实用新型,并非用以局限本实用新型的范围。The optical element driving module of the embodiment of the present invention will be described below. It should be readily appreciated, however, that embodiments of the invention provide many suitable inventive concepts that can be implemented in a wide variety of specific contexts. The disclosed specific embodiments are only used to illustrate the use of the utility model in a specific way, and are not intended to limit the scope of the utility model.

除非另外定义,在此使用的全部用语(包括技术及科学用语)具有与此篇公开本领域技术人员所通常理解的相同涵义。能理解的是这些用语,例如在通常使用的字典中定义的用语,应被解读成具有一与相关技术及本公开的背景或上下文一致的意思,而不应以一理想化或过度正式的方式解读,除非在此特别定义。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art of this disclosure. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the related art and the present disclosure, rather than in an idealized or overly formal manner Interpretation, unless specifically defined herein.

首先请一并参阅图1A、图1B,本实用新型一实施例的光学元件驱动模块10可装设于一电子装置20内以承载一光学元件30(例如一镜头),并驱动前述光学元件30使其可相对于电子装置20中的感光模块S移动,来达到调整焦距和晃动补偿的目的。前述电子装置20例如为具有照相或摄影功能的智能手机或是数码相机。在照相或摄影时,光线可穿过光学元件30,且感光模块S可接收前述光线并成像。First, please refer to FIG. 1A and FIG. 1B together. The optical element driving module 10 of an embodiment of the present invention can be installed in an electronic device 20 to carry an optical element 30 (such as a lens), and drive the aforementioned optical element 30 It can be moved relative to the photosensitive module S in the electronic device 20 to achieve the purpose of adjusting focus and compensating for shaking. The aforementioned electronic device 20 is, for example, a smart phone or a digital camera with a camera or video function. When taking pictures or photographing, light can pass through the optical element 30 , and the photosensitive module S can receive the aforementioned light and form an image.

如图2所示,前述光学元件驱动模块10主要包括一壳体100、一活动机构200、多个吊环线300以及一底座400。其中,壳体100和底座400可组合为中空的盒体,且活动机构200可被壳体100所围绕而容置于前述盒体中。壳体100和底座400分别具有相互对应的光学孔O1、O2,光线可依序通过光学孔O1、光学元件30和光学孔O2而抵达感光模块S。As shown in FIG. 2 , the aforementioned optical element driving module 10 mainly includes a housing 100 , a movable mechanism 200 , a plurality of lifting ring wires 300 and a base 400 . Wherein, the casing 100 and the base 400 can be combined into a hollow box, and the movable mechanism 200 can be surrounded by the casing 100 and housed in the aforementioned box. The casing 100 and the base 400 have optical holes O1 and O2 corresponding to each other respectively, and light can pass through the optical hole O1 , the optical element 30 and the optical hole O2 in sequence to reach the photosensitive module S.

活动机构200包括一光学元件承载座210、一框体220、至少一第一电磁驱动组件230、至少一第二电磁驱动组件240、一第一弹性元件250以及一第二弹性元件260。The movable mechanism 200 includes an optical element bearing seat 210 , a frame body 220 , at least one first electromagnetic driving component 230 , at least one second electromagnetic driving component 240 , a first elastic element 250 and a second elastic element 260 .

光学元件承载座210具有一容置空间211和一内凹结构212,其中容置空间211形成于光学元件承载座210的中央,而内凹结构212则形成于光学元件承载座210的外壁面并环绕容置空间211。前述光学元件30可固定于光学元件承载座210上且容置于容置空间211中,而第一电磁驱动组件230则可设置于内凹结构212中。The optical element carrying seat 210 has an accommodating space 211 and a concave structure 212, wherein the accommodating space 211 is formed in the center of the optical element carrying seat 210, and the concave structure 212 is formed on the outer wall surface of the optical element carrying seat 210 and surrounding the accommodation space 211 . The aforementioned optical element 30 can be fixed on the optical element bearing seat 210 and accommodated in the accommodating space 211 , while the first electromagnetic driving component 230 can be disposed in the concave structure 212 .

框体220具有一收容部221和多个凹槽222。前述光学元件承载座210被收容于收容部221中,而第二电磁驱动组件240则被固定于凹槽222中并邻近于前述第一电磁驱动组件230。The frame body 220 has a receiving portion 221 and a plurality of grooves 222 . The aforementioned optical element carrier 210 is accommodated in the receiving portion 221 , and the second electromagnetic driving component 240 is fixed in the groove 222 and adjacent to the aforementioned first electromagnetic driving component 230 .

通过前述第一电磁驱动组件230和第二电磁驱动组件240之间的电磁作用,光学元件承载座210以及设置于光学元件承载座210上的镜头30可被驱动而相对于框体220沿Z轴方向移动。举例而言,于本实施例中,第一电磁驱动组件230可为围绕光学元件承载座210的容置空间211的驱动线圈,而第二电磁驱动组件240则可包括至少一磁铁。当电流通入驱动线圈(第一电磁驱动组件230)时,驱动线圈和磁铁之间将产生电磁作用,如此一来即可带动光学元件承载座210及设置于其上的镜头单元300相对于框体220沿Z轴方向移动,进而相对于感光模块S沿Z轴方向移动,以达成调整焦距的目的。Through the electromagnetic interaction between the first electromagnetic drive assembly 230 and the second electromagnetic drive assembly 240, the optical element carrier 210 and the lens 30 disposed on the optical element carrier 210 can be driven relative to the frame body 220 along the Z axis. direction to move. For example, in this embodiment, the first electromagnetic driving component 230 can be a driving coil surrounding the accommodating space 211 of the optical element carrier 210 , and the second electromagnetic driving component 240 can include at least one magnet. When the current is passed into the driving coil (the first electromagnetic driving assembly 230), an electromagnetic interaction will be generated between the driving coil and the magnet, so that the optical element bearing seat 210 and the lens unit 300 disposed thereon can be driven relative to the frame. The body 220 moves along the Z-axis direction, and then moves relative to the photosensitive module S along the Z-axis direction, so as to achieve the purpose of adjusting the focus.

于一些实施例中,第一电磁驱动组件230可为磁铁,而第二电磁驱动组件240可为驱动线圈。In some embodiments, the first electromagnetic driving component 230 can be a magnet, and the second electromagnetic driving component 240 can be a driving coil.

如图2所示,第一弹性元件250和第二弹性元件260分别设置于光学元件承载座210/框体220的相反侧,使光学元件承载座210/框体220位于第一弹性元件250和第二弹性元件260之间。第一弹性元件250的内圈段251连接光学元件承载座210,且第一弹性元件250的外圈段252连接前述框体220。同样的,第二弹性元件260的内圈段261连接光学元件承载座210,且第二弹性元件260的外圈段262连接框体220。如此一来,光学元件承载座210可通过前述第一弹性元件250和第二弹性元件260而被悬挂于框体220的收容部221中,且其在Z轴方向的移动幅度亦可被第一、第二弹性元件250、260限制。As shown in Figure 2, the first elastic element 250 and the second elastic element 260 are respectively arranged on the opposite sides of the optical element bearing seat 210/frame body 220, so that the optical element bearing seat 210/frame body 220 is located between the first elastic element 250 and the second elastic element 250. between the second elastic elements 260 . The inner ring section 251 of the first elastic element 250 is connected to the optical element bearing seat 210 , and the outer ring section 252 of the first elastic element 250 is connected to the aforementioned frame body 220 . Similarly, the inner ring section 261 of the second elastic element 260 is connected to the optical element bearing seat 210 , and the outer ring section 262 of the second elastic element 260 is connected to the frame body 220 . In this way, the optical element bearing seat 210 can be suspended in the receiving portion 221 of the frame body 220 through the first elastic element 250 and the second elastic element 260, and its movement range in the Z-axis direction can also be controlled by the first elastic element 250 and the second elastic element 260. , The second elastic member 250, 260 limits.

请参阅图3,于本实施例中,底座400包括一本体410、一第一线路420、一第二线路430以及一线圈组件440。其中,本体410具有一第一表面411、一第二表面412以及多个开口413,第一表面411相反于第二表面412,且第二表面412朝向前述光学元件承载座210。Please refer to FIG. 3 , in this embodiment, the base 400 includes a body 410 , a first circuit 420 , a second circuit 430 and a coil assembly 440 . Wherein, the body 410 has a first surface 411 , a second surface 412 and a plurality of openings 413 , the first surface 411 is opposite to the second surface 412 , and the second surface 412 faces the aforementioned optical element bearing seat 210 .

第一线路420和第二线路430分别形成于第一表面411和第二表面412上,且可分别与感光模块S和线圈组件440电性连接。同样的,当电流经由第二线路430流经线圈组件440时,线圈组件440和前述第二电磁驱动组件240(或第一电磁驱动组件230)之间会产生电磁作用,使光学元件承载座210和框体220相对于底座400沿X轴方向及/或Y轴方向移动,进而带动光学元件30相对于感光模块S沿X轴方向及/或Y轴方向移动,以达到晃动补偿的目的。The first circuit 420 and the second circuit 430 are formed on the first surface 411 and the second surface 412 respectively, and can be electrically connected to the photosensitive module S and the coil assembly 440 respectively. Similarly, when the current flows through the coil assembly 440 via the second circuit 430, an electromagnetic interaction will be generated between the coil assembly 440 and the aforementioned second electromagnetic drive assembly 240 (or the first electromagnetic drive assembly 230), so that the optical element bearing seat 210 The frame body 220 moves along the X-axis direction and/or the Y-axis direction relative to the base 400 , and then drives the optical element 30 to move relative to the photosensitive module S along the X-axis direction and/or the Y-axis direction, so as to achieve the purpose of shake compensation.

于一些实施例中,本体410包括绝缘板材,而第一线路420和第二线路430则是通过镀膜或模塑互联物件(Molded Interconnect Device,MID)的方式直接形成于绝缘板材上。前述模塑互联物件的方式例如为通过激光直接成型(Laser Direct Structuring,LDS)、微体积化工艺技术(Microscopic Integrated Processing Technology,MIPTEC)、激光诱导金属化技术(Laser Induced Metallization,LIM)、激光印刷重组技术(LaserRestructuring Print,LRP)、气悬胶喷印工艺(Aerosol Jet Process)、或双料射出(Two-shot molding method)。于一些实施例中,为了增加底座400的硬度和平整度,本体410可包括金属板材和设置于金属板材相反面的绝缘层,第一线路420和第二线路430同样可通过镀膜或模塑互联物件的方式直接形成于前述绝缘层上。In some embodiments, the body 410 includes an insulating board, and the first circuit 420 and the second circuit 430 are directly formed on the insulating board by coating or molding an interconnect device (MID). The aforementioned methods of molding interconnected objects are, for example, laser direct structuring (Laser Direct Structuring, LDS), microscopic integrated processing technology (MiPTEC), laser induced metallization technology (Laser Induced Metallization, LIM), laser printing Recombination technology (Laser Restructuring Print, LRP), aerosol jet printing process (Aerosol Jet Process), or double-material injection (Two-shot molding method). In some embodiments, in order to increase the hardness and flatness of the base 400, the body 410 may include a metal plate and an insulating layer disposed on the opposite side of the metal plate, and the first circuit 420 and the second circuit 430 may also be interconnected by coating or molding Objects are directly formed on the aforementioned insulating layer.

请继续参阅图3,本体410的开口413由第一表面411延伸至第二表面412,且开口413的数量和位置对应于吊环线300的位置和数量。吊环线300可延伸穿过前述开口413并与第一线路420电性连接,且其两端分别通过焊锡R固定于第一弹性元件250和本体410的第一表面411。由于吊环线300的长度大于或等于第一弹性元件250与底座400之间的距离加上底座400的厚度,因此相较于现有镜头驱动模块中的吊环线,本实用新型的前述吊环线300可在有限的空间内具有较长的长度,有利于降低光学元件驱动模块10的厚度。Please continue to refer to FIG. 3 , the openings 413 of the body 410 extend from the first surface 411 to the second surface 412 , and the number and positions of the openings 413 correspond to the positions and numbers of the ring wires 300 . The ring wire 300 can extend through the aforementioned opening 413 and be electrically connected to the first circuit 420 , and its two ends are respectively fixed to the first elastic element 250 and the first surface 411 of the body 410 by solder R. Since the length of the loop wire 300 is greater than or equal to the distance between the first elastic element 250 and the base 400 plus the thickness of the base 400, compared with the loop wire in the existing lens drive module, the aforementioned loop wire 300 of the present invention It can have a longer length in a limited space, which is beneficial to reduce the thickness of the optical element driving module 10 .

当光学元件承载座210和镜头30沿X轴方向及/或Y轴方向移动时,吊环线300可限制其移动幅度。应注意的是,如图3所示,吊环线300和开口413的内壁之间应具有一间隙,以避免在光学元件承载座210移动时,吊环线300接触开口413的内壁而产生弯折。此外,由于吊环线280包含金属材料(例如铜或其合金等),因此亦可作为导体使用。举例而言,电流可经由底座400和吊环线300流入第一电磁驱动组件230。When the optical element bearing seat 210 and the lens 30 move along the X-axis direction and/or the Y-axis direction, the lifting ring wire 300 can limit the moving range thereof. It should be noted that, as shown in FIG. 3 , there should be a gap between the ring wire 300 and the inner wall of the opening 413 , so as to avoid bending caused by the ring wire 300 contacting the inner wall of the opening 413 when the optical element carrier 210 moves. In addition, since the ring wire 280 includes metal material (such as copper or its alloy, etc.), it can also be used as a conductor. For example, electric current can flow into the first electromagnetic driving assembly 230 through the base 400 and the ring wire 300 .

如图2所示,于本实施例中,光学元件驱动模块10还包括多个设置于底座400上的位置检测器500。这些位置检测器500是通过检测第二电磁驱动组件240的位移来确定光学元件承载座210和光学元件30于X轴方向以及Y轴方向上的位置。举例而言,前述位置检测器500可包括霍尔效应感测器(Hall Sensor)、磁阻效应感测器(Magnetoresistance EffectSensor,MR Sensor)、巨磁阻效应感测器(Giant Magnetoresistance Effect Sensor,GMRSensor)、穿隧磁阻效应感测器(Tunneling Magnetoresistance Effect Sensor,TMRSensor)、或磁通量感测器(Fluxgate)。As shown in FIG. 2 , in this embodiment, the optical element driving module 10 further includes a plurality of position detectors 500 disposed on the base 400 . These position detectors 500 determine the positions of the optical element carrier 210 and the optical element 30 in the X-axis direction and the Y-axis direction by detecting the displacement of the second electromagnetic driving assembly 240 . For example, the aforementioned position detector 500 may include a Hall effect sensor (Hall Sensor), a magnetoresistance effect sensor (Magnetoresistance Effect Sensor, MR Sensor), a giant magnetoresistance effect sensor (Giant Magnetoresistance Effect Sensor, GMRSensor) ), a tunneling magnetoresistance effect sensor (Tunneling Magnetoresistance Effect Sensor, TMRSensor), or a magnetic flux sensor (Fluxgate).

请参阅图4A,于本实用新型另一实施例中,底座400的本体410还具有一凹陷部414,且凹陷部414的底面414a与第二表面412之间的距离小于第一表面411和第二表面412之间的距离。需特别说明的是,本实施例中的底面414a与第二表面412之间的距离大致等于图1A~图3所示的实施例中第一表面411和第二表面412之间的距离,因此,本实施例中的吊环线300的长度可更为增加。Please refer to FIG. 4A. In another embodiment of the present invention, the body 410 of the base 400 also has a recessed portion 414, and the distance between the bottom surface 414a of the recessed portion 414 and the second surface 412 is smaller than the first surface 411 and the second surface 412. The distance between the two surfaces 412 . It should be noted that the distance between the bottom surface 414a and the second surface 412 in this embodiment is approximately equal to the distance between the first surface 411 and the second surface 412 in the embodiment shown in FIGS. 1A to 3 , therefore , the length of the ring wire 300 in this embodiment can be further increased.

再者,如图4B所示,当光学元件驱动模块10连接感光模块S时,感光模块S的至少一部分可容置于前述凹陷部414中,故光学元件驱动模块10和感光模块S的整体厚度不会增加,有利于电子装置20的小型化。Furthermore, as shown in FIG. 4B, when the optical element driving module 10 is connected to the photosensitive module S, at least a part of the photosensitive module S can be accommodated in the aforementioned recess 414, so the overall thickness of the optical element driving module 10 and the photosensitive module S It does not increase, which is beneficial to the miniaturization of the electronic device 20 .

请参阅图5,于本实用新型另一实施例中,底座400的本体410还包括一侧面417和至少一凸起416,其中前述侧面417连接第一表面411和一第二表面412,而凸起416则凸出于第一表面411并设置于吊环线300周围。吊环线300固定于第一表面411上的一端位于前述侧面417和凸起416之间,因此,可避免固定吊环线300时,焊锡R流向底座400的中心(或凹陷部414中),进而避免光学元件驱动模块10连接感光模块S时,感光模块S接触到前述焊锡R而导致短路的情形。Please refer to Fig. 5, in another embodiment of the present utility model, the body 410 of the base 400 also includes a side 417 and at least one protrusion 416, wherein the aforementioned side 417 connects the first surface 411 and a second surface 412, and the protrusion The protrusion 416 protrudes from the first surface 411 and is disposed around the ring wire 300 . One end of the lifting ring wire 300 fixed on the first surface 411 is located between the aforementioned side surface 417 and the protrusion 416, so that when the lifting ring wire 300 is fixed, the solder R flows to the center of the base 400 (or in the concave portion 414), thereby avoiding When the optical element driving module 10 is connected to the photosensitive module S, the photosensitive module S contacts the aforementioned solder R, resulting in a short circuit.

请参阅图6,于本实用新型另一实施例中,底座400还包括埋设于本体410中的内线路450。第一线路420和内线路450是通过嵌入成形(insert molding)的方式形成于本体410上,且内线路450与第二线路430电性连接。Please refer to FIG. 6 , in another embodiment of the present invention, the base 400 further includes an inner circuit 450 embedded in the body 410 . The first circuit 420 and the inner circuit 450 are formed on the body 410 by insert molding, and the inner circuit 450 is electrically connected to the second circuit 430 .

如图7A~图7C所示,于本实用新型一些实施例中,第一线路420可通过与本体410连接的金属片形成,而第二线路430则可为与本体410连接的柔性印刷电路板(FlexiblePrinted Circuit,FPC)。于一些实施例中,第一线路420和第二线路430可通过在本体410的相反侧分别设置柔性印刷电路板形成。于一些实施例中,本体410具有金属材质和绝缘层,且绝缘层设置于金属材质的表面上,第一线路420和第二线路430可设置于本体410的绝缘层上。As shown in FIGS. 7A to 7C , in some embodiments of the present invention, the first circuit 420 can be formed by a metal sheet connected to the body 410 , while the second circuit 430 can be a flexible printed circuit board connected to the body 410 (Flexible Printed Circuit, FPC). In some embodiments, the first circuit 420 and the second circuit 430 may be formed by respectively disposing flexible printed circuit boards on opposite sides of the body 410 . In some embodiments, the body 410 has a metal material and an insulating layer, and the insulating layer is disposed on the surface of the metal material, and the first circuit 420 and the second circuit 430 can be disposed on the insulating layer of the body 410 .

请参阅图8A、图8B,为了降低光学元件驱动模块10的厚度,于本实用新型另一实施例中,底座400可包括一本体410、一线圈组件440、一第一绝缘层460、一第二绝缘层470、一金属基板480、至少一第一隔离元件B1以及至少一第二隔离元件B2。Please refer to FIG. 8A and FIG. 8B. In order to reduce the thickness of the optical element driving module 10, in another embodiment of the present utility model, the base 400 may include a body 410, a coil assembly 440, a first insulating layer 460, a first Two insulating layers 470, a metal substrate 480, at least one first isolation element B1 and at least one second isolation element B2.

前述本体410由彼此分离的多个金属框架415所构成,并具有多个延伸部418和多个引脚419。其中,延伸部418为本体410的四个角落,朝向远离活动机构200的方向延伸并具有L字型截面。图8C所示,延伸部418的底面可为第一表面411,而金属框架415朝向活动机构200的表面可为第二表面412。延伸部418被第一隔离元件B1所围绕,且吊环线300的一端可穿过延伸部418并以焊锡R固定于第一表面411。The aforementioned body 410 is composed of a plurality of metal frames 415 separated from each other, and has a plurality of extensions 418 and a plurality of pins 419 . Wherein, the extension portion 418 is the four corners of the body 410 , extending away from the moving mechanism 200 and having an L-shaped cross section. As shown in FIG. 8C , the bottom surface of the extension part 418 may be the first surface 411 , and the surface of the metal frame 415 facing the moving mechanism 200 may be the second surface 412 . The extension part 418 is surrounded by the first isolation element B1 , and one end of the lifting ring wire 300 can pass through the extension part 418 and be fixed on the first surface 411 by solder R.

通过第一隔离元件B1,可增加延伸部418的强度,避免框体220相对于底座400移动时,延伸部418受到吊环线300的拉扯而弯折,且可防止前述焊锡R的溢流造成金属框架415之间发生短路。此外,于本实施例中,第一隔离元件B1具有一中空结构,且一阻尼元件D设置于此中空结构中,以包覆部分吊环线300。如此一来,可减少吊环线300在框体220相对于底座400移动时的震动。Through the first isolation element B1, the strength of the extension part 418 can be increased to prevent the extension part 418 from being bent by the pull of the ring wire 300 when the frame body 220 moves relative to the base 400, and it can prevent the overflow of the aforementioned solder R from causing metal A short circuit occurs between frames 415 . In addition, in this embodiment, the first isolation element B1 has a hollow structure, and a damping element D is disposed in the hollow structure to cover part of the suspension loop wire 300 . In this way, the vibration of the hanging ring wire 300 when the frame body 220 moves relative to the base 400 can be reduced.

请回到图8A、图8B,引脚419同样是朝向远离活动机构200的方向延伸,因此可与感光模块S相邻并与其电性连接。前述金属框架415是形成于第一绝缘层460上,且金属框架415于第一绝缘层460上的投影面积大于第一绝缘层460面积的50%,因此可提升基座400的机械强度。此外,第一绝缘层460上形成有多个开口461,吊环线300和位置检测器500可通过这些开口461与金属框架415连接。Please return to FIG. 8A and FIG. 8B , the pin 419 also extends away from the moving mechanism 200 , so it can be adjacent to the photosensitive module S and electrically connected thereto. The aforementioned metal frame 415 is formed on the first insulating layer 460 , and the projected area of the metal frame 415 on the first insulating layer 460 is larger than 50% of the area of the first insulating layer 460 , so the mechanical strength of the base 400 can be improved. In addition, a plurality of openings 461 are formed on the first insulating layer 460 , and the ring wire 300 and the position detector 500 can be connected to the metal frame 415 through these openings 461 .

如图8D所示,当位置检测器500与金属框架415连接时,第二隔离元件B2围绕位置检测器500和金属框架415的连接处。同样的,借此可避免在将位置检测器500焊接至金属框架415时,焊锡往外扩散而导致金属框架415之间发生短路。As shown in FIG. 8D , when the position detector 500 is connected to the metal frame 415 , the second isolation element B2 surrounds the joint between the position detector 500 and the metal frame 415 . Likewise, when the position detector 500 is welded to the metal frame 415 , the solder diffuses out and causes a short circuit between the metal frames 415 .

第二绝缘层470设置于线圈组件440和本体410之间。与第一绝缘层460类似,第二绝缘层470上亦形成多个开口471,吊环线300和线圈组件440可通过这些开口471与金属框架415连接。The second insulating layer 470 is disposed between the coil component 440 and the body 410 . Similar to the first insulating layer 460 , a plurality of openings 471 are formed on the second insulating layer 470 , and the ring wire 300 and the coil assembly 440 can be connected to the metal frame 415 through these openings 471 .

金属基板480连接第一绝缘层460,且第一绝缘层460位于本体410和金属基板480之间。通过前述金属基板480,可以提升本体410的平整度,且可通过将金属基板480焊接至壳体100来结合底座400和壳体100。The metal substrate 480 is connected to the first insulating layer 460 , and the first insulating layer 460 is located between the body 410 and the metal substrate 480 . Through the foregoing metal substrate 480 , the flatness of the body 410 can be improved, and the base 400 and the casing 100 can be combined by welding the metal substrate 480 to the casing 100 .

需特别说明的是,第一绝缘层460的厚度小于本体410的厚度的一半,且第二绝缘层470的厚度亦小于本体410的厚度的一半,因此,相较于前述在绝缘板材相反表面铺设线路的底座,本实施例的底座400的厚度可更为降低。于一些实施例中,第一绝缘层460和第二绝缘层470的厚度分别小于本体410的厚度的四分之一,例如本体410的厚度介于0.15mm~0.20mm,而第一绝缘层和第二绝缘层470的厚度则介于0.01mm~0.03mm。It should be noted that the thickness of the first insulating layer 460 is less than half of the thickness of the main body 410, and the thickness of the second insulating layer 470 is also less than half of the thickness of the main body 410. The base of the circuit, the thickness of the base 400 in this embodiment can be further reduced. In some embodiments, the thicknesses of the first insulating layer 460 and the second insulating layer 470 are respectively less than a quarter of the thickness of the main body 410, for example, the thickness of the main body 410 is between 0.15 mm and 0.20 mm, while the first insulating layer and the second insulating layer The thickness of the second insulating layer 470 is between 0.01mm˜0.03mm.

于一些实施例中,可依需求省略底座400中的第二绝缘层470及/或金属基板480,使底座400的厚度更为减少。于一些实施例中,本体410的金属框架415之间可填充绝缘材料,使线圈组件440及/或第二绝缘层470可更为平整地设置在本体410上,其中前述绝缘材料相异于第一、第二绝缘层460、470的材料。In some embodiments, the second insulating layer 470 and/or the metal substrate 480 in the base 400 can be omitted as required, so that the thickness of the base 400 can be further reduced. In some embodiments, an insulating material may be filled between the metal frame 415 of the body 410, so that the coil component 440 and/or the second insulating layer 470 may be disposed on the body 410 more flatly, wherein the aforementioned insulating material is different from the first insulating material. 1. Materials of the second insulating layers 460 and 470 .

请参阅图9A、图9B,于本实用新型另一实施例中,底座400可还包括一第三隔离元件B3,围绕底座400的本体410。当底座400和壳体100结合时,焊锡或粘胶G可位于第三隔离元件B3和壳体100之间,借此可增加焊锡或粘胶G的接触面积,并可达到防止异物入侵的效果。Referring to FIG. 9A and FIG. 9B , in another embodiment of the present invention, the base 400 may further include a third isolation element B3 surrounding the body 410 of the base 400 . When the base 400 and the housing 100 are combined, the solder or glue G can be located between the third isolation element B3 and the housing 100, thereby increasing the contact area of the solder or glue G, and achieving the effect of preventing the intrusion of foreign matter .

如图10所示,于本实用新型另一实施例中,本体410的延伸部418可朝向活动机构200延伸,以承载活动机构200的元件,例如前述第二弹性元件260。As shown in FIG. 10 , in another embodiment of the present invention, the extension portion 418 of the body 410 can extend toward the moving mechanism 200 to carry components of the moving mechanism 200 , such as the aforementioned second elastic element 260 .

综上所述,本实用新型提供一种光学元件驱动模块。通过光学元件驱动模块的吊环线延伸穿过底座,可使吊环线在光学元件驱动模块具有较低厚度的状态下仍具有适当的拉力。此外,通过光学元件驱动模块中的底座包括多个金属框架,更可使底座的厚度降低,进而达成减少光学元件驱动模块厚度的功效。To sum up, the utility model provides an optical element driving module. The lifting ring wire of the optical element driving module is extended through the base, so that the lifting ring wire can still have a proper pulling force when the optical element driving module has a relatively low thickness. In addition, the base in the optical element driving module includes a plurality of metal frames, so that the thickness of the base can be reduced, thereby achieving the effect of reducing the thickness of the optical element driving module.

虽然本实用新型的实施例及其优点已公开如上,但应该了解的是,本领域技术人员在不脱离本实用新型的精神和范围内,当可作更动、替代与润饰。此外,本实用新型的保护范围并未局限于说明书内所述特定实施例中的工艺、机器、制造、物质组成、装置、方法及步骤,本领域技术人员可从本实用新型公开内容中理解现行或未来所发展出的工艺、机器、制造、物质组成、装置、方法及步骤,只要可以在此处所述实施例中实施大抵相同功能或获得大抵相同结果皆可根据本实用新型使用。因此,本实用新型的保护范围包括上述工艺、机器、制造、物质组成、装置、方法及步骤。另外,每一权利要求书构成个别的实施例,且本实用新型的保护范围也包括各个权利要求书及实施例的组合。Although the embodiments of the present invention and their advantages have been disclosed above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the protection scope of the present utility model is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the specification. Those skilled in the art can understand the existing Or the technology, machine, manufacture, composition of matter, device, method and steps developed in the future, as long as they can implement substantially the same function or obtain substantially the same result in the embodiments described here, they can all be used according to the present invention. Therefore, the protection scope of the present utility model includes the above-mentioned process, machine, manufacture, composition of matter, device, method and steps. In addition, each claim constitutes an individual embodiment, and the protection scope of the present invention also includes the combination of each claim and the embodiment.

虽然本实用新型以前述多个较佳实施例公开如上,然其并非用以限定本实用新型。实用新型本领域技术人员在不脱离本实用新型的精神和范围内,当可做些许的更动与润饰。因此本实用新型的保护范围当视后附的权利要求书所界定者为准。此外,每个权利要求书建构成一独立的实施例,且各种权利要求书及实施例的组合皆介于本实用新型的范围内。Although the present invention is disclosed above with the aforementioned preferred embodiments, it is not intended to limit the present invention. Utility model Those skilled in the art may make some changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the present utility model should be defined by the appended claims as the criterion. In addition, each claim constitutes an independent embodiment, and combinations of various claims and embodiments fall within the scope of the present invention.

Claims (13)

1.一种光学元件驱动模块,其特征在于,所述光学元件驱动模块包括:1. An optical element drive module, characterized in that, the optical element drive module comprises: 一活动机构,包括一光学元件承载座;A movable mechanism, including an optical element bearing seat; 一底座,包括一本体,且该本体具有一第一表面、一第二表面和一开口,其中该第二表面朝向该光学元件承载座并相反于该第一表面,且该开口由该第一表面延伸至该第二表面;A base, including a body, and the body has a first surface, a second surface and an opening, wherein the second surface faces the optical element bearing seat and is opposite to the first surface, and the opening is formed by the first surface the surface extends to the second surface; 一吊环线,穿过该开口,且该吊环线的两端分别固定于该第一表面和该活动机构;以及a ring wire passing through the opening, and the two ends of the ring wire are respectively fixed to the first surface and the movable mechanism; and 一电磁驱动机构,用以驱动该活动机构相对于该底座移动。An electromagnetic driving mechanism is used to drive the movable mechanism to move relative to the base. 2.如权利要求1所述的光学元件驱动模块,其特征在于,该吊环线与该开口的内壁之间具有一间隙。2 . The optical element driving module according to claim 1 , wherein there is a gap between the lifting ring wire and the inner wall of the opening. 3 . 3.如权利要求1所述的光学元件驱动模块,其特征在于,该底座具有一凹陷部,且该凹陷部的一底面与该第二表面之间的距离小于该第一表面与该第二表面之间的距离。3. The optical element driving module according to claim 1, wherein the base has a concave portion, and the distance between a bottom surface of the concave portion and the second surface is smaller than that between the first surface and the second surface distance between surfaces. 4.如权利要求3所述的光学元件驱动模块,其特征在于,该光学元件驱动模块设置于一感光模块上,且该感光模块的至少一部分容置于该凹陷部中。4 . The optical element driving module according to claim 3 , wherein the optical element driving module is disposed on a photosensitive module, and at least a part of the photosensitive module is accommodated in the concave portion. 5.如权利要求1所述的光学元件驱动模块,其特征在于,该底座具有一凸起,凸出于该第一表面。5. The optical element driving module as claimed in claim 1, wherein the base has a protrusion protruding from the first surface. 6.如权利要求5所述的光学元件驱动模块,其特征在于,该凸起设置于该吊环线周围。6. The optical element driving module as claimed in claim 5, wherein the protrusion is disposed around the ring wire. 7.如权利要求5所述的光学元件驱动模块,其特征在于,该底座具有一侧面,连接该第一表面和该第二表面,且该吊环线的一端位于该侧面和该凸起之间。7. The optical element driving module according to claim 5, wherein the base has a side connecting the first surface and the second surface, and one end of the suspension ring wire is located between the side and the protrusion . 8.如权利要求1所述的光学元件驱动模块,其特征在于,该底座还包括一第一线路,设置于该第一表面。8. The optical element driving module according to claim 1, wherein the base further comprises a first circuit disposed on the first surface. 9.如权利要求8所述的光学元件驱动模块,其特征在于,该底座还包括一内线路,埋设于该本体中,并与该第一线路电性连接。9 . The optical element driving module according to claim 8 , wherein the base further comprises an internal circuit embedded in the body and electrically connected to the first circuit. 10.如权利要求9所述的光学元件驱动模块,其特征在于,该第一线路和该内线路利用嵌入成形的方式形成于该本体上。10. The optical element driving module according to claim 9, wherein the first circuit and the inner circuit are formed on the body by insert molding. 11.如权利要求8所述的光学元件驱动模块,其特征在于,该第一线路利用模塑互联物件或镀膜的方式形成于该本体上。11 . The optical element driving module according to claim 8 , wherein the first circuit is formed on the body by molded interconnection or coating. 12.如权利要求8所述的光学元件驱动模块,其特征在于,该第一线路通过连接该本体的一金属片形成。12. The optical element driving module as claimed in claim 8, wherein the first circuit is formed by connecting a metal sheet of the body. 13.如权利要求1所述的光学元件驱动模块,其特征在于,该驱动模块还包括一第二线路,设置于该第二表面,并与该电磁驱动机构电性连接。13 . The optical element driving module according to claim 1 , further comprising a second circuit disposed on the second surface and electrically connected to the electromagnetic driving mechanism. 14 .
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