CN215183861U - Die piece mounting device of chip ball-planting tool - Google Patents
Die piece mounting device of chip ball-planting tool Download PDFInfo
- Publication number
- CN215183861U CN215183861U CN202121487189.3U CN202121487189U CN215183861U CN 215183861 U CN215183861 U CN 215183861U CN 202121487189 U CN202121487189 U CN 202121487189U CN 215183861 U CN215183861 U CN 215183861U
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- middle frame
- die
- die fixing
- ball
- die piece
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Abstract
The utility model relates to a chip plants mould piece installation device of ball frock installs on base subassembly, and this mould piece installation device includes fixed center of mould, eccentric quick detach device and the mould piece of planting the ball, it has a plurality of first permanent magnets to inlay on the fixed center of mould, the fixed center downside of mould is equipped with enclosure baffle under the center, enclosure baffle blocks base subassembly under the center, what eccentric quick detach device was rotatable installs under the center on enclosure baffle and eccentric quick detach device extrusion base subassembly, each first permanent magnet adsorbs base subassembly, the mould piece of planting the ball is adorned admittedly on the fixed center of mould, plants the tin ball position accuracy.
Description
Technical Field
The utility model relates to a chip ball planting technical field especially relates to a mould piece installation device of chip ball planting frock.
Background
Chip pin is mostly the material that contains tin, and on the one hand, in carrying out circuit board assembly process, the device can melt because of through high temperature welding, soldering tin on the device to be in the same place with the circuit end butt fusion on the circuit board. In addition, if the BGA device needs to be repaired, when the BGA device is detached from the circuit board, the pins of the BGA device are changed into a disordered shape due to the fact that the pin materials are melted and deformed at high temperature, and a new solder ball needs to be implanted again after the device is detached.
SUMMERY OF THE UTILITY MODEL
For overcoming the technical defect that prior art exists, the utility model provides a die piece installation device of chip ball planting frock plants the tin ball position accuracy.
The utility model discloses a technical solution be:
the die piece installation device of the chip ball planting tool is installed on the base assembly and comprises a die fixing middle frame, an eccentric quick-release device and a ball planting die piece, a plurality of first permanent magnets are embedded on the die fixing middle frame, a middle frame lower side is provided with a middle frame lower baffle plate, the middle frame lower baffle plate blocks the base assembly, the eccentric quick-release device is rotatably installed on the middle frame lower baffle plate, the eccentric quick-release device extrudes the base assembly, each first permanent magnet adsorbs the base assembly, and the ball planting die piece is fixedly installed on the die fixing middle frame.
Preferably, the die piece mounting device further comprises a die fixing upper cover, wherein the upper side of the die fixing middle frame is provided with a middle frame upper enclosing baffle, the die fixing upper cover is embedded between the middle frame upper enclosing baffles and clamps the ball-planting die piece between the die fixing upper cover and the die fixing middle frame, and each first permanent magnet adsorbs the die fixing upper cover.
Preferably, the die piece mounting device further comprises two adjusting rods, the two adjusting rods are embedded into the die fixing middle frame, and adjusting tapered grooves are formed in the adjusting rods.
Preferably, the upper side of the middle fixing frame of the mold is provided with a plurality of anti-skid rubber strips.
Preferably, the eccentric quick-release device comprises a control rod, an extrusion pin and an extrusion roller, the extrusion pin is fixedly arranged on the lower enclosure plate of the middle frame, the control rod is fixedly arranged on the extrusion roller, and the extrusion roller is rotatably and eccentrically arranged on the lower enclosure plate of the middle frame through the extrusion pin.
Preferably, the extrusion roller is rotatably mounted on a middle frame lower baffle plate at one corner of the fixed middle frame of the die through an extrusion pin.
The utility model has the advantages that:
the die piece mounting device comprises a die fixing middle frame, an eccentric quick-release device and a ball-planting die piece, wherein a plurality of first permanent magnets are embedded on the die fixing middle frame, a middle frame lower baffle is arranged on the lower side of the die fixing middle frame, a base assembly is clamped by the middle frame lower baffle, the eccentric quick-release device is rotatably mounted on the middle frame lower baffle and extrudes the base assembly through the eccentric quick-release device, the die fixing middle frame is fixedly mounted on the base assembly, the first permanent magnets adsorb the base assembly and are used for attaching the die fixing middle frame to attract the base assembly before the eccentric quick-release device locks the die fixing middle frame, the ball-planting die piece is ensured to be pressed close to a chip, the ball-planting die piece is fixedly mounted on the die fixing middle frame, the position of the ball-planting die piece cannot be dislocated, and the position of the ball-planting die piece is accurate.
Drawings
Fig. 1 is a schematic view of the installation position structure of the present invention.
Fig. 2 is a schematic view of the upper side structure of the mold fixing middle frame.
Fig. 3 is a schematic view of the structure of the lower side of the mold fixing middle frame.
Fig. 4 is an enlarged schematic view of a portion a in fig. 3.
Description of reference numerals:
1. a base assembly;
2. a die piece mounting device; 21. planting a ball mould sheet; 22. fixing the middle frame by the mold; 221. a first permanent magnet; 222. a middle frame lower surrounding baffle plate; 223. the middle frame is provided with an upper surrounding baffle; 224. an anti-slip rubber strip; 23. an eccentric quick release device; 231. a control lever; 232. a squeeze pin; 233. extruding the roller; 24. the upper cover is fixed on the mould; 25. an adjusting lever; 251. and adjusting the tapered slot.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings:
as shown in fig. 1-4, the present embodiment provides a die chip mounting device of a die ball mounting fixture, which is mounted on a base assembly 1, the die piece mounting device 2 comprises a die fixing middle frame 22, an eccentric quick-release device 23 and a ball-planting die piece 21, wherein a plurality of first permanent magnets 221 are embedded on the die fixing middle frame 22, a middle frame lower surrounding baffle 222 is arranged on the lower side of the die fixing middle frame 22, the middle frame lower surrounding baffle 222 clamps a base assembly 1, the eccentric quick-release device 23 is rotatably mounted on the middle frame lower surrounding baffle 222, the eccentric quick-release device 23 extrudes the base assembly 1, further, the mold fixing middle frame 22 is fixed on the base assembly 1, each first permanent magnet 221 adsorbs the base assembly 1, the device is used for attracting and attaching the die fixing middle frame 22 to the base assembly 1 before the eccentric quick-release device 23 locks the die fixing middle frame 22, so that the ball-planting die piece 21 is ensured to be close to a chip, and the ball-planting die piece 21 is fixedly arranged on the die fixing middle frame 22.
The die piece mounting device 2 further comprises a die fixing upper cover 24, the upper side of the die fixing middle frame 22 is provided with a middle frame upper baffle 223, the die fixing upper cover 24 is embedded into the middle frame upper baffle 223 and clamps the ball planting die piece 21 between the die fixing upper cover 24 and the die fixing middle frame 22, each first permanent magnet 221 adsorbs the die fixing upper cover 24, the upper side of the die fixing middle frame 22 is provided with a plurality of anti-slip rubber strips 224, the die fixing upper cover 24 compresses the ball planting die piece 21 under the adsorption of the first permanent magnet 221, the anti-slip rubber strips 224 further prevent the ball planting die piece 21 from sliding, the position of the ball planting position cannot be dislocated, and the position of the ball planting position is accurate.
The die piece mounting device 2 further comprises two adjusting rods 25, the two adjusting rods 25 are embedded into the die fixing middle frame 22 to be stored, adjusting tapered grooves 251 are formed in the adjusting rods 25, the adjusting rods 25 are respectively held by two hands when the position of the ball-planting die piece 21 needs to be adjusted, the adjusting tapered grooves 251 in the two adjusting rods 25 are used for clamping two opposite angles of the ball-planting die piece 21 and aligning the relative positions of hole positions on the ball-planting die piece 21 and chip pins.
The eccentric quick-release device 23 comprises a control rod 231, an extrusion pin 232 and an extrusion roller 233, wherein the extrusion pin 232 is fixedly arranged on the middle frame lower surrounding baffle 222, the control rod 231 is fixedly arranged on the extrusion roller 233, the extrusion roller 233 is rotatably and eccentrically arranged on the middle frame lower surrounding baffle 222 through the extrusion pin 232, the extrusion roller 233 is rotatably arranged on the middle frame lower surrounding baffle 222 at one corner of the die fixing middle frame 22 through the extrusion pin 232, the die fixing middle frame 22 is placed on the base assembly 1 when the die fixing middle frame 22 is arranged, the extrusion roller 233 is driven to rotate by rotating the control rod 231, the extrusion roller 233 extrudes the base assembly 1, and the middle frame upper surrounding baffle 223 is fixedly arranged on the base assembly 1.
Having shown and described the fundamental principles and the principal features of the invention and its advantages, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (6)
1. The die piece installation device of the chip ball planting tool is installed on the base assembly and is characterized by comprising a die fixing middle frame, an eccentric quick-release device and a ball planting die piece, wherein a plurality of first permanent magnets are embedded on the die fixing middle frame, a middle frame lower side is arranged on the die fixing middle frame and provided with a middle frame lower baffle plate, the middle frame lower baffle plate blocks the base assembly, the eccentric quick-release device is rotatably installed on the middle frame lower baffle plate and extrudes the base assembly through the eccentric quick-release device, and each first permanent magnet adsorbs the base assembly, and the ball planting die piece is fixedly installed on the die fixing middle frame.
2. The die piece mounting device of the chip ball mounting tool according to claim 1, further comprising a die fixing upper cover, wherein an upper surrounding baffle of the middle frame is arranged on the upper side of the die fixing middle frame, the die fixing upper cover is embedded between the upper surrounding baffles of the middle frame and clamps the ball mounting die piece between the die fixing upper cover and the die fixing middle frame, and each first permanent magnet adsorbs the die fixing upper cover.
3. The die piece mounting device of the chip ball mounting tool according to claim 2, wherein the die piece mounting device further comprises two adjusting rods, the two adjusting rods are embedded into the die fixing middle frame, and adjusting tapered grooves are formed in the adjusting rods.
4. The die piece mounting device of the chip ball mounting tool according to claim 2, wherein a plurality of anti-slip rubber strips are arranged on the upper side of the die fixing middle frame.
5. The die piece mounting device of the chip ball mounting tool according to claim 2, wherein the eccentric quick release device comprises a control rod, an extrusion pin and an extrusion roller, the extrusion pin is fixedly arranged on the lower surrounding baffle of the middle frame, the control rod is fixedly arranged on the extrusion roller, and the extrusion roller is rotatably and eccentrically mounted on the lower surrounding baffle of the middle frame through the extrusion pin.
6. The die piece mounting device of the die ball mounting tool according to claim 5, wherein the extrusion roller is rotatably mounted on a lower surrounding baffle plate of the middle frame at one corner of the fixed middle frame of the die through an extrusion pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121487189.3U CN215183861U (en) | 2021-07-01 | 2021-07-01 | Die piece mounting device of chip ball-planting tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121487189.3U CN215183861U (en) | 2021-07-01 | 2021-07-01 | Die piece mounting device of chip ball-planting tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215183861U true CN215183861U (en) | 2021-12-14 |
Family
ID=79381990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121487189.3U Active CN215183861U (en) | 2021-07-01 | 2021-07-01 | Die piece mounting device of chip ball-planting tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215183861U (en) |
-
2021
- 2021-07-01 CN CN202121487189.3U patent/CN215183861U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: The fourth floor of Building 5 #, Phase III, Zhongxi Industrial Park, No. 912 Binhu Road, Zhangban Town, Quanzhou Taishang Investment Zone, Quanzhou City, Fujian Province, 362100 Patentee after: Quanzhou Yingchuang Electronics Co.,Ltd. Address before: The fourth floor of Building 5 #, Phase III, Zhongxi Industrial Park, No. 912 Binhu Road, Zhangban Town, Quanzhou Taishang Investment Zone, Quanzhou City, Fujian Province, 362100 Patentee before: Quanzhou Yingchuang Electronic Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |