CN214429789U

CN214429789U - Smt carrier capable of controlling thickness of solder paste

Info

Publication number: CN214429789U
Application number: CN202022129248.1U
Authority: CN
Inventors: 赵云花
Original assignee: Wan'an Yugao Electronic Technology Co ltd
Current assignee: Wan'an Yugao Electronic Technology Co ltd
Priority date: 2020-09-24
Filing date: 2020-09-24
Publication date: 2021-10-19
Anticipated expiration: 2030-09-24

Abstract

The application discloses but smart carrier of steerable tin cream thickness, include carrier body, locating lever, spacing clamp, slide bar, locating lever base, magnet, fixture block groove, circuit board, locating piece, place board, apron, opening and handle pole. In order to control the thickness of tin cream, place the board through the inside setting at the carrier body, top surface through placing the board sets up the locating lever, pass the locating lever with the wall of apron, through the wall clamping spacing clip at the locating lever, thereby highly change the height of apron at locating lever wall clamping through changing the spacing clip, place the circuit board through the top surface at placing the board, set up the opening at the wall of apron, thereby realize changing the tin cream thickness of welding on the circuit board surface through the height that changes the apron.

Description

Smt carrier capable of controlling thickness of solder paste

Technical Field

The application relates to a smt carrier capable of controlling the thickness of solder paste, in particular to a smt carrier capable of controlling the thickness of solder paste.

Background

smt (surface mount technology) is a surface mounting technology, which is currently the most popular technology and process in the electronic assembly industry. The smt is not required to drill inserting holes on the printed board, and the surface assembly components are directly attached to and welded on the specified positions of the surface of the printed board. The process flow of the smt includes printing (or dispensing) → mounting → (curing) → reflow soldering → cleaning → detecting → repairing; in the process of processing the PCB, solder paste needs to be sprayed, and a smt carrier needs to be used.

The height control effect of the existing smt carrier on the solder paste in the using process is poor, the positioning effect of the cover plate of the smt carrier is poor, the damage to the carrier is large for a long time, and the service life of the carrier is influenced. Therefore, a smt carrier capable of controlling the thickness of solder paste is provided to solve the above problems.

Disclosure of Invention

A smt carrier capable of controlling the thickness of solder paste comprises a carrier body, a circuit board, a placing plate, an opening, a handle rod and an adjusting mechanism;

the adjusting mechanism comprises a positioning rod, a limiting clamp, a sliding rod, a positioning rod base, a magnet, a clamping block groove, a positioning block and a cover plate, wherein the inner top surface of the carrier body is fixedly connected with the bottom surface of the placing plate, two ends of the sliding rod are embedded into the carrier body, the bottom surface of the magnet is fixedly connected into the clamping block groove, the outer wall surface of the sliding rod is embedded into the clamping block groove, the outer wall surface of the positioning rod is embedded into the cover plate, the bottom end of the positioning rod is fixedly connected with the top surface of the positioning rod base, the bottom surface of the positioning rod base is fixedly connected with the side edge of the top surface of the placing plate, the top surface of the positioning block is fixedly connected with the bottom surface of the cover plate, the inner part of the limiting clamp is clamped on the wall surface of the positioning rod, and the top surface of the limiting clamp is tightly attached to the bottom surface of the cover plate;

the bottom surface of the circuit board is placed on the top surface of the placing plate, the inner wall of the clamping block groove is tightly attached to the wall surface of the circuit board, the bottom end of the handle rod is fixedly connected with the top surface of the cover plate, and the top surface of the cover plate is provided with an opening.

Furthermore, the number of the slide bars is two, and the two slide bars are symmetrically arranged along the transverse center line of the carrier body.

Furthermore, the number of the positioning rods, the limiting clamps and the positioning rod bases is two, and the two positioning rods, the limiting clamps and the positioning rod bases are symmetrically arranged along the vertical center line of the carrier body.

Furthermore, the outer wall surface of the positioning block is clamped in the groove of the fixture block groove.

Furthermore, the number of the block grooves is two, the two block grooves are symmetrically arranged along the vertical central line of the carrier body, and the positioning blocks are arranged on the surface of the outer wall of the sliding rod in a sliding mode.

Further, carrier body, circuit board, place board, apron and open-ended central point set up on same vertical line.

The beneficial effect of this application is: the application provides a smt carrier capable of controlling thickness of solder paste.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic overall perspective view of an embodiment of the present application;

FIG. 2 is an overall front cross-sectional schematic view of one embodiment of the present application;

fig. 3 is an overall front view of an embodiment of the present application.

In the figure: 1. carrier body, 2, locating lever, 3, spacing clamp, 4, slide bar, 5, locating lever base, 6, magnet, 7, fixture block groove, 8, circuit board, 9, locating piece, 10, place the board, 11, apron, 12, opening, 13, handle pole.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1-3, a smt carrier capable of controlling solder paste thickness includes a carrier body 1, a circuit board 8, a placing plate 10, an opening 12, a handle bar 13 and an adjusting mechanism;

the adjusting mechanism comprises a positioning rod 2, a limiting clamp 3, a sliding rod 4, a positioning rod base 5, a magnet 6, a fixture block groove 7, a positioning block 9 and a cover plate 11, the inner top surface of the carrier body 1 is fixedly connected with the bottom surface of the placing plate 10, two ends of the sliding rod 4 are embedded into the carrier body 1, the bottom surface of the magnet 6 is fixedly connected in the groove of the block groove 7, the outer wall surface of the sliding rod 4 is embedded in the block groove 7, the outer wall surface of the positioning rod 2 is embedded into the cover plate 11, the bottom end of the positioning rod 2 is fixedly connected with the top surface of the positioning rod base 5, the bottom surface of the positioning rod base 5 is fixedly connected with the side of the top surface of the placing plate 10, the top surface of the positioning block 9 is fixedly connected with the bottom surface of the cover plate 11, the inner part of the limiting clamp 3 is clamped on the wall surface of the positioning rod 2, and the top surface of the limiting clamp 3 is tightly attached to the bottom surface of the cover plate 11;

the bottom surface of the circuit board 8 is placed on the top surface of the placing plate 10, the inner wall of the block groove 7 is tightly attached to the wall surface of the circuit board 8, the bottom end of the handle rod 13 is fixedly connected with the top surface of the cover plate 11, the top surface of the cover plate 11 is provided with an opening 12, the number of the sliding rods 4 is two, the two sliding rods 4 are symmetrically arranged along the transverse central line of the carrier body 1, the number of the positioning rods 2, the two spacing clamps 3 and the positioning rod base 5 is two, the two positioning rods 2, the two spacing clamps 3 and the positioning rod base 5 are symmetrically arranged along the vertical central line of the carrier body 1, the outer wall surface of the positioning block 9 is clamped in the groove of the block groove 7, the number of the block groove 7 is two, the two block grooves 7 are symmetrically arranged along the vertical central line of the carrier body 1, and the positioning block 9 is slidably arranged on the outer wall surface of the sliding rods 4, the carrier body 1, the circuit board 8, the placing plate 10, the cover plate 11 and the center point of the opening 12 are arranged on the same vertical line;

when the solder paste welding tool is used, firstly, the placing plate 10 is arranged in the carrier body 1, the positioning rod 2 is arranged on the top surface of the placing plate 10, the wall surface of the cover plate 11 penetrates through the positioning rod 2, the limiting clamp 3 is clamped on the wall surface of the positioning rod 2, the clamping height of the limiting clamp 3 on the wall surface of the positioning rod 2 is changed, the height of the cover plate 11 is changed, the circuit board 8 is placed on the top surface of the placing plate 10, the opening 12 is formed in the wall surface of the cover plate 11, the solder paste thickness welded on the surface of the circuit board 8 is changed by changing the height of the cover plate 11, the two ends of the sliding rod 4 are embedded in the carrier body 1, the clamping block groove 7 is connected in a sliding mode through the wall surface of the sliding rod 4, the magnet 6 is arranged in the clamping block groove 7, the positioning block 9 is arranged on the bottom surface of the cover plate 11, and the positioning block 9 is clamped in the clamping block groove 7, reduce wearing and tearing extension carrier life in the carrier course of operation, through pressing from both sides circuit board 8 between two chuck block grooves 7 to according to circuit board 8's size, slide chuck block groove 7 on the surface of slide bar 4, thereby increase the practicality of carrier.

The application has the advantages that:

1. in order to control the thickness of tin cream, place the board through the inside setting at the carrier body, top surface through placing the board sets up the locating lever, pass the locating lever with the wall of apron, through the wall clamping spacing clip at the locating lever, thereby highly change the height of apron at locating lever wall clamping through changing the spacing clip, place the circuit board through the top surface at placing the board, set up the opening at the wall of apron, thereby realize changing the tin cream thickness of welding on the circuit board surface through the height that changes the apron.

2. This application is rational in infrastructure, through the inside with the both ends embedding carrier body of slide bar, through the inside in the wall sliding connection fixture block groove at the slide bar, through setting up magnet in the inside in fixture block groove, set up the locating piece in the bottom surface of apron, thereby with the locating piece block at the inslot in fixture block groove, reduce wearing and tearing extension carrier life in the carrier course of the work, press from both sides the circuit board between two fixture block grooves, thereby according to the size of circuit board, slide the fixture block groove on the surface of slide bar, thereby increase the practicality of carrier.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A kind of smt carrier that can control the thickness of tin cream, characterized by that: comprises a carrier body (1), a circuit board (8), a placing plate (10), an opening (12), a handle rod (13) and an adjusting mechanism;

the adjusting mechanism comprises a positioning rod (2), a limiting clamp (3), a sliding rod (4), a positioning rod base (5), a magnet (6), a clamping block groove (7), a positioning block (9) and a cover plate (11), wherein the inner top surface of the carrier body (1) is fixedly connected with the bottom surface of a placing plate (10), two ends of the sliding rod (4) are embedded into the carrier body (1), the bottom surface of the magnet (6) is fixedly connected into the clamping block groove (7), the outer wall surface of the sliding rod (4) is embedded into the clamping block groove (7), the outer wall surface of the positioning rod (2) is embedded into the cover plate (11), the bottom end of the positioning rod (2) is fixedly connected with the top surface of the positioning rod base (5), the bottom surface of the positioning rod base (5) is fixedly connected with the side edge of the top surface of the placing plate (10), and the top surface of the positioning block (9) is fixedly connected with the bottom surface of the cover plate (11), the inner part of the limiting clamp (3) is clamped on the wall surface of the positioning rod (2), and the top surface of the limiting clamp (3) is tightly attached to the bottom surface of the cover plate (11);

the bottom surface of the circuit board (8) is placed on the top surface of the placing plate (10), the inner wall of the clamping block groove (7) is tightly attached to the wall surface of the circuit board (8), the bottom end of the handle rod (13) is fixedly connected with the top surface of the cover plate (11), and the top surface of the cover plate (11) is provided with an opening (12).

2. A smt carrier of claim 1, wherein said solder paste thickness is controllable by: the number of the sliding rods (4) is two, and the two sliding rods (4) are symmetrically arranged along the transverse central line of the carrier body (1).

3. A smt carrier of claim 1, wherein said solder paste thickness is controllable by: the number of the positioning rods (2), the limiting clamps (3) and the positioning rod bases (5) is two, and the positioning rods (2), the limiting clamps (3) and the positioning rod bases (5) are symmetrically arranged along the vertical center line of the carrier body (1).

4. A smt carrier of claim 1, wherein said solder paste thickness is controllable by: the outer wall surface of the positioning block (9) is clamped in the groove of the block clamping groove (7).

5. A smt carrier of claim 1, wherein said solder paste thickness is controllable by: the number of the block grooves (7) is two, the two block grooves (7) are symmetrically arranged along the vertical central line of the carrier body (1), and the positioning blocks (9) are arranged on the surface of the outer wall of the sliding rod (4) in a sliding mode.

6. A smt carrier of claim 1, wherein said solder paste thickness is controllable by: the carrier body (1), the circuit board (8), the placing plate (10), the cover plate (11) and the center point of the opening (12) are arranged on the same vertical line.