CN214898345U - Equipment for producing ceramic coated chip by melt sealing - Google Patents
Equipment for producing ceramic coated chip by melt sealing Download PDFInfo
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- CN214898345U CN214898345U CN202121054807.5U CN202121054807U CN214898345U CN 214898345 U CN214898345 U CN 214898345U CN 202121054807 U CN202121054807 U CN 202121054807U CN 214898345 U CN214898345 U CN 214898345U
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- 238000007789 sealing Methods 0.000 title claims abstract description 30
- 239000000919 ceramic Substances 0.000 title claims description 26
- 230000007246 mechanism Effects 0.000 claims abstract description 146
- 239000000463 material Substances 0.000 claims description 92
- 230000007306 turnover Effects 0.000 claims description 14
- 230000004927 fusion Effects 0.000 claims description 7
- 238000005524 ceramic coating Methods 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000032258 transport Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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Abstract
The utility model discloses a device for producing ceramic coating chip by melt sealing, which comprises an assembly platform device, an element supply device, a clamping piece supply device and a blanking device; the assembling platform device comprises a plurality of limiting mechanisms; the assembling space is formed among the plurality of limiting mechanisms; the distance between a plurality of the limiting mechanisms can be adjusted so that the assembling space is matched with the cover plate gasket element. The utility model discloses the technical problem that the tradition is used for melting the equipment of sealing production ceramic coating film chip can not compatible multiple size, can not be compatible the ceramic coating film chip of multiple shape has been solved at least.
Description
Technical Field
The utility model relates to a ceramic coating chip technical field. More specifically, the utility model relates to a device for producing ceramic coating film chip by melt-sealing.
Background
The traditional equipment for producing the ceramic coated chip by fusion sealing has the following defects: 1) the ceramic film-coated chips with various sizes and shapes cannot be compatible; 2) the process of assembling the ceramic film-coated chip is easy to have position deviation and low reliability.
SUMMERY OF THE UTILITY MODEL
It is an object of the present invention to at least solve the above problems and to provide corresponding advantageous effects.
Another objective of the present invention is to provide an apparatus for sealing ceramic coated chip, which at least solves the technical problems that the conventional apparatus for sealing ceramic coated chip cannot be compatible with various sizes and shapes. The utility model discloses mainly realize through following technical scheme:
the utility model provides an equipment for sealing production ceramic coating film chip, include:
the assembly platform device is used for sequentially stacking the cover plate gasket element, the cover plate element, the tube shell element and the tube shell gasket element from bottom to top at the assembly space, and then clamping the stacked components by the clamping piece to form a target assembly, wherein the target assembly is used for producing a ceramic film-coated chip in the fusion sealing step;
the component supply device is used for conveying a cover plate gasket component, a cover plate component, a pipe shell component and a pipe shell gasket component for the assembly platform device;
the clamping piece supply device is used for providing clamping pieces for the assembling platform device;
a blanking device for receiving the target assembly assembled from the assembly platform device;
the assembling platform device comprises a plurality of limiting mechanisms;
the assembling space is formed among the plurality of limiting mechanisms;
the distance between a plurality of the limiting mechanisms can be adjusted so that the assembling space is matched with the cover plate gasket element.
The utility model discloses in, through set up a plurality of stop gear in the assembly platform device, wherein, it is a plurality of distance between the stop gear can be adjusted, consequently, can be according to the size and the shape of apron gasket component, it is a plurality of distance between the stop gear is adjusted into with apron gasket component assorted equipment space, makes the equipment space can be compatible the apron gasket component of various sizes and shape to the equipment that has solved the tradition and is used for sealing production ceramic coating film chip can not be compatible multiple size, can not be compatible the ceramic coating film chip's of multiple shape technical problem, the effectual compatibility that improves equipment assembly.
In some technical solutions, the limiting end of the limiting mechanism is disposed toward the assembling space and can move in a reciprocating linear motion toward the assembling space.
In some embodiments, a plurality of the limiting mechanisms surround the assembly space.
In some embodiments, the plurality of limiting mechanisms surround the assembly space in a centrosymmetric manner.
In some embodiments, the limiting mechanism includes a first limiting unit, and the limiting end of the first limiting unit has a groove for receiving the limited portion of the cover plate gasket element.
In some technical solutions, the limiting mechanism includes a second limiting unit located above the first limiting unit, a limiting end of the second limiting unit extends towards the first limiting unit to form a pressing limiting part,
the pipe shell component comprises a placing area and a non-placing area, the non-placing area is used for being pressed by the pressing limiting part after the pipe shell component is placed on the cover plate component, and the placing area is used for placing the pipe shell gasket component.
In the technical scheme, the tube shell element is pressed by the pressing limiting part, so that the cover plate gasket element, the cover plate element and the tube shell element in the assembling space can be fixed on the assembling space, the position deviation phenomenon in the process of assembling the ceramic film-coated chip is effectively prevented, and the assembling reliability is improved.
In some technical solutions, the pressing limiting portion is an elastic mechanism.
In some technical solutions, the limiting mechanism further includes a first driving unit for driving the first limiting unit to move and a second driving unit for driving the second limiting unit to move.
In some embodiments, the mounting platform assembly further comprises at least one clip mounting mechanism;
the clamp mounting mechanism is used for receiving the clamp provided by the clamp supply device and conveying the clamp to the assembly space to clamp the cover plate gasket element, the cover plate element, the pipe shell element and the pipe shell gasket element together.
In some technical solutions, the carrying end of the clamping member mounting mechanism is disposed toward the assembling space and can reciprocate linearly toward the assembling space.
In some aspects, the component supplying apparatus includes:
the first feeding mechanism comprises a first material placing platform, a first mechanical arm and a turnover mechanism, wherein the first mechanical arm is used for grabbing the tube shell element from the first material placing platform, conveying the tube shell element to the turnover mechanism for turnover, and conveying the turned-over tube shell element to the assembling space.
In some aspects, the component supply apparatus further includes:
second feed mechanism, it includes first material mechanism, second material mechanism, third material mechanism and the second robotic arm of holding, wherein, second robotic arm is used for:
grabbing a cover plate gasket member from the first receiving mechanism for transportation to the assembly space;
grabbing the cover element from the second receiving mechanism for transportation to the assembly space;
grabbing the cartridge shim member from the third containment mechanism for transport to the assembly space.
In some embodiments, the second feeding mechanism further comprises:
the first standby material accommodating mechanism corresponds to the first material accommodating mechanism;
the second standby material containing mechanism corresponds to the second material containing mechanism;
and the third standby material accommodating mechanism corresponds to the third material accommodating mechanism.
In some aspects, the clip supply device includes:
the device comprises a second material placing platform and a third mechanical arm, wherein the third mechanical arm is used for grabbing a clamping piece from the second material placing platform and transporting the clamping piece to the assembling platform device.
In some technical solutions, the blanking device includes a material receiving platform and a material receiving machine, wherein the material receiving machine is used for providing a material receiving tray placed on the material receiving platform; the receiving tray is used for receiving the target assembly conveyed from the assembling space.
The technical effects of the embodiment of the utility model include at least:
the utility model discloses in, through set up a plurality of stop gear in the assembly platform device, wherein, it is a plurality of distance between the stop gear can be adjusted, consequently, can be according to the size and the shape of apron gasket component, it is a plurality of distance between the stop gear is adjusted into with apron gasket component assorted equipment space, makes the equipment space can be compatible the apron gasket component of various sizes and shape to the equipment that the tradition is used for sealing production ceramic coating film chip can not be compatible multiple size, can not be compatible the ceramic coating film chip's of multiple shape technical problem has been solved. Therefore, the utility model discloses an advantageous effect contains at least: 1) the compatibility of the traditional equipment for producing the ceramic coated chip by melt sealing to various sizes and shapes is effectively improved; 2) the phenomenon of position deviation in the process of assembling the ceramic film-coated chip is effectively prevented, and the reliability of assembly is improved.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a schematic structural diagram of an apparatus for sealing a ceramic coated chip according to some embodiments of the present invention;
FIG. 2 is a schematic structural diagram of an apparatus for sealing a ceramic-coated chip according to another embodiment of the present invention;
fig. 3 is a schematic view of the stacked structure of the cover plate gasket member, the cover plate member, the shell member and the shell gasket member of the present invention in some embodiments;
fig. 4 is a schematic structural view of the mounting platform assembly of the present invention in some embodiments;
fig. 5 is an enlarged view of a portion a of fig. 4 according to the present invention;
fig. 6 is a schematic structural view of a spacing mechanism of the present invention in some embodiments;
fig. 7 is an enlarged view of the portion B of fig. 6 according to the present invention;
fig. 8 is a schematic view of a shell component of the present invention in some embodiments;
fig. 9 is a schematic structural view of a clip mounting mechanism according to some embodiments of the present invention;
fig. 10 is a schematic structural view of a mounting platform assembly of the present invention in another embodiment;
fig. 11 is a schematic view of a component supply apparatus according to the present invention in some embodiments;
fig. 12 is a top view of a first feed mechanism of the present invention in some embodiments;
fig. 13 is a perspective view of a first feed mechanism of the present invention in some embodiments;
fig. 14 is a top view of a second feed mechanism of the present invention in some embodiments;
fig. 15 is a schematic structural view of a second feeding mechanism according to another embodiment of the present invention;
FIG. 16 is a schematic view of a clip supply apparatus according to some embodiments of the present invention;
fig. 17 is a top view of a blanking device of the present invention in some embodiments;
description of reference numerals:
1. equipment for producing ceramic film-coated chips by melt sealing;
10. assembling the platform device; 11. a limiting mechanism; 110. a limiting end; 1111. a groove; 1112. a pressing limiting part; 111. a first limit unit; 112. a second limit unit; 113. a first drive unit; 114. a second driving unit; 12. a clamping piece mounting mechanism; 121. a carrying end; 13. a first lifting mechanism;
20. a component supply device; 21. a first feeding mechanism; 211. a first material placing platform; 212. a turnover mechanism; 213. a first robot arm; 22. a second feeding mechanism; 221. a first material containing mechanism; 222. a second material containing mechanism; 223. a third material holding mechanism; 224. a second robot arm; 225. a second lifting mechanism; 226. a material containing column; 227. a first standby material containing mechanism; 228. a second standby material containing mechanism; 229. a third standby material containing mechanism;
30. a holder supplying device; 31. a second material placing platform; 32. a third robot arm;
40. a blanking device; 41. a material receiving platform; 42. a material receiving machine;
50. a cover plate gasket member; 510. a limited part;
60. a cover member;
70. a case element; 710. a placement area; 720. a non-placement region;
80. a cartridge gasket member;
and S1, assembling space.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly apparent, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application, and it should be understood that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first", "second", and "third" and the like in the description of the embodiments of the present application are used for distinguishing different objects, and are not used for describing a particular order of the objects. For example, the first robot arm, the second robot arm, and the third robot arm are used to distinguish different robot arms, and are not used to describe a specific order of the robot arms. As another example, the first and second spacing units are used to distinguish between different spacing units, rather than to describe a particular order of spacing units.
In the embodiments of the present application, words such as "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
< apparatus for producing ceramic coated chip by melt-sealing >
As shown in FIG. 1 and FIG. 2, the utility model provides a pair of equipment 1 for producing ceramic coating chip by melt-sealing, equipment 1 for producing ceramic coating chip by melt-sealing includes:
an assembly platform device 10 for stacking the cover plate gasket member 50, the cover plate member 60, the package shell member 70 and the package shell gasket member 80 in sequence from bottom to top at an assembly space S1, and then clamping the stacked components by a clamping member to form a target assembly, wherein the target assembly is used for producing a ceramic coating chip in a fusion sealing step;
a component supply device 20 for supplying the assembly platform device 10 with a cover plate gasket member 50, a cover plate member 60, a cartridge member 70, a cartridge gasket member 80;
a clamp supply device 30 for supplying a clamp to the mounting platform device 10;
a blanking device 40 for receiving the target component assembled from the assembly platform device 10;
wherein the assembly platform device 10 comprises a plurality of limiting mechanisms 11;
the assembly space S1 is formed between the plurality of stopper mechanisms 11;
the distance between the plurality of the limiting mechanisms 11 can be adjusted so that the assembling space S1 is matched with the cover plate shim member 50, so that the cover plate shim member 50 is defined at the assembling space S1.
It should be understood that the assembly platform device 10, the component supply device 20, the clamping member supply device 30 and the blanking device 40 are sequentially arranged in the apparatus 1 for producing ceramic coated chips by fusion sealing.
In the embodiment of the present application, the number of the plurality of limiting mechanisms 11 may be 4.
Fig. 3 is a schematic view showing a stacked structure of the cover plate gasket member 50, the cover plate member 60, the case member 70 and the case gasket member 80 from bottom to top.
The utility model discloses in, through set up a plurality of stop gear 11 in the assembly platform device 10, wherein, it is a plurality of distance between the stop gear 11 can be adjusted, consequently, can be according to apron gasket component 50' S size and shape, it is a plurality of distance between the stop gear 11 is adjusted into with apron gasket component 50 assorted equipment space S1, makes equipment space S1 can be compatible the apron gasket component 50 of various sizes and shape to the technical problem of the pottery coating film chip that traditional equipment 1 that is used for the sealing production pottery coating film chip can not be compatible multiple size, can not be compatible multiple shape has been solved, the effectual compatibility that improves equipment.
In fig. 4 and 5, in some embodiments, the limiting end 110 of the limiting mechanism 11 is disposed toward the assembling space S1 and can reciprocate linearly toward the assembling space S1.
In some embodiments, a plurality of the limiting mechanisms 11 surround the assembly space S1.
In some embodiments, a plurality of the limiting mechanisms 11 surround the assembly space S1 in a central symmetrical manner.
In fig. 6 and 7, in some embodiments, the limiting mechanism 11 includes a first limiting unit 111, and the limiting end 110 of the first limiting unit 111 has a groove 1111, and the groove 1111 is used for accommodating the limited portion 510 of the cover plate gasket member 50.
As shown in fig. 6, in some embodiments, the limiting mechanism 11 includes a second limiting unit 112 located above the first limiting unit 111, the limiting end 110 of the second limiting unit 112 extends towards the first limiting unit 111 to form a pressing limiting portion 1112,
the case element 70 comprises a placement area 710 and a non-placement area 720710, as shown in fig. 8, the non-placement area 720710 is used for being pressed by the pressing stopper 1112 after the case element 70 is placed on the cover element 60, and the placement area 710 is used for placing the case spacer element 80.
In the embodiment of the present application, the tube-housing element 70 is pressed by the pressing limiting portion 1112, so that the cover-plate gasket element 50, the cover-plate element 60 and the tube-housing element 70 in the assembling space S1 can be fixed on the assembling space S1, thereby effectively preventing the position deviation in the process of assembling the ceramic film-coated chip and improving the assembling reliability.
In some embodiments, the press limiting portion 1112 is a resilient mechanism. Illustratively, the press limiting part 1112 may be a probe.
As further shown in fig. 6, in some embodiments, the limiting mechanism 11 further includes a first driving unit 113 for driving the first limiting unit 111 to move and a second driving unit 114 for driving the second limiting unit 112 to move.
As next shown in fig. 9, in some embodiments, the mounting platform assembly 10 further includes at least one clip mounting mechanism 12;
the clip fitting mechanism 12 is adapted to receive the clips supplied from the clip supply apparatus 30 and to transport them to the assembly space S1 to clamp the cover gasket member 50, the cover member 60, the cartridge member 70, and the cartridge gasket member 80 together.
As further shown in fig. 9, in some embodiments, the carrying end 121 of the clip mounting mechanism 12 is disposed toward the assembling space S1 and is capable of reciprocating linearly toward the assembling space S1.
As shown in fig. 10, in some embodiments, the assembly platform device 10 further includes a first lifting mechanism 13, and the first lifting mechanism 13 is configured to adjust positions of a plurality of the limiting mechanisms 11.
As next shown in fig. 11, 12, 13, and 14, in some embodiments, the component supply apparatus 20 includes:
the first loading mechanism 21, as shown in fig. 12 and 13, includes a first loading platform 211, a first robot 213 and a turnover mechanism 212, wherein the first robot 213 is configured to grab the cartridge components 70 from the first loading platform 211, transport the cartridge components 70 to the turnover mechanism 212 for turnover, and then transport the shell components 70 to the assembly space S1.
In this application, the first feeding mechanism 21 is also referred to as a cartridge element feeding mechanism, since the first feeding mechanism 21 is used for storing the cartridge elements 70.
The first material placing platform 211 may be a rectangular platform for accommodating the cartridge component 70. In other embodiments, the first material placing platform 211 may also be a non-rectangular platform. It should be appreciated that in the present embodiment, the cartridge component 70 may be placed in a first blister tray, which may be placed on the first loading platform 211.
The moving end of the first robot arm 213 is provided with a robot, which is in the shape of a gripper for gripping an object, and in some other embodiments, the robot may be in the shape of a non-gripper.
The turnover mechanism 212 includes an electric clamp for clamping the cartridge components 70 transported from the first robot arm 213, and a rotary cylinder; the rotary cylinder is used for driving the electric clamp to rotate.
Regarding the operation of the first feeding mechanism 21, it can be realized in the following exemplary manner:
the first robot 213 picks up the cartridge component 70 from the first suction tray, transports the cartridge component to the upper side of the turnover mechanism 212, adjusts the angle of the cartridge component 70, and after the first robot 213 adjusts the angle (the angle is adjusted here to be parallel to the horizontal direction of the turnover mechanism 212), the motorized clamp picks up the cartridge component 70 from the first robot 213, the rotary cylinder drives the motorized clamp to rotate, and turns over, and then the first robot 213 sucks the turned-over cartridge component 70 from the motorized clamp and transports the turned-over cartridge component to the assembly space S1.
In some embodiments, the component supplying apparatus 20 further includes:
the second feeding mechanism 22, as shown in fig. 14, includes a first material containing mechanism 221, a second material containing mechanism 222, a third material containing mechanism 223, and a second robot arm 224, wherein the second robot arm 224 is configured to:
grabbing the cover plate shim member 50 from the first receiving mechanism 221 for transportation to the assembly space S1;
grabbing the cover member 60 from the second containing mechanism 222 to be transported to the assembling space S1;
the cartridge shim member 80 is grabbed from the third material holding means 223 and transported to the assembly space S1.
It should be understood that the first receiving mechanism 221 is used to store the cover plate shim member 50; the second material containing means 222 is used for storing the cover plate element 60 and the third material containing means 223 is used for storing the cartridge gasket element 80.
The first material accommodating mechanism 221, the second material accommodating mechanism 222, and the third material accommodating mechanism 223 are respectively provided with a second lifting mechanism 225 and four material accommodating columns 226, as shown in fig. 15, the four material accommodating columns 226 surround a circle, an accommodating space is formed inside, and the bottom of the accommodating space is provided with the second lifting mechanism 225.
Regarding the operation of the second feeding mechanism 22, it can be realized in the following exemplary manner:
the second robot arm 224 first picks up the lid gasket member 50 from the first receiving mechanism 221 and transports it to the assembly space S1, then picks up the lid gasket member 60 from the second receiving mechanism 222 and transports it to the assembly space S1, and then picks up the case gasket member 80 from the third receiving mechanism 223 and transports it to the assembly space S1.
Continuing with fig. 14, in some embodiments, the second feed mechanism 22 further comprises:
a first spare receiving mechanism 227 corresponding to the first receiving mechanism 221;
a second spare receiving mechanism 228 corresponding to the second receiving mechanism 222;
and a third spare housing part 229 corresponding to the third housing part 223.
The first, second and third spare material accommodating mechanisms 227, 228 and 229 may be identical to the first, second and third material accommodating mechanisms 221, 222 and 223, and are respectively provided with a second lifting mechanism 225 and four material accommodating columns 226. The four material containing columns 226 form a circle, a containing space is formed inside the material containing columns, and a second lifting mechanism 225 is arranged at the bottom of the containing space.
In the present application, since the first material accommodating mechanism 221 and the first spare material accommodating mechanism 227 are used for storing the cover gasket member 50, and the cover gasket member 50 is grabbed and transported by the second robot arm 224 to the assembly space S1, the combination of the first material accommodating mechanism 221, the first spare material accommodating mechanism 227, and the second robot arm 224 is referred to as a cover gasket member feeding mechanism.
Since the second material containing mechanism 222 and the second spare material containing mechanism 228 are used for storing the cover members 60, and the cover members 60 are grabbed and transported to the assembly space S1 by the second robot arm 224, the combination of the second material containing mechanism 222, the second spare material containing mechanism 228, and the second robot arm 224 is referred to as a cover member feeding mechanism.
Since the third material containing mechanism 223 and the third spare material containing mechanism 229 are used for storing the cartridge gasket member 80, and the cartridge gasket member 80 is grabbed and transported to the assembling space S1 by the second robot arm 224, the combination of the third material containing mechanism 223, the third spare material containing mechanism 229 and the second robot arm 224 is referred to as a cartridge gasket member loading mechanism.
As next shown in fig. 16, in some embodiments, the clip supply apparatus 30 includes:
a second material placing platform 31 and a third mechanical arm 32, wherein the third mechanical arm 32 is used for grabbing the clamping piece from the second material placing platform 31 and transporting the clamping piece to the assembling platform device 10.
The second material placing platform 31 may be a rectangular platform for accommodating a clamping member. In other embodiments, the second material placing platform 31 may also be a non-rectangular platform. It should be understood that in the present embodiment, the gripper members can be placed in the second blister tray, which can be placed on said second laying platform 31.
Next, as shown in fig. 17, in some embodiments, the blanking device 40 includes a material receiving platform 41 and a material receiving machine 42, where the material receiving machine 42 is used for providing a material receiving tray placed on the material receiving platform 41; the receiving tray is used for receiving the target assembly conveyed from the assembly space S1.
The material receiving machine 42 includes an empty frame, a full frame and a transmission mechanism. The empty material frame is used for storing an empty material receiving tray; the full material frame is used for storing a material receiving tray filled with the target assembly; the transmission mechanism is used for transmitting the material receiving disc.
While the embodiments of the invention have been described above, it is not intended to be limited to the details shown, or described, but rather to cover all modifications, which would come within the scope of the appended claims, and all changes which come within the meaning and range of equivalency of the art are therefore intended to be embraced therein.
Claims (9)
1. An apparatus for producing ceramic coated chips by melt sealing, comprising:
the assembly platform device is used for sequentially stacking the cover plate gasket element, the cover plate element, the tube shell element and the tube shell gasket element from bottom to top at the assembly space, and then clamping the stacked components by the clamping piece to form a target assembly, wherein the target assembly is used for producing a ceramic film-coated chip in the fusion sealing step;
the component supply device is used for conveying a cover plate gasket component, a cover plate component, a pipe shell component and a pipe shell gasket component for the assembly platform device;
the clamping piece supply device is used for providing clamping pieces for the assembling platform device;
a blanking device for receiving the target assembly assembled from the assembly platform device;
the assembling platform device comprises a plurality of limiting mechanisms;
the assembling space is formed among the plurality of limiting mechanisms;
the distance between a plurality of the limiting mechanisms can be adjusted so that the assembling space is matched with the cover plate gasket element.
2. The apparatus according to claim 1, wherein the limiting end of the limiting mechanism is disposed toward the assembling space and can reciprocate in a linear motion toward the assembling space.
3. The apparatus for producing ceramic coated chips by fusion sealing according to claim 2, wherein the limiting mechanism comprises a first limiting unit, a second limiting unit, a first driving unit and a second driving unit.
4. The apparatus for sealing and producing ceramic coated chips according to claim 1, wherein said mounting platform means further comprises at least one clamping member mounting mechanism;
the clamp mounting mechanism is used for receiving the clamp provided by the clamp supply device and conveying the clamp to the assembly space to clamp the cover plate gasket element, the cover plate element, the pipe shell element and the pipe shell gasket element together.
5. The apparatus for fusion-sealing ceramic coated chips according to claim 1, wherein the component supplying device comprises a first feeding mechanism, the first feeding mechanism comprises a first material placing platform, a first robot arm and a turnover mechanism, wherein the first robot arm is used for grabbing the cartridge components from the first material placing platform, transporting the cartridge components to the turnover mechanism for turnover, and then transporting the turnover cartridge components to the assembling space.
6. The apparatus for fusion bonding ceramic coated chips according to claim 5, wherein said component supplying means further comprises:
second feed mechanism, it includes first material mechanism, second material mechanism, third material mechanism and the second robotic arm of holding, wherein, second robotic arm is used for:
grabbing a cover plate gasket member from the first receiving mechanism for transportation to the assembly space;
grabbing the cover element from the second receiving mechanism for transportation to the assembly space;
grabbing the cartridge shim member from the third containment mechanism for transport to the assembly space.
7. The apparatus for sealing and producing ceramic coated chips according to claim 6, wherein the second feeding mechanism further comprises:
the first standby material accommodating mechanism corresponds to the first material accommodating mechanism;
the second standby material containing mechanism corresponds to the second material containing mechanism;
and the third standby material accommodating mechanism corresponds to the third material accommodating mechanism.
8. The apparatus for sealing a ceramic-coated chip according to claim 1, wherein the holder feeding device comprises:
the device comprises a second material placing platform and a third mechanical arm, wherein the third mechanical arm is used for grabbing a clamping piece from the second material placing platform and transporting the clamping piece to the assembling platform device.
9. The apparatus for sealing and producing ceramic coated chips according to claim 1, wherein the blanking device comprises a material receiving platform and a material receiving machine, wherein the material receiving machine is used for providing a material receiving tray placed on the material receiving platform; the receiving tray is used for receiving the target assembly conveyed from the assembling space.
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CN202121054807.5U CN214898345U (en) | 2021-05-17 | 2021-05-17 | Equipment for producing ceramic coated chip by melt sealing |
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CN202121054807.5U CN214898345U (en) | 2021-05-17 | 2021-05-17 | Equipment for producing ceramic coated chip by melt sealing |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113241318A (en) * | 2021-05-17 | 2021-08-10 | 海铭德(海宁)半导体科技有限公司 | Equipment and method for producing ceramic coated chip by melt sealing |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113241318A (en) * | 2021-05-17 | 2021-08-10 | 海铭德(海宁)半导体科技有限公司 | Equipment and method for producing ceramic coated chip by melt sealing |
CN113241318B (en) * | 2021-05-17 | 2025-03-07 | 海铭德(海宁)半导体科技有限公司 | Equipment and method for melting and sealing ceramic coated chips |
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