CN111147042B - Crystal oscillator chip mounting device and crystal oscillator chip mounting method - Google Patents
Crystal oscillator chip mounting device and crystal oscillator chip mounting method Download PDFInfo
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- CN111147042B CN111147042B CN202010032078.7A CN202010032078A CN111147042B CN 111147042 B CN111147042 B CN 111147042B CN 202010032078 A CN202010032078 A CN 202010032078A CN 111147042 B CN111147042 B CN 111147042B
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- 239000013078 crystal Substances 0.000 title claims abstract description 215
- 238000000034 method Methods 0.000 title claims description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 276
- 238000011068 loading method Methods 0.000 claims abstract description 30
- 238000001514 detection method Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 59
- 238000007599 discharging Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 abstract description 9
- 210000000078 claw Anatomy 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011257 shell material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
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Abstract
本发明提供了一种晶振芯片搭载设备及晶振芯片搭载方法，包括：芯片上料机构，用于芯片上料；晶振上料机构，用于晶振上料；第一转盘机构，用于接收晶振上料机构的晶振，并在晶振点胶后将晶振转移至与芯片搭载，还用于转移搭载晶振后的芯片；第二转盘机构，用于从芯片上料机构接收芯片，还用于将芯片搭载至至第一转盘机构；点胶机构，用于对晶振及搭载芯片后的晶振进行点胶；检测机构，用于对点胶后的晶振及搭载芯片后点胶的晶振进行检测；以及下料机构，用于将搭载芯片的晶振摆盘下料。本发明提供的晶振芯片搭载设备及晶振芯片搭载方法，点胶和搭载的精度高，速度快，质量稳定，能够大大提高生产力。
The present invention provides a crystal oscillator chip loading device and a crystal oscillator chip loading method, including: a chip loading mechanism for chip loading; a crystal oscillator loading mechanism for crystal oscillator loading; a first turntable mechanism for receiving the crystal oscillator from the crystal oscillator loading mechanism, and transferring the crystal oscillator to the chip after the crystal oscillator is glued, and also for transferring the chip after the crystal oscillator is loaded; a second turntable mechanism for receiving the chip from the chip loading mechanism, and also for loading the chip to the first turntable mechanism; a glue dispensing mechanism for dispensing glue on the crystal oscillator and the crystal oscillator after the chip is loaded; a detection mechanism for detecting the crystal oscillator after the glue is dispensed and the crystal oscillator after the chip is loaded; and a feeding mechanism for unloading the crystal oscillator loaded with the chip from a swing plate. The crystal oscillator chip loading device and the crystal oscillator chip loading method provided by the present invention have high precision in glue dispensing and loading, fast speed, stable quality, and can greatly improve productivity.
Description
Technical Field
The invention belongs to the technical field of crystal oscillator manufacturing, and particularly relates to crystal oscillator chip mounting equipment and a crystal oscillator chip mounting method.
Background
Micro quartz crystal resonator, crystal oscillator for short. The addition of a chip inside a package to form a crystal element of an oscillating circuit is called a crystal oscillator. The products are generally encapsulated with a metal shell, and also encapsulated with a glass shell, ceramic or plastic. In the electronic and electrical appliance era, the demand of crystal oscillators is increasing, however, at present, many crystal oscillators are used for manually dispensing glue to paste chips on the crystal oscillators, so that the efficiency is low, the labor cost is high, operators need to have a skillful craftsman, and for mass production enterprises, the production efficiency of the mode is low, and the product quality is unstable.
Disclosure of Invention
The invention aims to provide crystal oscillator chip carrying equipment so as to solve the technical problems of low production efficiency and unstable production quality caused by manual dispensing in the prior art.
In order to achieve the above purpose, the invention adopts the technical scheme that the crystal oscillator chip carrying device comprises:
the chip feeding mechanism is used for chip feeding;
The crystal oscillator feeding mechanism is used for feeding the crystal oscillator;
The first rotating disc mechanism is used for receiving the crystal oscillator of the crystal oscillator feeding mechanism, transferring the crystal oscillator to be carried on a chip after the crystal oscillator is subjected to dispensing, and transferring the chip carrying the crystal oscillator;
the second turntable mechanism is used for receiving the chips from the chip feeding mechanism and carrying the chips to the first turntable mechanism;
the dispensing mechanism is used for dispensing the crystal oscillator and the crystal oscillator after the chip is carried;
the detection mechanism is used for detecting the crystal oscillator after dispensing and the crystal oscillator after dispensing after carrying the chip, and
And the blanking mechanism is used for blanking the crystal oscillating tray carrying the chip.
In one embodiment, the chip feeding mechanism comprises a cartridge mechanism comprising at least one cartridge, a lifting assembly, a material taking assembly and a translation assembly, wherein one of the cartridges is placed at the moving end of the lifting assembly, the cartridge comprises a plurality of trays arranged at intervals in a stacked manner, each tray is provided with a plurality of chip accommodating cavities for accommodating chips, the lifting assembly is used for lifting the cartridge for the material taking assembly to take materials, and the translation assembly is used for transferring empty cartridges from which the chips have been taken.
In one embodiment, the magazine mechanism further comprises a support frame, the support frame comprises a bottom frame and an upper frame, the translation assembly is arranged on the bottom frame to transfer empty magazines placed on the bottom frame, and the material taking assembly is fixed on the upper frame to grab trays suspended in the magazines above the bottom frame.
In one embodiment, the lifting assembly comprises a lifting motor, a screw driven by the lifting motor, a screw slider connected with the screw, and a carrier plate fixed on the screw slider, and the material box is placed on the carrier plate.
In one embodiment, the chip feeding mechanism further comprises a tray arranging mechanism for receiving the chip tray from the material taking assembly, wherein the tray arranging mechanism comprises an XY moving module, a clamp moving along with the XY moving module and used for limiting the tray and a pushing assembly used for fixing the tray, and the clamp is arranged on one side of the second turntable mechanism, so that the material pressing mechanism on the second turntable mechanism drives the suction nozzle to grab chips from the tray of the clamp.
In one embodiment, the first rotating disc mechanism comprises a first rotating driving part and a first rotating disc driven to rotate by the first rotating driving part, the first rotating disc is provided with at least eight stations, each station is provided with a placing table for placing a crystal oscillator, the eight stations are crystal oscillator feeding stations, a first dispensing station, a first detecting station, a first carrying station, carrying detecting stations, a second dispensing station, a second detecting station and a discharging station which are sequentially arranged, a discharge hole of the crystal oscillator feeding mechanism is formed in the crystal oscillator feeding stations, the number of the dispensing mechanisms is at least two, the first dispensing stations and the second dispensing stations are respectively arranged, the number of the detecting mechanisms is three, one station of the second rotating disc mechanism is arranged in the first carrying station, the carrying detecting station and the second detecting station, and the discharging mechanism is arranged at the discharging station.
In one embodiment, the first turntable is further provided with a crystal oscillator positioning station, the crystal oscillator positioning station is arranged between the crystal oscillator feeding station and the first dispensing station, and a crystal oscillator positioning mechanism for positioning the crystal oscillator is arranged at the crystal oscillator positioning station.
In one embodiment, the second turntable mechanism comprises a second rotary driving part and a second turntable driven to rotate by the second rotary driving part, the second turntable is provided with at least three stations, each station is provided with a suction nozzle for adsorbing chips, the three stations are chip feeding stations, chip positioning stations and second carrying stations which are sequentially arranged, a discharge hole of the chip feeding mechanism is formed in the chip feeding stations, a four-claw positioning mechanism for positioning chips is arranged at the chip positioning stations, and the second carrying stations are arranged above the first carrying stations.
In one embodiment, the blanking mechanism comprises a third turntable mechanism, the third turntable mechanism comprises a third rotary driving piece and a third turntable driven to rotate by the third rotary driving piece, the third turntable is provided with at least two stations, each station is provided with a suction nozzle for adsorbing chips, the two stations are a first crystal oscillator transfer station and a second crystal oscillator transfer station, the first crystal oscillator transfer station is arranged above the blanking station, and the second crystal oscillator transfer station is arranged above the blanking mechanism.
The invention also provides a crystal oscillator chip carrying method which is applied to the crystal oscillator chip carrying equipment and is characterized by comprising the following steps:
The crystal oscillator is fed to the first turntable mechanism through the crystal oscillator feeding mechanism, and the chip is fed to the second turntable mechanism through the chip feeding mechanism;
The first rotating disc mechanism drives the crystal oscillator to rotate to the dispensing mechanism and the detecting mechanism, and the detecting mechanism detects the crystal oscillator after dispensing the crystal oscillator;
The first turntable mechanism drives the detected crystal oscillator to the second turntable mechanism, and the second turntable mechanism loads the chip on the crystal oscillator and transfers the chip to the detection mechanism for detection;
The first rotating disc mechanism drives the crystal oscillator to rotate to the other dispensing mechanism and the other detecting mechanism, and the detecting mechanism detects the crystal oscillator again after the dispensing mechanism dispenses the crystal oscillator again;
The first rotating disc mechanism drives the mechanism to rotate to the blanking mechanism.
Compared with the prior art, the crystal oscillator chip carrying device and the crystal oscillator chip carrying method have the beneficial effects that the crystal oscillator chip carrying device comprises a chip feeding mechanism, a crystal oscillator feeding mechanism, a first rotating disc mechanism, a second rotating disc mechanism, a dispensing mechanism, a detection mechanism and a blanking mechanism. Chip feed mechanism is with chip material loading to the second carousel, and crystal oscillator feed mechanism is used for with crystal oscillator material loading to first carousel, and the crystal oscillator is transferred to second carousel mechanism department after gluing the mechanism point through the point, detection mechanism detects, and second carousel mechanism carries the chip in the crystal oscillator, then the crystal oscillator is after gluing and detection once more, shifts to unloading mechanism. The crystal oscillator chip carrying device and the crystal oscillator chip carrying method provided by the invention have the advantages of high dispensing and carrying precision, high speed, stable quality and capability of greatly improving the productivity.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a top view of a crystal oscillator chip mounting apparatus according to an embodiment of the present invention;
fig. 2 is a perspective view of a vibration mechanism according to an embodiment of the present invention;
fig. 3 is a first perspective view of a cartridge mechanism according to an embodiment of the present invention;
Fig. 4 is a second perspective view of a cartridge structure according to an embodiment of the present invention;
fig. 5 is a perspective view of a wobble plate mechanism according to an embodiment of the present invention;
fig. 6 is a perspective view of a first turntable mechanism according to an embodiment of the present invention;
FIG. 7 is a perspective view of a crystal oscillator positioning mechanism according to an embodiment of the present invention;
Fig. 8 is a perspective view of a dispensing mechanism according to an embodiment of the present invention;
FIG. 9 is a perspective view of a detection mechanism according to an embodiment of the present invention;
fig. 10 is a perspective view of a second turntable mechanism according to an embodiment of the present invention;
fig. 11 is a perspective view of a four-jaw positioning mechanism according to an embodiment of the present invention.
Wherein, each reference sign in the figure:
1-a crystal oscillator feeding mechanism; 11-a vibration mechanism; 111-vibrating plate; 112-direct vibration track, 113-direct vibration generator, 12-manipulator, 2-chip loading mechanism, 21-cartridge mechanism, 211-lifting assembly, 2111-lifting motor, 2112-lead screw, 2113-carrier plate, 212-translation assembly, 2121-translation motor, 2122-belt assembly, 2123-push rod, 213-material taking assembly, 2131-material taking motor, 2132-conveyor belt assembly, 2133-material taking claw, 214-cartridge, 215-support frame, 2151-underframe, 2152-upper frame, 216-microswitch, 217-clamping cylinder, 22-wobble plate mechanism, 221-XY moving module, 222-clamp, 2221-limit bar, 2222-stop dog, 223-pushing assembly, 2231-limit pushing cylinder, 2232-limit cylinder, 2233-limit cylinder push block, 2234-angle limit piece, 3-first rotary drive, 32-first rotary drive, 4-second rotary drive, 41-second rotary drive, 42-rotary drive, 6-lower rotary drive, guide frame, 714, guide rail, 22231-limit bar, 2222-limit stop, and driving mechanism, etc. 2-angle drive, and so as well as the driving mechanism, the crystal rotation mechanism, the guide frame, the crystal rotation mechanism, the crystal rotation and the guide frame, the crystal rotation frame, the guide, the stop, and the stop, and the stop, the rotation, 2, the rotation, and, the rotation, lifting, lifting Z-axis component, 84-needle nozzle component, 9-detection mechanism, 91-lens fixing plate, 92-lens, 93-light source fixing plate and 94-light source.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The crystal oscillator chip mounting apparatus provided by the embodiment of the invention will now be described.
Referring to fig. 1, in one embodiment, the crystal oscillator chip mounting apparatus includes a chip feeding mechanism 2, a crystal oscillator feeding mechanism 1, a first turntable mechanism 3, a second turntable mechanism 4, a dispensing mechanism 8, a detecting mechanism 9, a discharging mechanism 6, and the like. The crystal oscillator feeding mechanism 1 is used for transferring the crystal oscillator to the first rotating disc mechanism 3, after the first rotating disc mechanism 3 receives the crystal oscillator, the crystal oscillator rotates to the position of the dispensing mechanism 8 along with the first rotating disc mechanism 3, the dispensing mechanism 8 dispenses the crystal oscillator at the position, the crystal oscillator after dispensing rotates to the detecting mechanism 9 along with the first rotating disc mechanism 3, the detecting mechanism 9 detects the crystal oscillator after dispensing, and the detecting point is accurate. The chip feeding mechanism 2 is used for transferring the chip to the second turntable mechanism 4, and the second turntable mechanism 4 transfers the chip to the crystal oscillator which is already glued and detected, so that the chip is carried on the crystal oscillator. After the chip is carried on the crystal oscillator, the crystal oscillator continuously rotates to the dispensing mechanism 8 along with the first rotating disc mechanism 3, the dispensing mechanism 8 dispenses the crystal oscillator carrying the chip again, the crystal oscillator rotates to the detecting mechanism 9 along with the first rotating disc mechanism 3 after dispensing, and the detecting mechanism 9 detects again. After the detection is finished, the qualified products are transferred through the blanking mechanism 6 and are placed on a tray for blanking. The dispensing mechanisms 8 used for two dispensing can be the same dispensing mechanism 8 or different dispensing mechanisms 8, and the detecting mechanisms 9 used for two detecting can be the same detecting mechanism 89 or different detecting mechanisms 9.
The crystal oscillator chip carrying device in the embodiment has the advantages of high dispensing and carrying precision, high speed and stable quality, and can greatly improve the productivity.
In one embodiment of the crystal oscillator feeding mechanism 1, the crystal oscillator feeding mechanism 1 comprises a vibrating mechanism 11 and a manipulator 12, crystal oscillators are fed into bulk materials, the bulk materials are fed into the vibrating mechanism 11, the crystal oscillators are discharged one by one through the vibrating mechanism 11, and then are transferred to the first rotating disc mechanism 3 through the manipulator 12. Referring to fig. 2, the vibration mechanism 11 includes a vibration plate 111, a direct vibration rail 112, and a direct vibration generator 113, wherein one end of the direct vibration rail 112 is connected to an outlet of the vibration plate 111, the other end of the direct vibration rail 112 is discharged, and the direct vibration generator 113 is used for vibrating the direct vibration rail 112. When the vibration plate 111 works, crystal oscillators are arranged to the direct vibration tracks 112 one by one, and the crystal oscillators are continuously moved to the discharge ends of the direct vibration tracks 112 through the vibration of the direct vibration tracks 112. The robot 12 takes the material from the discharge end of the linear vibration rail 112 and transfers the crystal to the first turntable 32. The type of robot 12 is not limited herein and may be a three-axis robot. Or the manipulator 12 includes rotating electrical machines, dwang and suction nozzle, and the radial setting of rotating electrical machines is followed to the length direction of dwang, and the suction nozzle is fixed in the tip of dwang, and the rotating electrical machines during operation, dwang swing, makes the suction nozzle follow the dwang swing to make the suction nozzle can move between the discharge end of direct vibration track 112 and the crystal oscillator material loading station of first carousel mechanism 3, such manipulator 12 simple structure can satisfy the transmission of short distance material.
Referring to fig. 3 and 4, in one embodiment of the chip loading mechanism 2, the chip is loaded into the magazine 214. The chip loading mechanism 2 includes a magazine mechanism 21, and the magazine mechanism 21 includes a magazine 214, a lifting assembly 211, a material taking assembly 213, and a translation assembly 212. One of the cartridges 214 is disposed at a moving end of the lifting assembly 211, and the movement of the lifting assembly 211 can drive the cartridge 214 to move up and down. The magazine 214 includes a plurality of stacked, spaced apart trays, each having a plurality of die placement cavities for placing dies. The translation assembly 212 is used to transfer the empty magazine 214 from which the chip has been removed. More specifically, when a material is required to be taken, the lifting component 211 lifts the material box 214 to a height corresponding to the material taking component 213, and the material taking component 213 stretches into the material box 214 to clamp one of the material trays, and then transfers the material tray to the tray arranging mechanism 22, or directly stretches into the material box 214 to clamp one of the chips, and then directly transfers the chip to the second turntable mechanism 4. After the chips of the tray are picked up, the lifting assembly 211 moves to make the other tray have the same height as the picking assembly 213, and the above steps are repeated to pick up one of the cartridges 214. After one of the cartridges 214 is completely unloaded, the lifting assembly 211 lowers the cartridge 214 to the translation assembly 212, and the empty cartridge 214 is carried away by the translation assembly 212. While one of the cartridges 214 is taking a material, the other cartridge 214 filled with material may be placed in a waiting position, which is disposed directly above the cartridge 214 being taken.
Still further, the magazine mechanism 21 further comprises a supporting frame 215, the supporting frame 215 comprises a bottom frame 2151 and an upper frame 2152, the translation assembly 212 is arranged on the bottom frame 2151, the empty magazine 214 is transferred on the bottom frame 2151 through the translation assembly 212, the material taking assembly 213 is fixed on the upper frame 2152, and a certain distance is provided between the empty magazine and the bottom frame 2151, so that the magazine 214 of the translation assembly 212 and the magazine 214 taking material are prevented from being interfered highly. The take-out assembly 213 may grasp a tray suspended in the magazine 214 above the chassis 2151, and the take-out assembly 213 transfers the tray to the tray swing mechanism 22 after grasping the tray.
Optionally, the cartridge mechanism 21 further comprises a clamping cylinder 217. Specifically, when the cartridges 214 are loaded, two or more cartridges 214 may be placed on the carrier plate 2113, the carrier plate 2113 is lifted to align the lowermost cartridge 214 with the loading assembly 213, after the cartridges 214 are loaded, all the chips in the cartridges 214 are taken out, then the clamping cylinder 217 clamps the cartridges 214 above the empty cartridges 214, the carrier plate 2113 drives the empty cartridges 214 to descend to the translation assembly 212, the empty cartridges 214 which are loaded and the cartridges 214 which are not loaded are separated, the clamping cylinder 217 can prevent the empty cartridges 214 from falling, so that the cartridges 214 can be loaded on the carrier plate 2113 at the same time, the loading efficiency can be improved, the cartridges 214 do not need to be replaced after the completion of the loading of each cartridge 214, and the cartridges 214 can be replaced after the completion of the full loading of the cartridges 214.
Optionally, the lift assembly 211 includes a lift motor 2111, a lead screw 2112, a lead screw slider, and a carrier plate 2113. The lifting motor 2111 drives the screw 2112 to rotate, the screw slider is connected with the screw 2112 and moves up and down relative to the screw 2112, the carrier plate 2113 is fixed on the screw slider, the carrier plate 2113 also moves up and down, and the material taking material box 214 is placed on the carrier plate 2113, so that the material box 214 can move up and down. Further, the carrier plate 2113 may be moved to the translation assembly 212, and the translation assembly 212 may also be capable of moving the cartridge 214 filled with chips onto the carrier plate 2113 and then up and down with the carrier plate 2113.
Optionally, the translation assembly 212 includes a translation motor 2121, a belt assembly 2122, and a push rod 2123, the push rod 2123 is fixed to the belt assembly 2122, the translation motor 2121 drives the belt assembly 2122 to translate, and the belt assembly 2122 drives the push rod 2123 to translate. Wherein push rod 2123 is disposed vertically for pushing cartridge 214. After the cartridge 214 is completely fetched and is moved down to the translation assembly 212 by the lifting assembly 211, the translation assembly 212 operates and the push rod 2123 pushes the cartridge 214 to move so as to free up a space under the cartridge 214 being fetched.
Optionally, the translation assembly 212 further includes a micro switch 216 disposed at a tail end of the translation assembly 212, which is a end far from the carrier 2113. When the placement space on the translation assembly 212 is filled with the empty material box 214, the push rod 2123 can continuously push the empty material box 214 to move towards the tail end, the material box 214 at the tail end can trigger the micro switch 216, the micro switch 216 can feed back information to an operator through sound, light or a display screen, and the operator is reminded that the material box 214 is completely taken, and the operator is not required to stare at the chip feeding mechanism 2.
Optionally, the material taking assembly 213 includes a material taking motor 2131, a conveyor belt assembly 2132 and a material taking claw 2133, the material taking motor 2131 drives the conveyor belt assembly 2132 to move, and the conveyor belt assembly 2132 drives the material taking claw 2133 to move, so as to clamp the material taking tray and drag the material taking tray to the tray arranging mechanism 22. The direction of movement of the conveyor belt assembly 2132 is horizontal so that the take out claw 2133 can extend into the space between the two trays to clamp the trays. The specific structure of the take-out claw 2133 is not limited herein, and can clamp the take-out tray.
Referring to fig. 5, in one embodiment of the chip loading mechanism 2, the chip loading mechanism 2 includes a magazine mechanism 21 and a wobble plate mechanism 22 for receiving chips from a take-out assembly 213. The tray arranging mechanism 22 comprises an XY moving module 221, a clamp 222 and a pushing component 223, wherein the clamp 222 is connected with the XY moving module 221, the clamp 222 is used for positioning a tray received from the material taking component 213, and the pushing component 223 is used for pushing the tray to enable the tray to be fixed in the clamp 222 after the tray is placed into the clamp 222, so that the tray is prevented from moving relative to the clamp 222. More specifically, as the take out assembly 213 clips a tray from the magazine 214, the XY movement module 221 moves the gripper 222 closer to the magazine 214, the take out claw 2133 pulls the tray from the magazine 214 into the gripper 222, and the push assembly 223 then pushes the tray into the gripper 222. More specifically, the clamp 222 has two parallel limiting bars 2221, and a stop block 2222 disposed at one end of the limiting bars 2221 opposite to the magazine 214, and when the tray is transferred from the magazine 214 to the clamp 222, the tray is limited between the two limiting bars 2221 and can only move in the dragging direction of the material taking assembly 213. The moving end of the pushing assembly 223 is provided with a corner limiter 2234, the corner limiter 2234 having a groove matching the corner shape of the tray. The corner limiter 2234 pushes the tray from one of the corners of the tray, so that the other end of the tray opposite to the corner abuts against the stop block 2222 and cannot move continuously along the dragging direction of the material taking assembly 213, and thus the tray is fixed in the fixture 222. After the material tray is clamped in the jig, the chip is opposite to the chip feeding station of the second turntable mechanism 4 in sequence under the action of the XY moving module 221, and the chip is sucked up by the suction nozzle driven by the pressing mechanism at the chip feeding station. After all the chips in the tray are transferred, the XY moving module 221 moves the empty tray to be close to the tray 214, and the material taking assembly 213 of the tray mechanism 21 drags the empty tray back to the tray 214 again, and the lifting assembly 211 works to load the next tray.
Optionally, the pushing assembly 223 includes a limiting pushing cylinder 2231, a limiting cylinder pushing block 2233, a limiting cylinder sliding rail 2232, and a corner limiting member 2234, wherein the limiting cylinder pushing block 2233 is connected to a moving end of the limiting pushing cylinder 2231, and the corner limiting member 2234 is fixed to the limiting cylinder pushing block 2233, and the limiting cylinder pushing block 2233 is slidably connected to the limiting cylinder sliding rail 2232, so as to guide the movement of the limiting cylinder pushing block 2233.
Referring to fig. 1 and 6, in one embodiment of the first turntable mechanism 3, the first turntable mechanism 3 includes a first rotary driving member 31 and a first turntable 32, the first rotary driving member 31 drives the first turntable 32 to rotate, and the first turntable 32 has at least eight stations, each of which has a placing table for placing a crystal oscillator. The eight stations are crystal oscillator feeding stations, first dispensing stations, first detecting stations, first carrying stations, carrying detecting stations, second dispensing stations, second detecting stations and discharging stations which are sequentially arranged, crystal oscillators sequentially pass through first dispensing, first detecting, chip carrying, second detecting, second dispensing and third detecting after being fed from the crystal oscillator feeding stations, and flow to the discharging mechanism 6 from the discharging stations. The discharge gate of crystal oscillator feed mechanism 1 locates crystal oscillator material loading station department, specifically is the placing table that manipulator 12 transferred crystal oscillator to crystal oscillator material loading station of discharge gate department. The number of the dispensing mechanisms 8 is at least two, and the dispensing mechanisms are respectively arranged at the first dispensing station and the second dispensing station. Of course, the first rotating disc 32 may be provided with two first dispensing stations for dispensing at two different positions of the crystal oscillator, or may be provided with two second dispensing stations for dispensing again at two different positions of the crystal oscillator, and in this embodiment, the number of dispensing mechanisms 8 is four. The number of the detection mechanisms 9 is three, and the detection mechanisms are respectively arranged at a first detection station, a carrying detection station and a second detection station, the structures of the detection mechanisms 9 can be identical, and the detection mechanisms can be different, so that specific detection mechanisms 9 are selected according to specific contents required to be detected. In addition, one of the stations of the second turntable mechanism 4 is provided at the first mounting station, and when the chip moving along with the second turntable mechanism 4 is transferred to the first mounting station, the chip can be directly stuck to the crystal oscillator at the first mounting station. The blanking mechanism 6 is arranged at the blanking station and is used for blanking from the blanking station.
Further, the first turntable 32 also has crystal oscillator positioning stations, so that the stations of the first turntable 32 are at least nine. The number of stations of the first reel 32 is not limited herein, and the number of stations may be selected according to the tact of production. The crystal oscillator positioning station is arranged between the crystal oscillator feeding station and the first dispensing station, and a crystal oscillator positioning mechanism 71 for positioning the crystal oscillator is arranged at the crystal oscillator positioning station. Before the crystal oscillator is glued, after the crystal oscillator positioning mechanism 71 is used for positioning, the glue dispensing position can be more accurate.
Optionally, referring to fig. 7, the crystal oscillator positioning mechanism 71 includes a crystal oscillator positioning cylinder 711, a positioning cylinder slider 713, a positioning cylinder sliding rail 712 and a corner positioning member 714, where the positioning cylinder slider 713 is connected to a moving end of the crystal oscillator positioning cylinder 711, and the corner positioning member 714 is fixed to the positioning cylinder slider 713, and the positioning cylinder slider 713 is slidably connected to the positioning cylinder sliding rail 712, so as to guide the movement of the positioning cylinder slider 713. The corner positioning piece 714 is provided with a groove matched with the corner shape of the crystal oscillator, and when the positioning cylinder slider 713 pushes the crystal oscillator to move, the positioning cylinder slider can be abutted against the inner wall of the crystal oscillator placing position of the first turntable 32, so that the crystal oscillator is positioned.
Optionally, referring to fig. 8, the dispensing mechanism 8 includes an X-axis assembly 81, a Y-axis assembly 82, a Z-axis assembly 83, and a nozzle assembly 84 that are sequentially connected, so that the nozzle assembly 84 can move along three axes, thereby dispensing the crystal oscillator. The specific structures of the X-axis assembly 81, the Y-axis assembly 82, and the Z-axis assembly 83 are not limited herein, and may be driven by a motor, a cylinder, or the like. The nozzle assembly 84 is used to drop glue downward, and the nozzle assembly 84 may be of any construction known in the art.
Optionally, referring to fig. 9, the detecting mechanism 9 includes a lens fixing plate 91, a lens 92, a light source fixing plate 93 and a light source 94, the lens 92 is disposed above the light source 94, the light source 94 irradiates the crystal oscillator, and the lens 92 photographs the crystal oscillator to detect whether the glue position and the glue dispensing amount meet the requirements, so as to prevent the defective products from flowing into the subsequent stations.
Referring to fig. 10, in one embodiment of the second turntable mechanism 4, the second turntable mechanism 4 includes a second rotary drive member 41 and a second turntable 42. The second turntable 42 is rotated by the second rotation driving member 41, and the second turntable 42 has at least three stations each having a suction nozzle for sucking chips. The three stations are a chip feeding station, a chip positioning station and a second carrying station which are sequentially arranged, after the chip feeding mechanism 2 transfers the chip to the chip feeding station, the chip is positioned and then transferred to the first carrying station of the first rotary table 32 at the second carrying station, so that the chip is adhered to the crystal oscillator of the first rotary table 32. The discharge gate of chip feed mechanism 2 locates the chip material loading station, and the last swager of chip material loading station drives the suction nozzle motion and can absorb the chip in the chip feed mechanism 2 to in the second carousel 42 mechanism 4. The four-jaw positioning mechanism 72 for positioning the chip is arranged at the chip positioning station, so that the chip is positioned and then carried with the crystal oscillator, and the carrying precision is improved. The second carrying station is arranged above the first carrying station, and when the chip moves to the second carrying station, the pressing mechanism at the second carrying station drives the suction nozzle to move downwards to place the chip on the crystal oscillator at the first carrying station, so that the chip and the crystal oscillator are adhered.
Alternatively, referring to fig. 11, the four-pawl positioning mechanism 72 includes a positioning motor 721, a cam 722 provided at a moving end of the positioning motor 721, four positioning pawls 723 abutting against an outer wall of the cam 722, and an elastic member 724 for retracting the four positioning pawls 723. When the motor works, the cam 722 rotates to push the four positioning claws 723 open, so that the four positioning claws 723 open, a chip is placed in the four positioning claws 723, the motor rotates to enable the cam 722 to return, the elastic piece 724 pulls the four positioning claws 723 back to clamp the chip, and the chip is positioned.
In one embodiment of the crystal oscillator mounting apparatus, the blanking mechanism 6 includes a third turntable mechanism 5, and the third turntable mechanism 5 is configured to receive a crystal oscillator (abbreviated as a product) after the chip is mounted thereon, and transfer the product to the blanking mechanism 6. The third turntable mechanism 5 comprises a third rotary driving piece and a third turntable, the third rotary driving piece drives the third turntable to rotate, the third turntable is provided with at least two stations, each station is provided with a suction nozzle for sucking chips, and the two stations are specifically a first crystal oscillator transfer station and a second crystal oscillator transfer station. The suction nozzle of the first crystal oscillator transfer station is used for sucking products from the second turntable mechanism 4, and the suction nozzle of the second crystal oscillator transfer station is used for transferring the products to the blanking mechanism 6. Wherein, the first crystal oscillator transfer station is arranged above the blanking station of the first rotary table 32, and the second crystal oscillator transfer station is arranged above the blanking mechanism 6. The number of stations of the third turntable is not limited herein, and may be more than two, and may be selected according to the tact of production. Optionally, the third turntable mechanism 5 and the second turntable mechanism 4 have the same structure, and the number of stations may be the same or different.
Optionally, the blanking mechanism 6 further includes a wobble plate mechanism having the same structure as the chip feeding mechanism 2.
The embodiment of the invention also provides a crystal oscillator chip carrying method which can be applied to the crystal oscillator chip carrying equipment in any embodiment, and the method comprises the following steps:
The crystal oscillator is fed to the first turntable mechanism 3 through the crystal oscillator feeding mechanism 1, and the chip is fed to the second turntable mechanism 4 through the chip feeding mechanism 2;
the first rotating disc mechanism 3 drives the crystal oscillator to rotate to the dispensing mechanism 8 and the detecting mechanism 9, and after the dispensing mechanism 8 dispenses the crystal oscillator, the detecting mechanism 9 detects the crystal oscillator after dispensing;
the first turntable mechanism 3 drives the detected crystal oscillator to the second turntable mechanism 4, and the second turntable mechanism 4 loads the chip on the crystal oscillator;
The first rotating disc mechanism 3 drives the crystal oscillator to rotate to the other dispensing mechanism 8 and the other detecting mechanism 9, and the detecting mechanism 9 detects the crystal oscillator again after the dispensing mechanism 8 dispenses the crystal oscillator again;
the first rotating disc mechanism 3 drives the mechanism to rotate to the blanking mechanism 6.
The number of the dispensing mechanisms 8 can be two and can be respectively used for first dispensing and second dispensing, and the number of the dispensing mechanisms 8 can be four and can be respectively used for first dispensing at different positions of the crystal oscillator and second dispensing at different positions of the crystal oscillator. The number of the detecting mechanisms 9 can be three, and the detecting mechanisms are respectively used for detecting after first dispensing, detecting after chip mounting and detecting after second dispensing.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (10)
1. Crystal oscillator chip carrying device, its characterized in that includes:
the chip feeding mechanism is used for chip feeding;
The crystal oscillator feeding mechanism is used for feeding the crystal oscillator;
The first rotating disc mechanism is used for receiving the crystal oscillator of the crystal oscillator feeding mechanism, transferring the crystal oscillator to be carried on a chip after the crystal oscillator is subjected to dispensing, and transferring the chip carrying the crystal oscillator;
the second turntable mechanism is used for receiving the chips from the chip feeding mechanism and carrying the chips to the first turntable mechanism;
the dispensing mechanism is used for dispensing the crystal oscillator and the crystal oscillator after the chip is carried;
the detection mechanism is used for detecting the crystal oscillator after dispensing and the crystal oscillator after dispensing after carrying the chip, and
And the blanking mechanism is used for blanking the crystal oscillating tray carrying the chip.
2. The crystal oscillator chip mounting apparatus of claim 1, wherein the chip loading mechanism comprises a magazine mechanism, the magazine mechanism comprises at least one magazine, a lifting assembly, a material taking assembly and a translation assembly, wherein one of the magazines is arranged at the moving end of the lifting assembly, the magazine comprises a plurality of trays which are arranged at intervals in a stacking manner, the trays are provided with a plurality of chip accommodating cavities for accommodating chips, the lifting assembly is used for lifting the magazines for taking materials from the material taking assembly, and the translation assembly is used for transferring empty magazines from which the chips have been taken.
3. The crystal oscillator chip carrying apparatus of claim 2, wherein the magazine mechanism further comprises a support frame, the support frame comprises a bottom frame and an upper frame, the translation assembly is arranged on the bottom frame to transfer empty magazines arranged on the bottom frame, and the material taking assembly is fixed on the upper frame to grab trays suspended in the magazines above the bottom frame.
4. The crystal oscillator chip mounting apparatus according to claim 2, wherein the lifting assembly comprises a lifting motor, a screw driven by the lifting motor, a screw slider connected with the screw, and a carrier plate fixed to the screw slider, and the magazine is placed on the carrier plate.
5. The crystal oscillator chip carrying device as set forth in claim 2, wherein the chip loading mechanism further comprises a tray arranging mechanism for receiving the chip tray from the material taking assembly, the tray arranging mechanism comprises an XY moving module, a clamp moving along with the XY moving module and used for limiting the tray and a pushing assembly used for fixing the tray, the clamp is arranged on one side of the second turntable mechanism, and a material pressing mechanism on the second turntable mechanism drives a suction nozzle to grab chips from the tray of the clamp.
6. The crystal oscillator chip carrying device according to claim 1, wherein the first rotating disc mechanism comprises a first rotating driving part and a first rotating disc driven to rotate by the first rotating driving part, the first rotating disc is provided with at least eight stations, each station is provided with a placing table for placing crystal oscillators, the eight stations are crystal oscillator feeding stations, first dispensing stations, first detecting stations, first carrying stations, carrying detecting stations, second dispensing stations, second detecting stations and discharging stations which are sequentially arranged, a discharge hole of the crystal oscillator feeding mechanism is formed in the crystal oscillator feeding stations, the number of the dispensing mechanisms is at least two, the dispensing mechanisms are respectively arranged at the first dispensing stations and the second dispensing stations, the number of the detecting mechanisms is three, one station of the second rotating disc mechanism is arranged at the first carrying stations, the second dispensing stations is arranged at the discharging stations, and the discharging mechanism is arranged at the discharging stations.
7. The crystal oscillator chip carrying apparatus of claim 6, wherein the first turntable is further provided with a crystal oscillator positioning station, the crystal oscillator positioning station is arranged between the crystal oscillator feeding station and the first dispensing station, and a crystal oscillator positioning mechanism for positioning a crystal oscillator is arranged at the crystal oscillator positioning station.
8. The crystal oscillator chip carrying device according to claim 6, wherein the second turntable mechanism comprises a second rotary driving piece and a second turntable driven by the second rotary driving piece to rotate, the second turntable is provided with at least three stations, each station is provided with a suction nozzle for sucking chips, the three stations are a chip feeding station, a chip positioning station and a second carrying station which are sequentially arranged, a discharge hole of the chip feeding mechanism is formed in the chip feeding station, a four-claw positioning mechanism for positioning chips is arranged at the chip positioning station, and the second carrying station is arranged above the first carrying station.
9. The crystal oscillator chip carrying apparatus as set forth in claim 6, wherein the discharging mechanism comprises a third rotary table mechanism, the third rotary table mechanism comprises a third rotary driving part and a third rotary table driven to rotate by the third rotary driving part, the third rotary table is provided with at least two stations, each station is provided with a suction nozzle for sucking chips, the two stations are a first crystal oscillator transfer station and a second crystal oscillator transfer station, the first crystal oscillator transfer station is arranged above the discharging station, and the second crystal oscillator transfer station is arranged above the discharging mechanism.
10. A crystal oscillator chip mounting method applied to the crystal oscillator chip mounting apparatus according to any one of claims 1 to 9, characterized by comprising the steps of:
The crystal oscillator is fed to the first turntable mechanism through the crystal oscillator feeding mechanism, and the chip is fed to the second turntable mechanism through the chip feeding mechanism;
The first rotating disc mechanism drives the crystal oscillator to rotate to the dispensing mechanism and the detecting mechanism, and the detecting mechanism detects the crystal oscillator after dispensing the crystal oscillator;
The first turntable mechanism drives the detected crystal oscillator to the second turntable mechanism, and the second turntable mechanism loads the chip on the crystal oscillator and transfers the chip to the detection mechanism for detection;
The first rotating disc mechanism drives the crystal oscillator to rotate to the other dispensing mechanism and the other detecting mechanism, and the detecting mechanism detects the crystal oscillator again after the dispensing mechanism dispenses the crystal oscillator again;
The first rotating disc mechanism drives the mechanism to rotate to the blanking mechanism.
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| CN111731813A (en) * | 2020-06-19 | 2020-10-02 | 三壹联光智能装备(深圳)有限公司 | Product inspection and automatic material changing machine |
| CN114551292A (en) * | 2021-12-24 | 2022-05-27 | 深圳市联赢激光股份有限公司 | Sensor core pasting equipment |
| CN114496848A (en) * | 2022-01-06 | 2022-05-13 | 浙江鼎炬电子科技股份有限公司 | Semiconductor element assembling method |
| CN115283954B (en) * | 2022-07-27 | 2023-03-17 | 深圳市三一联光智能设备股份有限公司 | Full-automatic assembling equipment for inductors |
| CN115332120B (en) * | 2022-08-18 | 2023-10-03 | 无锡市华宇光微电子科技有限公司 | Automatic chip detection packaging device |
| CN115092682B (en) * | 2022-08-26 | 2022-12-20 | 苏州华兴源创科技股份有限公司 | Detection equipment and detection method |
| CN116637780A (en) * | 2023-05-16 | 2023-08-25 | 广东涌固科技有限公司 | A crystal oscillator dispensing and solid crystal equipment |
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| JP2864795B2 (en) * | 1991-07-12 | 1999-03-08 | 松下電器産業株式会社 | Chip mounting equipment |
| JP4119691B2 (en) * | 2002-06-10 | 2008-07-16 | 株式会社日立ハイテクインスツルメンツ | Die pickup device |
| CN105552005B (en) * | 2015-12-28 | 2017-12-22 | 华中科技大学 | A kind of back bonding mounting device of object chip |
| CN107222180B (en) * | 2017-05-12 | 2020-12-22 | 汇隆电子（金华）有限公司 | Quartz crystal resonator based on new device production research and development |
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