CN214521189U

CN214521189U - Shearing device for semiconductor element production

Info

Publication number: CN214521189U
Application number: CN202022684572.XU
Authority: CN
Inventors: 方萌; 刘小祥; 方小明; 赵纪平
Original assignee: Zhejiang Xunsheng Electronic Co ltd
Current assignee: Zhejiang Xunsheng Electronic Co ltd
Priority date: 2020-11-19
Filing date: 2020-11-19
Publication date: 2021-10-29
Anticipated expiration: 2030-11-19

Abstract

The utility model relates to a semiconductor element produces technical field, and discloses a shearing mechanism for semiconductor element produces, comprising a base plate, bottom plate bottom fixedly connected with landing leg, bottom plate top fixedly connected with L shaped plate, L shaped plate top is equipped with the handle, handle bottom fixedly connected with montant, the spring has been cup jointed on the montant, the montant bottom runs through the L shaped plate and extends to L shaped plate bottom, be provided with first control frame between L shaped plate and the bottom plate. This a shearing mechanism for semiconductor element production can drive the carousel through operating means and rotate, and then drives the holder and remove and fix the wafer edge, then can drive the cutterbar and move down and cut out the cut mark at the wafer surface according to the handle, and the cooperation movable rod can realize cutting out the shearing at last, compares manual operation instrument and draws the accurate safety more of mar, has reduced the damage phenomenon because of operating technology leads to, compares full-automatic professional shearing equipment cost lower.

Description

Shearing device for semiconductor element production

Technical Field

The utility model relates to a semiconductor element produces technical field, specifically is a shearing mechanism for semiconductor element production.

Background

Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After a silicon crystal bar is ground, polished and sliced, a silicon wafer is formed, and the silicon wafer needs to be continuously sheared as required during subsequent processing of the wafer, wherein most of the conventional shearing modes are manually carried out.

At present, when a tool is used manually for cutting, scratches are scribed at the edge of a wafer repeatedly and then broken along the scratches, the influence of personal slave operation technology on the process of scribing the scratches is large, and the wafer is easily damaged by mistake.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a be not enough to prior art, the utility model provides a shearing mechanism for semiconductor element production possesses convenient operation, and cutting accuracy advantage such as high has solved present manual use tool when cutting, at the first repeated mar of drawing out in wafer edge, then breaks off with the fingers and thumb along the mar, and it is big to be influenced by individual follow operation technique at the in-process of drawing out the mar, and very easy error leads to the problem that the wafer damaged.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a shearing mechanism for semiconductor element production, includes the bottom plate, bottom plate bottom fixedly connected with landing leg, bottom plate top fixedly connected with L shaped plate, L shaped plate top is equipped with the handle, handle bottom fixedly connected with montant, the spring has been cup jointed on the montant, the montant bottom runs through the L shaped plate and extends to L shaped plate bottom, be provided with first control frame between L shaped plate and the bottom plate, install the second control frame on the first control frame, install the cutterbar on the second control frame.

The bottom plate surface has been seted up and has been directly slided the hole, the bottom plate bottom sets up the pivot, pivot and bottom plate swing joint, fixedly connected with worm wheel and carousel in the pivot, the worm wheel edge is provided with operating means, the arc hole has been seted up on the carousel, the inside holder that is provided with of arc hole, the bar groove has been seted up on the bottom plate surface, bar inslot portion is equipped with the movable rod, movable rod one end is articulated with bar inslot wall, the movable rod other end articulates there is the telescopic link, telescopic link one end is articulated with bottom plate edge.

Preferably, the first control frame comprises a first mounting frame, the first mounting frame is fixedly connected with the bottom end of the vertical rod, a first screw is arranged on the first mounting frame, two ends of the first screw are movably connected with the first mounting frame, and a first knob is fixedly connected with one end of the first screw.

Preferably, the second control frame comprises a second mounting frame, a threaded hole is formed in the second mounting frame, the second mounting frame is in threaded connection with the first screw rod through the threaded hole, the second mounting frame is in sliding connection with the first mounting frame, a second screw rod is arranged on the second mounting frame, two ends of the second screw rod are movably connected with the second mounting frame, a second knob is fixedly connected with one end of the second screw rod, a movable seat is in threaded connection with the second screw rod, and the movable seat is in sliding connection with the second mounting frame.

Preferably, the cutter comprises a motor, the motor is fixedly connected to the movable seat, and a cutting blade is fixedly connected to an output shaft of the motor.

Preferably, the operating device comprises a worm, the worm is meshed with a worm wheel, two bearing seats are fixedly mounted on the worm, the bearing seats are fixedly connected with the bottom plate, and one end of the worm is fixedly connected with a third knob.

Preferably, the holder includes the quarter butt, the quarter butt bottom is located the downthehole portion of arc, quarter butt top and straight slide opening sliding connection, quarter butt top fixedly connected with clamp splice.

Compared with the prior art, the utility model provides a shearing mechanism for semiconductor element production possesses following beneficial effect:

1. this a shearing mechanism for semiconductor element production can drive the carousel through operating means and rotate, and then drives the holder and remove and fix the wafer edge, then can drive the cutterbar and move down and cut out the cut mark at the wafer surface according to the handle, and the cooperation movable rod can realize cutting out the shearing at last, compares manual operation instrument and draws the accurate safety more of mar, has reduced the damage phenomenon because of operating technology leads to, compares full-automatic professional shearing equipment cost lower.

2. This a shearing mechanism for semiconductor element production moves first knob and second knob through twisting, can control the position of cutterbar respectively, is favorable to satisfying the cutting needs of each angle, and the suitability is strong, can make the movable rod rotate to the bar inslot through the length of control telescopic link, can realize accomodating of movable rod.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural view of a second control frame of the present invention;

fig. 3 is a top view of the bottom plate of the present invention;

fig. 4 is a top view of the turntable of the present invention;

fig. 5 is a schematic structural view of the clamp of the present invention.

Wherein: 1. a base plate; 2. an L-shaped plate; 3. a handle; 4. a vertical rod; 5. a spring; 6. a straight slide hole; 7. A rotating shaft; 8. a worm gear; 9. a turntable; 10. an arc-shaped hole; 11. a strip-shaped groove; 12. a movable rod; 13. a telescopic rod; 14. a first mounting bracket; 15. a first screw; 16. a first knob; 17. a second mounting bracket; 18. A second screw; 19. a second knob; 20. a movable seat; 21. a motor; 22. cutting the slices; 23. a worm; 24. a bearing seat; 25. a third knob; 26. a short bar; 27. and (5) clamping blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, a shearing apparatus for semiconductor device production comprises a base plate 1, the bottom of the base plate 1 is fixedly connected with supporting legs, the top of the base plate 1 is fixedly connected with an L-shaped plate 2, the top of the L-shaped plate 2 is provided with a handle 3, the bottom of the handle 3 is fixedly connected with a vertical rod 4, the vertical rod 4 is sleeved with a spring 5, the bottom end of the vertical rod 4 penetrates through the L-shaped plate 2 and extends to the bottom of the L-shaped plate 2, in practical application, the vertical rod 4 and the spring 5 are arranged into two groups, the handle 3 is pressed to drive the vertical rod 4 to move downwards and compress the spring 5, the handle 3 is loosened to automatically return under the action of the spring 5, a first control frame is arranged between the L-shaped plate 2 and the base plate 1, the first control frame comprises a first mounting frame 14, the first mounting frame 14 is fixedly connected with the bottom end of the vertical rod 4, a first screw 15 is arranged on the first mounting frame 14, both ends of the first screw 15 are movably connected with the first mounting frame 14, one end of the first screw 15 is fixedly connected with a first knob 16, a second control frame is arranged on the first control frame, the second control frame comprises a second mounting frame 17, a threaded hole is arranged on the second mounting frame 17, the second mounting frame 17 is in threaded connection with the first screw 15 through the threaded hole, the second mounting frame 17 is in sliding connection with the first mounting frame 14, a second screw 18 is arranged on the second mounting frame 17, two ends of the second screw 18 are movably connected with the second mounting frame 17, one end of the second screw 18 is fixedly connected with a second knob 19, a movable seat 20 is in threaded connection with the second screw 18, the movable seat 20 is in sliding connection with the second mounting frame 17, a cutter is arranged on the second control frame, the cutter comprises a motor 21, the motor 21 is fixedly connected to the movable seat 20, a cutting piece 22 is fixedly connected to an output shaft of the motor 21, in actual operation, the first knob 16 and the second knob 19 can be screwed to respectively drive the first screw 15 and the second screw 18 to rotate, the first screw 15 can drive the second mounting rack 17 to move left and right when rotating, and the second screw 18 can drive the movable seat 20 to move back and forth when rotating, so that the position of the cutter can be accurately controlled.

Straight smooth hole 6 has been seted up on bottom plate 1 surface, 1 bottom of bottom plate sets up pivot 7,

pivot

7 and 1 swing joint of bottom plate, 7 tops of pivot are provided with the bearing during practical application, pivot 7 passes through bearing and 1 swing joint of bottom plate, fixedly connected with worm wheel 8 and carousel 9 on the

pivot

7, 8 edges of worm wheel are provided with operating means, operating means includes worm 23, worm 23 meshes with worm wheel 8, fixed mounting has two bearing frames 24 on the worm 23, bearing

frame

24 and 1 fixed connection of bottom plate, 23 one end fixedly connected with third knob 25 of worm, it can drive worm 23 and rotate to rotate third knob 25 during actual operation, and then drive worm wheel 8 and rotate.

Seted up arc hole 10 on carousel 9, the inside holder that is provided with in arc hole 10, arc hole 10 and the quantity of straight slide opening 6 all set up to three during practical application, arc hole 10 all is annular array distribution with straight slide opening 6, the holder includes

quarter butt

26, 26 bottoms of quarter butt are located arc hole 10 insidely, 26 tops of quarter butt and the 6 sliding connection of straight slide opening, 26 top fixedly connected with clamp splice 27 of quarter butt, during practical application, 6 inner walls in straight slide opening are provided with the spout, be provided with the slider on the quarter butt 26, accessible arc hole 10 drives the quarter butt 26 and removes when carousel 9 rotates, and then drive clamp splice 27 and remove and realize the centre gripping, the principle is similar with manual chuck.

Strip groove 11 has been seted up on bottom plate 1 surface, strip groove 11 inside is equipped with

movable rod

12, 12 one end of movable rod is articulated with 11 inner walls in strip groove, the 12 other ends of movable rod articulate there is telescopic link 13, telescopic link 13 one end is articulated with 1 edge of bottom plate, be provided with adjusting bolt during practical application on the telescopic link 13, twist the length of the adjustable telescopic link 13 of adjusting bolt, drive movable rod 12 slope when telescopic link 13 extends, the movable rod 12 of slope can act as the fulcrum when wafer separation, can make movable rod 12 accomodate to strip inslot 11 during the telescopic link 13 shrink.

When the cutting tool is used, a wafer is firstly placed on the bottom plate 1, then the third knob 25 is screwed to drive the worm 23 to rotate, and further drive the worm wheel 8, the rotating shaft 7 and the rotating disc 9 to rotate, the short rod 26 and the clamping block 27 can be driven to slide along the straight sliding hole 6 by limiting the short rod 26 through the arc-shaped hole 10 when the rotating disc 9 rotates, so as to clamp and position the edge of the wafer, then the first knob 16 and the second knob 19 are respectively screwed according to operation requirements to respectively drive the first screw 15 and the second screw 18 to rotate, the position of the cutting tool can be controlled, when the cutting tool is moved to the appointed edge of the wafer, the motor 21 is started to drive the cutting blade 22 to rotate, then the handle 3 is pressed to drive the cutting blade 22 to move downwards, so as to realize cutting, after the scratching is finished, the third knob 25 is screwed to release the fixing of the wafer, then the adjusting bolt on the telescopic rod 13 is screwed to adjust the length of the telescopic rod 13, the telescopic rod 13 is extended to drive the movable rod 12 to tilt upwards, then the cutting mark of the wafer is aligned with the movable rod 12, and the two sides of the wafer are pressed to realize the cutting separation.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A shearing device for semiconductor component production, comprising a base plate (1), characterized in that: the bottom of the bottom plate (1) is fixedly connected with supporting legs, the top of the bottom plate (1) is fixedly connected with an L-shaped plate (2), the top of the L-shaped plate (2) is provided with a handle (3), the bottom of the handle (3) is fixedly connected with a vertical rod (4), the vertical rod (4) is sleeved with a spring (5), the bottom end of the vertical rod (4) penetrates through the L-shaped plate (2) and extends to the bottom of the L-shaped plate (2), a first control frame is arranged between the L-shaped plate (2) and the bottom plate (1), a second control frame is arranged on the first control frame, and a cutter is arranged on the second control frame;

straight slide opening (6) have been seted up on bottom plate (1) surface, bottom plate (1) bottom sets up pivot (7), pivot (7) and bottom plate (1) swing joint, fixedly connected with worm wheel (8) and carousel (9) are gone up in pivot (7), worm wheel (8) edge is provided with operating means, arc hole (10) have been seted up on carousel (9), arc hole (10) inside is provided with the holder, bar groove (11) have been seted up on bottom plate (1) surface, bar groove (11) inside is equipped with movable rod (12), movable rod (12) one end is articulated with bar groove (11) inner wall, movable rod (12) other end articulates there is telescopic link (13), telescopic link (13) one end is articulated with bottom plate (1) edge.

2. A shearing device as defined in claim 1 for use in the production of semiconductor components, characterized in that: the first control frame comprises a first mounting frame (14), the first mounting frame (14) is fixedly connected with the bottom end of the vertical rod (4), a first screw rod (15) is arranged on the first mounting frame (14), two ends of the first screw rod (15) are movably connected with the first mounting frame (14), and a first knob (16) is fixedly connected with one end of the first screw rod (15).

3. A shearing device for semiconductor element production as recited in claim 2, wherein: the second control frame comprises a second mounting frame (17), a threaded hole is formed in the second mounting frame (17), the second mounting frame (17) is in threaded connection with a first screw rod (15) through the threaded hole, the second mounting frame (17) is in sliding connection with the first mounting frame (14), a second screw rod (18) is arranged on the second mounting frame (17), two ends of the second screw rod (18) are both movably connected with the second mounting frame (17), a second knob (19) is fixedly connected with one end of the second screw rod (18), a movable seat (20) is in threaded connection with the second screw rod (18), and the movable seat (20) is in sliding connection with the second mounting frame (17).

4. A shearing device as defined in claim 3 for semiconductor component production, characterized in that: the cutter comprises a motor (21), the motor (21) is fixedly connected to a movable seat (20), and a cutting blade (22) is fixedly connected to an output shaft of the motor (21).

5. A shearing device as defined in claim 1 for use in the production of semiconductor components, characterized in that: the operating device comprises a worm (23), the worm (23) is meshed with a worm wheel (8), two bearing seats (24) are fixedly mounted on the worm (23), the bearing seats (24) are fixedly connected with the bottom plate (1), and one end of the worm (23) is fixedly connected with a third knob (25).

6. A shearing device as defined in claim 1 for use in the production of semiconductor components, characterized in that: the clamp holder comprises a short rod (26), the bottom end of the short rod (26) is located inside the arc-shaped hole (10), the top end of the short rod (26) is connected with the straight sliding hole (6) in a sliding mode, and a clamp block (27) is fixedly connected to the top end of the short rod (26).