CN214084793U

CN214084793U - Metamaterial structure, deicing device and aircraft

Info

Publication number: CN214084793U
Application number: CN201921251254.5U
Authority: CN
Inventors: 刘若鹏; 王艳丽; 赵治亚; 田华; 安迪; 商院芳
Original assignee: Shenzhen Guangqi High End Equipment Technology Research And Development Co ltd
Current assignee: Shenzhen Guangqi High End Equipment Technology Research And Development Co ltd
Priority date: 2019-08-05
Filing date: 2019-08-05
Publication date: 2021-08-31
Anticipated expiration: 2029-08-05

Abstract

The utility model provides a metamaterial structure, including the bed material layer and the metal micro-structure layer of stack on the bed material layer, the metal micro-structure layer has the closed loop open structure of periodic arrangement, and wherein, the bed material layer forms first metal soft board with the metal micro-structure layer jointly, and the end connection of first metal soft board has binding post to through binding post and external power source switch-on, form electrically conductive route, carry out the electrical heating with the characteristic that utilizes metal ohmic heating. Furthermore, the utility model discloses still provide a defroster and aircraft. The utility model provides a technical scheme carries out specific structural design with metal micro-structure layer, makes it both as the electrical heating unit, possesses electrical heating deicing function, as the electromagnetic modulation structure again, allows the electromagnetic signal transmission of electromagnetism transceiver within range of working frequency band, nevertheless shields the electromagnetic wave outside the working frequency band scope, suppresses clutter signal's interference.

Description

Metamaterial structure, deicing device and aircraft

Technical Field

The utility model relates to a material field, more specifically relates to a metamaterial structure, defroster and aircraft.

Background

Icing of an aviation aircraft in the flying process is a physical phenomenon which widely exists, and is one of the major hidden dangers of flight safety accidents. When the aircraft flies under the condition of lower than icing weather, supercooled water drops in the atmosphere impact the surface of the aircraft, and are easy to desublimate and form ice on the surfaces of parts of the protruding parts of the aircraft body, such as wing leading edges, rotors, tail rotor leading edges, an engine air inlet, an airspeed tube, aircraft windshield glass, an antenna housing and the like. The icing of the aircraft can not only increase the weight, but also destroy the aerodynamic appearance of the aircraft surface, change the streaming flow field, destroy the aerodynamic performance, cause the maximum lift force of the aircraft to be reduced, increase the flight resistance, reduce the flight performance, and cause fatal threat to the flight safety under severe conditions. In addition, for military aircraft, like unmanned aerial vehicle, cargo airplane etc. icing will directly restrict its flight area, very big influence its operational capability. Therefore, the critical parts which are easy to freeze must be protected from deicing.

The existing deicing method mainly comprises the following steps: hot air deicing, mechanical deicing, microwave deicing and electrothermal deicing. However, the hot gas deicing method adopting engine air bleed needs to design a complex air supply pipeline, distributes the hot gas bled by the engine air compressor to the part needing deicing, and affects the power and the working efficiency of the engine; the pneumatic appearance of the aircraft can be damaged by a mechanical deicing method of crushing an ice layer by adopting contraction and expansion of the air bag and the expansion pipe, and the deicing is not thorough; microwave deicing is easy to be captured by radar; in addition, the conventional electrothermal deicing generally adopts metal foils, metal wires, conductive metal films, resistance wires and the like as an electric heating unit, and is not suitable for parts needing an electromagnetic transmission function.

Therefore, how to realize deicing and having an electromagnetic modulation function on an aircraft to ensure transmission of electromagnetic signals has become a pain point problem that needs to be solved urgently in the industry.

SUMMERY OF THE UTILITY MODEL

To above problem, the utility model provides a metamaterial structure, wherein, metamaterial structure includes the bed material layer and superposes metal micro structure layer on the bed material layer, metal micro structure layer has the closed loop intercommunication structure of periodic arrangement, wherein, the bed material layer with metal micro structure layer forms first metal soft board jointly, just the end connection binding post of first metal soft board, and pass through binding post forms the electrically conductive route with the external power source switch-on, utilizes metal circular telegram heating's characteristic to carry out electrical heating.

Preferably, the metamaterial structure further comprises a first prepreg layer, and the first prepreg layer is bonded with the metal microstructure layer through a layer of adhesive.

Preferably, the metamaterial structure further comprises a second prepreg layer bonded to the base material layer by a layer of adhesive.

Preferably, the metamaterial structure further comprises a sandwich layer, and the sandwich layer is bonded with the second prepreg layer through a glue film.

Preferably, the metamaterial structure further comprises a third prepreg layer, and the third prepreg layer is bonded with the sandwich layer through a glue film.

Preferably, a second metal flexible board is embedded in the core layer or the third prepreg layer.

Preferably, the shape and the size of the metal microstructure on the second metal soft plate are the same as those of the metal microstructure on the first metal soft plate.

Preferably, the shape and the size of the metal microstructure on the second metal soft plate are different from those of the metal microstructure on the first metal soft plate.

Preferably, in the metal microstructure layer, an intersection exists between two adjacent periodic units, and each periodic unit is a closed-loop closed structure.

Preferably, in the metal microstructure layer, at least one metal communication line exists in a plurality of periodic units periodically arranged between the connection terminals.

Additionally, the utility model also provides a defroster, wherein, defroster includes above arbitrary any the metamaterial structure.

Furthermore, the utility model also provides an aircraft, wherein, aircraft includes above arbitrary any one the metamaterial structure.

The utility model provides a technical scheme is through the metal route that the design switches on and the specific design to metal route, solve current electric heat deicing mode because of the metal level can't realize electromagnetic signal transmission's a difficult problem to electromagnetic signal shielding, can restrain the interference of the external electromagnetic signal outside the inside electromagnetic transceiver working frequency channel of part simultaneously, thereby make and become possible like microwave millimeter wave antenna at the position overall arrangement electromagnetic transceiver that possesses good electromagnetic transmission field of vision, integrated for the aircraft is towards many sensing simultaneously, the basis is established in trend development such as full airspace perception, this also will further promote the full information chain link up that high-end aviation was equipped.

Drawings

Fig. 1 is a schematic cross-sectional view of a multi-layer structure included in a metamaterial structure according to a first embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of another multi-layer structure included in a metamaterial structure according to a second embodiment of the present invention;

fig. 3 is a schematic two-dimensional cross-sectional view of another multi-layer stack included in a metamaterial structure according to a second embodiment of the present invention;

fig. 4 is a schematic diagram illustrating a periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the second embodiment of the present invention;

fig. 5 is a schematic view of another periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the second embodiment of the present invention;

fig. 6 is a schematic diagram illustrating the variation of the S21 curve of the metamaterial structure under TE polarization with the incident angle theta according to the second embodiment of the present invention;

fig. 7 is a schematic diagram illustrating the variation of the S21 curve of the metamaterial structure under TM polarization with the incident angle theta according to the second embodiment of the present invention;

fig. 8 is a schematic view illustrating the periodic arrangement of the metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the third embodiment of the present invention;

fig. 9 is a schematic diagram of a curve S21 of a metamaterial structure according to a third embodiment of the present invention under TE polarization at an incident angle theta equal to 0 degree;

fig. 10 is a schematic diagram of a curve S21 of a metamaterial structure according to a third embodiment of the present invention under TM polarization at an incident angle theta equal to 0 degree;

fig. 11 is a schematic view illustrating the periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the fourth embodiment of the present invention;

fig. 12 is a schematic diagram of a curve S21 of a metamaterial structure according to a fourth embodiment of the present invention under TE polarization at an incident angle theta equal to 0 degree;

fig. 13 is a schematic diagram of a curve S21 of a metamaterial structure according to a fourth embodiment of the present invention under TM polarization at an incident angle theta equal to 0 degree;

fig. 14 is a schematic view illustrating the periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the fifth embodiment of the present invention;

fig. 15 is a schematic diagram of a curve S21 of a metamaterial structure according to a fifth embodiment of the present invention under TE polarization at an incident angle theta equal to 0 degree;

fig. 16 is a schematic diagram of a curve S21 of a metamaterial structure according to a fifth embodiment of the present invention under TM polarization at an incident angle theta equal to 0 degree;

fig. 17 is a schematic view illustrating the periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the sixth embodiment of the present invention;

fig. 18 is a schematic diagram of a curve S21 of a metamaterial structure according to a sixth embodiment of the present invention under TE polarization at an incident angle theta equal to 0 degree;

fig. 19 is a schematic diagram of a curve S21 of a metamaterial structure according to a sixth embodiment of the present invention under TM polarization at an incident angle theta equal to 0 degree;

fig. 20 is a schematic two-dimensional cross-sectional view of another multi-layer stack included in a metamaterial structure according to a seventh embodiment of the present invention;

fig. 21 is a schematic view of the periodic arrangement of respective metal microstructures on a double-layer modulation structure included in a metamaterial structure according to a seventh embodiment of the present invention;

fig. 22 is a schematic diagram of S21 curves of the metamaterial structure in the seventh embodiment of the present invention under TE polarization and TM polarization when the incident angle theta is 0 degree;

fig. 23 is a schematic view of the periodic arrangement of respective metal microstructures on a double-layer modulation structure included in a metamaterial structure according to a seventh embodiment of the present invention;

fig. 24 is a schematic diagram of S21 curves of the metamaterial structure in the seventh embodiment of the present invention under TE polarization and TM polarization at an incident angle theta of 0-60 °.

Detailed Description

The following examples are presented to enable those skilled in the art to more fully understand the present invention, but are not intended to limit the invention in any way.

Fig. 1 is a schematic cross-sectional view of a multi-layer structure included in a metamaterial structure according to an embodiment of the present invention.

As shown in fig. 1, the utility model discloses a many stromatolite structural design are adopted to the metamaterial structure, it is concrete, the metamaterial structure includes substrate material layer 1 and the metal micro structure layer 2 of stack on substrate material layer 1, metal micro structure layer 2 has the closed loop intercommunication structure of periodic arrangement, wherein, substrate material layer 1 forms first metal soft board with metal micro structure layer 2 jointly, and binding post 3 is connected respectively to the tip of first metal soft board, and put through with external power supply through binding post 3, form conductive path, carry out electrical heating with the characteristic that utilizes metal circular telegram heating. The base material layer 1 may be a flexible base material layer or a rigid base material layer, and the specific requirement is determined according to an actual application scenario, for example, if the metamaterial structure is applied to a curved surface, the flexible base material layer is required, and if the metamaterial structure is applied to a plane, the rigid base material layer or the flexible base material layer may be selected. Wherein, the substrate material layer 1 has excellent insulating property, high and low temperature resistance, the good characteristics of mechanical properties such as tensile, form first metal soft board with substrate material layer 1 and metal micro-structure layer 2 jointly, and first metal soft board is at end connection binding post 3, binding post 3 can be through the metal connection on welding mode and the metal micro-structure layer 2, or other connected mode, as long as satisfy binding post 3 and the metal on the metal micro-structure layer 2 and be connected equally, binding post 3 connects the positive and negative two poles of external power source through the power cord respectively, make the metal on the metal micro-structure layer 2, binding post 3, the power cord, form the electrically conductive access structure between the external power source, external power source passes through this electrically conductive access structure, carry out the electrical heating deicing to the position that easily freezes.

As shown in fig. 1, in the first metal flexible board, the metal on the base material layer 1 is etched by an etching process, and then processed into various metal microstructure patterns required actually, the metal is retained in the area of the metal microstructure layer 2 that is not etched away, and the retained metal in the metal microstructure layer 2 forms a communication structure, which is a closed-loop communication structure with periodic arrangement, for example, the closed-loop communication structure may be a closed-loop communication structure with a polygon such as a triangle, a quadrangle, a pentagon, a hexagon, etc., or a closed-loop communication structure with a curved shape such as a circle, a circular ring, etc.

In the metal microstructure layer 2, an intersection exists between two adjacent periodic units, for example, two adjacent periodic units share a metal edge, and each periodic unit is a closed-loop structure, and if the closed-loop communication structure is a closed-loop communication structure of polygons such as a triangle, a quadrangle, a pentagon, or a hexagon, the closed-loop communication structure of the metal microstructure layer 2 in periodic arrangement is a closed-loop communication structure formed by a plurality of periodically arranged triangles and two adjacent triangles share a metal edge, or a closed-loop communication structure formed by a plurality of periodically arranged quadrangles and two adjacent quadrangles share a metal edge, or a closed-loop communication structure formed by a plurality of periodically arranged pentagons and two adjacent pentagons share a metal edge, or a closed-loop communication structure formed by a plurality of periodically arranged hexagons and two adjacent hexagons share a metal edge And so forth; if the closed-loop communication structure is a curved closed-loop communication structure such as a circle or a circular ring, the periodically arranged closed-loop communication structure of the metal microstructure layer 2 is a closed-loop communication structure formed by a plurality of periodically arranged circles, and an intersection exists between two adjacent circles, for example, one or more metal points are shared, or a closed-loop communication structure formed by a plurality of periodically arranged circular rings, and an intersection exists between two adjacent circular rings, for example, one or more metal points are shared. In the metal microstructure layer 2, at least one metal communication line exists in a plurality of periodic units which are periodically distributed between two wiring terminals 3, so that the wiring terminals 3 at the end part of the first metal soft plate can be ensured to form a conduction path after being electrified and serve as heating units, and the metamaterial structure has an electric heating deicing function.

As shown in fig. 1, the metamaterial structure further includes a first prepreg layer 4 and a second prepreg layer 5, which are respectively bonded to the front surface and the back surface of the first metal flexible board through two layers of adhesives 6, specifically, the first prepreg layer 4 is bonded to the front surface of the metal microstructure layer 2 through one layer of adhesives 6, the back surface of the metal microstructure layer 2 is overlapped with the front surface of the base material layer 1, and the second prepreg layer 5 is bonded to the back surface of the base material layer 1 through another layer of adhesives 6. The prepregs in the first prepreg layer 4 and the second prepreg layer 5 are glass or quartz fiber prepregs and have the effects of insulation, strength support and the like, and the two layers of bonding agents 6 are used for better bonding the first prepreg layer 4 and the second prepreg layer 5 to the front surface and the back surface of the first metal soft board.

In this embodiment, the metal microstructure layer 2 has a closed-loop communication structure that is periodically arranged, the closed-loop communication structure that is periodically arranged is prepared by etching the metal on the base material layer 1 in the first metal soft plate through an etching process, and then processing into various metal microstructure patterns that are actually required, all the metal microstructure patterns are communicated together, specifically, the communication type metal structure pattern can be regarded as a gap type metal structure pattern, and from the external physical characteristics, the gap type metal structure pattern can be regarded as a gap where some metal units are etched on the surface of a complete metal layer according to a certain arrangement form. The gap-type metal structure pattern can flow without restriction electrons generated under the irradiation of electromagnetic waves, and has a band-pass type electromagnetic modulation effect in terms of frequency response characteristics, and specifically, the mechanism of the band-pass type electromagnetic modulation effect is represented by:

a) when low-frequency electromagnetic waves irradiate the surface of the gap type metal structure pattern, electrons in a large range are excited to move, so that the electrons absorb most of energy, induced current around the gap is small, and the transmission coefficient is small;

b) along with the continuous increase of the frequency of the incident electromagnetic wave, the moving range of electrons is gradually reduced, the current flowing around the gap is continuously increased, and the transmission coefficient is improved;

c) when the frequency of the incident electromagnetic wave reaches a certain value, electrons around the gap just move back and forth under the drive of the electric field vector of the incident electromagnetic wave, and a strong induced current is formed around the gap;

d) when the frequency of the incident electromagnetic wave is continuously increased, the movement range of electrons is reduced, the current around the gap is divided into a plurality of sections, the electromagnetic wave radiated by the electrons through the gap is reduced, and the transmission coefficient is reduced;

e) for the induced current generated on the metal surface far away from the gap, the electromagnetic field is radiated to the reflection direction, and because the electric field variation period of the high-frequency electromagnetic wave restricts the electron movement, the radiation energy is limited, when the high-frequency electromagnetic wave is incident, the transmission coefficient is reduced, and the reflection coefficient is increased.

In this embodiment, the surface of the slit-type metal structure pattern can be freely combined with slit-type metal surface infinitesimal and patch-type metal surface infinitesimal, thereby realizing the required electromagnetic modulation characteristics. The utility model discloses combine electromagnetic transceiver's electromagnetic response characteristic and structure, intensity requirement, carry out the material selection to the composite bed that contains electrical heating and electromagnetic modulation function to integrated design such as thickness, metal structure pattern realizes the integrated part of structure, intensity and compound electrical heating and electromagnetic modulation function.

In this embodiment, according to the requirements of structure, strength, electromagnetic control performance, etc., a new combined dielectric layer may be further added to the metamaterial structure, as shown in fig. 2.

Fig. 2 is a schematic cross-sectional view of another multi-layer structure included in the metamaterial structure according to the embodiment of the present invention.

As shown in fig. 2, a dashed box a indicates the metamaterial structure in fig. 1, and a dashed box B indicates the added composite dielectric layer. On the basis of the metamaterial structure shown in fig. 1, the metamaterial structure shown in fig. 2 further includes a sandwich layer 7 and a third prepreg layer 8, wherein one surface of the sandwich layer 7 is bonded to the second prepreg layer 5 through one adhesive film 9, and the third prepreg layer 8 is bonded to the other surface of the sandwich layer 7 through another adhesive film 9.

Fig. 3 is a schematic two-dimensional cross-sectional view of another multi-layer structure included in a metamaterial structure according to a second embodiment of the present invention.

Fig. 3 is a schematic two-dimensional cross-sectional view of the multi-layer structure shown in fig. 2, which is a multi-layer metamaterial structure formed by laminating the multi-layer structures, and the metamaterial structure shown in fig. 3 is a sandwich structure integrating functions of de-icing and electromagnetic modulation and a structure bearing function, and includes 9 layers, specifically, from top to bottom, the first prepreg layer 4 has a thickness d₁A layer of adhesive 6 having a thickness d₂The thickness of the first metal soft board (comprising the base material layer 1 and the metal microstructure layer 2) is d₃The other layer of adhesive 6 has a thickness d₄The second prepreg layer 5 has a thickness d₅The thickness of one layer of glue film 9 is d₆The thickness of the sandwich layer 7 is d₇The thickness of the other glue film 9 is d₈The thickness of the third prepreg layer 8 is d₉。

Wherein, the prepregs in the first prepreg layer 4, the second prepreg layer 5 and the third prepreg layer 8 are quartz fiber cyanate ester prepregs with low dielectric and low loss, and have high wave-transmitting and bearing functions, and simultaneously, the first prepreg layer 4, the second prepreg layer 5 and the third prepreg layer 8 are all good skin materials, the first prepreg layer 4 and the second prepreg layer 5 can be used as outer skin materials, the third prepreg layer 8 can be used as inner skin materials, the two layers of adhesives 6 can be bonded by adhesive films, the first metal soft plate is mainly composed of heating materials and insulating materials as an electric heating layer, the metal micro-structure layer 2 in the utility model is a heating material, which is made of metal copper with high resistivity and high electric conductivity, the substrate material layer 1 in the utility model is an insulating material, which is mainly a Polyimide (PI) film with excellent comprehensive performance, the sandwich layer 7 is used as a honeycomb layer to realize electromagnetic performance optimization and bearing functions.

The thickness of the metal layer in the metal microstructure layer 2 is determined according to the actual required resistance, the thicker the metal layer, the smaller the resistance, and the thinner the metal layer, the larger the resistance. In the present embodiment, the metal layer thickness in the metal microstructure layer 2 is 18 μm, and the thickness of the base material layer 1 is 25 μm, so the first metal soft plate composed of the two in the present invention is flexible as an electric heating layer, and is easily attached to a curved surface member. And the metal copper can be designed into hollow patterns with different topological structures, so that the electromagnetic modulation function of frequency selection is realized. Meanwhile, the metal microstructure layer 2 is of a communicated structure, so that a passage can be formed after the metal in the metal microstructure layer 2 is electrified, and the function of deicing through energization heating is realized. In order to realize the frequency selection function of different polarizations and frequency bands, the metal micro-structural layer 2 also needs to have a closed-loop structure which is periodically arranged. The utility model discloses a bond through realizing with the glued membrane between each layer. Among the materials used above, the skin material had a dielectric constant of 3.15 and a loss tangent of 0.006, the prepreg had a dielectric constant of 2.7 and a loss tangent of 0.0065, the PI film material had a dielectric constant of 3.2 and a loss tangent of 0.002, and the honeycomb material had a dielectric constant of 1.11 and a loss tangent of 0.006.

Fig. 4 is a schematic diagram illustrating a periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the second embodiment of the present invention.

As shown in fig. 4, the basic unit of the metal microstructure on the metal microstructure layer 2 is a regular hexagon, the metal inside the regular hexagon is etched away, only the metal lines on six sides of the regular hexagon are remained to form a regular hexagon metal ring, the metal lines on six sides of the regular hexagon metal microstructure are all p, the metal lines are all ww, the metal lines are periodically arranged in a manner that an intersection exists between two adjacent regular hexagon metal microstructures, for example, one metal side is shared, any side of the regular hexagon metal ring can be bent or converted into any polygon periodic boundary, each side of the hexagonal ring is bent as shown in FIG. 5, the deformation can increase the perimeter of the metal wire in the unit, so that the wave-transmitting frequency band shifts to low frequency, and the bending form, period, line width, line distance and bending length can be specially designed.

In the present embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in fig. 4 is applied to the stacked structure shown in fig. 3, in which the main structure dimensions are as shown in table 1 below.

TABLE 1 major structural dimensions in the laminate Structure

The metamaterial structures in fig. 3 were then simulated according to the dimensions in the above table, and the results are shown in fig. 6 and 7.

It can be seen from fig. 6 that when the incident angle theta is 0-60 °, the TE polarization shows high-pass characteristic at 8-15GHz, and the wave-transparent is greater than-1.4 dB; when the incident angle theta is 0-60 degrees, the TE polarization shows a cut-off characteristic at 0-1.5GHz, and the wave-transmitting is less than-10 dB.

It can be seen from fig. 7 that when the incident angle theta is 0-70 °, TM polarization exhibits high-pass characteristics at 8-20GHz, and wave-transparent is greater than-1 dB; when the incidence angle theta is 0-60 degrees, TM polarization shows a cut-off characteristic at 0-1GHz, and wave-transmitting is less than-9.4 dB.

Therefore, from the simulation results of fig. 6 and fig. 7, the metamaterial structure of the present invention realizes the frequency selection function of high-frequency wave-transparent and low-frequency cutoff. In addition, the electromagnetic modulation function of frequency selection can be compounded on the basis of electric heating deicing by adopting the topology structure similar to the communicated metal layer.

Furthermore, the utility model discloses in not only the periodic arrangement of hexagonal metal microstructure can realize electrical heating deicing function, as long as satisfy between other arbitrary polygons (like the trilateral, the quadrangle, pentagon etc.) the unit structure and exist the condition of intersection (like sharing the limit, share the point, the collineation section etc.), all can form closed loop communication structure in order to realize the electric path, and then can realize deicing function when as the circular telegram of electric heating layer, and through the major structure size among the design laminated structure, make it possess specific electromagnetic modulation function.

Fig. 8 is a schematic diagram illustrating the periodic arrangement of the metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the third embodiment of the present invention.

As shown in fig. 8, the basic unit structure of the metal microstructure on the metal microstructure layer 2 is a regular triangle, the metal inside the regular triangle is etched away, only the metal lines on three sides of the regular triangle are remained to form a regular triangle metal ring, and the length of the metal lines on the three sides of the regular triangle metal microstructure is p₁All the metal line widths are ww₁The periodic arrangement is adjacentThe two regular-triangular metal microstructures have an intersection, for example, a metal edge is shared, and the arrangement can realize that the metal layer is in a path when the power is on. In addition, any side of the regular trilateral metal ring can be bent or transformed into any polygon periodic boundary, for example, each side can be bent in a bending manner as shown in fig. 5, the deformation can increase the perimeter of the metal wire in the cell, so that the wave-transparent band shifts to a low frequency, and the bending form, period, line width, line distance and bending length can be specially designed.

In the present embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in fig. 8 is applied to the stacked structure shown in fig. 3, in which the main structure dimensions are as shown in table 2 below.

TABLE 2 major structural dimensions in the laminate Structure

Parameter(s)	Numerical value (mm)
		d₁	0.3
d₂	0.1
		d₃	0.043
d₄	0.1
		d₅	0.3
d₆	0.2
		d₇	5.6
d₈	0.2
		d₉	0.3
ww₁	0.2
		P ₁	6

The metamaterial structures in fig. 3 were then simulated according to the dimensions in the above table, and the results are shown in fig. 9 and 10.

Fig. 9 is a schematic diagram of an S21 curve of a metamaterial structure according to a third embodiment of the present invention under TE polarization at an incident angle theta of 0 degree. It can be seen from fig. 9 that the TE polarization exhibits high-pass characteristics at 10-20GHz at an incident angle theta of 0 °, and the wave-transparent is greater than-2.5 dB.

Fig. 10 is a schematic diagram of an S21 curve of a metamaterial structure according to a third embodiment of the present invention under TM polarization at an incident angle theta of 0 degree. It can be seen from fig. 10 that the TE polarization exhibits high-pass characteristics at 10-20GHz at an incident angle theta of 0 °, and the wave-transparent is greater than-2.5 dB.

Therefore, from the simulation results of fig. 9 and fig. 10, the metamaterial structure of the present invention realizes the electromagnetic modulation functions of high-frequency wave-transparent and low-frequency cut-off, and in addition, the metamaterial structure having the topology structure similar to the connected metal layer can be combined with the electromagnetic modulation functions on the basis of realizing the electric heating deicing.

Fig. 11 is a schematic diagram illustrating a periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the fourth embodiment of the present invention.

As shown in fig. 11, the basic unit structure of the metal microstructure on the metal microstructure layer 2 is a regular quadrangle, the metal inside the regular quadrangle is etched away, only the metal lines on the four sides of the regular quadrangle are remained to form a regular quadrangle metal ring, and the length of the metal lines on the four sides of the regular quadrangle metal microstructure is p₂All the metal line widths are ww₂The metal layer is arranged in a way of being periodically arranged, that is, an intersection exists between two adjacent regular quadrilateral metal microstructures, for example, one metal edge is shared, and the arrangement can realize that the metal layer is in a path when the metal layer is electrified. In addition, any side of the regular quadrilateral metal ring can be bent or converted into any polygon periodic boundary, for example, each side can be bent in a bending way as shown in fig. 5, the deformation can increase the perimeter of the metal wire in the cell, so that the wave-transparent frequency band shifts to a low frequency, and the bending form, period, line width, line distance and bending length can be specially designed.

In the present embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in fig. 11 is applied to the stacked structure shown in fig. 3, in which the main structure dimensions are as shown in table 3 below.

TABLE 3 major structural dimensions in the laminate Structure

Parameter(s)	Numerical value (mm)
		d₁	0.3
d₂	0.1
		d₃	0.043
d₄	0.1
		d₅	0.3
d₆	0.2
		d₇	5.6
d₈	0.2
		d₉	0.3
ww₂	0.3
		P ₂	6

The metamaterial structures in fig. 3 were then simulated according to the dimensions in the above table, and the results are shown in fig. 12 and 13.

Fig. 12 is a schematic diagram of an S21 curve of a metamaterial structure according to a fourth embodiment of the present invention under TE polarization at an incident angle theta of 0 degree. It can be seen from fig. 12 that the TE polarization exhibits high-pass characteristics at 12-20GHz at an incident angle theta of 0 °, and the wave-transparent is greater than-2.5 dB.

Fig. 13 is a schematic diagram of an S21 curve of a metamaterial structure according to a fourth embodiment of the present invention under TM polarization at an incident angle theta equal to 0 degree. It can be seen from fig. 13 that the TE polarization exhibits high-pass characteristics at 12-20GHz at an incident angle theta of 0 °, and the wave-transparent is greater than-2.5 dB.

Therefore, from the simulation results of fig. 12 and fig. 13, the metamaterial structure of the present invention realizes the electromagnetic modulation functions of high-frequency wave-transparent and low-frequency cut-off, and in addition, the metamaterial structure having the topology structure similar to the connected metal layer can be combined with the electromagnetic modulation functions on the basis of realizing the electric heating deicing.

Additionally, the utility model discloses in not only the cyclic (al) configuration of the closed-loop metal connectivity structure of this kind of linear type of polygon can realize electrical heating deicing function, and as long as satisfy between other arbitrary closed-loop curve (like circular, ring etc.) the unit structure and exist the condition that intersects (like being on a common side, be on a common point, collinear section etc.), the closed-loop metal connectivity structure that all can form the curvilinear figure is in order to realize the electric path, and then can realize deicing function when the circular telegram as electric heating layer, and can also make it possess the electromagnetic modulation function through the major structure size among the design laminated structure.

Fig. 14 is a schematic diagram illustrating a periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the fifth embodiment of the present invention.

As shown in fig. 14, the basic unit structure of the metal microstructure on the metal microstructure layer 2 is a circular ring with an inner diameter p₃The line widths of the circular rings are all ww₃The periodic arrangement mode is that two adjacent circular rings are connected with each other, and the arrangement can realize that the metal layer is in a path when electrified.

In the present embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in fig. 14 is applied to the stacked structure shown in fig. 3, in which the main structure dimensions are as shown in table 4 below.

TABLE 4 major structural dimensions in the laminate Structure

Parameter(s)	Magnitude (mm)
		d₁	0.3
d₂	0.1
		d₃	0.043
d₄	0.1
		d₅	0.3
d₆	0.2
		d₇	5.6
d₈	0.2
		d₉	0.3
ww₃	0.6
		P ₃	6

The metamaterial structures in fig. 3 were then simulated according to the dimensions in the above table, and the results are shown in fig. 15 and 16.

Fig. 15 is a schematic diagram of an S21 curve of a metamaterial structure according to a fifth embodiment of the present invention under TE polarization at an incident angle theta of 0 degree. It can be seen from fig. 15 that the TE polarization exhibits high-pass characteristics at 14-20GHz at an incident angle theta of 0 °, and the wave-transparent is greater than-2.5 dB.

Fig. 16 is a schematic diagram of an S21 curve of a metamaterial structure according to a fifth embodiment of the present invention under TM polarization at an incident angle theta of 0 degree. It can be seen from fig. 16 that the TE polarization exhibits high-pass characteristics at 14-20GHz at an incident angle theta of 0 °, and the wave-transparent is greater than-2.5 dB.

Therefore, from the simulation results of fig. 15 and fig. 16, the metamaterial structure of the present invention realizes the high-frequency wave-transmitting function, and in addition, the metamaterial structure having such a topology structure similar to the connected metal layer can be combined with the electromagnetic modulation function on the basis of realizing the electrical heating deicing.

Additionally, the utility model discloses in not only linear type's closed loop metal open structure, curved closed loop metal open structure can realize electrical heating deicing function under periodic arrangement, and poroid closed loop metal open structure also can realize electrical heating deicing function under periodic arrangement, closed loop metal open structure to poroid is as unit structure, as long as satisfy interconnect condition between the unit structure, all can form poroid closed loop metal open structure's electric path, and then can realize deicing function when circular telegram as the electric heating layer, and can also make it possess the electromagnetic modulation function through the main structure size among the design laminated structure.

Fig. 17 is a schematic diagram illustrating a periodic arrangement of metal microstructures on the metal microstructure layer 2 included in the metamaterial structure according to the sixth embodiment of the present invention.

As shown in FIG. 17, the metal micro-structure layer 2 has metal micro-structureThe basic unit structure of the structure is that a round through hole is hollowed in the middle of a regular hexagonal metal sheet to form a porous closed-loop metal communication structure, and the side length of the regular hexagonal metal sheet is p₄Radius of the circular through-hole is r₄The metal sheets of two adjacent regular hexagons are arranged periodically, for example, they share one edge, so as to form a condition of mutual connection between two adjacent unit structures, and the two-dimensional connected arrangement is used to implement the metal layer in a path when the power is on.

In the present embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in fig. 17 is applied to the stacked structure shown in fig. 3, in which the main structural dimension design is as shown in table 5 below.

TABLE 5 major structural dimensions in the laminate Structure

The metamaterial structures in fig. 3 were then simulated according to the dimensions in the above table, and the results are shown in fig. 18 and 19.

Fig. 18 is a schematic diagram of the S21 curve of the metamaterial structure in the sixth embodiment of the present invention under the TE polarization when the incident angle theta is 0 degree. It can be seen from fig. 18 that the TE polarization exhibits high-pass characteristics at 18-20GHz at an incident angle theta of 0 °, and the wave-transparent is greater than-2.5 dB.

Fig. 19 is a schematic diagram of an S21 curve of a metamaterial structure according to a sixth embodiment of the present invention under TM polarization at an incident angle theta equal to 0 degree. It can be seen from fig. 19 that the TE polarization exhibits high-pass characteristics at 18-20GHz at an incident angle theta of 0 °, and the wave-transparent is greater than-2.5 dB.

Therefore, from the simulation results of fig. 18 and fig. 19, the metamaterial structure of the present invention realizes the electromagnetic modulation function of high-frequency wave-transparent, and in addition, the metamaterial structure having such a topology structure similar to the connected metal layer can be combined with the electromagnetic modulation function on the basis of realizing the electric heating deicing.

Therefore, the utility model discloses in with the closed loop metal open communication structure of linear type, the closed loop metal open communication structure of curved type, the closed loop metal open communication structure of poroid is as the elementary cell structure homoenergetic realization electrical heating deicing function under the periodicity is arranged, and as long as satisfy and have intersection's condition (like being on one side, being on one side altogether, collinear section etc.) between the unit structure, all can form poroid closed loop metal open communication structure's electric circuit, and then can realize deicing function when switching on as the electrical heating layer, and main structure size through in the design laminated structure can also make it possess the electromagnetic modulation function. The electric heating layer (namely the first metal soft plate) with the deicing function is connected with a power line through a welding point to form a wiring terminal except that the metal layer is a communicated structure, the wiring terminal is connected to an airborne power supply on an aircraft through the power line, a thin layer is dissolved out by heat generated by the electric heating layer between an ice layer and an outer skin, the adhesive force between the ice layer and the outer skin is reduced, and the ice layer is easily blown down under the action of aerodynamic force or centrifugal force.

In this embodiment, for the newly added combined dielectric layer, in order to realize more excellent electromagnetic modulation performance, the utility model discloses can also embed the metal soft board shown in fig. 1 alone in sandwich layer 7 or third prepreg layer 8, for example, the second metal soft board is the same with first metal soft board, also includes substrate material layer and metal micro-structure layer, the second metal soft board is the same with first metal soft board, also is as the electromagnetic modulation layer, but the difference is, the second metal soft board can realize whole more excellent electromagnetic modulation performance as the electromagnetic modulation layer.

Fig. 20 is a schematic two-dimensional cross-sectional view of another multi-layer stack included in a metamaterial structure according to a seventh embodiment of the present invention. The metamaterial structure shown in fig. 20 is a sandwich structure integrating functions of deicing and electromagnetic modulation and a structure bearing function, and comprises 13 layers in total, and the metamaterial structure is added on the basis of fig. 3d10, d11 and d12, in particular, from top to bottom, d1-d9 are the same as those shown in FIG. 3, i.e., the first prepreg layer 4 has a thickness d₁A layer of adhesive 6 having a thickness d₂The thickness of the first metal flexible sheet is d₃The other layer of adhesive 6 has a thickness d₄The second prepreg layer 5 has a thickness d₅The thickness of one layer of glue film 9 is d₆The thickness of the sandwich layer 7 is d₇The thickness of the other glue film 9 is d₈The thickness of the third prepreg layer 8 is d₉(ii) a d11 is a second metal soft plate, d10 and d12 are two layers of adhesives respectively covering the upper surface and the lower surface of the second metal soft plate, d9 and d13 together form d9 in fig. 3, and the difference is that the thicknesses are different, namely the combined thickness is different from the thickness of d9 in fig. 3. Therefore, the metamaterial structure shown in fig. 20 is a double-layer modulation structure, that is, the first metal flexible board as an electrical heating layer realizes an electrical heating function and an electromagnetic modulation function, and the second metal flexible board as an electromagnetic modulation layer can realize more excellent electromagnetic modulation performance as a whole.

Fig. 21 is a schematic diagram illustrating the periodic arrangement of respective metal microstructures on a dual-layer modulation structure included in a metamaterial structure according to a seventh embodiment of the present invention.

As shown in fig. 21(a), the basic unit structure of the metal microstructure on the metal microstructure layer of the first metal flexible board is a circular ring, the metal in the circular metal sheet is etched away, only the peripheral curved metal lines are remained to form a circular ring, and the inner diameter of the circular ring is p₁The metal line widths of the circular rings are all ww₁The periodic arrangement mode is that an intersection exists between two adjacent circular metal microstructures, for example, two circular metal microstructures are tangent to each other, and the arrangement can realize that the metal layer is in a path when the power is on. As shown in fig. 21(b), the basic unit structure of the metal microstructure on the metal microstructure layer of the second metal flexible board is a circular ring, the metal in the circular metal sheet is etched away, only the peripheral curved metal lines are remained to form a circular ring, and the inner diameter of the circular ring is p₂The metal line widths of the circular rings are all ww₂The periodic arrangement is that an intersection exists between two adjacent circular metal microstructures, such as two circular ringsThe shapes are tangent, and the arrangement can realize that the metal layer is in a path when the power is on.

In this embodiment, the periodic arrangement of the respective metal microstructures on the two-layer modulation structure shown in fig. 21 is applied to the stacked structure shown in fig. 20, in which the main structure dimensions are as shown in table 6 below.

TABLE 6 major structural dimensions in the laminate Structure

Parameter(s)	Numerical value (mm)
		d₁	0.3
d₂	0.1
		d₃	0.043
d₄	0.2
		d₅	0.3
d₆	0.2
		d₇	5.6
d₈	0.2
		d₉	0.3
d₁₀	0.1
		d₁₁	0.043
d₁₂	0.1
		d₁₃	0.3
ww₁	0.6
		ww₂	0.6
p₁	6
		p ₂	6

The metamaterial structure of fig. 20 was then simulated according to the dimensions in the above table, and the result is shown in fig. 22.

As can be seen from fig. 22, when the incident angle theta is 0 °, the low-frequency cutoff bandwidth of the dual-layer modulation structure (i.e., including both the first metal soft plate and the second metal soft plate) is significantly larger than that of the single-layer modulation structure (i.e., including only the first metal soft plate), which indicates that adding the metal soft plate as the electromagnetic modulation layer is beneficial to widening the cutoff bandwidth, and the high-frequency wave-transmitting is not affected, so that the overall more excellent electromagnetic modulation performance can be achieved.

Therefore, the above embodiments illustrate that, no matter the linear closed-loop metal connection structure, the curved closed-loop metal connection structure, or the hole-shaped closed-loop metal connection structure is arranged periodically as the basic unit structure on the metal flexible board, the electrical heating deicing function and the electromagnetic modulation function can be realized, and the metal flexible board (e.g., the second metal flexible board) shown in fig. 1 is embedded in the third prepreg layer 9, and the shape and size of the metal microstructure on the second metal flexible board are designed to be the same as those on the first metal flexible board, so that the overall more excellent electromagnetic modulation performance can be realized. However, if the shape of the metal microstructure on the second metal soft plate is designed to be the same as the shape but different from the size of the metal microstructure on the first metal soft plate, or the shape and the size are different, the overall more excellent electromagnetic modulation performance can be realized.

Fig. 23 is a schematic diagram illustrating the periodic arrangement of respective metal microstructures on a dual-layer modulation structure included in a metamaterial structure according to a seventh embodiment of the present invention.

As shown in fig. 23(a), the basic unit structure of the metal microstructure on the metal microstructure layer of the first metal flexible board is a regular hexagon, the metal inside the regular hexagon is etched away, only the metal lines on six sides of the regular hexagon are remained to form a regular hexagon metal ring, and the metal lines on six sides of the regular hexagon metal microstructure are all p in length₁All the metal line widths are ww₁The periodic arrangement mode is that an intersection exists between two adjacent regular hexagonal metal microstructures, for example, one metal edge is shared, and the arrangement can realize that the metal layer is in a path when the power is on. As shown in fig. 23(b), the basic unit structure of the metal microstructure on the metal microstructure layer of the second metal flexible board is also a regular hexagon, the metal inside the regular hexagon is etched away, only the metal lines on six sides of the regular hexagon are remained to form a regular hexagon metal ring, and the metal lines on six sides of the regular hexagon metal microstructure are all p in length₂All the metal line widths are ww₂The periodic arrangement mode is that an intersection exists between two adjacent regular hexagonal metal microstructures, for example, one metal edge is shared, and the arrangement can realize that the metal layer is in a path when the power is on. In addition, any side of the regular hexagonal metal ring can be bent or transformed into any polygonal periodic boundary, for example, each side can be bent in a bending manner as shown in fig. 5, and this deformation can increase the perimeter of the metal line in the cell, so that the wave-transparent band shifts to a low frequency, and the bending form, period, line width, line distance, and bending length can be designed specifically.

In this embodiment, the periodic arrangement of the respective metal microstructures on the two-layer modulation structure shown in fig. 23 is applied to the stacked structure shown in fig. 20, in which the main structure dimensions are as shown in table 7 below.

TABLE 7 major structural dimensions in the laminate Structure

The metamaterial structure of fig. 23 was then simulated according to the dimensions in the above table, and the result is shown in fig. 24.

As can be seen from fig. 24, when the incident angle theta is 0 °, the low-frequency cutoff bandwidth of the dual-layer modulation structure (i.e., including both the first metal flexible board and the second metal flexible board) is significantly greater than that of the single-layer modulation structure (i.e., including only the first metal flexible board), and the wave-transmission of 7 to 15GHz is greater than-1 dB, which is substantially the same as the surface wave-transmission of the single-layer modulation structure, which indicates that adding the metal flexible board as the electromagnetic modulation layer is beneficial to widening the cutoff bandwidth, and the high-frequency wave-transmission is not affected, so that the overall superior electromagnetic modulation performance can be achieved.

The utility model provides a technical scheme is compound electromagnetic modulation function on the basis that satisfies deicing function, metal access and to the specific design of metal access that switch on through the design, solve current deicing mode because of the metal level can't guarantee electromagnetic signal transmission's a difficult problem to electromagnetic signal shielding, can restrain the interference of the external electromagnetic signal outside the inside electromagnetic transceiver working frequency channel of part simultaneously, thereby make the position overall arrangement electromagnetic transceiver who possesses good electromagnetic transmission field of vision, if microwave, millimeter wave antenna etc. become probably, integrated for the aircraft is towards many sensing simultaneously, trend development such as full airspace perception establishes the basis, this also link up with the complete information chain that further promotes high-end aviation equipment.

Those skilled in the art will appreciate that the above embodiments are merely exemplary embodiments and that various changes, substitutions and alterations can be made without departing from the spirit and scope of the invention.

Claims

1. A metamaterial structure is characterized by comprising a base material layer and a metal micro-structure layer superposed on the base material layer, wherein the metal micro-structure layer is provided with a closed-loop communication structure which is periodically arranged, the base material layer and the metal micro-structure layer jointly form a first metal soft board, the end part of the first metal soft board is connected with a wiring terminal and is communicated with an external power supply through the wiring terminal to form a conductive path, so that the metal is electrically heated by utilizing the characteristic of metal power-on heating; wherein, the first metal soft plate is an electric heating layer.

2. The metamaterial structure of claim 1, further comprising a first prepreg layer bonded to the metallic microstructure layer with a layer of adhesive.

3. The metamaterial structure of claim 2, further comprising a second prepreg layer bonded to the base material layer with a layer of adhesive.

4. The metamaterial structure of claim 3, further comprising a sandwich layer bonded to the second prepreg layer by a glue film.

5. The metamaterial structure of claim 4, further comprising a third prepreg layer bonded to the core layer by a glue film.

6. The metamaterial structure of claim 5, wherein a second metal flexible board is embedded in the core layer or the third prepreg layer, the second metal flexible board comprises a base material layer and a metal microstructure layer superposed on the base material layer, and the second metal flexible board is an electromagnetic modulation layer.

7. The metamaterial structure of claim 1, wherein in the metal microstructure layer, an intersection exists between two adjacent periodic units, and each periodic unit is a closed loop structure.

8. The metamaterial structure according to claim 7, wherein in the metal microstructure layer, at least one metal communication line exists in a plurality of periodic units periodically arranged between the connection terminals.

9. A de-icing arrangement, characterized in that it comprises a metamaterial structure according to any one of claims 1 to 8.

10. An aircraft, characterized in that it comprises a metamaterial structure according to any one of claims 1 to 8.