CN110707410A - A metamaterial, radome and aircraft - Google Patents

Abstract

The invention provides a metamaterial, comprising a base material layer and a metal microstructure layer superimposed on the base material layer, wherein the metal microstructure layer has a unidirectionally connected structure arranged periodically, wherein the base material layer and the metal microstructure The layers together form a whole, and the ends of the whole in a single direction are connected with terminals, and are connected to an external power source through the terminals to form a conductive path to perform electric heating by utilizing the characteristics of metal heating by electricity. In addition, the present invention also provides a radome and an aircraft. The technical solution provided by the present invention is to carry out a specific structural design of the metal microstructure layer, so that it not only acts as an electric heating unit, but also has the function of electric heating and deicing, and also acts as an electromagnetic modulation structure, which allows electromagnetic signal transmission within the operating frequency range of the electromagnetic transceiver device. However, it shields electromagnetic waves outside the operating frequency range and suppresses the interference of clutter signals.

Description

A metamaterial, radome and aircraft

technical field

The present invention relates to the field of materials, and more particularly, to a metamaterial, a radome and an aircraft.

Background technique

The icing of aircraft during flight is a widespread physical phenomenon and one of the major hidden dangers of flight safety accidents. When the aircraft is flying under icing weather conditions, the supercooled water droplets in the atmosphere hit the surface of the aircraft, and are prone to protruding parts of the fuselage, such as the leading edge of the wing, rotor, tail rotor, and engine air intake. , pitot tubes, aircraft windshields and radomes and other components surface sublimation to form ice. The icing of the aircraft will not only increase the weight, but also destroy the aerodynamic shape of the aircraft, change the flow field around it, destroy the aerodynamic performance, cause the maximum lift of the aircraft to decrease, increase the flight resistance, and reduce the flight performance. In severe cases, it will cause flight safety. Deadly Threat. In addition, for military aircraft, such as unmanned aerial vehicles, transport aircraft, etc., icing will directly limit their flight area and greatly affect their combat capabilities. Therefore, deicing protection must be carried out for the key parts that are prone to freezing.

Existing deicing methods mainly include: hot gas deicing, mechanical deicing, microwave deicing, and electric heating deicing. However, using the hot gas deicing method of starting bleed air requires the design of complex air supply pipelines to distribute the hot gas drawn from the engine compressor to the parts that need to be deiced, which will affect the power and work efficiency of the engine; the use of airbags and expansion pipes The mechanical de-icing method that shrinks and expands to break the ice layer will destroy the aerodynamic shape of the aircraft, and the de-icing will not be complete; Films, resistance wires, etc. are used as electric heating units, which are not suitable for components requiring electromagnetic transmission function.

Therefore, how to realize both deicing and electromagnetic modulation function on the aircraft to ensure the transmission of electromagnetic signals has become a pain point problem that the industry needs to solve urgently.

SUMMARY OF THE INVENTION

In view of the above problems, the present invention provides a metamaterial, wherein the metamaterial includes a base material layer and a metal microstructure layer superimposed on the base material layer, and the metal microstructure layer has periodically arranged A single-direction communication structure, wherein the base material layer and the metal microstructure layer together form a whole, and the end of the whole in a single direction is connected with a terminal, and is connected to an external power supply through the terminal. The conductive path is formed to use the characteristics of the metal to conduct electric heating.

Preferably, the metamaterial further includes a first prepreg layer, and the first prepreg layer is bonded to the metal microstructure layer through a layer of adhesive.

Preferably, the metamaterial further includes a second prepreg layer, and the second prepreg layer is bonded to the base material layer through a layer of adhesive.

Preferably, the metamaterial further includes a core layer, and the core layer is bonded to the second prepreg layer through a layer of adhesive film.

Preferably, the metamaterial further includes a third prepreg layer, and the third prepreg layer is bonded to the sandwich layer through a layer of adhesive film.

Preferably, there is at least one metal communication line among the plurality of metal periodic units periodically arranged between the connection terminals.

Preferably, any metal communication line includes a plurality of periodic metal units sequentially connected in the horizontal direction, the metal units are V-shaped, and the opening angle of the V-shaped is greater than 0 degrees and less than or equal to 180 degrees.

Preferably, in the metal microstructure layer, any metal communication line includes a plurality of periodic metal units that are sequentially connected in a single direction, and the metal units are in the shape of a rectangular wave.

In addition, the present invention also provides a radome, wherein the radome includes the metamaterial described in any one of the above.

In addition, the present invention also provides an aircraft, wherein the aircraft includes the metamaterial described in any one of the above.

The technical solution provided by the present invention solves the problem that the electromagnetic signal transmission cannot be realized in the existing electrothermal deicing method due to the shielding of the electromagnetic signal by the metal layer by designing the conductive metal path and the specific design of the metal path, and at the same time, the electromagnetic signal inside the component can be suppressed. The interference of external electromagnetic signals outside the working frequency band of the transceiver device makes it possible to arrange electromagnetic transceiver devices such as microwave and millimeter-wave antennas in parts with a good electromagnetic transmission field of view, which further promotes the trend of multi-sensor integration and full airspace perception for aircraft. Lay the foundation for development and further enhance the complete information chain connection of high-end aviation equipment.

Description of drawings

1 is a schematic cross-sectional view of a multi-layered structure included in a metamaterial in a first embodiment of the present invention;

2 is a schematic cross-sectional view of another multi-layered structure included in the metamaterial in the second embodiment of the present invention;

3 is a two-dimensional cross-sectional schematic diagram of another multi-layer stack included in the metamaterial in the second embodiment of the present invention;

4 is a schematic diagram of the periodic arrangement of the in-line metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

5 is a schematic diagram of the variation of the S21 curve of the metamaterial under TE polarization with the incident angle theta in the second embodiment of the present invention;

6 is a schematic diagram of the variation of the S21 curve of the metamaterial under TM polarization with the incident angle theta in the second embodiment of the present invention;

7 is a schematic diagram of another periodic arrangement of the in-line metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

8 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 7 under TE polarization with the incident angle theta in the second embodiment of the present invention;

9 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 7 under TM polarization with the incident angle theta in the second embodiment of the present invention;

10 is a schematic diagram of a periodic arrangement of V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

11 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 10 under TE polarization with the incident angle theta in the second embodiment of the present invention;

12 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 10 under TM polarization with the incident angle theta in the second embodiment of the present invention;

13 is a schematic diagram of another periodic arrangement of the V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

14 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 13 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention;

15 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 13 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention;

16 is a schematic diagram of the third periodic arrangement of the V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

17 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 16 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention;

18 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 16 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention;

19 is a schematic diagram of the periodic arrangement of the semicircular metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

20 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 19 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention;

21 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 19 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention;

FIG. 22 is a schematic diagram of the periodic arrangement of the sine wave metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

23 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 22 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention;

FIG. 24 is a schematic diagram of the change of the S21 curve of the metamaterial of FIG. 22 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention.

Detailed ways

The following examples may enable those skilled in the art to more fully understand the present invention, but do not limit the present invention in any way.

FIG. 1 is a schematic cross-sectional view of a multi-layered structure included in a metamaterial in an embodiment of the present invention.

As shown in FIG. 1 , the metamaterial of the present invention adopts a multi-layer structure design. Specifically, the metamaterial includes a base material layer 1 and a metal microstructure layer 2 superimposed on the base material layer 1, and the metal microstructure layer 2 has a period A single flat-direction communication structure arranged in a linear manner, wherein the base material layer 1 and the metal microstructure layer 2 together form a whole, and the ends of the whole in a single direction are connected with terminals 3, and through the two terminals 3 are connected with each other. When the external power supply is turned on, a conductive path is formed, and the electric heating is carried out by using the characteristics of metal electric heating. Among them, the base material layer 1 can be either a flexible base material layer or a rigid base material layer, which depends on the actual application scenario. For example, if the metamaterial is applied to a curved surface, a flexible base material layer is required. When it comes to a flat surface, a rigid base material layer or a flexible base material layer can be selected. Among them, the base material layer 1 has the characteristics of excellent insulation performance, high and low temperature resistance, and good mechanical properties such as stretching. The end of the flexible board in the horizontal direction is connected with a terminal 3. The terminal 3 can be connected to the metal on the metal microstructure layer 2 by welding, or other connection methods, as long as the terminal 3 and the metal microstructure layer 2 are satisfied. The two terminals 3 are respectively connected to the positive and negative poles of the external power supply through the power cord, so that the metal on the metal microstructure layer 2, the two terminals 3, the power cord and the external power supply will be connected to each other. A conductive path structure is formed, and an external power source passes through this electrical path structure to perform electrical heating by utilizing the characteristics of the metal microstructure layer 2 being electrically heated.

As shown in Figure 1, in the soft metal plate, the metal on the base material layer 1 is etched through an etching process, and then processed into various metal microstructure patterns that are actually required. The metal microstructure layer 2 is not The metal is retained in the etched area, and the retained metal in the metal microstructure layer 2 forms a single-directional connected structure, and the connected structure is a single-directional connected structure with periodic arrangement. For example, the single-directional connected structure can It is a straight horizontal connection structure such as a straight line, a V shape, and a rectangular waveform, and may also be a curved horizontal connection structure such as a sine waveform and a semicircle.

Wherein, in the metal microstructure layer 2, each metal periodic unit includes two ends, and one of the ends of two adjacent metal periodic units is connected. Specifically, the end of the first metal periodic unit is connected to the adjacent The end of the second metal periodic unit is connected to the end of the second metal periodic unit, the other end of the second metal periodic unit is connected to the end of the adjacent third metal periodic unit, and the other end of the third metal periodic unit is connected to the adjacent fourth metal periodic unit. The ends of the metal periodic units are connected, . Among them, in the metal microstructure layer 2, there is at least one metal connection line in the plurality of metal periodic units periodically arranged between the two terminals 3, which can ensure that the two terminals 3 at both ends of the metal flexible board are energized. A conduction path is formed, and as a heating unit, the metamaterial structure has the function of electric heating and deicing. In any metal communication line, a plurality of metal periodic units are sequentially connected in a single direction, and the metal periodic units are in the shape of a line or V and the opening angle of the V-shape is greater than 0 degrees and less than or equal to 180 degrees, or, in any metal communication line, a plurality of metal periodic units are included in sequence and sequentially connected in the horizontal direction, and the metal periodic units are in the shape of a rectangular wave shape.

As shown in FIG. 1, the metamaterial also includes a first prepreg layer 4 and a second prepreg layer 5, which are respectively bonded to the front and back surfaces of the metal soft plate through two layers of adhesives 6. Specifically, The first prepreg layer 4 is bonded to the front side of the metal microstructure layer 2 through a layer of adhesive 6, the reverse side of the metal microstructure layer 2 is superimposed with the front side of the base material layer 1, and the second prepreg layer 5 is passed through. Another layer of adhesive 6 is bonded to the reverse side of the base material layer 1 . The respective prepregs in the first prepreg layer 4 and the second prepreg layer 5 are fiber prepregs such as glass or quartz, which play the roles of insulation and strength support. The function is to better bond the first prepreg layer 4 and the second prepreg layer 5 to the front and back surfaces of the soft metal board.

In this embodiment, the metal microstructure layer 2 has a periodically arranged single-direction connected structure, and the preparation of this periodically arranged single-direction connected structure is to etch the base material layer 1 in a soft metal plate through an etching process. The metal on it is etched, and then processed into various metal microstructure patterns that are actually required. The metal microstructure patterns are connected in a single direction. Specifically, this connected metal structure pattern can be regarded as a gated metal structure. Graphics, in terms of external physical characteristics, the metal structure pattern with gate can be regarded as some unidirectional metal lines obtained by etching on the surface of a complete metal layer according to a certain arrangement. The electrons generated by this kind of band-gate metal structure pattern under the irradiation of electromagnetic waves can flow unrestrictedly. From the frequency response characteristics, the band-gate metal structure pattern has the electric field polarization direction parallel to the band-gate direction under the incidence of electromagnetic waves. The electromagnetic modulation effect of the high-pass type of the low-frequency cut-off basically has no effect on the field in another orthogonal polarization direction. Specifically, the mechanism of the high-pass type of electromagnetic modulation effect of the low-frequency cut-off is as follows:

a) When the low-frequency electromagnetic wave with the electric field polarization direction parallel to the band gate direction is irradiated on the surface of this band gate metal structure pattern, a large amount of free electrons will be excited to move in the same direction for a long time, so as to obtain a larger kinetic energy. The lower the frequency of the incident electromagnetic wave, the more energy absorbed by the electrons, therefore, the weaker the transmission ability of the incident electromagnetic wave, and the smaller the transmission coefficient;

b) When high-frequency electromagnetic waves are incident, the direction of the electric field changes rapidly, the speed that the electrons can reach is small, and the energy absorbed by the electrons is small. Therefore, the incident electromagnetic waves have high transmission capacity and high transmission coefficient.

In this embodiment, the surface of the gated metal structure pattern can also be freely combined with non-connected annular metal surface micro-elements and patch-type metal surface micro-elements, thereby achieving the required electromagnetic modulation characteristics. According to the electromagnetic response characteristics, structure and strength requirements of the electromagnetic transceiver device, the invention selects the material of the composite layer with electric heating and electromagnetic modulation functions, and carries out the integrated design of thickness, metal structure pattern, etc., so as to realize the structure, strength and composite electric heating. Integral part with electromagnetic modulation function.

In this embodiment, according to the needs of structural strength, electromagnetic regulation performance, etc., a new composite dielectric layer can be further added to the metamaterial, as shown in FIG. 2 .

FIG. 2 is a schematic cross-sectional view of another multi-layered structure included in a metamaterial according to an embodiment of the present invention.

As shown in Figure 2, the dashed box A represents the metamaterial in Figure 1, and the dashed box B represents the newly added composite dielectric layer. On the basis of the metamaterial structure shown in FIG. 1 , the metamaterial in FIG. 2 further includes a sandwich layer 7 and a third prepreg layer 8 , wherein one side of the sandwich layer 7 is connected to the third prepreg layer through a layer of adhesive film 9 . The second prepreg layer 5 is bonded, and the third prepreg layer 8 is bonded to the other side of the core layer 7 through another layer of adhesive film 9 . In this embodiment, in order to achieve more excellent electromagnetic modulation performance, the present invention can also embed the soft metal board shown in FIG. 1 (that is, the base material layer 1 and the The metal microstructure layer 2 is formed together as a whole) as an electromagnetic modulation layer.

FIG. 3 is a two-dimensional cross-sectional schematic diagram of another multi-layered layer included in the metamaterial according to the second embodiment of the present invention.

The structure diagram shown in FIG. 3 is a two-dimensional cross-sectional schematic diagram of a multi-layered metamaterial by pressing the multi-layered structure in FIG. 2 together to form a multi-layered metamaterial. The metamaterial structure shown in FIG. 3 is a kind of integrated deicing , The sandwich structure which integrates the function of electromagnetic modulation and the function of structural bearing, includes 9 layers in total. Specifically, from top to bottom, the thickness of the first prepreg layer 4 is d ₁ , and the thickness of one layer of adhesive 6 is d ₂ , the thickness of the soft metal board (including the base material layer 1 and the metal microstructure layer 2 ) is d ₃ , the thickness of another layer of adhesive 6 is d ₄ , and the thickness of the second prepreg layer 5 is d ₅ , the thickness of one layer of adhesive film 9 is d ₆ , the thickness of the sandwich layer 7 is d ₇ , the thickness of the other layer of adhesive film 9 is d ₈ , and the thickness of the third prepreg layer 8 is d ₉ .

Wherein, the prepregs in the first prepreg layer 4, the second prepreg layer 5, and the third prepreg layer 8 are all low-dielectric, low-loss quartz fiber cyanate prepregs, with High transmittance and bearing effect, at the same time, the first prepreg layer 4, the second prepreg layer 5, and the third prepreg layer 8 are all good skin materials. The first prepreg layer 4, The second prepreg layer 5 can be used as the outer skin material, the third prepreg layer 8 can be used as the inner skin material, the two layers of adhesive 6 can be bonded by adhesive films, and the metal soft board is used as the electrical The heating layer is mainly composed of a heating material and an insulating material. The metal microstructure layer 2 in the present invention is the heating material, which is made of metal copper with high resistivity and high conductivity, and the base material layer 1 in the present invention is the insulating material. , which is mainly a polyimide (PI) film with excellent comprehensive performance, and the sandwich layer 7 is used as a honeycomb layer to achieve electromagnetic performance optimization and bearing functions.

The thickness of the metal layer in the metal microstructure layer 2 is determined according to the actual required resistance. The thicker the metal layer is, the smaller the resistance is, and the thinner the metal layer is, the larger the resistance is. In this embodiment, the thickness of the metal layer in the metal microstructure layer 2 is 18 μm, and the thickness of the base material layer 1 (ie, the PI film) is 25 μm, so the metal soft plate composed of the two in the present invention has the function of an electric heating layer. It is flexible and easy to be pasted on curved parts, and the metal copper can be designed into hollow patterns with different topological structures to realize the electromagnetic modulation function of frequency selection. At the same time, the metal microstructure layer 2 is a connected structure, which ensures that the metal After power-on, a conductive path can be formed to realize the function of heating and deicing. In order to realize the high-pass frequency selection function of single-polarization low-frequency cut-off, the metal microstructure layer 2 also needs to have a periodic arrangement structure and a horizontal connection structure. Adhesion between the layers of the present invention is achieved by using an adhesive film. Among the materials used above, the dielectric constant of the skin material is 3.15, the loss tangent value is 0.006, the dielectric constant of the film material is 2.7, the loss tangent value is 0.0065, and the dielectric constant of the PI film material is 3.2 , the loss tangent value is 0.002, the dielectric constant of the honeycomb material is 1.11, and the loss angle tangent value is 0.006.

FIG. 4 is a schematic diagram of the periodic arrangement of the in-line metal microstructures on the metal microstructure layer 2 included in the metamaterial according to the second embodiment of the present invention.

As shown in FIG. 4 , the basic unit of the metal microstructure on the metal microstructure layer 2 is inline, including two ends, and one of the ends of two adjacent inline metal microstructures is connected. Specifically, in the first In the row, the end of the first inline metal microstructure is connected to the end of the adjacent second inline metal microstructure, and the other end of the second inline metal microstructure is connected to the adjacent third inline The ends of the metal microstructures are connected, and the other end of the third inline metal microstructure is connected with the end of the adjacent fourth inline metal microstructure, ..., according to this rule, they are sequentially connected to form a horizontal direction. In the second row, the connection method of multiple in-line metal microstructures is the same as that of the first row; in the third row, the fourth row, the ... In the N rows, the connection methods of the multiple in-line metal microstructures are the same as the connection methods of the first row; in this way, the metal microstructures on the metal microstructure layer 2 realize a one-dimensional connected arrangement, and the horizontal direction For the connection structure, an electrical circuit can be formed through the connection terminals on both sides, that is, the two ends of the connection structure in the horizontal direction of each row are respectively connected to two connection terminals 3 . As shown in FIG. 4 , the metal line widths of the in-line metal microstructures are all ww, the distance between the two adjacent rows of metal microstructures is p, and the metal line widths are both ww.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 4 is applied to the laminated structure shown in FIG. 3 , wherein the main structure dimensions are designed as shown in Table 1 below :

Table 1 Main structural dimensions

parameter Value (mm) d₁ 0.3 d₂ 0.1 d₃ 0.043 d₄ 0.1 d₅ 0.3 d₆ 0.2 d₇ 5.6 d₈ 0.2 d₉ 0.3 www 0.04 p 10

The metamaterial in Figure 3 is then simulated according to the dimensions in the above table, and the results are shown in Figures 5 and 6.

It can be seen from Figure 5 and Figure 6 that when the incident angle theta=0～70°, the TM polarization exhibits high-pass characteristics at 4-18GHz, and the transmission wave is greater than -0.8dB; when the incident angle theta=0～60° When the TM polarization shows a cut-off characteristic at 0-0.6GHz, the transmitted waves are all less than -9dB; when the TE polarization is at the incident angle theta=0～60°, the transmitted waves basically behave as pure medium properties, and the transmittance is basically a pure medium at 0-20GHz. The wave is greater than -0.834dB.

It can be seen from the above simulation results that the continuous metal wire in the horizontal direction is equivalent to a high-pass frequency selection structure with a low-frequency cut-off of TM polarization, which can achieve relatively independent modulation of the TM wave without affecting the other polarization. Similarly, by changing the periodic arrangement of the metal lines in the vertical direction, as shown in Figure 7, the continuous metal lines in the vertical direction are equivalent to the high-pass frequency selection structure with TE polarization low-frequency cut-off, which can realize the TE polarization. The waves are modulated relatively independently, and the specific dimensions are shown in Table 1.

The metamaterial in Figure 7 is then simulated according to the dimensions in the above table, and the results are shown in Figures 8 and 9.

FIG. 8 is a schematic diagram showing the variation of the S21 curve of the metamaterial of FIG. 7 under TE polarization with the incident angle theta in the second embodiment of the present invention.

FIG. 9 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 7 under TM polarization with the incident angle theta in the second embodiment of the present invention.

It can be seen from Figure 8 and Figure 9 that when the incident angle theta=0～70°, the TE polarization exhibits high-pass characteristics at 8-16GHz, and the transmission wave is greater than -1.3dB; when the incident angle theta=0～80° When the TE polarization shows a cut-off characteristic at 0-1.3GHz, the transmitted waves are all less than -10dB; when the incident angle theta=0～70°, the TM polarization transmits the wave basically as a pure medium property, and the transmittance at 0-18GHz The wave is greater than -0.8dB.

Therefore, from the simulation results of Fig. 5, Fig. 6, Fig. 8 and Fig. 9, the metamaterial in the present invention realizes the high-frequency wave-transmitting function. The horizontal connection structure of both can realize the combined electromagnetic modulation function on the basis of realizing electric heating and deicing, and can realize the single-polarization low-frequency cut-off function.

In addition, in the present invention, not only the periodic arrangement of linear horizontal communication structures such as in-line metal microstructures can realize electric heating and deicing functions and electromagnetic modulation functions, but other types of linear horizontal communication structures, For example, any side of the metal wire can be bent (such as V-shape) or transformed into any polygon periodic boundary (such as rectangular waveform), and the bent metal wire can form a connected structure as long as it satisfies the one-dimensional continuous arrangement in the horizontal direction. The conductive path can be realized, and then the deicing function can be realized when the electric heating layer is energized, and the electromagnetic modulation function can also be provided by designing the main structure size in the laminated structure.

10 is a schematic diagram of a periodic arrangement of V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention;

As shown in FIG. 10 , the basic unit of the metal microstructure on the metal microstructure layer 2 is V-shaped and symmetrical on both sides, including two ends. One of the ends of two adjacent V-shaped metal microstructures is connected. Specifically , in the first row, the end of the first V-shaped metal microstructure is connected to the end of the adjacent second V-shaped metal microstructure, and the other end of the second V-shaped metal microstructure is connected to the adjacent The ends of the three V-shaped metal microstructures are connected, and the other end of the third V-shaped metal microstructure is connected with the end of the adjacent fourth V-shaped metal microstructure, ..., according to this rule, they are sequentially connected to form The connected structure in the horizontal direction, that is, the overall horizontal direction is also V-shaped; in the second row, the connection method of a plurality of V-shaped metal microstructures is the same as that of the first row; in the third row, the fourth row row, ... in the Nth row, the connection method of multiple V-shaped metal microstructures is the same as that of the first row; in this way, the metal microstructures on the metal microstructure layer 2 realize a one-dimensional connected arrangement , it is a communication structure in the horizontal direction, and an electric circuit can be formed through the connection terminals on both sides, that is, the two ends of the connection structure in the horizontal direction of each row are respectively connected to two connection terminals 3 . As shown in Figure 10, the metal line widths of the V-shaped metal microstructures are all ww, the distance between two adjacent rows of metal microstructures is p, and the lengths of the left and right sides of the V-shaped metal microstructures are a, The opening angle of the V-shaped metal microstructure is greater than 0 degrees and less than or equal to 180 degrees.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 10 is applied to the laminated structure shown in FIG. 3 , wherein the main structure dimensions are designed as shown in Table 2 below :

Table 2 Main structural dimensions

The metamaterial in Figure 3 is then simulated according to the dimensions in the above table, and the results are shown in Figures 11 and 12.

FIG. 11 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 10 under TE polarization with the incident angle theta in the second embodiment of the present invention.

FIG. 12 is a schematic diagram illustrating the variation of the S21 curve of the metamaterial of FIG. 10 under TM polarization with the incident angle theta in the second embodiment of the present invention.

It can be seen from Figure 11 and Figure 12 that when the incident angle theta=0～70°, the TM polarization exhibits high-pass characteristics at 7-20GHz, and the transmitted wave is greater than -1dB; when the incident angle theta=0～70° , TM polarization exhibits cut-off characteristics at 0-0.8GHz, and the transmission wave is less than -9.8dB; when the incident angle theta=0~60°, the TE polarization transmission wave basically behaves as a pure medium property, and the transmission wave at 0-18GHz The wave is greater than -0.64dB.

13 is a schematic diagram of another periodic arrangement of the V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial according to the second embodiment of the present invention.

As shown in FIG. 13 , the basic unit of the metal microstructure on the metal microstructure layer 2 is V-shaped and the opening angle of the V-shaped metal microstructure is 60 degrees, and other parameters are the same as those shown in FIG. 10 .

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 13 is applied to the laminated structure shown in FIG. 3 , and the main structure dimensions are designed as shown in Table 3 below. :

Table 3 Main structural dimensions

The metamaterial in Figure 13 is then simulated according to the dimensions in the above table, and the results are shown in Figures 14 and 15.

FIG. 14 is a schematic diagram of the change of the S21 curve of the metamaterial of FIG. 13 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention.

FIG. 15 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 13 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention.

It can be seen from Figure 14 and Figure 15 that when the incident angle theta=0°, the TE polarization is greater than -0.64dB at 0-16GHz; the TM polarization exhibits high-pass characteristics, and at 3-20GHz the transmittance is greater than - 0.66dB, the low frequency has a cutoff function. Therefore, in the present invention, the periodic arrangement of linear horizontally connected structures such as V-shaped metal microstructures can also realize the function of electric heating and deicing and the function of electromagnetic modulation.

16 is a schematic diagram of the third periodic arrangement of the V-shaped metal microstructures on the metal microstructure layer 2 included in the metamaterial in the second embodiment of the present invention.

As shown in FIG. 16 , the basic unit of the metal microstructures on the metal microstructure layer 2 is V-shaped and the opening angle of the V-shaped metal microstructures is 90 degrees, and the distance p between two adjacent rows of metal microstructures is 12mm, other parameters are the same as those shown in FIG. 10 , and a plurality of metal microstructures in any row are sequentially connected in sequence in the horizontal direction to form the shape of a rectangular wave.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 16 is applied to the laminated structure shown in FIG. 3 , wherein the main structure dimensions are designed as shown in Table 4 below :

Table 4 Main structural dimensions

The metamaterial in Figure 16 is then simulated according to the dimensions in the above table, and the results are shown in Figures 17 and 18.

FIG. 17 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 16 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention.

FIG. 18 is a schematic diagram of the change of the S21 curve of the metamaterial of FIG. 16 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention.

It can be seen from Figure 17 and Figure 18 that when the incident angle theta = 0°, the TE polarization is greater than -0.54dB at 0-18GHz; the TM polarization exhibits high-pass characteristics, and the transmittance at 3-20GHz is greater than - 0.95dB, the low frequency has a cutoff function. Therefore, in the present invention, the linear connected structures in the horizontal direction, such as the straight-line metal microstructures in a straight line, the V-shaped bent metal microstructures, the bent metal microstructures with rectangular waveforms, etc. It can form a connected structure to realize a conductive path, and then can realize the deicing function when it is energized as an electric heating layer, and can also have an electromagnetic modulation function by designing the main structural dimensions in the laminated structure.

In addition, in the present invention, not only the periodic arrangement of the linear single-direction communication structure can realize the electric heating deicing function and the electromagnetic modulation function, but also the periodic arrangement of the curved single-direction communication structure can also realize the electric heating deicing function. Ice function and electromagnetic modulation function.

FIG. 19 is a schematic diagram of the periodic arrangement of the semicircular metal microstructures on the metal microstructure layer 2 included in the metamaterial according to the second embodiment of the present invention.

As shown in FIG. 19 , the basic unit of the metal microstructure on the metal microstructure layer 2 is a semicircle, including multiple rows of semicircular metal microstructures arranged in a continuous period in the horizontal direction. The semicircular metal microstructures are sequentially connected in the horizontal direction to form a curved horizontally connected structure, the spacing between rows is p, the diameter of the semicircle is a, and the lines of the semicircular metal microstructure are The width is ww.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 19 is applied to the laminated structure shown in FIG. 3 , and the main structure dimensions are designed as shown in Table 5 below. :

Table 5 Main structural dimensions

parameter Value (mm) d₁ 0.3 d₂ 0.1 d₃ 0.043 d₄ 0.1 d₅ 0.3 d₆ 0.2 d₇ 5.6 d₈ 0.2 d₉ 0.3 www 0.04 p 8 a 4

The metamaterial in Figure 19 is then simulated according to the dimensions in the above table, and the results are shown in Figures 20 and 21.

FIG. 20 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 19 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention.

FIG. 21 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 19 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention.

It can be seen from Figure 20 and Figure 21 that when the incident angle theta = 0°, the TE polarization is greater than -0.35dB at 0-20GHz; the TM polarization exhibits high-pass characteristics, and the transmittance at 6-20GHz is greater than - 1dB, the low frequency has a cutoff function.

FIG. 22 is a schematic diagram of the periodic arrangement of the sine wave metal microstructures on the metal microstructure layer 2 included in the metamaterial according to the second embodiment of the present invention.

As shown in Figure 22, the basic unit of the metal microstructure on the metal microstructure layer 2 is a sinusoidal waveform, including multiple rows of sinusoidal metal microstructures arranged in a continuous period in the horizontal direction. In any row, a plurality of sinusoidal waveforms The metal microstructures are sequentially connected in the horizontal direction to form a curved horizontally connected structure, the spacing between rows is p, the period of the sinusoidal waveform is a, and the line width of the semicircular metal microstructure is ww.

In this embodiment, the periodic arrangement of the metal microstructures on the metal microstructure layer 2 shown in FIG. 22 is applied to the laminated structure shown in FIG. 3 , wherein the main structure dimensions are designed as shown in Table 6 below :

Table 6 Main structural dimensions

parameter Value (mm) d₁ 0.3 d₂ 0.1 d₃ 0.043 d₄ 0.1 d₅ 0.3 d₆ 0.2 d₇ 5.6 d₈ 0.2 d₉ 0.3 www 0.04 p 15 a 10

The metamaterial in Figure 22 is then simulated according to the dimensions in the above table, and the results are shown in Figure 23 and Figure 24.

FIG. 23 is a schematic diagram of the variation of the S21 curve of the metamaterial of FIG. 22 under TE polarization when the incident angle theta=0° in the second embodiment of the present invention.

FIG. 24 is a schematic diagram of the change of the S21 curve of the metamaterial of FIG. 22 under TM polarization when the incident angle theta=0° in the second embodiment of the present invention.

It can be seen from Figure 23 and Figure 24 that when the incident angle theta=0°, the TE polarization is greater than -0.02dB at 0-20GHz; the TM polarization exhibits high-pass characteristics, and at 4-20GHz the transmittance is greater than - 0.74dB, the low frequency has a cutoff function. Therefore, in the present invention, the curved single-direction connected structures, such as semi-circular metal microstructures, sinusoidal metal microstructures, etc., can form a connected structure to realize a conductive path as long as they satisfy the one-dimensional continuous arrangement in a single direction. When the electric heating layer is energized, it can realize the deicing function, and it can also have the electromagnetic modulation function by designing the main structure size in the laminated structure.

It can be seen from this that in the present invention, the linear and curvilinear single-direction communication structures are used as the basic unit structures to realize the electric heating deicing function under the periodic arrangement, and as long as the single-direction continuous arrangement is satisfied, the adjacent two If there are intersection conditions (such as co-edge, co-point, co-line segment, etc.) between the unit structures, a conductive path can be formed, and then the deicing function can be realized when the electric heating layer is energized. The main structural dimensions also enable it to have electromagnetic modulation capabilities. In addition to ensuring that the metal layer is a connected structure, the electric heating layer (ie metal soft plate) that realizes the deicing function also needs to connect the metal on the electric heating layer with the power line through the solder joint to form a terminal, and the terminal uses the power line. Connected to the onboard power supply on the aircraft, the heat generated by the electric heating layer melts a thin layer between the ice layer and the outer skin, reducing the adhesion between the ice layer and the outer skin, so that the aerodynamic or centrifugal force Under the action of the ice layer is easily blown off.

In addition, the present invention also provides a radome, wherein the radome includes the metamaterial described in any one of the above.

In addition, the present invention also provides an aircraft, wherein the aircraft includes the metamaterial described in any one of the above.

The technical solution provided by the invention combines the electromagnetic modulation function on the basis of satisfying the deicing function, and solves the problem that the existing deicing method cannot guarantee the shielding of the electromagnetic signal due to the shielding of the electromagnetic signal by the metal layer by designing the conductive metal path and the specific design of the metal path. At the same time, it can suppress the interference of external electromagnetic signals outside the working frequency band of the electromagnetic transceiver device inside the component, so that it is possible to arrange electromagnetic transceiver devices, such as microwave and millimeter-wave antennas, in parts with a good electromagnetic transmission field of view. At the same time, it lays the foundation for the development of aircraft towards the trend of multi-sensor integration and full airspace perception, which will further improve the full information chain connection of high-end aviation equipment.

Those skilled in the art should understand that the above embodiments are only exemplary embodiments, and various changes, substitutions and alterations may be made without departing from the spirit and scope of the present invention.

Claims (10)

1. The metamaterial is characterized by comprising a base material layer and a metal micro-structure layer superposed on the base material layer, wherein the metal micro-structure layer is provided with a single-direction communication structure which is periodically arranged, the base material layer and the metal micro-structure layer jointly form a whole, the end part of the whole in the single direction is connected with a wiring terminal, and the wiring terminal is connected with an external power supply to form a conductive path so as to carry out electric heating by utilizing the characteristic of metal power-on heating.

2. The metamaterial according to claim 1, further comprising a first prepreg layer bonded to the metallic microstructure layer by a layer of adhesive.

3. The metamaterial according to claim 2, further comprising a second prepreg layer bonded to the base material layer by a layer of adhesive.

4. The metamaterial according to claim 3, further comprising a sandwich layer bonded to the second prepreg layer by a glue film.

5. The metamaterial according to claim 4, further comprising a third prepreg layer bonded to the core layer by a glue film.

6. The metamaterial according to claim 1, wherein in the metal microstructure layer, at least one metal communication line exists in a plurality of metal periodic units periodically arranged between the wiring terminals.

7. The metamaterial according to claim 6, wherein in the metal microstructure layer, a plurality of periodic metal units are sequentially connected in a horizontal direction in any one metal communication line, the metal units are V-shaped, and the opening angle of the V-shape is greater than 0 degree and less than or equal to 180 degrees.

8. The metamaterial according to claim 6, wherein in the metal microstructure layer, a plurality of periodic metal units are included in any one metal communication line and are sequentially connected in a horizontal direction, and the metal units are in a rectangular wave shape.

9. A radome, characterized in that it comprises a metamaterial according to any one of claims 1-8.

10. An aircraft, characterized in that it comprises a metamaterial according to any one of claims 1 to 8.

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