CN213280228U - Packaging structure and electronic product - Google Patents
Packaging structure and electronic product Download PDFInfo
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- CN213280228U CN213280228U CN202022538637.XU CN202022538637U CN213280228U CN 213280228 U CN213280228 U CN 213280228U CN 202022538637 U CN202022538637 U CN 202022538637U CN 213280228 U CN213280228 U CN 213280228U
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Abstract
The utility model discloses an encapsulation structure and electronic product. The packaging structure comprises a first circuit board, a second circuit board and an electronic component assembly; the second circuit board is arranged opposite to the first circuit board; the electronic component assembly comprises a first electronic component, a second electronic component and a third electronic component; the lower surface of the first electronic component is arranged on the first circuit board, and the upper surface of the first electronic component is abutted against the second circuit board; the second electronic component is electrically mounted on the first circuit board, and the third electronic component is electrically mounted on the second circuit board; the projection of the third electronic component on the first circuit board is at least partially overlapped with the projection of the second electronic component on the first circuit board. The utility model discloses technical scheme packaging structure make full use of first electronic components's high space has reduced second electronic components and third electronic components and has been on a parallel with the ascending tiling area of the side of first circuit board, has reached the effect that reduces packaging structure's plane size.
Description
Technical Field
The utility model relates to the field of semiconductor technology, in particular to packaging structure and electronic product.
Background
With the development of electronic products toward miniaturization, high performance, high reliability, etc., the size requirement of semiconductor package structures is also getting smaller. However, in the related art, the electronic components in the package structure are all laid on the substrate, which results in a problem that the planar size of the package structure is large.
SUMMERY OF THE UTILITY MODEL
The main objective of the present invention is to provide a package structure, which aims to reduce the plane size of the package structure.
In order to achieve the above object, the present invention provides a package structure, which includes a first circuit board, a second circuit board, and an electronic component assembly; the second circuit board is arranged opposite to the first circuit board, and the first circuit board is electrically connected with the second circuit board; the electronic component assembly comprises a first electronic component, a second electronic component and a third electronic component;
the first electronic component is provided with an upper surface and a lower surface which are opposite, the lower surface is arranged on the first circuit board, and the upper surface is abutted against the second circuit board; the second electronic component is electrically mounted on the first circuit board, and the third electronic component is electrically mounted on the surface of the second circuit board facing the first circuit board; the projection of the third electronic component on the first circuit board is at least partially overlapped with the projection of the second electronic component on the first circuit board.
In an embodiment of the present invention, the height dimension of the first electronic component is defined as H1, the height dimension of the second electronic component is H2, and the height dimension of the third electronic component is H3, so that H1 is not less than H2+ H3.
In an embodiment of the present invention, the projection of the third electronic component on the first circuit board overlaps with the projection of the second electronic component on the first circuit board.
In an embodiment of the present invention, the first circuit board is a hard circuit board, and the second circuit board is a flexible circuit board; one end of the second circuit board is fixedly connected with the first circuit board, and the other end of the second circuit board is bent and extends to be attached to the upper surface of the first electronic component.
In an embodiment of the present invention, the second circuit board is fixed to the first circuit board by welding; and/or the second circuit board is fixedly bonded with the first electronic component.
In an embodiment of the present invention, the first electronic component is electrically attached to the first circuit board.
In an embodiment of the present invention, the electronic component assembly further includes a fourth electronic component, and the fourth electronic component is disposed on an inner surface of the first circuit board or an inner surface of the second circuit board; wherein the height H4 of the fourth electronic component is less than the height H1 of the first electronic component.
In an embodiment of the present invention, the electronic component assembly further includes a fifth electronic component, the fifth electronic component is disposed on the surface of the first circuit board.
In an embodiment of the present invention, the height dimension of the fifth electronic component is defined as H5, and H5 < H2 and H5 < H3 are satisfied.
In an embodiment of the present invention, the package structure further includes a package, the package is connected to the first circuit board and packages the first circuit board, the electronic component assembly and the second circuit board.
In order to achieve the above object, the present invention further provides an electronic product, including the above package structure; the packaging structure comprises a first circuit board, a second circuit board and an electronic component assembly; the second circuit board is arranged opposite to the first circuit board, and the first circuit board is electrically connected with the second circuit board; the electronic component assembly comprises a first electronic component, a second electronic component and a third electronic component; the first electronic component is provided with an upper surface and a lower surface which are opposite, the lower surface is arranged on the first circuit board, and the upper surface is abutted against the second circuit board; the second electronic component is electrically mounted on the first circuit board, and the third electronic component is electrically mounted on the surface of the second circuit board facing the first circuit board; the projection of the third electronic component on the first circuit board is at least partially overlapped with the projection of the second electronic component on the first circuit board.
The utility model discloses among the technical scheme packaging structure, through setting up first circuit board and second circuit board relatively, the electronic components subassembly includes first electronic components, second electronic components and third electronic components, through the lower surface electrical installation with first electronic components in first circuit board, upper surface and second circuit board butt for form the space of first electronic components height and size between first circuit board and the second circuit board. Meanwhile, the second electronic component is electrically mounted on the first circuit board, the third electronic component is electrically mounted on the surface, facing the first circuit board, of the second circuit board, the projection of the third electronic component on the first circuit board is at least partially overlapped with the projection of the second electronic component on the first circuit board, so that the height space of the first electronic component is fully utilized, the tiled area of the second electronic component and the third electronic component in the direction parallel to the first circuit board is reduced, and the effect of reducing the plane size of the packaging structure is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the package structure of the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the package structure of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
330 | Third |
| 200 | |
340 | Fourth |
| 310 | First |
350 | Fifth |
| 320 | Second |
400 | Package member |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides an encapsulation structure.
In the embodiment of the present invention, as shown in fig. 1 and fig. 2, the package structure includes a first circuit board 100, a second circuit board 200, and an electronic component assembly; the second circuit board 200 is arranged opposite to the first circuit board 100, and the first circuit board 100 is electrically connected with the second circuit board 200; the electronic component assembly comprises a first electronic component 310, a second electronic component 320 and a third electronic component 330; the first electronic component 310 has an upper surface and a lower surface opposite to each other, the lower surface is provided on the first circuit board 100, and the upper surface abuts against the second circuit board 200; the second electronic component 320 is electrically mounted on the first circuit board 100, and the third electronic component 330 is electrically mounted on the surface of the second circuit board 200 facing the first circuit board 100; the projection of the third electronic component 330 on the first circuit board 100 at least partially coincides with the projection of the second electronic component 320 on the first circuit board 100.
The first circuit board 100 and the second circuit board 200 are electrically connected and oppositely arranged, the first electronic component 310 in the electronic component assembly is electrically mounted on the first circuit board 100, the second circuit board 200 is abutted against the surface of the first electronic component 310 away from the first circuit board 100, in fact, the first electronic component 310 is clamped between the first circuit board 100 and the second circuit board 200, a certain mounting space is formed between the first circuit board 100 and the second circuit board 200, the second electronic component 320 and the third electronic component 330 are arranged in the space, the third electronic component 330 is electrically mounted on the surface of the second circuit board 200 facing the first circuit board 100 by electrically mounting the second electronic component 320 on the first circuit board 100, and the projections of the second electronic component 320 and the third electronic component 330 on the first circuit board 100 are at least partially overlapped, compared with the scheme that the second electronic component 320 and the third electronic component 330 are directly paved on the first circuit board 100, the area of the second electronic component 320 and the third electronic component 330 in the direction parallel to the first circuit board 100 is reduced, and the effect of reducing the plane size of the packaging structure is achieved.
In this embodiment, the specific form of the first circuit board 100 and the second circuit board 200 may be determined according to an actual situation, for example, the first circuit board 100 and the second circuit board 200 may be a hard circuit board or a flexible circuit board, when the first circuit board 100 and the second circuit board 200 are both hard circuit boards, the first circuit board 100 and the second circuit board 200 are connected by using a flexible circuit board, and at this time, considering that projections of the second electronic component 320 and the third electronic component 330 on the first circuit board 100 are at least partially overlapped, a height dimension of the first electronic component 310 needs to be greater than or equal to a sum of heights of the second electronic component 320 and the third electronic component 330, so as to fully utilize a height space of the first electronic component 310, and compared with a tiling layout mode, the planar size is reduced under the condition that the height dimension is not changed. When the first circuit board 100 is a rigid circuit board and the second circuit board 200 is a flexible circuit board, at this time, since the second circuit board 200 can be bent at will, no specific limitation is imposed on the requirements on the height dimensions of the first electronic component 310, the second electronic component 320, and the third electronic component 330, but in this embodiment, in consideration of the compactness of the overall dimension of the package structure, the projections of the second electronic component 320 and the third electronic component 330 on the first circuit board 100 may be at least partially overlapped to reduce the plane dimensions of the second electronic component 320 and the third electronic component 330. It should be noted that the number of electronic components in the electronic component assembly in this embodiment is determined according to actual product requirements, and is not limited to the form of three electronic components in this embodiment.
In an actual application process, the overlapping degree of the projections of the second electronic component 320 and the third electronic component 330 on the first circuit board 100 may be determined according to the shape and structure of an actual product, for example, the projections may partially overlap or completely overlap.
Alternatively, the electronic component assembly may be a discrete device, such as a sensor, a sensitive device, a semiconductor diode, a semiconductor triode, a semiconductor special component, or the like.
The utility model discloses among the technical scheme packaging structure, through setting up first circuit board 100 and second circuit board 200 relatively, the electronic components subassembly includes first electronic components 310, second electronic components 320 and third electronic components 330, through the lower surface electric installation with first electronic components 310 in first circuit board 100, upper surface and second circuit board 200 butt for form the space of first electronic components 310 height dimension between first circuit board 100 and the second circuit board 200. Meanwhile, the second electronic component 320 is electrically mounted on the first circuit board 100, the third electronic component 330 is electrically mounted on the surface of the second circuit board 200 facing the first circuit board 100, and the projection of the third electronic component 330 on the first circuit board 100 is at least partially overlapped with the projection of the second electronic component 320 on the first circuit board 100, so that the height space of the first electronic component 310 is fully utilized, the tiled area of the second electronic component 320 and the third electronic component 330 in the direction parallel to the first circuit board 100 is reduced, and the effect of reducing the plane size of the packaging structure is achieved.
In order to further fully utilize the internal space of the package structure, referring to fig. 1 and 2, in an embodiment of the present invention, the height dimension of the first electronic component 310 is defined as H1, the height dimension of the second electronic component 320 is defined as H2, and the height dimension of the third electronic component 330 is defined as H3, so that H1 is greater than or equal to H2+ H3.
It is understood that, when the opposing upper and lower surfaces of the first electronic component 310 are disposed on the first circuit board 100, and the upper surface abuts against the first circuit board 200, the distance between the first circuit board 100 and the second circuit board 200 is substantially equal to the height H1 of the first electronic component 310. On this basis, by using the height space of the first electronic component 310, the projections of the second electronic component 320 and the third electronic component 330 on the first circuit board 100 are at least partially overlapped, and the height dimension of the second electronic component 320 and the third electronic component 330 is in a relationship of H1 being greater than or equal to H2+ H3, so as to reduce the plane dimension of the package structure without increasing the height dimension of the package structure, thereby further reducing the overall dimension of the package structure.
In an actual application process, considering that electronic components need to be powered on to realize corresponding functions, different electronic components may be separated to prevent interference, in this embodiment, in order to ensure that each electronic component can normally operate, the height dimension H1 of the first electronic component 310 is greater than the sum H2+ H3 of the height dimensions of the second electronic component 320 and the third electronic component 330, and a gap may exist between the second electronic component 320 and the third electronic component 330 to prevent the second electronic component 320 and the third electronic component 330 from interfering.
In order to further reduce the overall size of the package structure, referring to fig. 1 and fig. 2, in an embodiment of the present invention, the projection of the third electronic component 330 on the first circuit board 100 overlaps with the projection of the second electronic component 320 on the first circuit board 100. On the basis of the foregoing embodiment, at least part of the projections of the second electronic component 320 and the third electronic component 330 on the first circuit board 100 coincide with each other, and compared with the way that two electronic components are tiled on the first circuit board 100, the planar size is reduced, and it can be understood that the area where the projections of the two electronic components coincide with each other is the reduced planar area, so that the reduced planar area is larger by completely overlapping the projections of the second electronic component 320 and the third electronic component 330 on the first circuit board 100, and further, the effect of further reducing the overall size of the package structure is achieved.
In an embodiment of the present invention, referring to fig. 1 and fig. 2, the first circuit board 100 is a hard circuit board, and the second circuit board 200 is a flexible circuit board; one end of the second circuit board 200 is fixedly connected to the first circuit board 100, and the other end is bent to extend to be attached to the upper surface of the first electronic component 310. In the actual manufacturing process, first, the first electronic component 310 and the second electronic component 320 are disposed on the first circuit board 100, and the third electronic component 330 is disposed on the second circuit board 200; then, one end of the second circuit board 200 is fixedly connected to the first circuit board 100; then, the other end of the second circuit board 200 is bent and extended to be attached to the upper surface of the first electronic component 310, so as to move the third electronic component 330 mounted on the second circuit board 200 to the upper side of the second electronic component 320, so as to realize a structure in which at least parts of the projections of the third electronic component 330 and the second electronic component 320 on the first circuit board 100 are overlapped, thereby achieving the effect of reducing the planar size of the package structure.
It should be noted that after the second circuit board 200 is bent, the end of the second circuit board 200 may be attached to the upper surface of the first electronic component 310, and at this time, the second electronic component 320 and the third electronic component 330 are located between the bent sections of the first electronic component 310 and the second circuit board 200; the middle portion of the second circuit board 200 may also be attached to the upper surface of the first electronic component 310, and at this time, the second electronic component 320 and the third electronic component 330 may be located at a position where the first electronic component 310 deviates from the bent section of the second circuit board 200.
Optionally, the second circuit board 200 is fixed to the first circuit board 100 by soldering, so as to achieve the electrical connection function between the second circuit board 200 and the first circuit board 100. The second circuit board 200 is bonded and fixed with the first electronic component 310, and it can be understood that the first electronic component 310 realizes an electrical conduction function through electrical connection with the first circuit board 100, and then does not need to be repeatedly electrically connected with the second circuit board 200, so that the fixing function of the second circuit board 200 and the first electronic component 310 can be realized directly through bonding and fixing, so as to ensure structural stability.
Alternatively, the first electronic component 310 may be mounted on the first circuit board 100 using an SMT (surface mount technology) process.
In order to further improve the functionality of the package structure, referring to fig. 1, in an embodiment of the present invention, the electronic component assembly further includes a fourth electronic component 340, where the fourth electronic component 340 is disposed on an inner surface of the first circuit board 100 or an inner surface of the second circuit board 200; wherein the height H4 of the fourth electronic component 340 is less than the height H1 of the first electronic component 310.
It can be understood that the fourth electronic component 340 is further disposed in the package structure to increase the number of the electronic components, thereby achieving the effect of having more functions. The fourth electronic component 340 may be disposed on an inner surface of the first circuit board 100 or on an inner surface of the second circuit board 200, so that the fourth electronic component 340 can supply power to ensure normal operation of the fourth electronic component 340. In this embodiment, the height H4 of the fourth electronic component 340 is smaller than the height H1 of the first electronic component 310, so that the fourth electronic component 340 can be overlapped with the projection of the second electronic component 320 or the third electronic component 330 on the first circuit board 100, thereby achieving the effect of reducing the plane size. Of course, the fourth electronic component 340 may not coincide with the projection of other electronic components on the first circuit board 100, and may be directly installed in the space formed by the first circuit board 100 and the second circuit board 200, and since the height H4 of the fourth electronic component 340 is smaller than the height H1 of the first electronic component 310, the fourth electronic component 340 has little influence on the overall height dimension of the package structure, so as to achieve the effect of increasing functionality and not influencing the overall height dimension of the package structure.
In an embodiment of the present invention, referring to fig. 2, the electronic component assembly further includes a fifth electronic component 350, and the fifth electronic component 350 is disposed on the surface of the second circuit board 200 deviating from the first circuit board 100. It can be understood that, can all set up electronic components on two surfaces of second circuit board 200, can set up the surface that deviates from first circuit board 100 at second circuit board 200 with the electronic components that originally the tiling was located on first circuit board 100 to further reduce the plane area that electronic components subassembly tiled on first circuit board 100, and then reach the effect that reduces packaging structure's plane size. In this embodiment, the fifth electronic component 350 is mounted on the surface of the second circuit board 200 away from the first circuit board 100, so that the planar size of the package structure is reduced, and the functionality of the package structure is increased.
Further, the height dimension H5 of the fifth electronic component 350 satisfies H5 < H2 and H5 < H3. In an actual application process, when the electronic component assembly includes the first electronic component 310, the second electronic component 320, the third electronic component 330, and the fifth electronic component 350, the first electronic component 310 with the highest height dimension may be clamped between the first circuit board 100 and the second circuit board 200, then the second electronic component 320 and the third electronic component 330 with the height dimensions located at the middle positions are stacked, and the fifth electronic component 350 with the smallest height dimension is disposed on the surface of the second circuit board 200 away from the first circuit board 100, so that the increase of the height dimension of the package structure is reduced as much as possible under the condition of reducing the planar dimension of the package structure, thereby achieving the miniaturization of the overall dimension of the package structure.
In an embodiment of the present invention, referring to fig. 1 and fig. 2, the package structure further includes a package 400, and the package 400 is connected to the first circuit board 100 and encapsulates the first circuit board 100, the electronic component assembly, and the second circuit board 200. The package 400 plays a role of protecting each device. In the practical application process, after the first circuit board 100, the second circuit board 200 and the electronic component assembly are mounted, the package 400 is finally used to package the above structures, so as to ensure the safety of the packaged structure. Optionally, the package 400 is a plastic package.
The utility model discloses still provide an electronic product, this electronic product includes packaging structure, and this packaging structure's concrete structure refers to above-mentioned embodiment, because this electronic product has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.
The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.
Claims (11)
1. A package structure, comprising:
a first circuit board;
the second circuit board is arranged opposite to the first circuit board, and the first circuit board is electrically connected with the second circuit board; and
the electronic component assembly comprises a first electronic component, a second electronic component and a third electronic component;
the first electronic component is provided with an upper surface and a lower surface which are opposite, the lower surface is arranged on the first circuit board, and the upper surface is abutted against the second circuit board; the second electronic component is electrically mounted on the first circuit board, and the third electronic component is electrically mounted on the surface of the second circuit board facing the first circuit board; the projection of the third electronic component on the first circuit board is at least partially overlapped with the projection of the second electronic component on the first circuit board.
2. The package structure according to claim 1, wherein a height dimension of the first electronic component is defined as H1, a height dimension of the second electronic component is defined as H2, and a height dimension of the third electronic component is defined as H3, which satisfies H1 ≧ H2+ H3.
3. The package structure according to claim 2, wherein a projection of the third electronic component on the first circuit board overlaps with a projection of the second electronic component on the first circuit board.
4. The package structure of claim 1, wherein the first circuit board is a rigid circuit board and the second circuit board is a flexible circuit board; one end of the second circuit board is fixedly connected with the first circuit board, and the other end of the second circuit board is bent and extends to be attached to the upper surface of the first electronic component.
5. The package structure of claim 4, wherein the second circuit board is soldered to the first circuit board; and/or the second circuit board is fixedly bonded with the first electronic component.
6. The package structure according to any one of claims 1 to 5, wherein the first electronic component is electrically attached to the first circuit board.
7. The package structure according to any one of claims 2 to 5, wherein the electronic component assembly further comprises a fourth electronic component, the fourth electronic component being provided on an inner surface of the first circuit board or an inner surface of the second circuit board; wherein the height H4 of the fourth electronic component is less than the height H1 of the first electronic component.
8. The package structure according to any one of claims 2 to 5, wherein the electronic component assembly further comprises a fifth electronic component, and the fifth electronic component is disposed on a surface of the second circuit board facing away from the first circuit board.
9. The package structure according to claim 8, wherein a height dimension of the fifth electronic component is defined as H5, and H5 < H2, and H5 < H3 are satisfied.
10. The package structure according to any one of claims 1 to 5, further comprising a package that is connected to the first circuit board and that encapsulates the first circuit board, the electronic component assembly, and the second circuit board.
11. An electronic product, comprising the package structure according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022538637.XU CN213280228U (en) | 2020-11-05 | 2020-11-05 | Packaging structure and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022538637.XU CN213280228U (en) | 2020-11-05 | 2020-11-05 | Packaging structure and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213280228U true CN213280228U (en) | 2021-05-25 |
Family
ID=75953242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022538637.XU Active CN213280228U (en) | 2020-11-05 | 2020-11-05 | Packaging structure and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213280228U (en) |
-
2020
- 2020-11-05 CN CN202022538637.XU patent/CN213280228U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 266101 f / F, phase II, Qingdao International Innovation Park, 1 Keyuan Weiyi Road, Laoshan District, Qingdao City, Shandong Province Patentee after: Geer Microelectronics Co.,Ltd. Address before: Room 103, 396 Songling Road, Laoshan District, Qingdao City, Shandong Province 266100 Patentee before: Goer Microelectronics Co.,Ltd. |
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| CP03 | Change of name, title or address |