CN211958245U - A laser array unit and package assembly - Google Patents

Abstract

The application discloses laser array unit and encapsulation subassembly. The laser array unit includes: the laser array is provided with a power supply pin, and the printed circuit board is fixed on the power supply pin; and the power supply socket is fixed on the printed circuit board and is positioned on one side of the laser array, and the power supply pins are connected to the power supply socket through the printed circuit board. Through the mode, the laser array unit is simple and reliable in structure, simple in manufacturing process, less in material consumption and capable of saving production cost.

Description

A laser array unit and package assembly

technical field

The present application relates to the technical field of semiconductor packaging, and in particular, to a laser array unit and a packaging assembly.

Background technique

With the development of electronic products, the requirements for semiconductor laser array packaging are getting higher and higher, and the effect of laser array packaging directly affects the function of electronic products.

The inventor of the present application found in the long-term research and development that the laser array has multiple pairs of positive and negative power supply pins, and it is necessary to set up multiple pairs of pin welding positions on the corresponding printed circuit boards, and it is necessary to consider the installation and arrangement of the power supply sockets. . In addition, the entire laser array needs to be mounted on a heat sink to dissipate heat from the laser array, so the installation between the laser array, the printed circuit board and the heat sink also needs to be considered.

Since laser arrays are used as common units in projectors, and a projector needs to use as few as a few or as many as dozens of laser arrays, the laser arrays in the prior art are mainly installed on the circuit board through fixed brackets. In addition, both ends of the laser array are provided with power supply sockets, resulting in a complex structure of the laser array package and a lot of materials. Therefore, it is necessary to develop a simple, reliable and low-cost laser array and printed circuit board installation method, which not only The quality of use can be guaranteed, and the process is simple, the cost is low and the use is convenient.

Utility model content

The main technical problem to be solved by the present application is to provide a laser array unit and a package assembly, which has a simple and reliable structure, uses less materials, can simplify the production process and reduce the production cost.

In order to solve the above-mentioned technical problems, a technical solution adopted in the present application is: to provide a laser array unit, the laser array unit includes: a laser array, and power supply pins are arranged on the laser array; a printed circuit board, the power supply pins are fixed on the printed circuit board. The circuit board; the power supply socket, which is fixed on the printed circuit board and located on one side of the laser array, and the power supply pins are connected to the power supply socket through the printed circuit board.

Wherein, the printed circuit is provided with an opening, and the laser array is embedded in the opening.

The laser array unit also includes a temperature sensor, which includes: a terminal socket: fixed on the printed circuit board; a probe, connected to the terminal socket through a wire, and fixed on the laser array for sensing the temperature of the laser array.

The printed circuit board is U-shaped and includes a bottom plate and a first side plate and a second side plate connected to the bottom plate. The bottom plate, the first side plate and the second side plate form an opening, and the power supply socket is arranged on the bottom plate.

The terminal socket is fixed on the side of the first side plate away from the bottom plate, and the probe is fixed on the side of the laser array away from the power supply socket.

The power supply pin includes a positive power supply pin and a negative power supply pin arranged oppositely, a first welding part corresponding to the negative power supply pin is provided on the first side plate, and a positive power supply pin is provided on the second side board In the corresponding second welding part, the negative power supply pin is welded to the first welding part, and the positive power supply pin is welded to the second welding part.

Wherein, the laser array unit further includes a casing, which is covered on the printed circuit board, the laser array is located in the casing, and the power supply socket is located outside the casing.

Wherein, the laser array unit further includes a sealing gasket, and the sealing gasket is sleeved on the periphery of the power supply socket.

Wherein, the laser array unit further includes a heat sink, and the laser array and the printed circuit board are fixed on the heat sink by screws.

In order to solve the above technical problem, another technical solution adopted in the present application is to provide a package assembly, the package assembly includes a heat sink and the laser array units of the above-mentioned embodiments, and the laser array units are arranged on the heat sink in pairs to form a pair of laser array units. The pair of laser array units are arranged side by side and are arranged in opposite directions, so that the power supply sockets of the laser array units are arranged around the laser array.

The beneficial effects of the embodiments of the present application are: different from the prior art, the laser array unit of the present embodiment includes a laser array, a printed circuit board and a power supply socket, wherein the laser array is fixed on the printed circuit board through power supply pins, and the power supply pins The printed circuit board is connected to the power supply socket on one side of the laser array. This connection method is simple and reliable, which can simplify the production process, and the overall laser array unit uses less materials and does not require other fixing parts, which can save production costs.

Description of drawings

1 is a schematic structural diagram of an embodiment of a laser array unit provided by the present application;

Fig. 2 is the exploded view of the laser array unit provided by the present application;

Fig. 3 is an exploded view of the laser array unit in Fig. 1;

4 is a schematic diagram of an assembly structure of an embodiment of a package assembly provided by the present application;

FIG. 5 is a schematic diagram of the overall structure of an embodiment of a package assembly provided by the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

With the continuous development of integrated circuit technology, electronic products are becoming more and more intelligent and highly reliable, and the requirements for the packaging components of semiconductor laser arrays are getting higher and higher. Therefore, the packaging of laser arrays has become a new hot spot. The present application provides a laser array unit and a package assembly. The overall structure of the laser array unit is simple and reliable, the production process is simple, the material is low, the cost is low, and the power plug on the printed circuit board is convenient to plug and unplug, so as to be convenient for people to use.

Please refer to FIG. 1 and FIG. 2 , FIG. 1 is a schematic structural diagram of an embodiment of a laser array unit provided by the present application, and FIG. 2 is an exploded view of the laser array unit in FIG. 1 . In this embodiment, the laser array unit 10 includes a laser array 2 , a printed circuit board 1 and a power supply socket 3 .

The laser array 2 is provided with a power supply pin 21, and the power supply pin 21 is fixed on the printed circuit board 1, that is, the laser array 2 is fixed on the printed circuit board 1 through the power supply pin 21, and no other fixing bracket structure is required. Less material, can save production costs. The power supply socket 3 is fixed on the printed circuit board 1 and is located on one side of the laser array 2 , and the power supply pins 21 can be connected to the power supply socket 3 through the printed circuit board 1 to simplify the structure of the laser array unit 10 . The structure of the laser array unit 10 in this embodiment is simple and reliable, the manufacturing process is simple, and the materials used are few, which can save the production cost.

Further, as shown in FIG. 3 , in order to reduce the volume of the laser array unit 10 and facilitate heat dissipation, an opening 14 may be provided on the printed circuit board 1 , and the laser array 2 is embedded in the opening 14 . The opening 14 can be located in the middle of the printed circuit board 1 or at the edge of the printed circuit board 1 . When the opening 14 is located at the edge of the printed circuit board 1 , the printed circuit board 1 can be arranged in a U shape. The shape of the printed circuit board 1 and its opening 14 may be the same, for example, both are rectangular. In other embodiments, the shape of the printed circuit board 1 and the shape of its openings 14 may also be different. In order to improve the reliability of the laser array unit, the shape of the opening 14 can be adapted to the shape of the laser array 2, so that the laser array 2 can be fixed more firmly.

In this embodiment, the power supply pins 21 can be directly soldered on the printed circuit board 1 to make the packaging of the laser array 2 more reliable. Specifically, the power supply pin 21 includes a positive power supply pin (not marked in the figure) and a negative power supply pin (not marked in the figure). The positive power supply pin and the negative power supply pin are arranged in pairs, and the positive power supply pin and the negative power supply pin are arranged in pairs. The pins can be respectively arranged at opposite ends of the laser array 2 . The printed circuit board 1 is respectively provided with a first welding part 111 corresponding to the negative power supply pin and a second welding part 121 corresponding to the positive power supply pin, the negative power supply pin can be welded on the first welding part 111, and the positive power supply pin It can be welded on the second welding part 121, and in this way, the laser array 2 can be fixed more stably and reliably. In other alternative embodiments, the power supply pins 21 may also be directly bonded or clamped on the printed circuit board 1 .

The power supply socket 3 is fixed on the printed circuit board 1 and is located on one side of the laser array 2 . The power supply pins 21 are connected to the power supply socket 3 through the printed circuit board 1 to supply power to the laser array 2 through the power supply socket 3 . In order to utilize the space of the printed circuit board 1 reasonably, the power supply socket 3 and the laser array 2 are arranged side by side at intervals.

Further, the laser array unit 10 may further include a temperature sensor 4 for detecting the temperature of the laser array 2 in real time. Specifically, the temperature sensor 4 includes a terminal socket 41 and a probe 42, and the terminal socket 41 and the probe 42 are connected by wires (not shown in the figure). The terminal socket 41 is fixed on the printed circuit board 1 , and the probe 42 is fixed on the laser array 2 for sensing the temperature of the laser array 2 . Optionally, the terminal socket 41 can be soldered on the printed circuit board 1 , and the probe 42 is fixed on the laser array 2 by screws and is in direct contact with the laser array 2 to sense the temperature of the laser array 2 more accurately. The temperature sensor 4 may use a thermistor having a negative temperature coefficient (Negative Temperature Coefficient, NTC). The temperature sensing protection method provided by the present application has good reliability, is less prone to damage and is easy to install compared with the traditional thermistor and conductive foam heat transfer and temperature measurement method.

In a preferred embodiment, as shown in FIG. 3 , the printed circuit board 1 may have a U-shaped structure. Specifically, the printed circuit board 1 includes a bottom plate 13 and a first side plate 11 and a second side plate 12 connected to the bottom plate 13. The first side plate 11 and the second side plate 12 are disposed opposite to each other. The first side plate 11 and the second side plate 12 The plate 12 and the bottom plate 13 form an opening 14. In this embodiment, the laser array 2 is embedded in the opening 14, so that the installation of the laser array 2 is more convenient. The first side plate 11 is provided with a first welding portion 111, the second side plate 12 is provided with a second welding portion 121, the negative power supply pin of the laser array 2 can be welded on the first welding portion 111, and the laser array 2 The positive power supply pin of 1 can be welded on the second welding part 112 . In this way, the installation of the laser array 2 can be facilitated, the force of the laser array 2 can be relatively uniform, and the stability of the fixation of the laser array 2 can be improved.

Further, as shown in FIG. 1 and FIG. 2 , the power supply socket 3 can be arranged on the base plate 13, and the positive power supply pin and the negative power supply pin of the laser array 2 are respectively connected to the power supply socket 3 through the printed circuit board 1. In this way, The connection between the power supply pin 21 and the power supply socket 3 can be made simpler, and the volume of the laser array unit can be reduced.

Furthermore, in this embodiment, the terminal socket 41 in the temperature sensor 4 can be disposed on the side of the first side plate 11 away from the bottom plate 13 , and the probe 42 in the temperature sensor 4 is disposed on the laser array 2 away from the power supply socket 3 . on one side to improve the accuracy of temperature sensing. And the space of the printed circuit board 1 can be reasonably utilized.

In this preferred embodiment, the printed circuit board 1 has a U-shaped structure, and the laser array 2 is embedded in the opening 14 of the U-shaped printed circuit board 1 to facilitate assembly and production; the power supply socket 3 is located on the bottom plate 13, and the temperature sensor 4 The terminal socket 41 is fixed on the side of the first side plate 11 away from the bottom plate, and the probe 42 is fixed on the side of the laser array 2 away from the power supply socket 3. This connection method makes reasonable use of the space of the printed circuit board 1 and reduces the laser array. The volume of the unit 10 is reduced, and the reliability of the laser array unit 10 can be improved.

Further, the laser array unit 10 may also include a casing (not shown), the casing is covered on the printed circuit board 1, and the laser array 2 and the temperature sensor 4 can be located in the casing. The array 2 and the temperature sensor 4 are dustproof and waterproof. The casing can be fixed on the printed circuit board 1 by screws, so as to improve the reliability of the fixing and facilitate disassembly. In another embodiment, the casing can also be directly bonded to the printed circuit board 1 to simplify the production process.

The casing covers the laser array 2 and exposes the power supply socket 3, that is, the power supply socket 3 is outside the casing to facilitate plugging and unplugging. The laser array unit 10 further includes a sealing gasket 5 , and the sealing gasket 5 is sleeved on the periphery of the power supply socket 3 to better protect the power supply socket 3 . The sealing gasket 5 is used for sealing between the power supply socket 3 and the housing, so as to improve the reliability of the laser array unit 10 . The plugging direction of the power socket 3 is upward and exposed to the outside, which is convenient for plugging and unplugging. Therefore, the structure of the laser array unit 10 of the present application is simple, reliable, and convenient to use.

In order to reduce the temperature of the laser array 2 and the printed circuit board 1 , the laser array unit 10 further includes a heat sink (not shown). The laser array 2 and the printed circuit board 1 are connected to a heat sink for heat dissipation. Specifically, the laser array 2 and the printed circuit board 1 can be fixed on the heat dissipation surface of the heat sink by screws, which is simple, reliable and convenient for disassembly and maintenance. Preferably, the laser array 2 and the printed circuit board 1 can be fixed on the heat sink by 6 screws, so as to improve the reliability of the fixing.

As shown in FIGS. 4 and 5 , in another embodiment, the present application further provides a package assembly. In this embodiment, the package assembly includes a heat sink 6 and a laser array unit 10 disposed on the heat sink 6 . The laser The array unit 10 may be the laser array unit in the above embodiment. In this embodiment, the laser array unit 10 is fixed on the heat sink 6 . The laser array unit 10 can be easily modularized on the heat sink 6, and the number and arrangement of the laser array units 10 on the heat sink 6 can be set according to actual needs. Preferably, in order to ensure compact use of space, the laser array units 10 can be arranged on the heat sink 6 in pairs. For example, the laser array units 10 arranged in pairs can be arranged side by side along the first direction L1 and face opposite directions respectively. Set so that the power supply socket 3 of the laser array unit 10 is arranged around the laser array 2, that is, the power supply socket 3 is located on the outside of the laser array 2. In this way, the power supply socket 3 of the laser array unit 10 can be located on the outside, so as to facilitate plugging and unplugging. . The package assembly may include 4 pairs of laser array units, the 4 pairs of laser array units are arranged along the second direction L2, wherein the first direction L1 and the second direction L2 are perpendicular, the first direction L1 may be the width direction of the heat sink 6, and the first direction L1 may be the width direction of the heat sink 6. The two directions L2 may be the length direction of the heat sink 6 .

In order to make the structure of the package assembly simpler, the housing 7 of the package assembly can be a whole, and cover the printed circuit board 1, and cover all the laser arrays 2 for waterproof and dustproof. Only the power supply socket 3 is exposed, that is, the plugging direction of the power supply socket 3 faces outward and is exposed to the outside, which is convenient for plugging and unplugging. In this embodiment, the sealing gasket 5 can also seal the power supply socket 3 on the heat sink 6 as a whole. In this way, the plugging direction of the power supply socket 3 is upward and exposed to the outside, which is convenient for plugging and unplugging, and the sealing performance of the laser array unit 10 is also good.

In other embodiments, the number of laser array units 10 in the package assembly may be expanded in pairs, for example, the package assembly may include 3 pairs of laser array units 10 or 5 pairs of laser array units 10 and the like. Therefore, the laser array units 10 in the package assembly can be easily expanded modularly. As shown in FIG. 4 and FIG. 5 , the number of laser array units 10 can be expanded in pairs, which can ensure compact space usage.

Different from the situation in the prior art, in the laser array unit 10 provided in this embodiment, the laser array 2 can be directly welded on the printed circuit board 1 through the power supply pins 21, and the power supply pins 21 are connected to the power supply socket 3, and the temperature sensor 4 It is easy to install and not easy to be damaged, the casing can effectively block the laser array 2, which strengthens the protection of the laser array 2, and the power supply socket 3 is exposed on the outside, which is convenient for plugging and unplugging. Has high reliability. Moreover, the laser array unit 10 in the package assembly in this embodiment can be easily expanded, which improves the adaptability of the package assembly.

The above description is only an embodiment of the present application, and is not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related technologies Fields are similarly included within the scope of patent protection of this application.

Claims (10)

1. A laser array unit, comprising:

the laser device comprises a laser device array, wherein a power supply pin is arranged on the laser device array;

the power supply pin is fixed on the printed circuit board;

and the power supply socket is fixed on the printed circuit board and positioned on one side of the laser array, and the power supply pins are connected to the power supply socket through the printed circuit board.

2. The laser array unit of claim 1, wherein the printed circuit has an opening disposed therein, and the laser array is embedded in the opening.

3. The laser array unit of claim 2, further comprising a temperature sensor, the temperature sensor comprising:

a terminal socket fixed on the printed circuit board;

and the probe is connected with the terminal socket through a wire, is fixed on the laser array and is used for sensing the temperature of the laser array.

4. The laser array unit of claim 3, wherein the printed circuit board is U-shaped, comprising a base plate and first and second side plates connecting the base plate, the first side plate and the second side plate forming the opening, the power supply socket being disposed on the base plate.

5. The laser array unit of claim 4, wherein the terminal socket is secured to a side of the first side plate remote from the base plate, and the probe is secured to a side of the laser array remote from the power supply socket.

6. The laser array unit of claim 3, wherein the power pins comprise a positive power pin and a negative power pin, the positive power pin and the negative power pin are oppositely disposed, the first side plate is provided with a first welding portion corresponding to the negative power pin, the second side plate is provided with a second welding portion corresponding to the positive power pin, the negative power pin is welded to the first welding portion, and the positive power pin is welded to the second welding portion.

7. The laser array unit of claim 1, further comprising a housing that covers the printed circuit board, wherein the laser array is located within the housing, and wherein the power supply socket is located outside the housing.

8. The laser array unit of claim 7, further comprising a gasket disposed around the periphery of the power supply socket.

9. The laser array unit of claim 2, further comprising a heat sink, wherein the laser array and the printed circuit board are secured to the heat sink by screws.

10. A package comprising a heat sink and the laser array unit of any of claims 1-6, the laser array unit being disposed in pairs on the heat sink, the pairs of laser array units being disposed side-by-side and in opposite directions such that power supply sockets of the laser array units are disposed around the laser array.

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