CN209559346U - Components, measuring devices for measuring the case temperature of discrete components - Google Patents

Abstract

The present application discloses a component for measuring the shell temperature of a discrete device and a device for measuring the shell temperature of a discrete device, the component includes a printed circuit board, a resistor and pins; the resistor is used for embedding in the discrete device; the The pins are used to connect the temperature detection circuit to the component; the resistance and the pins are soldered to both ends of the printed circuit board respectively, and are electrically connected through the traces on the printed circuit board . This application uses printed circuit boards, resistors, and pins to measure the shell temperature of discrete devices; NTC resistors can be embedded directly below the hot spots of the copper substrate on the back of the discrete device from the shortest direction of the slot to achieve The purpose of accurately measuring the case temperature, while avoiding too long grooves on the surface of the radiator under the copper substrate to affect heat dissipation; use pins to connect to the temperature detection circuit to improve the reliability of the connection, low cost, and small footprint.

Description

Components, measuring devices for measuring the case temperature of discrete components

technical field

The present application relates to the technical field of power electronics, in particular to a component for measuring the shell temperature of a discrete device and a device for measuring the shell temperature of a discrete device.

Background technique

During the operation of the frequency converter, the temperature of its main power semiconductor device will be monitored at all times to prevent the semiconductor device from being damaged due to excessive temperature. There are currently two main forms of packaging for semiconductor power devices: power modules and discrete devices.

Whether it is a power module or a discrete device, it is attached to the heat sink by screws or other fixing methods when in use. The power module generally integrates an NTC (Negative Temperature Coefficient, negative temperature coefficient) resistor for temperature measurement inside, and the case temperature of the semiconductor device can be measured through the NTC resistor and the corresponding detection circuit board. There is no resistance for temperature measurement inside the discrete device. If you want to measure the shell temperature of the discrete device, you must bury a temperature sensor near the outside of the device. The type of sensor is usually NTC, and the buried position is crucial to the accuracy of the shell temperature measurement. Importantly, the temperature sensor buried at the same time needs to be connected with the temperature detection circuit board, and the choice of connection method also has a significant impact on the reliability of the temperature measurement circuit.

FIG. 1 is a schematic diagram of a rear view structure of a discrete device, and 11 in the figure is a copper substrate of the discrete device. Fig. 2 is the structure schematic diagram that existing temperature sensor is embedded in the discrete device, in this embedding mode, the embedding position (shown as 12 in the figure) deviates from the copper substrate 11 of the discrete device, has avoided the copper substrate 11 directly below The radiator (not shown in the accompanying drawings) is slotted, although it does not affect the heat dissipation, but there is a problem of inaccurate measurement of the shell temperature. Fig. 3 is another schematic diagram of the structure of the existing temperature sensor embedded in the discrete device, the embedding method is by slotting on the surface of the heat sink (not shown in the accompanying drawings) directly below the copper substrate 11 of the discrete device, and the temperature sensor directly reaches The hot spot position of the discrete device (shown by 22 in the figure), although this embedding method can measure the case temperature more accurately, the path of the slot directly under the copper substrate is relatively long, which has the problem of affecting the heat dissipation of the device.

After the temperature sensor is buried, it also needs to be connected to the temperature detection circuit board containing the A/D (analog/digital) converter. There are usually two connection schemes: one is through FPC (Flexible Printed Circuit, flexible circuit board) and The temperature detection circuit board is connected, and the other is connected with the temperature detection circuit board through a cable. The cost of connecting through FPC is relatively high, and the method of connecting through cables has poor vibration resistance, because a certain length needs to be reserved to facilitate the connection operation, and the reserved cables with a certain length will appear during operation or transportation. Repeated swings affect reliability.

Utility model content

In view of this, the purpose of this application is to provide a component for measuring the shell temperature of a discrete device and a device for measuring the shell temperature of a discrete device, so as to solve the inaccurate measurement or influence of the temperature sensor embedded in the discrete device. The heat dissipation of the device and the connection between the temperature sensor and the temperature detection circuit board have the problems of high cost and low reliability.

The technical solution adopted by the application to solve the above technical problems is as follows:

According to one aspect of the present application, a component for measuring the case temperature of a discrete device is provided, the component includes a printed circuit board, a resistor, and pins;

The resistor is used for embedding in the discrete device;

said pins are used to connect a temperature detection circuit to said component;

The resistors and the contact pins are soldered to two ends of the printed circuit board respectively, and are electrically connected through traces on the printed circuit board.

According to another aspect of the present application, a device for measuring the case temperature of a discrete device is provided, the device includes components for measuring the case temperature of a discrete device, and a discrete device;

The component includes a printed circuit board, a resistor, and pins; the pins are used to connect the temperature detection circuit to the component; the resistor and the pins are respectively welded at both ends of the printed circuit board , and are electrically connected through traces on the printed circuit board;

The discrete device includes pins, a copper substrate, and a heat sink arranged under the copper substrate; the surface of the heat sink is provided with a groove for embedding the resistor, and the side of the pin is provided with a groove;

The printed circuit board extends the resistor from the groove on the side of the pin into the groove below the copper substrate in a direction parallel to the pin for embedding.

The components used to measure the shell temperature of discrete devices and the device for measuring the shell temperature of discrete devices in the embodiment of the present application, the components used to measure the shell temperature of discrete devices constructed by printed circuit boards, resistors and pins; the shortest possible distance from the slot Embed the NTC resistor directly below the hot spot position of the copper substrate on the back of the discrete device in the direction of the discrete device, to achieve the purpose of accurately measuring the case temperature, and at the same time avoid the heat dissipation caused by too long slots on the surface of the radiator under the copper substrate; connect with pins To the temperature detection circuit, the reliability of the connection is improved, the cost is low, and the space occupied is small.

Description of drawings

Fig. 1 is a rear view structural schematic diagram of a discrete device;

FIG. 2 is a schematic structural diagram of an existing temperature sensor embedded in a discrete device;

Fig. 3 is another schematic diagram of the structure of the existing temperature sensor embedded in the discrete device;

4 is a schematic structural diagram of components used to measure the case temperature of a discrete device according to the first embodiment of the present application;

5 is a schematic structural diagram of a device for measuring the case temperature of a discrete device according to the second embodiment of the present application;

FIG. 6 is a schematic side view of the device for measuring the case temperature of a discrete device according to the second embodiment of the present application.

The realization, functional features and advantages of the present application will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer and clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right" etc. are based on The orientation or positional relationship shown in the drawings is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as Limitations on this Application. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance.

first embodiment

As shown in FIG. 4 , the first embodiment of the present application provides a component for measuring the case temperature of a discrete device, and the component 30 for measuring the case temperature of a discrete device includes a printed circuit board 32 , a resistor 33 and pins 31 ;

The resistor 33 is used for embedding in discrete devices;

The pin 31 is used to connect the temperature detection circuit to the component 30;

The resistors 33 and the contact pins 31 are soldered to two ends of the printed circuit board 32 respectively, and are electrically connected through traces on the printed circuit board 32 .

Specifically, both the resistors 33 and the contact pins 31 are soldered to both ends of the printed circuit board 32 in a surface mount manner.

In this embodiment, the shape of the printed circuit board is zigzag.

In this embodiment, the resistor is an NTC resistor.

In this embodiment, the contact pin is a two-pin contact pin.

The components for measuring the shell temperature of discrete devices in the embodiment of the present application are components for measuring the shell temperature of discrete devices constructed by printed circuit boards, resistors and pins; NTC resistors can be embedded in the discrete device from the shortest direction of the slot. The hot spot position of the copper substrate on the back of the device is directly below the hot spot position to achieve the purpose of accurately measuring the case temperature, and at the same time avoid the heat dissipation caused by too long grooves on the surface of the radiator under the copper substrate; use pins to connect to the temperature detection circuit to improve the connection. Reliable, low cost, small footprint.

second embodiment

As shown in FIG. 5 , the second embodiment of the present application provides a device for measuring the case temperature of a discrete device, which includes a component 30 and a discrete device 40 for measuring the case temperature of a discrete device;

Please understand in conjunction with FIG. 4 that the component 30 includes a printed circuit board 32, a resistor 33 and a pin 31; the pin 31 is used to connect the temperature detection circuit to the component 30; the resistor 33 and the The pins 31 are welded to both ends of the printed circuit board 32 respectively, and are electrically connected through the traces on the printed circuit board 32;

Specifically, both the resistors 33 and the contact pins 31 are soldered to both ends of the printed circuit board 32 in a surface mount manner.

The discrete device 40 includes pins 43, a copper substrate 41, and a heat sink (not shown in the drawings) below the copper substrate 41; the surface of the heat sink is provided with a groove for embedding the resistor, so The pin 43 side is provided with a groove;

Specifically, the shape of the groove is similar to that of one end of the printed circuit board 32 , and slightly larger than the outline of the printed circuit board 32 , so that one end of the printed circuit board 32 can fit into the surface of the heat sink.

One end of the printed circuit board 32 is embedded by extending the resistor 33 from the groove on the side of the pin 43 into the groove below the copper substrate 41 in a direction parallel to the pin 43 . It should be noted that, when the slots are opened from the side of the pin 43, the length of the slot path to the hot spot (indicated by 42 in the figure) is the shortest, which has the least impact on the heat dissipation of the discrete device.

In this embodiment, the shape of the printed circuit board is zigzag.

In this embodiment, the resistor is an NTC resistor.

In this embodiment, the contact pin is a two-pin contact pin.

Please refer to FIG. 6 , in this embodiment, the distance between the resistor 33 and the copper substrate 41 is less than 1 mm, and an insulating thermal pad 44 is provided between the resistor 33 and the copper substrate 41 . The electrical isolation and heat transfer between the discrete device 40 and the component 30 are realized through the insulating and heat-conducting material, and the temperature difference between the two is reduced while ensuring safety.

The device for measuring the shell temperature of discrete devices in the embodiment of the present application is a component for measuring the shell temperature of discrete devices constructed by printed circuit boards, resistors and pins; the NTC resistor can be embedded on the back of the discrete device from the shortest direction of the slot Just below the hot spot position of the copper substrate, to achieve the purpose of accurately measuring the shell temperature, and at the same time avoid the heat dissipation caused by too long slots on the surface of the radiator under the copper substrate; use pins to connect to the temperature detection circuit to improve the reliability of the connection , low cost, small footprint.

The preferred embodiments of the present application have been described above with reference to the accompanying drawings, and the scope of rights of the present application is not limited thereby. Any modifications, equivalent replacements and improvements made by those skilled in the art without departing from the scope and essence of the present application shall fall within the scope of rights of the present application.

Claims (9)

1. a kind of for measuring the component of discrete device shell temperature, which is characterized in that the component include printed circuit board, resistance with And contact pin；

The resistance in discrete device for being buried；

The contact pin is for making temperature sensing circuit be connected to the component；

The resistance and the contact pin are respectively welded at the both ends of the printed circuit board, and by the printed circuit board Cabling electrical connection.

2. according to claim 1 for measuring the component of discrete device shell temperature, which is characterized in that the printed circuit board Shape be Z-shaped.

3. according to claim 1 for measuring the component of discrete device shell temperature, which is characterized in that the resistance is NTC Resistance.

4. according to claim 1 for measuring the component of discrete device shell temperature, which is characterized in that the contact pin draws for two The contact pin of foot.

5. a kind of device for measuring discrete device shell temperature, which is characterized in that described device includes for measuring discrete device shell temperature Component, discrete device；

The component includes printed circuit board, resistance and contact pin；The contact pin is described for being connected to temperature sensing circuit Component；The resistance and the contact pin are respectively welded at the both ends of the printed circuit board, and by the printed circuit board Cabling electrical connection；

The discrete device includes the radiator below pin, copper base and the setting copper base；The table of the radiator Face offers the slot for burying the resistance, and the pin side is equipped with the tank circuit；

The resistance is extend into institute from the tank circuit of the pin side with the direction for being parallel to the pin by the printed circuit board The slot below copper base is stated to be buried.

6. the device of measurement discrete device shell temperature according to claim 5, which is characterized in that the shape of the printed circuit board Shape is Z-shaped.

7. the device of measurement discrete device shell temperature according to claim 5, which is characterized in that the resistance is NTC resistance.

8. the device of measurement discrete device shell temperature according to claim 5, which is characterized in that the contact pin is two pins Contact pin.

9. the device of measurement discrete device shell temperature according to claim 5, which is characterized in that the resistance and described copper-based Insulating heat-conductive gasket is equipped between plate.