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CN211660409U - Water-cooling and solidifying device for LED lamp - Google Patents

Water-cooling and solidifying device for LED lamp Download PDF

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CN211660409U
CN211660409U CN202020065996.5U CN202020065996U CN211660409U CN 211660409 U CN211660409 U CN 211660409U CN 202020065996 U CN202020065996 U CN 202020065996U CN 211660409 U CN211660409 U CN 211660409U
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led lamp
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欧阳达志
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Heshan Clivia Paint Co ltd
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Abstract

本实用新型提供了一种LED灯水冷降温固化装置,包括固化设备、水冷设备和触摸屏设备,所述固化设备和所述水冷设备拼接在一起,所述触摸屏设备设置在所述固化设备和所述水冷设备之间,其特征在于,所述固化设备包括第一底架、第一防尘罩、第一传动机构和固化组件,所述第一传动机构和所述固化组件设置在所述第一底架的顶部,所述第一防尘罩设置在所述第一传动机构和所述固化组件的顶部;所述水冷设备包括第二底架、第二防尘罩、第二传动机构和进水管,所述第二底架、所述第二传动机构和所述第二防尘罩从底部至顶部依次设置,所述进水管设置在所述第二底架的侧边。旨在解决现有LED灯固化操作工艺中降温处理不当,容易导致LED灯产品损坏的问题。

Figure 202020065996

The utility model provides a water-cooling cooling and solidifying device for an LED lamp, comprising a solidifying device, a water-cooling device and a touch screen device, wherein the solidifying device and the water-cooling device are spliced together, and the touch screen device is arranged on the solidifying device and the touch screen device. Between water cooling equipment, characterized in that the curing equipment includes a first chassis, a first dust cover, a first transmission mechanism and a curing assembly, and the first transmission mechanism and the curing assembly are arranged in the first The top of the chassis, the first dust cover is arranged on the top of the first transmission mechanism and the curing assembly; the water cooling equipment includes a second chassis, a second dust cover, a second transmission mechanism and an inlet The water pipe, the second chassis, the second transmission mechanism and the second dust cover are arranged in sequence from the bottom to the top, and the water inlet pipe is provided on the side of the second chassis. The purpose is to solve the problem of improper cooling treatment in the existing LED lamp curing operation process, which easily leads to damage to the LED lamp product.

Figure 202020065996

Description

LED灯水冷降温固化装置LED lamp water cooling cooling and curing device

技术领域technical field

本实用新型涉及工艺加工设备技术领域,具体涉及一种LED灯水冷降温固化装置。The utility model relates to the technical field of process equipment, in particular to a water-cooling cooling and solidifying device for an LED lamp.

背景技术Background technique

发光二极管简称为LED,是一种常用的发光器件,通过电子与空穴复合释放能量发光,它在照明领域应用广泛。发光二极管可高效地将电能转化为光能,在现代社会具有广泛的用途,如照明、平板显示、医疗器件等。LED灯在生产工艺过程中,其主要步骤可分为:清洗、装架、压焊、封装固化、焊接、切膜、装配、测试、包装等步骤,其中最为重要的是封装固化工艺。Light-emitting diodes, abbreviated as LEDs, are commonly used light-emitting devices that emit energy through the recombination of electrons and holes, and are widely used in the field of lighting. Light-emitting diodes can efficiently convert electrical energy into light energy, and have a wide range of uses in modern society, such as lighting, flat panel displays, medical devices, etc. In the production process of LED lights, the main steps can be divided into: cleaning, mounting, pressure welding, packaging and curing, welding, film cutting, assembly, testing, packaging and other steps, the most important of which is the packaging and curing process.

常见的LED灯固化方法有紫外光照射固化方法和汞灯照射固化方法。无论是紫外光照射固化方法还是汞灯照射固化方法,经过固化处理的LED灯产品均处于高温状态,如果不经过降温处理,一方面会影响LED灯的固化效果,另一方面高温附着的粘胶会损坏LED灯产品。现有的LED灯固化工艺是固化操作完成后,将LED灯产品放置阴凉区域自然降温或者通过风机吹风使其降温。这样做的弊端是,一方面将固化操作完成的LED灯产品拿去降温场所需要一段时间,这段时间容易导致LED灯未及时降温导致损坏,另一方面自然降温和风机吹风降温的降温时间长,降温效果差。Common LED lamp curing methods include ultraviolet light irradiation curing method and mercury lamp irradiation curing method. Whether it is UV light irradiation curing method or mercury lamp irradiation curing method, the cured LED lamp products are in a high temperature state. It will damage the LED light product. The existing LED lamp curing process is that after the curing operation is completed, the LED lamp product is placed in a shady area to naturally cool down, or a fan is blown to cool it down. The disadvantage of this is that, on the one hand, it takes a period of time to take the LED lamp products after the curing operation to the cooling place. During this time, it is easy to cause damage to the LED lamp without cooling down in time. On the other hand, the cooling time of natural cooling and fan blowing cooling is long. , the cooling effect is poor.

实用新型内容Utility model content

为解决现有LED灯固化操作工艺中降温处理不当,容易导致LED灯产品损坏的问题,本实用新型提供了一种LED灯水冷降温固化装置。In order to solve the problem of improper cooling treatment in the existing LED lamp curing operation process, which easily leads to damage to the LED lamp product, the utility model provides a water-cooling cooling and curing device for the LED lamp.

一种LED灯水冷降温固化装置,包括固化设备、水冷设备和触摸屏设备,所述固化设备和所述水冷设备拼接在一起,所述触摸屏设备设置在所述固化设备和所述水冷设备之间,其特征在于,所述固化设备包括第一底架、第一防尘罩、第一传动机构和固化组件,所述第一传动机构和所述固化组件设置在所述第一底架的顶部,所述第一防尘罩设置在所述第一传动机构和所述固化组件的顶部;所述水冷设备包括第二底架、第二防尘罩、第二传动机构和进水管,所述第二底架、所述第二传动机构和所述第二防尘罩从底部至顶部依次设置,所述进水管设置在所述第二底架的侧边。A water-cooling cooling and curing device for an LED lamp, comprising a curing device, a water-cooling device and a touch screen device, the curing device and the water-cooling device are spliced together, and the touch-screen device is arranged between the curing device and the water-cooling device, It is characterized in that, the curing device includes a first chassis, a first dust cover, a first transmission mechanism and a curing assembly, and the first transmission mechanism and the curing assembly are arranged on the top of the first chassis, The first dust cover is arranged on the top of the first transmission mechanism and the curing assembly; the water cooling equipment includes a second chassis, a second dust cover, a second transmission mechanism and a water inlet pipe, the first The second bottom frame, the second transmission mechanism and the second dust cover are arranged in sequence from the bottom to the top, and the water inlet pipe is arranged on the side of the second bottom frame.

进一步地,所述第一传动机构包括第一导轨机构、承托机构和第一电控设备,所述承托机构设置在所述第一导轨机构上,所述第一电控设备设置在所述第一导轨机构的侧边。Further, the first transmission mechanism includes a first guide rail mechanism, a supporting mechanism and a first electric control device, the supporting mechanism is arranged on the first guide rail mechanism, and the first electric control device is arranged on the first electric control device. the side of the first guide rail mechanism.

进一步地,所述第一传动机构还包括挡停机构,所述挡停机构设置在所述第一导轨机构的末端。Further, the first transmission mechanism further includes a stop mechanism, and the stop mechanism is provided at the end of the first guide rail mechanism.

进一步地,所述固化组件包括固化底板、紫外灯辐射器和辐射部,所述固化底板设置在所述第一底架的顶部,所述紫外灯辐射器设置在所述固化底板的顶部,所述辐射部设置在所述紫外灯辐射器的顶部。Further, the curing assembly includes a curing bottom plate, an ultraviolet lamp radiator and a radiation part, the curing bottom plate is arranged on the top of the first bottom frame, and the ultraviolet lamp radiator is arranged on the top of the curing bottom plate, so The radiation part is arranged on the top of the ultraviolet lamp radiator.

进一步地,所述第二防尘罩包括防尘罩壳体和轴流风机,所述轴流风机设置在所述防尘罩壳体上。Further, the second dust cover includes a dust cover casing and an axial flow fan, and the axial flow fan is arranged on the dust cover casing.

进一步地,所述第二传动机构包括第二导轨机构和第二电控设备,所述第二电控设备设置在所述第二导轨机构的侧边。Further, the second transmission mechanism includes a second guide rail mechanism and a second electronic control device, and the second electronic control device is arranged on the side of the second guide rail mechanism.

进一步地,所述触摸屏设备通过触摸屏支架设置在所述固化设备和所述水冷设备之间Further, the touch screen device is arranged between the curing device and the water cooling device through a touch screen bracket

本实用新型提供的LED灯水冷降温固化装置,包含固化设备、水冷设备和触摸屏设备三个部分。固化设备用于给LED灯产品进行固化封装操作,水冷设备和固化设备拼接在一起,用于给固化封装后的LED灯产品进行降温处理,触摸屏设备设置在水冷设备和固化设备之间,用于操控固化设备和水冷设备的加工工艺程序。实际使用该LED灯水冷降温固化装置时,将待固化封装的LED灯产品放至固化设备上的承托机构上,第一传动机构运载承托机构上的LED灯产品完成固化封装工艺,然后运至水冷设备中,由第二传动机构运载承托机构上的LED灯产品完成水冷降温工艺。由于水冷设备和固化设备拼接在一起,固化封装操作完成后的LED灯产品会被直接运至水冷设备中降温,从固化封装操作到降温操作几乎不耗费时间,降温工艺及时;且通过管道水冷降温方式的效果远远优于自然降温或者风机吹风降温的效果,避免LED灯产品出现热损坏的问题。The LED lamp water cooling cooling and curing device provided by the utility model includes three parts: curing equipment, water cooling equipment and touch screen equipment. The curing equipment is used for curing and encapsulating the LED lamp products. The water cooling equipment and the curing equipment are spliced together to cool down the cured and encapsulated LED lamp products. The touch screen equipment is set between the water cooling equipment and the curing equipment. Process procedures that control curing equipment and water cooling equipment. When actually using the LED lamp water cooling cooling and curing device, put the LED lamp product to be cured and packaged on the supporting mechanism on the curing equipment, and the first transmission mechanism carries the LED lamp product on the supporting mechanism to complete the curing and packaging process, and then transport it. In the water-cooling equipment, the second transmission mechanism carries the LED lamp products on the supporting mechanism to complete the water-cooling cooling process. Since the water-cooling equipment and the curing equipment are spliced together, the LED lamp products after the curing and packaging operation will be directly transported to the water-cooling equipment for cooling. It takes almost no time from the curing and packaging operation to the cooling operation, and the cooling process is timely; The effect of the method is far better than the effect of natural cooling or fan blowing cooling, avoiding the problem of thermal damage to LED light products.

附图说明Description of drawings

图1是本实用新型的整体结构的第一示意图;Fig. 1 is the first schematic diagram of the overall structure of the present utility model;

图2是本实用新型的整体结构的第二示意图;Fig. 2 is the second schematic diagram of the overall structure of the present utility model;

图3是本实用新型的固化设备的示意图;Fig. 3 is the schematic diagram of the curing equipment of the present invention;

图4是本实用新型的第一传动机构的示意图;Fig. 4 is the schematic diagram of the first transmission mechanism of the present utility model;

图5是本实用新型的固化组件的示意图;5 is a schematic diagram of the curing assembly of the present invention;

图6是本实用新型的第一传动机构和固化组件的装配示意图;6 is a schematic diagram of the assembly of the first transmission mechanism and the curing assembly of the present invention;

图7是本实用新型的水冷设备的示意图;Fig. 7 is the schematic diagram of the water cooling equipment of the present invention;

图8是本实用新型的第二防尘罩的示意图;Fig. 8 is the schematic diagram of the second dust cover of the present invention;

图9是本实用新型的第二传动机构的示意图;Fig. 9 is the schematic diagram of the second transmission mechanism of the present invention;

附图标记说明:1、固化设备;101、第一底架;102、第一防尘罩;103、第一传动机构;104、固化组件;1031、第一导轨机构;1032、承托机构;1033、挡停机构;1034第一电控设备;1041、固化底板;1042、紫外灯辐射器;1043、辐射部;2、水冷设备;201、第二底架;202、第二防尘罩;203、第二传动机构;204、进水管;2021、防尘罩壳体;2022、轴流风机;2031、第二导轨机构;2032、第二电控设备;3、触摸屏设备。Description of reference numerals: 1. curing equipment; 101, first chassis; 102, first dust cover; 103, first transmission mechanism; 104, curing assembly; 1031, first guide rail mechanism; 1032, supporting mechanism; 1033, stop mechanism; 1034, first electronic control equipment; 1041, curing base plate; 1042, ultraviolet lamp radiator; 1043, radiation part; 2, water cooling equipment; 201, second chassis; 202, second dust cover; 203, the second transmission mechanism; 204, the water inlet pipe; 2021, the dust cover shell; 2022, the axial flow fan; 2031, the second guide rail mechanism; 2032, the second electric control device; 3, the touch screen device.

具体实施方式Detailed ways

为使本实用新型实施例的目的、技术方案和优点更加清楚,下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本实用新型的一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例,都属于本实用新型保护的范围。In order to make the purposes, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. The embodiments of the present invention are some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

参见图1和图2,根据本实用新型的实施例,固化设备1和水冷设备2拼接在一起,具体为固化设备1上的第一传动机构103和水冷设备2上的第二传动机构203连接在一起。实际操作时,将LED灯产品放置固化设备1上的承托机构1032上,第一导轨机构1031将承托机构1032上的LED灯产品运载至固化设备1中的固化封装加工区域。固化封装操作完成后,第一导轨机构1031将承托机构1032上的LED灯产品运载至水冷设备2内部,此时,由第二导轨机构2031继续运载承托机构1032上的LED灯产品至水冷设备2中的水冷降温区域进行降温操作。最后,完成降温操作的LED灯产品被第二导轨机构2031运出此LED灯水冷降温固化装置。1 and 2 , according to the embodiment of the present invention, the curing device 1 and the water cooling device 2 are spliced together, specifically, the first transmission mechanism 103 on the curing device 1 and the second transmission mechanism 203 on the water cooling device 2 are connected together. In actual operation, the LED lamp product is placed on the supporting mechanism 1032 on the curing device 1 , and the first guide rail mechanism 1031 carries the LED lamp product on the supporting mechanism 1032 to the curing and packaging processing area in the curing device 1 . After the curing and packaging operation is completed, the first guide rail mechanism 1031 carries the LED lamp products on the support mechanism 1032 to the inside of the water cooling device 2. At this time, the second guide rail mechanism 2031 continues to carry the LED lamp products on the support mechanism 1032 to the water cooling device 2. The water-cooled cooling area in the equipment 2 performs the cooling operation. Finally, the LED lamp product that has completed the cooling operation is transported out of the LED lamp water cooling cooling and curing device by the second guide rail mechanism 2031 .

触摸屏设备3设置在固化设备1和水冷设备2之间,具体固定形式为:通过触摸屏支架(图中未标出)固定设置,具体的设置位置为:固定设置在固化设备1上的第一电控设备1034和水冷设备2的第二电控设备2032之间。触摸屏设备3取代机械式的按钮面板,通过手写板输入控制固化设备1和水冷设备2操作程序,从而使人机交互更为直截了当。The touch screen device 3 is set between the curing device 1 and the water cooling device 2, and the specific fixing form is: fixedly set through a touch screen bracket (not marked in the figure), and the specific setting position is: the first electric device fixed on the curing device 1. between the control device 1034 and the second electronic control device 2032 of the water cooling device 2 . The touch screen device 3 replaces the mechanical button panel, and controls the operation program of the curing device 1 and the water cooling device 2 through the handwriting pad input, thereby making the human-computer interaction more straightforward.

参见图3所示,根据本实用新型的实施例,固化设备1包括第一底架101、第一防尘罩102、第一传动机构103和固化组件104。第一传动机构103和固化组件104设置在第一底架的顶部,第一底架101用于放置电控元件并且起到支撑第一传动机构103和固化组件104的作用,第一传动机构103用于运载待固化封装的LED灯产品,固化组件104用于对LED灯产品进行紫外灯辐射固化操作。第一防尘罩102设置在第一传动机构103和固化组件104的顶部,能够防止灰尘及切屑、硬沙粒进入第一传动机构103的轨道,减少硬质颗粒状的异物对滑动轨面的损伤,从而减少导轨因操作变形对加工精度的影响,保持机床的加工精度,延长机床的使用寿命。Referring to FIG. 3 , according to an embodiment of the present invention, the curing device 1 includes a first chassis 101 , a first dust cover 102 , a first transmission mechanism 103 and a curing assembly 104 . The first transmission mechanism 103 and the curing assembly 104 are arranged on the top of the first chassis. The first chassis 101 is used to place the electronic control components and play a role of supporting the first transmission mechanism 103 and the curing assembly 104. The first transmission mechanism 103 For carrying the LED lamp product to be cured and packaged, the curing component 104 is used for curing the LED lamp product by ultraviolet lamp radiation. The first dust cover 102 is arranged on the top of the first transmission mechanism 103 and the curing assembly 104, which can prevent dust, chips, and hard sand from entering the track of the first transmission mechanism 103 and reduce the impact of hard granular foreign objects on the sliding rail surface. Therefore, the influence of the guide rail on the machining accuracy due to operation deformation is reduced, the machining accuracy of the machine tool is maintained, and the service life of the machine tool is prolonged.

参见图4所示,根据本实用新型的实施例,第一传动机构103包括第一导轨机构1031、承托机构1032和第一电控设备1034。承托机构1032用于放置待固化封装操作的LED灯产品,承托机构1032的两端分别可滑动的设置在第一导轨机构1031上,由第一导轨机构1031带动承托机构1032滑行运动。第一电控设备1034设置在第一导轨机构1031的侧边,第一电控设备1034内设有操控第一导轨机构1031运动的电控元件以及电机组件,电机组件用于驱动第一导轨机构1031运动从而驱动承托机构1032上的LED灯产品运动。Referring to FIG. 4 , according to an embodiment of the present invention, the first transmission mechanism 103 includes a first guide rail mechanism 1031 , a supporting mechanism 1032 and a first electronic control device 1034 . The support mechanism 1032 is used for placing the LED lamp products to be cured and packaged. Both ends of the support mechanism 1032 are slidably arranged on the first guide rail mechanism 1031, and the first guide rail mechanism 1031 drives the support mechanism 1032 to slide. The first electronic control device 1034 is arranged on the side of the first guide rail mechanism 1031. The first electronic control device 1034 is provided with an electronic control element and a motor assembly for controlling the movement of the first guide rail mechanism 1031. The motor assembly is used to drive the first guide rail mechanism. 1031 moves to drive the LED light product on the support mechanism 1032 to move.

第一传动机构103还设有挡停机构1033,挡停机构1033设置在第一导轨机构1031的末端,由气缸组件控制其在竖直方向的位置。在固化设备1尚未对LED灯产品完成固化封装操作时,挡停机构1033停留在第一导轨机构1031的顶部,阻挡承托机构1032继续向前运动,起到限位的效果;完成固化封装操作后,气缸组件带动挡停机构1033向下运动,不再阻挡承托机构1032继续向前运动。第一导轨机构1031将承托机构1032上的LED灯产品运载至水冷设备2内部,此时,由第二导轨机构2031继续运载承托机构1032上的LED灯产品至水冷设备2中的水冷降温区域进行降温操作。最后,完成降温操作的LED灯产品被第二导轨机构2031运出此LED灯水冷降温固化装置。The first transmission mechanism 103 is further provided with a stop mechanism 1033, the stop mechanism 1033 is arranged at the end of the first guide rail mechanism 1031, and its position in the vertical direction is controlled by the cylinder assembly. When the curing device 1 has not completed the curing and packaging operation for the LED lamp product, the stopper mechanism 1033 stays on the top of the first guide rail mechanism 1031 to prevent the supporting mechanism 1032 from continuing to move forward, which has the effect of limiting the position; the curing and packaging operation is completed. Afterwards, the cylinder assembly drives the blocking mechanism 1033 to move downward, and no longer blocks the supporting mechanism 1032 from continuing to move forward. The first guide rail mechanism 1031 carries the LED lamp products on the support mechanism 1032 to the inside of the water cooling device 2, at this time, the second guide rail mechanism 2031 continues to carry the LED lamp products on the support mechanism 1032 to the water cooling device 2 for water cooling. area for cooling. Finally, the LED lamp product that has completed the cooling operation is transported out of the LED lamp water cooling cooling and curing device by the second guide rail mechanism 2031 .

参见图5所示,根据本实用新型的实施例,固化组件104包括固化底板1041、紫外灯辐射器1042和辐射部1043。固化底板104设置在第一底架101的顶部,紫外灯辐射器1042设置在固化底板1041的顶部,也即固化底板104的一端和第一底架101的顶部抵接,另一端和紫外灯辐射器1042连接。这种设置方式,可以将紫外灯辐射器1042稳固设定在固化设备1中,不受可移动的第一传动机构103的影响。辐射部1043设置在紫外灯辐射器1042的顶部,用于对准LED灯产品并提高紫外光的照射精度和照射强度。固化封装操作时,紫外灯辐射器1042发出8600mW/m2的照射强度的紫外光,经过辐射部1043后,照射在LED灯产品的UV粘合剂上使其固化。相比于传统的汞灯照射固化方式,紫外光照射使UV粘合剂更快固化,缩短了生产时间,大幅度提高了生产效率Referring to FIG. 5 , according to an embodiment of the present invention, the curing assembly 104 includes a curing base plate 1041 , an ultraviolet lamp radiator 1042 and a radiation portion 1043 . The curing base plate 104 is arranged on the top of the first base frame 101, and the ultraviolet lamp radiator 1042 is arranged on the top of the curing base plate 1041, that is, one end of the curing base plate 104 is in contact with the top of the first base frame 101, and the other end is radiated by the ultraviolet lamp. device 1042 is connected. With this arrangement, the ultraviolet lamp radiator 1042 can be stably set in the curing device 1 and is not affected by the movable first transmission mechanism 103 . The radiation part 1043 is arranged on the top of the ultraviolet lamp radiator 1042, and is used for aiming at the LED lamp product and improving the irradiation precision and irradiation intensity of the ultraviolet light. During the curing and packaging operation, the ultraviolet lamp radiator 1042 emits ultraviolet light with an irradiation intensity of 8600 mW/m 2 , and after passing through the radiation part 1043 , it is irradiated on the UV adhesive of the LED lamp product to cure it. Compared with the traditional mercury lamp irradiation curing method, ultraviolet light irradiation makes the UV adhesive cure faster, shortens the production time and greatly improves the production efficiency

参见图6所示,根据本实用新型的实施例,固化组件104固定设置在第一底架101上,固化组件104和第一传动机构103贴紧设置且第一导轨机构1034和承托机构1032的移动不会影响固化组件104的固定效果。辐射部1043正对承托机构1032,第一电控设备1034操控第一导轨机构1031带动LED灯产品进入固化封装操作区域时,紫外灯辐射器1042发出高强度的紫外光,对准LED灯产品完成固化封装操作。Referring to FIG. 6 , according to the embodiment of the present invention, the curing assembly 104 is fixedly arranged on the first chassis 101 , the curing assembly 104 and the first transmission mechanism 103 are closely arranged, and the first guide rail mechanism 1034 and the supporting mechanism 1032 The movement of the curing element 104 does not affect the fixing effect of the curing assembly 104 . The radiation part 1043 is facing the supporting mechanism 1032. When the first electronic control device 1034 controls the first guide rail mechanism 1031 to drive the LED lamp product into the curing and packaging operation area, the ultraviolet lamp radiator 1042 emits high-intensity ultraviolet light, aiming at the LED lamp product. The curing and encapsulation operation is completed.

参见图7所示,根据本实用新型的实施例,水冷设备2包括第二底架201、第二防尘罩202、第二传动机构203和进水管20。第二底架201、第二传动机构203和第二防尘罩202从底部至顶部依次设置,第二底架201用于放置电控元件并且起到支撑第二传动机构203的作用,第二传动机构203用于运载待固化封装的LED灯产品,第二防尘罩202遮挡住第二传动机构203,能够防止灰尘及切屑、硬沙粒进入第二传动机构203的轨道,减少硬质颗粒状的异物对滑动轨面的损伤,从而减少导轨因操作变形对加工精度的影响,保持机床的加工精度,延长机床的使用寿命。进水管204设置在第二底架201的侧边,用于向水冷设备2提供低温度的冷水。冷水进入水冷设备2后注入分布在第二传动机构203上的细水管(图中未标出)中,第一导轨机构1031将承托机构1032上的LED灯产品运载至水冷设备2内部后,由细水管对第二传动机构203上的LED灯产品进行冷却降温。Referring to FIG. 7 , according to the embodiment of the present invention, the water cooling device 2 includes a second chassis 201 , a second dust cover 202 , a second transmission mechanism 203 and a water inlet pipe 20 . The second chassis 201 , the second transmission mechanism 203 and the second dust cover 202 are arranged in sequence from the bottom to the top. The second chassis 201 is used to place the electronic control components and play a role of supporting the second transmission mechanism 203 . The transmission mechanism 203 is used to carry the LED lamp product to be cured and packaged. The second dust cover 202 covers the second transmission mechanism 203, which can prevent dust, chips and hard sand from entering the track of the second transmission mechanism 203 and reduce hard particles. Therefore, the influence of the guide rail on the machining accuracy due to operation deformation is reduced, the machining accuracy of the machine tool is maintained, and the service life of the machine tool is prolonged. The water inlet pipe 204 is arranged on the side of the second bottom frame 201 and is used for providing low temperature cold water to the water cooling device 2 . After the cold water enters the water cooling device 2, it is injected into the thin water pipes (not shown in the figure) distributed on the second transmission mechanism 203. The LED lamp product on the second transmission mechanism 203 is cooled by the thin water pipe.

参见图8所示,根据本实用新型的实施例,第二防尘罩202包括防尘罩壳体2021和轴流风机2022,若干轴流风机2022设置在防尘罩壳体2021上。防尘罩壳体2021底部和第二传动机构203固定设置,一方面包裹住第二传动机构203,减少硬质颗粒状的异物对滑动轨面的损伤;另一方面为轴流风机2022起到固定支撑作用。轴流风机2022用于水冷设备2内部的通风散热,进一步加强第二传动机构203上的细水管的降温冷却效果。Referring to FIG. 8 , according to an embodiment of the present invention, the second dust cover 202 includes a dust cover casing 2021 and an axial flow fan 2022 , and several axial flow fans 2022 are arranged on the dust cover casing 2021 . The bottom of the dust cover housing 2021 and the second transmission mechanism 203 are fixedly arranged. On the one hand, the second transmission mechanism 203 is wrapped to reduce the damage to the sliding rail surface caused by hard granular foreign objects; Fixed support. The axial flow fan 2022 is used for ventilation and heat dissipation inside the water cooling device 2 , and further enhances the cooling effect of the thin water pipe on the second transmission mechanism 203 .

参见图9所示,根据本实用新型的实施例,第二传动机构203包括第二导轨机构2031和第二电控设备2032。第一导轨机构1031将承托机构1032上的LED灯产品运载至水冷设备2内部后,承托机构1032的两端分别可滑动的设置在第二导轨机构2031上,由第二导轨机构2031带动承托机构1032滑行运动。第二电控设备2032设置在第二导轨机构2031的侧边,第二电控设备2032内设有操控第二导轨机构2031运动的电控元件以及电机组件,电机组件用于驱动第二导轨机构2031运动从而驱动承托机构1032上的LED灯产品运动。Referring to FIG. 9 , according to an embodiment of the present invention, the second transmission mechanism 203 includes a second guide rail mechanism 2031 and a second electronic control device 2032 . After the first guide rail mechanism 1031 carries the LED lamp products on the support mechanism 1032 into the water cooling device 2, the two ends of the support mechanism 1032 are respectively slidably arranged on the second guide rail mechanism 2031, and are driven by the second guide rail mechanism 2031. The supporting mechanism 1032 slides. The second electronic control device 2032 is disposed on the side of the second guide rail mechanism 2031. The second electronic control device 2032 is provided with an electronic control element and a motor assembly for controlling the movement of the second guide rail mechanism 2031. The motor assembly is used to drive the second guide rail mechanism. 2031 moves to drive the LED light product on the support mechanism 1032 to move.

本实用新型提供的LED灯水冷降温固化装置,包含固化设备1、水冷设备2和触摸屏设备3三个部分。固化设备1用于给LED灯产品进行固化封装操作,水冷设备2和固化设备2拼接在一起,用于给固化封装后的LED灯产品进行降温处理,触摸屏设备3设置在水冷设备2和固化设备1之间,用于操控固化设备1和水冷设备2的加工工艺程序。实际使用该LED灯水冷降温固化装置时,将待固化封装的LED灯产品放至固化设备1上的承托机构1032上,第一传动机构103运载承托机构1032上的LED灯产品完成固化封装工艺,然后运至水冷设备2中,由第二传动机构203运载承托机构1032上的LED灯产品完成水冷降温工艺。由于水冷设备2和固化设备1拼接在一起,固化封装操作完成后的LED灯产品会被直接运至水冷设备2中降温,从固化封装操作到降温操作几乎不耗费时间,降温工艺及时;且通过管道水冷降温方式的效果远远优于自然降温或者风机吹风降温的效果,避免LED灯产品出现热损坏的问题。The LED lamp water cooling cooling and solidifying device provided by the present invention includes three parts: a solidifying device 1 , a water cooling device 2 and a touch screen device 3 . Curing equipment 1 is used for curing and encapsulating LED light products, water cooling equipment 2 and curing equipment 2 are spliced together to cool the cured and encapsulated LED lamp products, and touch screen equipment 3 is arranged on water cooling equipment 2 and curing equipment. 1, used to control the processing procedure of the curing equipment 1 and the water cooling equipment 2. When actually using the LED lamp water cooling cooling and curing device, put the LED lamp product to be cured and packaged on the supporting mechanism 1032 on the curing device 1, and the first transmission mechanism 103 carries the LED lamp product on the supporting mechanism 1032 to complete the curing package. process, and then transported to the water cooling equipment 2, and the second transmission mechanism 203 carries the LED lamp products on the supporting mechanism 1032 to complete the water cooling cooling process. Since the water-cooling equipment 2 and the curing equipment 1 are spliced together, the LED lamp products after the curing and packaging operation are completed will be directly transported to the water-cooling equipment 2 for cooling, and it takes almost no time from the curing and packaging operation to the cooling operation, and the cooling process is timely; The effect of pipeline water cooling is far better than the effect of natural cooling or fan blowing cooling, avoiding the problem of thermal damage to LED light products.

当然,以上是本实用新型的优选实施方式。应当指出,对于本技术领域的普通技术人员来说,在不脱离本实用新型基本原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本实用新型的保护范围。Of course, the above are the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the basic principle of the present invention, several improvements and modifications can be made, and these improvements and modifications are also regarded as the protection scope of the present invention.

Claims (7)

1. The LED lamp water-cooling solidification device comprises solidification equipment, water-cooling equipment and touch screen equipment, wherein the solidification equipment and the water-cooling equipment are spliced together, and the touch screen equipment is arranged between the solidification equipment and the water-cooling equipment; the water cooling equipment comprises a second chassis, a second dust cover, a second transmission mechanism and a water inlet pipe, wherein the second chassis is sequentially arranged from the bottom to the top of the second dust cover, and the water inlet pipe is arranged on the side edge of the second chassis.
2. The LED lamp water-cooling solidification device of claim 1, wherein the first transmission mechanism comprises a first guide rail mechanism, a supporting mechanism and a first electric control device, the supporting mechanism is arranged on the first guide rail mechanism, and the first electric control device is arranged on a side of the first guide rail mechanism.
3. The LED lamp water-cooling and solidifying device of claim 2, wherein the first transmission mechanism further comprises a stopping mechanism, and the stopping mechanism is arranged at the tail end of the first guide rail mechanism.
4. The LED lamp water-cooling solidification device of claim 3, wherein the solidification assembly comprises a solidification bottom plate, an ultraviolet lamp radiator and a radiation portion, the solidification bottom plate is arranged at the top of the first bottom frame, the ultraviolet lamp radiator is arranged at the top of the solidification bottom plate, and the radiation portion is arranged at the top of the ultraviolet lamp radiator.
5. The LED lamp water-cooling and solidifying device of claim 1, wherein the second dust cover comprises a dust cover housing and an axial flow fan, and the axial flow fan is arranged on the dust cover housing.
6. The LED lamp water-cooling solidification device of claim 4, wherein the second transmission mechanism comprises a second guide rail mechanism and a second electric control device, and the second electric control device is arranged on the side edge of the second guide rail mechanism.
7. The LED lamp water-cooling solidification device of any one of claims 1 to 6, wherein the touch screen device is arranged between the solidification device and the water-cooling device through a touch screen bracket.
CN202020065996.5U 2020-01-13 2020-01-13 Water-cooling and solidifying device for LED lamp Active CN211660409U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020065996.5U CN211660409U (en) 2020-01-13 2020-01-13 Water-cooling and solidifying device for LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020065996.5U CN211660409U (en) 2020-01-13 2020-01-13 Water-cooling and solidifying device for LED lamp

Publications (1)

Publication Number Publication Date
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